CN105564009A - Clamping device for BGA (Ball Grid Array) substrate - Google Patents
Clamping device for BGA (Ball Grid Array) substrate Download PDFInfo
- Publication number
- CN105564009A CN105564009A CN201610121877.5A CN201610121877A CN105564009A CN 105564009 A CN105564009 A CN 105564009A CN 201610121877 A CN201610121877 A CN 201610121877A CN 105564009 A CN105564009 A CN 105564009A
- Authority
- CN
- China
- Prior art keywords
- bga substrate
- clamping device
- support
- block
- support bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 59
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 229920001821 foam rubber Polymers 0.000 claims description 4
- 230000000153 supplemental effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/20—Supports for workpieces with suction-operated elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a clamping device for a BGA (Ball Grid Array) substrate. The clamping device comprises a bottom plate. The bottom plate is provided with four bearing mechanisms used for supporting the BGA substrate in an auxiliary manner. Each bearing mechanism comprises linear guide rails arranged on the upper end face of the bottom plate, a carrier plate arranged on the linear guide rails in a sliding manner, a supporting block fixedly arranged on the upper end face of the carrier plate, a bearing strip fixedly arranged on the lower end face of the carrier plate, and a drive air cylinder with a piston rod fixed to end of the bearing strip. Each supporting block comprises a vertical plate vertically fixed to the corresponding carrier plate, and a transverse plate vertically fixed to the middle of the vertical plate. A guiding block is formed on each bearing strip, and the upper end face of each guiding block is flush with the upper end face of the transverse plate of the corresponding supporting block. The end, opposite to the corresponding drive air cylinder, on each bearing strip is connected with a telescopic strip. A vacuum suction nozzle is arranged at the end of one end of each telescopic strip. According to the clamping device, the middle part of the BGA substrate can be prevented from protruding, the precision and quality of soldering paste coating are guaranteed, the structure is simple, and using is convenient.
Description
Technical field:
The present invention relates to the technical field of BGA equipment, specifically relate to the clamping device that a kind of BGA substrate uses when applying solder paste.
Background technology:
BGA is a kind of package method that integrated circuit adopts organic support plate, because of its there is package area minimizing, Yi Shangxi, advantage, the extremely favor of consumer such as reliability is high, good electrical property, holistic cost are low.When producing in enormous quantities, workman adopts full-automatic printer to carry out printing (i.e. applying solder paste) usually, before BGA substrate enters the applied soldering paste of printing machine, need first be fixed in printing machine, the mode that BGA substrate fixed by printing machine normally utilizes transmission guide rail to be fixed and to locate.For thinner and easily broken BGA substrate, after the transmission guide rail that printing machine put into by BGA substrate enters into appropriate location, two transmit guide rail can clamp BGA substrate in opposite directions, and this can cause BGA substrate mid portion protruding gently; This chucking power easily makes BGA substrate rupture on the one hand; On the other hand, due to protruding in the middle part of BGA substrate, make the soldering paste coated face on BGA substrate uneven, thus have impact on the coating quality of soldering paste, be necessary to be improved.
Summary of the invention:
Object of the present invention is intended to solve prior art Problems existing, and provide a kind of mid portion of BGA substrate of can avoiding protruding, ensure that the precision that soldering paste is coated with and quality, structure is simple, the clamping device of BGA substrate easy to use.
The present invention relates to a kind of clamping device of BGA substrate, comprise base plate, described base plate is provided with four support mechanisms for supplemental support BGA substrate, described four support mechanisms are separately positioned on four sides, limit of base plate upper surface, support mechanism comprises the line slideway be arranged on base plate upper surface, be slidably arranged in the support plate on described line slideway, be fixedly installed on the back-up block of described support plate upper surface, be fixedly installed on the driving cylinder that the support bar of support plate lower surface and piston rod are fixed on described support bar one end, support plate is vertical with line slideway to be arranged, support bar and line slideway be arranged in parallel, described back-up block comprises the riser be vertically fixed on support plate and the transverse slat be vertically fixed in the middle part of described riser, the edge of BGA substrate can the rectangular area that surrounds at riser and transverse slat of holding, support bar forms a guide pad, the upper surface of the upper surface of described guide pad and the transverse slat of back-up block maintains an equal level, relative to driving one end of cylinder to be connected with an expansion strip on support bar, described expansion strip adjustable its stretch out the distance of support bar, the end, one end of expansion strip is provided with a vacuum slot, described vacuum slot opening up and the upper surface of the upper surface of open upper end face and described guide pad and transverse slat maintain an equal level.
By technique scheme, clamping device of the present invention in use, according to the particular location of support plate on line slideway of the size modulation support mechanism of BGA substrate, back-up block is made to hold up BGA substrate, particularly, four drive the piston rod of cylinder to stretch, support bar is driven to move forward, thus drive support plate and back-up block to move forward, in the process, the lower surface that BGA substrate is close in the upper surface of the guide pad on support bar is moved, until the edge holding of BGA substrate is in the rectangular area that riser and transverse slat surround, afterwards, the position of expansion strip on support bar can be regulated according to the size of BGA substrate, make four vacuum slots on four of four support mechanisms support bars adjacent and be positioned at the centre position, bottom surface of BGA substrate, BGA substrate adsorption is lived by four vacuum slots tightly, the mid portion of BGA substrate is avoided to occur protruding, in addition, the quantity of back-up block is four, and be distributed in each length of side of BGA substrate, effectively support can play described BGA substrate.
By such scheme, the present invention is by the cooperation of back-up block and vacuum slot, and the mid portion of BGA substrate can be avoided protruding, and ensure that the precision that soldering paste be coated with and quality, structure is simply, easy to use.
One as such scheme is preferred, the both sides of described support bar upper surface form two gathering sills, the both sides, bottom surface of described expansion strip form two gib blocks, described gib block is plugged in described gathering sill, and the end of gathering sill forms the limited block for preventing gib block from departing from gathering sill.When the length regulating expansion strip to stretch out on support bar according to the size of BGA substrate, only need pull out expansion strip, two gib blocks outwards movement in two gathering sills of support bar of expansion strip, until adjust to desired location by expansion strip.
One as such scheme is preferred, the quantity of the line slideway in described four support mechanisms is corresponding four groups, often group has two line slideways, and the quantity of described driving cylinder is four corresponding with four groups of line slideways, and each driving cylinder is arranged on often to be organized between two line slideways; Described line slideway is removably disposed on base plate, and described support plate, across above two line slideways, line slideway forms guide-track groove, and the bottom surface of support plate forms guide block, and described guide block is plugged in described guide-track groove.
One as such scheme is preferred, and the end face of the rectangular area that described riser and transverse slat surround is stained with foam-rubber cushion.When location and fixing BGA substrate, described foam-rubber cushion can avoid damage BGA substrate, plays the buffer protection function to BGA substrate.
One as such scheme is preferred, and described vacuum slot is connected with vacuum source by pipeline, and described pipeline is arranged on support bar.
One as such scheme is preferred, and the cross section of described base plate is rectangular or square.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.
Accompanying drawing illustrates:
The following drawings is only intended to schematically illustrate the present invention and explain, not delimit the scope of the invention.Wherein:
Fig. 1 is structural representation of the present invention;
Fig. 2 is the partial structurtes schematic diagram of Fig. 1;
Fig. 3 is the sectional structure schematic diagram of A-A line in Fig. 2;
Fig. 4 is the sectional structure schematic diagram of B-B line in Fig. 2;
Fig. 5 is the sectional structure schematic diagram of C-C line in Fig. 2;
Fig. 6 is working state schematic representation of the present invention.
Detailed description of the invention:
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
See Fig. 1 to Fig. 4, the clamping device of a kind of BGA substrate of the present invention, comprise base plate 1, the cross section of described base plate is rectangular or square, base plate 1 is provided with four support mechanisms 3 for supplemental support BGA substrate 2, described four support mechanisms 3 are separately positioned on four sides, limit of base plate 1 upper surface, support mechanism 3 comprises the line slideway 31 be arranged on base plate 1 upper surface, be slidably arranged in the support plate 32 on described line slideway, be fixedly installed on the back-up block 33 of described support plate upper surface, be fixedly installed on the driving cylinder 35 that the support bar 34 of support plate lower surface and piston rod are fixed on described support bar one end, support plate 32 is vertical with line slideway 31 to be arranged, support bar 34 and line slideway 31 be arranged in parallel, described back-up block 33 comprises the riser 331 be vertically fixed on support plate and the transverse slat 332 be vertically fixed in the middle part of described riser, the edge of BGA substrate 2 can the rectangular area that surrounds at riser 331 and transverse slat 332 of holding, the end face of described rectangular area is stained with foam-rubber cushion 36, support bar 34 forms a guide pad 341, the upper surface of the upper surface of described guide pad and the transverse slat 332 of back-up block 33 maintains an equal level, relative to driving one end of cylinder 35 to be connected with an expansion strip 4 on support bar 34, described expansion strip 4 adjustable its stretch out the distance of support bar 34, the end, one end of expansion strip 4 is provided with a vacuum slot 5, described vacuum slot 5 opening up and the upper surface of the upper surface of open upper end face and described guide pad 341 and transverse slat 332 maintain an equal level, vacuum slot 5 is connected with vacuum source (not shown) by pipeline (not shown), described pipeline is arranged on support bar 34.
See Fig. 5, the both sides of described support bar 34 upper surface form two gathering sills 342, the both sides, bottom surface of described expansion strip 4 form two gib blocks 41, described gib block 41 is plugged in described gathering sill 342, and the end of gathering sill 341 forms the limited block 343 for preventing gib block 41 from departing from gathering sill 342.
See Fig. 1 to Fig. 3, the quantity of the line slideway 31 in described four support mechanisms 3 is corresponding four groups, often group has two line slideways 31, and the quantity of described driving cylinder 35 is four corresponding with four groups of line slideways 31, and each driving cylinder 35 is arranged on often to be organized between two line slideways 31; Described line slideway 31 is removably disposed on base plate 1, described support plate 32 is across above two line slideways 31, line slideway 31 forms guide-track groove 311, the bottom surface of support plate 32 forms guide block 321, described guide block 321 is plugged in described guide-track groove 311.
See Fig. 6, clamping device of the present invention in use, according to the particular location of support plate 32 on line slideway 31 of the size modulation support mechanism 3 of BGA substrate 2, back-up block 33 is made to hold up BGA substrate 2, particularly, four drive the piston rod of cylinder 35 to stretch, support bar 34 is driven to move forward, thus drive support plate 32 and back-up block 33 to move forward, in the process, the lower surface that BGA substrate 2 is close in the upper surface of the guide pad 341 on support bar 34 is moved, until the edge holding of BGA substrate 2 is in the rectangular area that riser 331 and transverse slat 332 surround, afterwards, the position of expansion strip 4 on support bar 34 can be regulated according to the size of BGA substrate 2, four vacuum slots tight 5 on four of four support mechanisms 3 support bars 34 are made to suffer and be positioned at the centre position, bottom surface of BGA substrate 2, BGA substrate 2 adsorbs by four vacuum slots 5 tightly, the mid portion of BGA substrate 2 is avoided to occur protruding, in addition, the quantity of back-up block 33 is four, and be distributed in each length of side of BGA substrate 2, effectively support can play described BGA substrate 2.
In sum, the present invention passes through the cooperation of back-up block 33 and vacuum slot 5, and the mid portion of BGA substrate 2 can be avoided protruding, and ensure that the precision that soldering paste is coated with and quality, structure is simple, easy to use.
The clamping device of BGA substrate provided by the present invention; be only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within scope.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.
Claims (7)
1. the clamping device of a BGA substrate, comprise base plate (1), it is characterized in that: described base plate (1) is provided with four support mechanisms (3) for supplemental support BGA substrate (2), described four support mechanisms (3) are separately positioned on four sides, limit of base plate (1) upper surface, support mechanism (3) comprises the line slideway (31) be arranged on base plate (1) upper surface, be slidably arranged in the support plate (32) on described line slideway, be fixedly installed on the back-up block (33) of described support plate upper surface, be fixedly installed on the driving cylinder (35) that the support bar (34) of support plate (32) lower surface and piston rod are fixed on described support bar (34) one end, support plate (32) is vertical with line slideway (31) to be arranged, support bar (34) and line slideway (31) be arranged in parallel, described back-up block (33) comprises the riser (331) be vertically fixed on support plate (32) and the transverse slat (332) be vertically fixed in the middle part of described riser, the edge of BGA substrate (2) can the rectangular area that surrounds at riser (331) and transverse slat (332) of holding, support bar (34) forms a guide pad (341), the upper surface of the transverse slat (332) of the upper surface of described guide pad and back-up block (33) maintains an equal level, relative to driving one end of cylinder (35) to be connected with an expansion strip (4) on support bar (34), described expansion strip adjustable its stretch out the distance of support bar (34), the end, one end of expansion strip (4) is provided with a vacuum slot (5), described vacuum slot opening up and the upper surface of the upper surface of open upper end face and described guide pad (341) and transverse slat (332) maintain an equal level.
2. the clamping device of BGA substrate according to claim 1, it is characterized in that: the both sides of described support bar (34) upper surface form two gathering sills (342), the both sides, bottom surface of described expansion strip (4) form two gib blocks (41), described gib block is plugged in described gathering sill (342), and the end of gathering sill forms the limited block (343) for preventing gib block (41) from departing from gathering sill.
3. the clamping device of BGA substrate according to claim 1, it is characterized in that: the quantity of the line slideway (31) in described four support mechanisms (3) is corresponding four groups, often group has two line slideways (31), the quantity of described driving cylinder (35) is four corresponding with four groups of line slideways (31), and each driving cylinder (35) is arranged on often to be organized between two line slideways (31).
4. the clamping device of BGA substrate according to claim 3, it is characterized in that: described line slideway (31) is removably disposed on base plate (1), described support plate (32) is across above two line slideways (31), line slideway (31) forms guide-track groove (311), the bottom surface of support plate (32) forms guide block (321), described guide block is plugged in described guide-track groove (311).
5. the clamping device of BGA substrate according to claim 1, is characterized in that: the end face of the rectangular area that described riser (331) and transverse slat (332) surround is stained with foam-rubber cushion (36).
6. the clamping device of BGA substrate according to claim 1, is characterized in that: described vacuum slot (5) is connected with vacuum source by pipeline, and described pipeline is arranged on support bar (34).
7. the clamping device of BGA substrate according to claim 1, is characterized in that: the cross section of described base plate (1) is rectangular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121877.5A CN105564009B (en) | 2016-03-03 | 2016-03-03 | A kind of clamping device of BGA substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610121877.5A CN105564009B (en) | 2016-03-03 | 2016-03-03 | A kind of clamping device of BGA substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105564009A true CN105564009A (en) | 2016-05-11 |
| CN105564009B CN105564009B (en) | 2017-11-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610121877.5A Active CN105564009B (en) | 2016-03-03 | 2016-03-03 | A kind of clamping device of BGA substrates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105564009B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110064883A (en) * | 2019-06-03 | 2019-07-30 | 东莞市迈泰热传科技有限公司 | A kind of new energy car battery pallet gas drive automation fixture and clamping method |
| CN112437539A (en) * | 2020-11-13 | 2021-03-02 | 北京航天微电科技有限公司 | Preparation method of sealing surface-mounted EMI filter and welding tool thereof |
| CN114310999A (en) * | 2022-01-04 | 2022-04-12 | 深圳爱络凯寻科技有限公司 | Intelligent integrated robot clamping mechanism telescopic adjusting mechanism |
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| CN105328384A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Locating clamp for laser cutting of circuit boards |
| CN205522961U (en) * | 2016-03-03 | 2016-08-31 | 浙江乔兴建设集团湖州智能科技有限公司 | Clamping device of BGA base plate |
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| CN2676235Y (en) * | 2003-12-31 | 2005-02-02 | 东捷半导体科技股份有限公司 | Liquid crystal baseplate holding mechanism applicable to different sizes |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110064883A (en) * | 2019-06-03 | 2019-07-30 | 东莞市迈泰热传科技有限公司 | A kind of new energy car battery pallet gas drive automation fixture and clamping method |
| CN110064883B (en) * | 2019-06-03 | 2024-01-30 | 东莞市迈泰热传科技有限公司 | Novel energy automobile battery tray air-drive automatic clamp and clamping method |
| CN112437539A (en) * | 2020-11-13 | 2021-03-02 | 北京航天微电科技有限公司 | Preparation method of sealing surface-mounted EMI filter and welding tool thereof |
| CN114310999A (en) * | 2022-01-04 | 2022-04-12 | 深圳爱络凯寻科技有限公司 | Intelligent integrated robot clamping mechanism telescopic adjusting mechanism |
| CN114310999B (en) * | 2022-01-04 | 2024-03-29 | 深圳爱络凯寻科技有限公司 | Intelligent conjoined robot clamping mechanism telescopic adjusting mechanism |
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| Publication number | Publication date |
|---|---|
| CN105564009B (en) | 2017-11-14 |
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Inventor after: Liu Rongli Inventor before: Ye Weiran |
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Effective date of registration: 20171017 Address after: Luojiang District of Quanzhou City, Fujian province 362000 River town of Baiyang village wells winter 19 Applicant after: Liu Rongli Address before: Yang Shu Lu Wuxing District 313000 Zhejiang city of Huzhou province No. 18 Applicant before: ZHEJIANG QIAOXING CONSTRUCTION GROUP HUZHOU INTELLIGENT TECHNOLOGY CO., LTD. |
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Effective date of registration: 20191017 Address after: 362010 First Floor, 128 South Street, Wan'an Street, Luojiang District, Quanzhou City, Fujian Province Patentee after: Quanzhou Luojiang Kui Fang Cleaning Co., Ltd. Address before: Luojiang District of Quanzhou City, Fujian province 362000 River town of Baiyang village wells winter 19 Patentee before: Liu Rong Li |
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Effective date of registration: 20191226 Address after: 223900 Building 2, Hangzhou Road, Sihong Economic Development Zone, Suqian City, Jiangsu Province Patentee after: Jiangsu Ge Lite electronics incorporated company Address before: 362010 First Floor, 128 South Street, Wan'an Street, Luojiang District, Quanzhou City, Fujian Province Patentee before: Quanzhou Luojiang Kui Fang Cleaning Co., Ltd. |
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