CN105525099A - Method for recovering tin and lead from waste printed circuit board - Google Patents

Method for recovering tin and lead from waste printed circuit board Download PDF

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Publication number
CN105525099A
CN105525099A CN201610074453.8A CN201610074453A CN105525099A CN 105525099 A CN105525099 A CN 105525099A CN 201610074453 A CN201610074453 A CN 201610074453A CN 105525099 A CN105525099 A CN 105525099A
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CN
China
Prior art keywords
circuit board
lead
tin
printed circuit
alkali
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Application number
CN201610074453.8A
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Chinese (zh)
Other versions
CN105525099B (en
Inventor
张承龙
郑飞龙
王景伟
白建峰
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Shanghai Xinjinqiao Environmental Co Ltd
Shanghai Polytechnic University
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Shanghai Polytechnic University
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Publication of CN105525099A publication Critical patent/CN105525099A/en
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/006Wet processes
    • C22B7/008Wet processes by an alkaline or ammoniacal leaching
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B13/00Obtaining lead
    • C22B13/04Obtaining lead by wet processes
    • C22B13/045Recovery from waste materials
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B25/00Obtaining tin
    • C22B25/06Obtaining tin from scrap, especially tin scrap
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/14Electrolytic production, recovery or refining of metals by electrolysis of solutions of tin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

The invention discloses a method for recovering tin and lead from a waste printed circuit board. The method uses the waste printed circuit board as a raw material for crushing to 1-2 mm; leaching liquid is added according to the solid-liquid mass volume ratio of 1: 5-1: 15 g/L, and is mixed solution of alkali and an oxidizing agent, wherein the mass volume concentration of alkali is 80-160 g/L, and the mass volume concentration of the oxidizing agent is 7-15 g/L; the stirring leaching is performed by 1-2 hours; the leaching temperature is 70-80 DEG C; the leached solution is precipitated and recovered by sodium sulfide to obtain lead sulfide; the lead-removed solution is electrically deposited to recover metal tin; the electric deposition temperature is 70-80 DEG C; and the current density is 50-300 A/M2. The method is simple in process and low in cost, can selectively leach out tin and lead in the circuit board, and realizes the green resourceful treatment of tin and lead in the circuit board.

Description

A kind of method reclaiming tin and lead from discarded printed circuit board
Technical field
The present invention relates to a kind of method reclaiming tin and lead from discarded printed circuit board, belong to metal recovery and reclamation of solid wastes technical field.
Background technology
With the progress of science and technology, the update speed of electronic product is accelerated, and the problem that result in electron wastes process is inevitably placed in front of us.And printed-wiring board (PWB) is as part topmost in electronic product, be extensively present in a large amount of electron wastes.Printed-wiring board (PWB) is different from general solid refuse, and wherein contain hazardous and noxious substances as heavy metal lead, cadmium, mercury etc., deal with improperly and can cause serious harm to environment.Printed-wiring board (PWB) also has a large amount of valuable resource simultaneously, and the plastics according to investigations usually containing 30% in printed-wiring board (PWB), the refractory oxide of 30% and the metal of about 40%, almost contain elements all in the periodic table of elements.And the result of study that Technical University Of Denmark announces shows, containing about 272kg resin and plastic in 1 ton of abandoned printed circuit board arbitrarily collected, 130kg copper, each approximate number 10kg of content of the metals such as iron, tin, antimony, the content of gold, palladium is at about 0.5kg.If these secondary resources can reasonably be utilized, the Sustainable development tool of the mankind is of great significance.
The technique that existing circuit card reclaims tin lead mainly contains pyrometallurgy, hydrometallurgy.Pyrometallurgy directly waste and old circuit board is put into smelting furnace to burn, and by component removings such as resins, adopts the method such as refining, electrolysis recovery metal wherein to remaining lime-ash.Owing to containing the toxic substances such as bromine, benzene, lead and mercury in waste and old circuit board, the poison gas containing dioxin, furans and polychlorinated biphenyl material can be produced during burning, cause serious pollution to environment, and the rate of recovery of valuable metal being low, is the superseded technique that country prohibites.Aciding is that the acid (mainly chloroazotic acid) by strong oxidizing property processes waste and old printed circuit board, be the difference that ion enters into that then solution utilize various reducing metal ions from solution by wherein contained burning, adopt displacement or electrolysis treatment technique Footwall drift.Owing to needing the chemical reagent using severe corrosive, this law easily causes secondary pollution.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a kind of simple, with low cost method reclaiming tin and lead from discarded printed circuit board.The method selectivity is high, green, environmental protection.
Technical solution of the present invention is achieved through the following technical solutions.
The invention provides a kind of method reclaiming tin and lead from discarded printed circuit board, concrete steps are as follows:
(1) using discarded printed circuit board as raw material, pulverization process is carried out to it;
(2) be that 1:5 ~ 1:15g/L adds leach liquor according to solid-liquid mass volume ratio, at 70 ~ 80 DEG C of temperature, agitation leach 1 ~ 2h, wherein: leach liquor is the mixing solutions of alkali and oxygenant, the mass body volume concentrations of alkali is 80g/L ~ 160g/L, and the mass body volume concentrations of oxygenant is 7g/L ~ 15g/L;
(3) leach the recovery of the precipitation of the leach liquor liquid sodium sulphite after terminating and obtain lead sulfide, after deleading, solution is reclaimed by galvanic deposit and obtains metallic tin, wherein: electrodeposition temperature is 70 DEG C ~ 80 DEG C, current density 50A/M 2~ 300A/M 2.
In above-mentioned steps (1), pulverize wiring board to 1-2mm.
In above-mentioned steps (2), mixing speed 400r/min ~ 800r/min.
In above-mentioned steps (2), the alkali in leach liquor is sodium hydroxide or potassium hydroxide.
In above-mentioned steps (2), the oxygenant in leach liquor be between nitro-sulfonic acid sodium, hydrogen peroxide or SODIUMNITRATE.
Beneficial effect of the present invention is: the method for the alkaline oxygenated leaching that the present invention adopts, strong to the selectivity of tin, lead, leached by the fast selective realizing elemental metals tin lead in wiring board that adds of oxygenant, avoid the use of the serious reagent of the environmental pollutions such as strong acid simultaneously.Liquid after leaching is recovered to lead sulfide product, technical maturity by adding sodium sulphite precipitation, simply; Liquid after deleading, by the leaching for tin lead capable of circulation after galvanic deposit Footwall drift tin, avoids the discharge of waste liquid, achieves the closed cycle of solution.
Accompanying drawing explanation
Fig. 1 is present invention process schema.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in detail.
Embodiment 1
With waste mobile phone components and parts for raw material, wherein containing Sn6.12%, Pb0.81%;
Extraction process is as shown in Figure 1: above-mentioned for 100g waste mobile phone components and parts are crushed to 1 ~ 2mm, join in mechanically stirred reactor, add the solution that 1L prepares simultaneously, wherein containing sodium hydroxide 120g/L, m-nitrobenzene sodium sulfonate 15g/L.Agitation leach 2h, rotating speed 600r/min.Filter after leaching, leach liquor adds sodium sulphite deleading, and the liquid after deleading is by galvanic deposit Footwall drift tin, and electrolysis adopts stainless steel electrode, electrodeposition temperature 70 DEG C ~ 80 DEG C, current density 50A/M 2~ 300A/M 2, after electrolysis, waste electrolyte returns extract technology recycle.The metal leaching rates such as the leaching yield of tin lead is greater than 95%, all the other copper are less than 5%.
Embodiment 2
Take memory bar as raw material, wherein containing Sn1.21%, Pb0.69%;
Extraction process is as shown in Figure 1: by above-mentioned for 100g memory bar raw material pulverizing to 1 ~ 2mm, join in mechanically stirred reactor, add the solution that 1L configures simultaneously, wherein containing potassium hydroxide 100g/L, hydrogen peroxide 13g/L.Agitation leach 2h, rotating speed 600r/min.Filter after leaching, leach liquor adds sodium sulphite deleading, and the liquid after deleading is by galvanic deposit Footwall drift tin, and electrolysis adopts stainless steel electrode, electrodeposition temperature 70 DEG C ~ 80 DEG C, current density 50A/M 2~ 300A/M 2, after electrolysis, waste electrolyte returns extract technology recycle.The metal leaching rates such as the leaching yield of tin lead is greater than 95%, all the other copper are less than 5%.

Claims (5)

1. from discarded printed circuit board, reclaim tin and a plumbous method, it is characterized in that, concrete steps are as follows:
(1) using discarded printed circuit board as raw material, pulverization process is carried out to it;
(2) be that 1:5 ~ 1:15g/L adds leach liquor according to solid-liquid mass volume ratio, at 70 ~ 80 DEG C of temperature, agitation leach 1 ~ 2h, wherein: leach liquor is the mixing solutions of alkali and oxygenant, the mass body volume concentrations of alkali is 80g/L ~ 160g/L, and the mass body volume concentrations of oxygenant is 7g/L ~ 15g/L;
(3) leach the recovery of the precipitation of the leach liquor liquid sodium sulphite after terminating and obtain lead sulfide, after deleading, solution is reclaimed by galvanic deposit and obtains metallic tin, wherein: electrodeposition temperature is 70 DEG C ~ 80 DEG C, current density 50A/M 2~ 300A/M 2.
2. method according to claim 1, is characterized in that, in step (1), pulverizes wiring board to 1-2mm.
3. method according to claim 1, is characterized in that, in step (2), and mixing speed 400r/min ~ 800r/min.
4. method according to claim 1, is characterized in that, in step (2), the alkali in leach liquor is sodium hydroxide or potassium hydroxide.
5. method according to claim 1, is characterized in that, in step (2), the oxygenant in leach liquor be between nitro-sulfonic acid sodium, hydrogen peroxide or SODIUMNITRATE.
CN201610074453.8A 2016-02-03 2016-02-03 A kind of method that tin and lead are reclaimed from discarded printed wiring board Active CN105525099B (en)

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CN201610074453.8A CN105525099B (en) 2016-02-03 2016-02-03 A kind of method that tin and lead are reclaimed from discarded printed wiring board

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CN105525099B CN105525099B (en) 2017-10-13

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105907986A (en) * 2016-06-29 2016-08-31 江西铜业集团公司 Extracting method for lead in silver separating residues
CN106381393A (en) * 2016-09-30 2017-02-08 中南大学 Method for removing tin from waste printed circuit board multi-metal powder and preparing potassium stannate
CN109022795A (en) * 2018-07-24 2018-12-18 上海第二工业大学 A kind of alkali electrochemical removes the method and its dedicated unit of component on discarded printed wiring board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6641712B1 (en) * 1999-01-25 2003-11-04 Alpha Fry Limited Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards
CN104775034A (en) * 2015-04-27 2015-07-15 上海第二工业大学 Method for leaching and recycling metals in waste printed circuit boards in steps by using ionic liquid
CN104946894A (en) * 2015-06-12 2015-09-30 中南大学 Method for separating amphoteric metal in waste circuit board powder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6641712B1 (en) * 1999-01-25 2003-11-04 Alpha Fry Limited Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards
CN104775034A (en) * 2015-04-27 2015-07-15 上海第二工业大学 Method for leaching and recycling metals in waste printed circuit boards in steps by using ionic liquid
CN104946894A (en) * 2015-06-12 2015-09-30 中南大学 Method for separating amphoteric metal in waste circuit board powder

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
刘静欣等: "低温碱性熔炼在有色冶金中的应用", 《金属材料与冶金工程》 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105907986A (en) * 2016-06-29 2016-08-31 江西铜业集团公司 Extracting method for lead in silver separating residues
CN105907986B (en) * 2016-06-29 2018-08-14 江西铜业集团公司 The extracting method of lead in a kind of silver separating residues
CN106381393A (en) * 2016-09-30 2017-02-08 中南大学 Method for removing tin from waste printed circuit board multi-metal powder and preparing potassium stannate
CN109022795A (en) * 2018-07-24 2018-12-18 上海第二工业大学 A kind of alkali electrochemical removes the method and its dedicated unit of component on discarded printed wiring board
CN109022795B (en) * 2018-07-24 2019-12-31 上海第二工业大学 Method for removing components on waste printed circuit board by alkaline electrochemistry and special device thereof

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Inventor after: Zhang Chenglong

Inventor after: Zheng Feilong

Inventor after: Li Yingshun

Inventor after: Wang Jingwei

Inventor after: Bai Jianfeng

Inventor before: Zhang Chenglong

Inventor before: Zheng Feilong

Inventor before: Wang Jingwei

Inventor before: Bai Jianfeng

TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20170822

Address after: 201209 Shanghai City, Pudong New Area Jinhai Road No. 2360

Applicant after: Shanghai No.2 Polytechnic Univ.

Applicant after: Shanghai Xinjinqiao Environmental Co., Ltd.

Address before: 201209 Shanghai City, Pudong New Area Jinhai Road No. 2360

Applicant before: Shanghai No.2 Polytechnic Univ.

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