CN105554600A - Electret microphone - Google Patents
Electret microphone Download PDFInfo
- Publication number
- CN105554600A CN105554600A CN201610134711.7A CN201610134711A CN105554600A CN 105554600 A CN105554600 A CN 105554600A CN 201610134711 A CN201610134711 A CN 201610134711A CN 105554600 A CN105554600 A CN 105554600A
- Authority
- CN
- China
- Prior art keywords
- electret microphone
- substrate
- microphone
- metal
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
- H04R2410/07—Mechanical or electrical reduction of wind noise generated by wind passing a microphone
Abstract
The invention discloses an electret microphone which comprises a vibration assembly, an electronic element and an insulating substrate. The face, close to the vibration assembly, of the substrate is provided with a covering film for storing electric charges, and the other face of the substrate is provided with a metal plating layer, a line is etched in the metal plating layer, and the electronic element is arranged in the line. According to the electret microphone, a metal back electrode board in the prior part is replaced by the insulating substrate, the electronic element is installed on the substrate by directly arranging the plating layer on the substrate and then etching the line to arrange the electronic element, therefore, the back electrode board, an electrode ring and a wiring board in the prior art are integrated into a whole, and a back cavity portion does not need to be formed; accordingly, the size of the microphone is effectively reduced, the resonant frequency of the microphone is increased, and therefore the wideband performance of the electret microphone is achieved. The electret microphone can be better and more flexibly applied to products such as mobile phones, tablet personal computers and notebook computers.
Description
Technical field
The present invention relates to microphone and make field, particularly relate to a kind of electret microphone.
Background technology
Along with popularizing of digital product, the thickness of the equipment such as mobile phone, panel computer is more and more thinner, the Consumer's Experience of user improves, but, the space leaving electret microphone for is but more and more less, but the requirement of user to tonequality is more and more higher, therefore, small size, wide band high-performance electret microphone become the common requirements in market.
In prior art, as shown in Figure 1, the annular polar ring 16 that electret microphone comprises back pole plate 11, terminal block 15 and is arranged between back pole plate 11 and terminal block 15, cavity is formed between back pole plate 11, terminal block 15 and polar ring 16, terminal block 15 is also connected with the electronic component 14 with impedance transformation or the effect such as amplification, anti-radio frequency interference, electronic component 14 is arranged in cavity; Back pole plate 11 is provided with vibration component 13 away from the side of terminal block 15, is provided with pad between vibration component 13 and back pole plate 11.
In prior art, back pole plate 11 is metallic plate, and presses together with overlay film 12 (as Teflon film, i.e. poly tetrafluoroethylene), back pole plate 11 overlay film 12 stores electric charge, forms the capacitor board part of electret microphone with pad together with vibration component 13.
When there being Speech input, vibration component 13 vibrates, the distance of the capacitor board part between back pole plate 11 overlay film 12 and vibration component 13 is changed, the electric capacity of capacitive part changes, and then cause voltage to change, voltage signal exports by electronic component 14, realizes by the conversion of voice signal to the signal of telecommunication.
But, electret microphone of the prior art, owing to increasing electrical signal transfer that electret microphone converts to by polar ring 16 and terminal block 15 to follow-up circuit adding man-hour requirement, therefore, the volume of the electret microphone of this structure is very large, and the existence due to back cavity adds the volume of the operatic tunes, cause the frequency response width of existing electret microphone narrower.
Therefore, how while reduction electret microphone volume, improving its performance, is the current technical issues that need to address of those skilled in the art.
Summary of the invention
The object of this invention is to provide a kind of electret microphone, this electret microphone eliminates rear cavity segment, can effectively reduce the volume of self, and serviceability effectively improves simultaneously.
For solving the problems of the technologies described above, the invention provides following technical scheme:
A kind of electret microphone, involving vibrations assembly and electronic component, also comprise insulated substrate, described substrate is provided with the overlay film for stored charge near the one side of described vibration component, another side is provided with the coat of metal, on the described coat of metal, etching has circuit, and described electronic component is arranged in described circuit.
Preferably, the described coat of metal is layers of copper.
Preferably, described substrate is paper base plate, glass cloth substrate or glass mat.
Preferably, described overlay film is be covered with the film that can store electric charge.
Preferably, the pad for supplying to be formed between described vibration component and described overlay film capacitor board part is also provided with between described substrate and described vibration component.
Preferably, the metal cap for covering described electronic component is also comprised.
Preferably, the polar ring also comprising pcb board and be arranged between described pcb board and described substrate, forms back cavity between described pcb board, described substrate and described polar ring.
Electret microphone provided by the present invention, involving vibrations assembly and electronic component, also comprise insulated substrate, described substrate is provided with the overlay film for stored charge near the one side of described vibration component, another side is provided with the coat of metal, on the described coat of metal, etching has circuit, and described electronic component is arranged in described circuit.This electret microphone is by replacing with insulated substrate by metal backing pole plate of the prior art, and by directly arranging coating after etching circuit on the substrate and arrange described electronic component, described electronic component is realized to install on the substrate, make back pole plate of the prior art, polar ring and terminal block are integrated, and without the need to forming rear cavity segment, the volume of electret microphone is effectively reduced, and improve the resonance frequency of microphone, thus achieve the broad band performance of electret microphone, this electret microphone can be better, be applied to mobile phone more flexibly, panel computer, in the products such as notebook computer.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of electret microphone in prior art;
Fig. 2 is the structural representation of a kind of embodiment of electret microphone provided by the present invention;
Fig. 3 is the partial enlarged drawing at the position of A shown in Fig. 2;
Fig. 4 is the structural representation of the another kind of embodiment of electret microphone provided by the present invention;
Fig. 5 is the structural representation of the third embodiment of electret microphone provided by the present invention;
Wherein: 11-back pole plate, 12-overlay film, 13-vibration component, 14-electronic component, 15-terminal block, 16-polar ring, 21-substrate, 22-overlay film, 23-vibration component, 24-electronic component, 25-PCB plate, 26-polar ring, 27-cavity ring, 28-shell, 29-pad, 30-metal cap.
Embodiment
Core of the present invention is to provide a kind of electret microphone, and electronic device is directly arranged on the coating of substrate by this electret microphone, eliminates chamber portion, and the volume of microphone is significantly reduced, and serviceability significantly improves simultaneously.
In order to make those skilled in the art person understand the present invention program better, below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Please refer to Fig. 2 to Fig. 5, Fig. 2 is the structural representation of a kind of embodiment of electret microphone provided by the present invention; Fig. 3 is the partial enlarged drawing at the position of A shown in Fig. 2; Fig. 4 is the structural representation of the another kind of embodiment of electret microphone provided by the present invention; Fig. 5 is the structural representation of the third embodiment of electret microphone provided by the present invention.
In this embodiment, electret microphone comprises for the vibration component 23 of perceives sound signal after vibration and the electronic component 24 for exporting the signal of telecommunication, and insulated substrate 21, substrate 21 is provided with the overlay film 22 for stored charge near the one side of vibration component 23, between the overlay film 22 of substrate 21 and vibration component 23, there is gap, form capacitor board part, when there is vibration in vibration component 23, distance between vibration component 23 and overlay film 22 changes, make the capacitance variations of capacitor board part, and then voltage is changed, the signal of telecommunication exports by electronic component 24, complete by the conversion of voice signal to the signal of telecommunication, concrete, gap between the overlay film 22 of substrate 21 and vibration component 23 can realize by setting up pad 29.
Substrate 21 is provided with the coat of metal away from the one side of vibration component 23, and arranging electronic element 24 after circuit etching on the coat of metal, realize the connection of electronic component 24 and substrate 21, vibration component 23 vibrates the signal of telecommunication produced and be directly passed to electronic component 24 after coating, and the signal of telecommunication exports by electronic component 24.
This electret microphone achieves to be installed on the base plate (21 by electronic component 24, back pole plate of the prior art, polar ring 26 and terminal block are integrated, and without the need to forming rear cavity segment, the volume of electret microphone is effectively reduced, and improve the resonance frequency of microphone, thus achieving the broad band performance of electret microphone, this electret microphone can be applied in the products such as mobile phone, panel computer, notebook computer better, more flexibly.
Preferably, the coat of metal is layers of copper, and because the electroplating technology of copper material and etching technics are relatively simple, and the price of copper is low, can reduce the cost of this electret microphone.Certainly, the coat of metal can be the coating of the materials such as tin layers, layer gold, silver layer or nickel dam, under the condition that cost and technological process allow, also can select coating that is above-mentioned or other materials.
Simultaneously, substrate 21 can be paper base plate, glass cloth substrate or glass mat, be preferably glass mat, as FR-4 wiring sheet material, glass mat is easily electroplated, and etching is convenient, for preferred version, certainly, other can coating be set and be easy to etch circuit material also can, be not further qualified at this.
Certainly, overlay film 22 is preferably covered with the film that can store electric charge, and as PTFE (poly tetrafluoroethylene), FEP (fluoroplastics) etc., poly tetrafluoroethylene, easy iunjected charge, result of use is good, and serviceability is stablized.
On the other hand, as shown in Figure 3, in order to improve the antijamming capability of this electret microphone, also comprise the metal cap 30 for overlay electronic element 24, the height of metal cap 30 can be selected according to the height of electronic component 24, compared to prior art, without the need to arranging parts such as polar ring 26 grade, still while raising microphone property, the volume of this microphone can be reduced.
Certainly, present invention also offers the third embodiment of electret microphone, as shown in Figure 4, this microphone can also comprise pcb board 25 and be arranged on the polar ring 26 between pcb board 25 and substrate 21, pcb board 25, back cavity is formed between substrate 21 and polar ring 26, this back cavity is different from back cavity of the prior art, because electronic component 24 is arranged on terminal block in prior art, therefore back cavity of the prior art exists as the operatic tunes, and the electronic component 24 of microphone in the present invention is installed on the base plate (21, therefore, the back cavity of the microphone provided in this embodiment does not exist as the operatic tunes, therefore, the performance of the microphone shown in Fig. 4 effectively improves compared to prior art, simultaneously, the volume of the microphone that the third embodiment provides is the most close with prior art with structure, shape is specification the most, in use, just the replacing of microphone conveniently can be carried out without the need to changing other related peripheral parts, cost-saving, better compatibility is had with existing microphone.
Certainly; the microphone provided in the third embodiment can also comprise the dielectric chamber ring 27 being arranged on polar ring 26 peripheral part; certainly; the microphone most external provided in each embodiment has been provided with the shell 28 of protection and fixation, and electronic component 24 specifically also comprises the field-effect transistor (FET) for the input and output signal of telecommunication.
Electret microphone provided by the present invention, by carrying out overlay film 22 to substrate 21 and arranging the coat of metal, directly connect up on the base plate (21, by back pole plate of the prior art, polar ring and terminal block are integrated, electret microphone back cavity parts reduce to 1 by original four, greatly reduce the volume of electret microphone, the reduction of the back cavity volume of electret microphone, and improve the resonance frequency of microphone, thus achieve the broad band performance of electret microphone, electret microphone can be better, be applied to mobile phone more flexibly, panel computer, in the products such as notebook computer.
This electret microphone meets current industry small size, wide band demand, and the exploitativeness of this microphone structure is high, is convenient to industrial mass production.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
Above electret microphone provided by the present invention is described in detail.Apply specific case herein to set forth principle of the present invention and execution mode, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improve and modify and also fall in the protection range of the claims in the present invention.
Claims (7)
1. an electret microphone, involving vibrations assembly (23) and electronic component (24), it is characterized in that, also comprise insulated substrate (21), the one side of the close described vibration component (23) of described substrate (21) is provided with the overlay film (22) for stored charge, another side is provided with the coat of metal, and on the described coat of metal, etching has circuit, and described electronic component (24) is arranged in described circuit.
2. electret microphone according to claim 1, is characterized in that, the described coat of metal is layers of copper.
3. electret microphone according to claim 2, is characterized in that, described substrate (21) is paper base plate, glass cloth substrate or glass mat.
4. electret microphone according to claim 3, is characterized in that, described overlay film (22) is for being covered with the film that can store electric charge.
5. electret microphone according to claim 4, it is characterized in that, between described substrate (21) and described vibration component (23), being also provided with the pad (29) for supplying to be formed between described vibration component (23) and described overlay film (22) capacitor board part.
6. the electret microphone according to claim 1 to 5 any one, is characterized in that, also comprises the metal cap (30) for covering described electronic component (24).
7. the electret microphone according to claim 1 to 5 any one, it is characterized in that, also comprise pcb board (25) and be arranged on the polar ring (26) between described pcb board (25) and described substrate (21), between described pcb board (25), described substrate (21) and described polar ring (26), form back cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610134711.7A CN105554600A (en) | 2016-03-09 | 2016-03-09 | Electret microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610134711.7A CN105554600A (en) | 2016-03-09 | 2016-03-09 | Electret microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105554600A true CN105554600A (en) | 2016-05-04 |
Family
ID=55833500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610134711.7A Pending CN105554600A (en) | 2016-03-09 | 2016-03-09 | Electret microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105554600A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018032466A1 (en) * | 2016-08-18 | 2018-02-22 | Harman International Industries, Incorporated | Electret condenser microphone and manufacturing method thereof |
| CN108989959A (en) * | 2018-08-09 | 2018-12-11 | 京东方科技集团股份有限公司 | Electret microphone and its manufacturing method, display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2045169U (en) * | 1989-03-15 | 1989-09-27 | 机械电子工业部第三研究所 | Microsize electret microphone |
| RU2079978C1 (en) * | 1994-09-08 | 1997-05-20 | Государственное научно-производственное предприятие "Исток" | Midjet-size electret microphone |
| US20020172385A1 (en) * | 2001-05-16 | 2002-11-21 | Citizen Electronics Co., Ltd. | Electret microphone |
| CN201898611U (en) * | 2010-12-20 | 2011-07-13 | 深圳市豪恩声学股份有限公司 | Miniature electret microphone |
| CN104113807A (en) * | 2014-06-20 | 2014-10-22 | 宁波兴隆电子有限公司 | Polar ring coverage membrane-contained ultra-thin microphone |
| CN205491147U (en) * | 2016-03-09 | 2016-08-17 | 山东共达电声股份有限公司 | Electret microphone |
-
2016
- 2016-03-09 CN CN201610134711.7A patent/CN105554600A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2045169U (en) * | 1989-03-15 | 1989-09-27 | 机械电子工业部第三研究所 | Microsize electret microphone |
| RU2079978C1 (en) * | 1994-09-08 | 1997-05-20 | Государственное научно-производственное предприятие "Исток" | Midjet-size electret microphone |
| US20020172385A1 (en) * | 2001-05-16 | 2002-11-21 | Citizen Electronics Co., Ltd. | Electret microphone |
| CN201898611U (en) * | 2010-12-20 | 2011-07-13 | 深圳市豪恩声学股份有限公司 | Miniature electret microphone |
| CN104113807A (en) * | 2014-06-20 | 2014-10-22 | 宁波兴隆电子有限公司 | Polar ring coverage membrane-contained ultra-thin microphone |
| CN205491147U (en) * | 2016-03-09 | 2016-08-17 | 山东共达电声股份有限公司 | Electret microphone |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018032466A1 (en) * | 2016-08-18 | 2018-02-22 | Harman International Industries, Incorporated | Electret condenser microphone and manufacturing method thereof |
| US10939192B2 (en) | 2016-08-18 | 2021-03-02 | Harman International Industries, Incorporated | Electret condenser microphone and manufacturing method thereof |
| CN108989959A (en) * | 2018-08-09 | 2018-12-11 | 京东方科技集团股份有限公司 | Electret microphone and its manufacturing method, display device |
| CN108989959B (en) * | 2018-08-09 | 2020-11-10 | 京东方科技集团股份有限公司 | Electret microphone, manufacturing method thereof and display device |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160504 |
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| RJ01 | Rejection of invention patent application after publication |