CN105525242A - Method for treating copper alloy strip - Google Patents
Method for treating copper alloy strip Download PDFInfo
- Publication number
- CN105525242A CN105525242A CN201510978606.7A CN201510978606A CN105525242A CN 105525242 A CN105525242 A CN 105525242A CN 201510978606 A CN201510978606 A CN 201510978606A CN 105525242 A CN105525242 A CN 105525242A
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- alloy
- copper alloy
- liquid nitrogen
- copper
- band
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
A method for treating a copper alloy strip comprises the following steps that alloy is subjected to solution treatment and then cold-rolled, so that the alloy is made into the strip; the obtained copper alloy strip is subjected to subzero treatment in liquid nitrogen, the temperature of the liquid nitrogen is minus 165 DEG C-minus 170 DEG C, and the treatment time in the liquid nitrogen is three to ten min; and then the temperature of the strip is increased to the room temperature in oil at the temperature of 25 DEG C. The method has the beneficial effects that the copper alloy treated through the subzero treatment process obtains a bi-directional twin-crystal fine structure, the performance of the copper alloy is made to reach the performance of beryllium bronze, and thus the electron scattering degree is reduced, and the electrical conductivity of the strip is improved.
Description
Technical field
The invention belongs to metal alloy production field, be specifically related to a kind of thermal treatment process for copper alloy band.
Background technology
Copper alloy is for matrix adds the alloy that one or more other elements form with fine copper.Fine copper is red-purple, also known as red copper.Conventional copper alloy is divided into the large class of Huang Tong ﹑ Qing Tong ﹑ copper-nickel alloy 3.
The alloy that brass is made up of copper and zinc.If the brass be just made up of copper, zinc is just called market brass.Brass is often used to manufacture valve, water pipe, air-conditioning connection pipe for internal-external unit and scatterer etc.; Bronze is the alloy that China uses the earliest, so far the history of existing more than 3,000 year.The former finger gunmetal of bronze, rear copper alloy except Huang Tong ﹑ copper-nickel alloy all claims Qing Tong ﹐ and the front name titled with the first main adding elements of bronze name of being everlasting.Good and the good mechanical property of the casting Neng ﹑ antifriction performance of tinbronze, is applicable to what and manufactures Zhou Cheng ﹑ Wo Lun ﹑ gear etc.Lead bronze is the widely used bearing materials of Modern Engine and grinding machine; Copper-nickel alloy take nickel as the copper alloy of main adding elements.Copper nickel binary alloy claims common copper-nickel alloy; The White brass alloy being added with the elements such as Meng ﹑ Tie ﹑ Xin ﹑ aluminium claims complicated copper-nickel alloy.Industrial copper-nickel alloy is divided into structure copper-nickel alloy and the large class of electrician's copper-nickel alloy two.The feature of structure copper-nickel alloy is that mechanical property and solidity to corrosion are good, and color and luster is attractive in appearance.This copper-nickel alloy is widely used in and manufactures Jing close Ji Xie ﹑ glasses accessory, chemical machinery and ship structural component.
In prior art, copper alloy carries out ageing treatment after solution treatment.Its tensile strength is lower than 1000Mpa, and intensity and the life-span of the elastic conduction connector made are lower, and the present invention is studied this side up.
Summary of the invention
For deficiency of the prior art, the invention provides a kind of thermal treatment process for copper alloy band.
The present invention is achieved through the following technical solutions.
A kind of copper alloy band treatment process, step comprises carries out cold rolling by alloy after solution treatment, make band, the copper alloy band made is carried out sub-zero treatment in liquid nitrogen, liquid nitrogen temperature is-165 ~-170 DEG C, treatment time in liquid nitrogen is 3min ~ 10min, then in the fluid of 25 DEG C, is warming up to room temperature.
As preferably, described copper alloy band is cuprum-nickel-stannum zirconium alloy or cuprum-nickel-stannum niobium alloy.
Compared with prior art, the present invention has following beneficial effect: obtain two-way twin microtexture with the copper alloy of above-mentioned cryogenic treatment process process, be the performance that its performance reaches berylliumbronze, and because this reducing the degree of electron scattering, the electroconductibility of band improved.
Embodiment
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1: a kind of copper alloy band treatment process, step comprises carries out cold rolling by alloy after solution treatment, make band, the copper alloy band made is carried out sub-zero treatment in liquid nitrogen, liquid nitrogen temperature is-165 DEG C, treatment time in liquid nitrogen is 10min, then in the fluid of 25 DEG C, is warming up to room temperature.Described copper alloy band is cuprum-nickel-stannum zirconium alloy.
Embodiment 2: a kind of copper alloy band treatment process, step comprises carries out cold rolling by alloy after solution treatment, make band, the copper alloy band made is carried out sub-zero treatment in liquid nitrogen, liquid nitrogen temperature is-170 DEG C, treatment time in liquid nitrogen is 3min, then in the fluid of 25 DEG C, is warming up to room temperature.Described copper alloy band is cuprum-nickel-stannum niobium alloy.
Embodiment 3: a kind of copper alloy band treatment process, step comprises carries out cold rolling by alloy after solution treatment, make band, the copper alloy band made is carried out sub-zero treatment in liquid nitrogen, liquid nitrogen temperature is-168 DEG C, treatment time in liquid nitrogen is 5min, then in the fluid of 25 DEG C, is warming up to room temperature.Described copper alloy band is cuprum-nickel-stannum zirconium alloy.
Two-way twin microtexture is obtained with the copper alloy of above-mentioned cryogenic treatment process process, it is the performance that its performance reaches berylliumbronze, the unit elongation of cuprum-nickel-stannum zirconium alloy band is 6.61%, the unit elongation of cuprum-nickel-stannum niobium alloy band is 6.57%, and reduce the degree of electron scattering, the electroconductibility of band is improved.
Protection scope of the present invention includes but not limited to above embodiment, and protection scope of the present invention is as the criterion with claims, and any replacement that those skilled in the art will find apparent that, distortion, improvement made this technology all falls into protection scope of the present invention.
Claims (2)
1. a copper alloy band treatment process, step comprises carries out cold rolling by alloy after solution treatment, make band, it is characterized in that, the copper alloy band made is carried out sub-zero treatment in liquid nitrogen, liquid nitrogen temperature is-165 ~-170 DEG C, and the treatment time in liquid nitrogen is 3min ~ 10min, then in the fluid of 25 DEG C, is warming up to room temperature.
2. a kind of copper alloy band treatment process according to claim 1, is characterized in that, described copper alloy band is cuprum-nickel-stannum zirconium alloy or cuprum-nickel-stannum niobium alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510978606.7A CN105525242A (en) | 2015-12-24 | 2015-12-24 | Method for treating copper alloy strip |
Applications Claiming Priority (1)
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CN201510978606.7A CN105525242A (en) | 2015-12-24 | 2015-12-24 | Method for treating copper alloy strip |
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CN105525242A true CN105525242A (en) | 2016-04-27 |
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CN201510978606.7A Withdrawn CN105525242A (en) | 2015-12-24 | 2015-12-24 | Method for treating copper alloy strip |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110408870A (en) * | 2019-09-02 | 2019-11-05 | 中南大学 | A kind of preparation method improving gradient-structure copper alloy thin crystal layer and coarse-grain layer coordination rheology |
CN113832420A (en) * | 2020-06-24 | 2021-12-24 | 南京理工大学 | Method for improving elastic performance and prolonging service life of beryllium bronze bean pod rod |
-
2015
- 2015-12-24 CN CN201510978606.7A patent/CN105525242A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110408870A (en) * | 2019-09-02 | 2019-11-05 | 中南大学 | A kind of preparation method improving gradient-structure copper alloy thin crystal layer and coarse-grain layer coordination rheology |
CN110408870B (en) * | 2019-09-02 | 2021-05-07 | 中南大学 | Preparation method for improving coordinated rheological capacity of fine crystal layer and coarse crystal layer of gradient-structure copper alloy |
CN113832420A (en) * | 2020-06-24 | 2021-12-24 | 南京理工大学 | Method for improving elastic performance and prolonging service life of beryllium bronze bean pod rod |
CN113832420B (en) * | 2020-06-24 | 2022-04-19 | 南京理工大学 | Method for improving elastic performance and prolonging service life of beryllium bronze bean pod rod |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C04 | Withdrawal of patent application after publication (patent law 2001) | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160427 |