CN105586559A - Copper surface treatment process - Google Patents
Copper surface treatment process Download PDFInfo
- Publication number
- CN105586559A CN105586559A CN201610054979.XA CN201610054979A CN105586559A CN 105586559 A CN105586559 A CN 105586559A CN 201610054979 A CN201610054979 A CN 201610054979A CN 105586559 A CN105586559 A CN 105586559A
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- CN
- China
- Prior art keywords
- workpiece
- treatment
- copper
- temperature
- surface treatment
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/12—Aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Thermal Sciences (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
A copper surface treatment process comprises the following steps of (1) cleaning the surface of a workpiece in mechanical cleaning and chemical cleaning manners; (2) conducting sand blasting treatment on the workpiece; (3) heating the workpiece to 520-560 DEG C under the condition of oxygen isolation, holding the temperature, immersing the workpiece into molten aluminum and then taking the workpiece out of the molten aluminum; (4) cooling the workpiece rapidly; (5) conducting shot blasting treatment on the workpiece after the workpiece is cooled to the normal temperature; (6) spraying a sealing reagent onto the surface of the workpiece; and (7) heating and diffusing the workpiece in a thermal treatment furnace. The copper surface treatment process has the beneficial effects that the technological process is simple, operation is easy, the real cost of production is low, the workpiece manufactured through the process is high in surface hardness, high in abrasion resistance and corrosion resistance and easy to popularize.
Description
Technical field
The present invention relates to a kind of copper process of surface treatment.
Background technology
Copper and copper alloy are in human history, to use one of metal material the earliest. Copper alloy toolHave high electric conductivity, thermal conductivity, corrosion resistance and good formability, be widely used in electric power,Electrician, mine, metallurgy and machinery manufacturing industry. But the hot anti-wear performance of copper alloy surface is poor,In engineering application, usually needing to carry out surface applies or modification.
Copper belongs to semi-precious metal, compared with equilibrium hydrogen electrode, has the current potential of calibration, but and oxygenElectrode potential is compared, more negative again. So may carry out negative electrode oxygen uptake corruption under most of conditionsErosion, and can not from acid, separate out hydrogen. In the time that in acid, alkali, anaerobic agent exists, copper comparisonAnti-corrosion; When containing oxidant, copper corrodes.
Copper corrosion is divided into chemical attack, electrochemical corrosion and physics corrosion by process. Chemistry is rottenErosion is the surperficial destruction that directly electrochemical action occurs with surrounding medium and cause of copper. In corrosionIn process, the transmission of electronics is directly carried out between copper and oxidant. Electrochemical corrosionBe the destruction that copper surface produces with the dielectric generation electrochemical reaction of ionic conductance, be alsoThe most general, the modal corrosion of one is also a more serious class corrosion simultaneously. Copper existsThe corrosion overwhelming majority in atmosphere, seawater, soil, acid, alkali, salt medium is electrochemistry corruptionErosion. Electrochemical corrosion can with machinery, mechanics, biological destruction acting in conjunction, aggravation goldBelong to the loss of copper. Physics corrosion refers to that copper is due to the caused destruction of simple physical action,This class corrosion proportion is less.
Fine copper has very high thermal conductivity, electric conductivity and corrosion stability, in metallurgical industry and petrochemical industryIn industry, be used widely. For example use fine copper manufacture air port in blast furnace, cinder notch,Knot in cooling wall, Oxygen Lance Nozzle for Converter, steel billet thermal cutting burning torch burner, steelmaking continuous casting machinesBrilliant device and some chemical device elements etc. Working environment one side and the high-temperature liquid of these partsBody or gas medium directly contact, and another side contacts with the cooling medium such as water or gas. ButBe, the high temperature oxidation resistance of fine copper is poor, and hardness is low, not wear-resisting. With fine copper make air port,Cinder notch and crystallizer etc. are easy to lose efficacy damage under the washing away, wear and tear of high temperature liquid iron, molten steel.The life problems of metallurgy industry heat transfer copper product is a global difficult problem, and is all exerting countries in the worldPower solves. Be considered at present the good technology of effect and mostly be surface reinforcing method, comprising:Alloy plating, alloying and built-up welding heat-resisting alloy, in addition also have thermal spraying heat insulating coat andInlay the processes such as ceramics. Traditional processing method effect is bad, and processing need to be higherCost, and its performance of the workpiece of handling well can not reach requirement, therefore a kind of improvement of urgent needTechnology solve above-mentioned technological deficiency.
Summary of the invention
The invention provides a kind of copper process of surface treatment.
The present invention is directed to the technical scheme that above-mentioned technological deficiency proposes is:
A kind of copper process of surface treatment, comprises the following steps:
(1) adopt the mode of mechanical cleaning and Chemical cleaning to carry out cleaning treatment to surface of the work;
(2) workpiece is carried out to blasting treatment;
(3) workpiece oxygen barrier is heated to 520-560 DEG C, keeps temperature, workpiece immersion is meltedIn aluminium liquid, by its taking-up;
(4) workpiece is cooling rapidly;
(5) work-piece cools is carried out bead to workpiece to normal temperature;
(6) workpiece surface spraying hole sealing agent;
(7) workpiece is added in heat-treatment furnace to thermal diffusion.
The time that workpiece immerses in aluminium liquid is 1-2min.
DIFFUSION TREATMENT is carried out in the heat treatment of atmospheric environment, heating-up temperature 750-820 DEG C, temperatureDegree keeps 3-6 hour, naturally cooling.
The invention has the beneficial effects as follows: technical process is simple, easy to operate, actual production becomesThis is less, and its case hardness of workpiece that uses the present invention to make is high, and wearability is strong, corrosion-resistantProperty strong, be easy to promote.
Detailed description of the invention
A kind of copper process of surface treatment, comprises the following steps: (1) adopts mechanical cleaning and chemistry clearlyThe mode of washing is carried out cleaning treatment to surface of the work; (2) workpiece is carried out to blasting treatment;(3) workpiece oxygen barrier is heated to 550 DEG C, keeps temperature, workpiece is immersed to the aluminium liquid of fusingIn, by its taking-up; (4) workpiece is cooling rapidly; (5) work-piece cools is to normal temperatureWorkpiece is carried out to bead; (6) workpiece surface spraying hole sealing agent; (7) workpiece is existedIn heat-treatment furnace, add thermal diffusion, the time that workpiece immerses in aluminium liquid is 1min, diffusion placeReason is carried out in the heat treatment of atmospheric environment, 760 DEG C of heating-up temperatures, and temperature keeps 4 hours,Naturally cooling, technical process is simple, easy to operate, and real cost of production is less, uses thisIts case hardness of workpiece that invention is made is high, and wearability is strong, and corrosion resistance is strong, is easy to promote.
Claims (3)
1. a copper process of surface treatment, is characterized in that: comprise the following steps:
(1) adopt the mode of mechanical cleaning and Chemical cleaning to carry out cleaning treatment to surface of the work;
(2) workpiece is carried out to blasting treatment;
(3) workpiece oxygen barrier is heated to 520-560 DEG C, keeps temperature, workpiece immersion is meltedIn aluminium liquid, by its taking-up;
(4) workpiece is cooling rapidly;
(5) work-piece cools is carried out bead to workpiece to normal temperature;
(6) workpiece surface spraying hole sealing agent;
(7) workpiece is added in heat-treatment furnace to thermal diffusion.
2. a kind of copper process of surface treatment according to claim 1, is characterized in that: workpieceThe time of immersing in aluminium liquid is 1-2min.
3. a kind of copper process of surface treatment according to claim 1, is characterized in that: diffusionProcess and carry out in the heat treatment of atmospheric environment, heating-up temperature 750-820 DEG C, temperature keeps 3-6 hours, naturally cooling.
Priority Applications (1)
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CN201610054979.XA CN105586559A (en) | 2016-01-27 | 2016-01-27 | Copper surface treatment process |
Applications Claiming Priority (1)
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CN201610054979.XA CN105586559A (en) | 2016-01-27 | 2016-01-27 | Copper surface treatment process |
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CN105586559A true CN105586559A (en) | 2016-05-18 |
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CN201610054979.XA Pending CN105586559A (en) | 2016-01-27 | 2016-01-27 | Copper surface treatment process |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106967940A (en) * | 2017-05-02 | 2017-07-21 | 贵州理工学院 | A kind of method and device for preparing arc profile iron |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5983756A (en) * | 1982-11-05 | 1984-05-15 | Sankyo Gokin Chuzosho:Kk | Method for coating of sprayed base film on copper base metal matrix |
CN101638788A (en) * | 2008-07-28 | 2010-02-03 | 沈阳工业大学 | Process for preparing antioxidant and wear-resistant layer on surface of copper |
CN104480422A (en) * | 2014-11-25 | 2015-04-01 | 昆山泽拉金属制品有限公司 | Copper surface treatment process |
-
2016
- 2016-01-27 CN CN201610054979.XA patent/CN105586559A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5983756A (en) * | 1982-11-05 | 1984-05-15 | Sankyo Gokin Chuzosho:Kk | Method for coating of sprayed base film on copper base metal matrix |
CN101638788A (en) * | 2008-07-28 | 2010-02-03 | 沈阳工业大学 | Process for preparing antioxidant and wear-resistant layer on surface of copper |
CN104480422A (en) * | 2014-11-25 | 2015-04-01 | 昆山泽拉金属制品有限公司 | Copper surface treatment process |
Non-Patent Citations (2)
Title |
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王征等: "铜热浸镀铝扩散层生长动力学模型", 《功能材料》 * |
王征等: "铜热浸镀铝的组织与性能", 《稀有金属》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106967940A (en) * | 2017-05-02 | 2017-07-21 | 贵州理工学院 | A kind of method and device for preparing arc profile iron |
CN106967940B (en) * | 2017-05-02 | 2023-05-30 | 贵州理工学院 | Method and device for preparing arc-shaped special-shaped steel |
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Application publication date: 20160518 |
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