CN105524429A - 一种3d打印用聚芳酯粉末材料及其制备方法 - Google Patents
一种3d打印用聚芳酯粉末材料及其制备方法 Download PDFInfo
- Publication number
- CN105524429A CN105524429A CN201511010352.6A CN201511010352A CN105524429A CN 105524429 A CN105524429 A CN 105524429A CN 201511010352 A CN201511010352 A CN 201511010352A CN 105524429 A CN105524429 A CN 105524429A
- Authority
- CN
- China
- Prior art keywords
- polyarylester
- printing
- weight part
- carbosphere
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
- C08K5/526—Esters of phosphorous acids, e.g. of H3PO3 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
- B29B2009/125—Micropellets, microgranules, microparticles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08J2367/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
Abstract
本发明涉及一种3D打印用聚芳酯粉末材料,其特征在于具有聚芳酯包覆碳微球的结构,原料组分按重量份计包括:聚芳酯60~80重量份,碳微球20~30重量份,硼酸铝晶须10~20重量份,偶联剂0.2~0.5重量份,热稳定剂0.1-0.3份,助流剂0.2~2重量份;通过将聚芳酯包裹在多孔碳微球表面从而获得一种高流动性的粉末,能满足3D打印SLS技术对粉体材料的要求。进一步选用多孔的碳微球,通过均质机和磨盘作用下使聚芳酯牢固镶嵌在碳微球表面,得到球形3D打印用聚芳酯粉末材料流动性好,满足3D打印SLS技术对材料的要求。大幅拓展了聚芳酯在3D打印领域的应用。
Description
技术领域
本发明涉及一种聚芳酯复合材料及其制备方法,更具体的说,本发明涉及一种3D打印用聚芳酯复合材料粉体及其制备方法,属于3D打印材料领域。
背景技术
3D打印,即快速成型技术的一种,它是一种以数字模型文件为基础,运用粉末状金属或塑料等可粘合材料,通过逐层打印的方式来构造物体的技术,又称作增材制造,其制造快速,可完全再现三维效果,使产品设计和模具生产同步进行,实现设计制造一体化。可用于3D打印设备上使用的材料种类广泛,包括金属材料、无机粉体材料、陶瓷材料、高分子材料、蜡、纸等。
目前,用于高分子材料快速成型的3D打印设备所用技术主要有:熔融层积成型技术(FDM),其用于丝状的热熔性塑料;选区激光烧结技术(SLS),其用于粉末状材料的快速成型,是适用材料最多的一种3D打印技术;立体光固化成型技术(SLA),其主要用于光敏树脂的成型,原料为液态树脂。
SLS技术是适用材料最多的一种3D打印技术,且具有加工成本低、时间短的特点,是应用最广泛的的一种3D技术。SLS技术及设备采用发射聚焦于目标区域的能量的激光。在生产部件的目标区域内在由激光所发射的能量的作用下部分熔融或软化的粉末材料。操作时粉末所接受照射的激光能量的数量应足以快速形成部件薄片,因而在实施激光照射前必须将目标化境进行加热,将粉末预热到稍低于其熔点的温度,然后在刮平棍子的作用下将粉末铺平;激光束在计算机控制下根据分层截面信息进行有选择地烧结,一层完成后再进行下一层烧结,全部烧结完后去掉多余的粉末,则可以得到一烧结好的零件。
聚芳酯(PAR)又称芳香族聚酯,是分子主链上带有芳香族环和酯键的热塑性特种工程塑料,是一种无定形的、透明的聚合物。聚芳酯酯键两端均连接苯环,使主链结构中含有大量的芳环,因而具有优异的耐热性(热变形温度175℃,玻璃化温度193℃,分解温度443℃,成型温度300~350℃)和良好的力学性能;此外,它还具有优良的耐紫外线屏蔽性、耐冲击性、表面硬度和耐蠕变性能,在航空航天、电子电器、汽车及机械行业、医用品和日用品等行业具有广泛的应用。聚芳酯是非结晶性高分子化合物,能用热塑性塑料的方法成型,但熔融流动性较差;聚芳酯耐酸、耐油,但耐碱、耐应力开裂性、耐芳烃和酮类的性能不够理想。聚芳酯的这些缺陷限制了其在众多领域的应用与发展,因此往往对其改性处理,主要包括引入特殊基团或原子的化学改性、玻纤增强、及与其他聚合物形成合金,如PAR/PET、PAR/PA、PAR/PC等。
聚芳酯为非结晶性聚合物,熔融温度高(300~350℃),熔体流动性差,耐应力开裂性差等制约了其在3D打印材料上的应用。因此,开发一种粉末状的聚芳酯,对满足3D打印SLS技术需求具有重要意义。
发明内容
为了实现聚芳酯3D打印技术要求,本发明提出一种3D打印用聚芳酯粉末材料,该聚芳酯粉末通过将聚芳酯包裹在多孔碳微球表面从而获得一种高流动性的粉末,能满足3D打印SLS技术对粉体材料的要求。进一步提供3D打印用聚芳酯粉末材料的制备方法。
本发明的技术方案如下:
1.一种3D打印用聚芳酯粉末材料,其特征在于具有聚芳酯包覆碳微球的结构,原料组分按重量份计包括:
聚芳酯60~80重量份,
碳微球20~30重量份,
硼酸铝晶须10~20重量份,
偶联剂0.2~0.5重量份,
热稳定剂0.1-0.3重量份,
助流剂0.2~2重量份;
所述的聚芳酯数均分子量为40000~100000,聚芳酯经过封端剂进行封端处理,所述的封端剂为苯酚、甲基苯酚、苯甲酸、甲基苯甲酸;所述的硼酸铝晶须直径为0.5~2μm,长度为10~40μm;所述的碳微球为粒径在50-100μm的多孔碳微球。
所述的偶联剂为三(十二烷基苯磺酰基)钛酸异丙酯、三(二辛基焦磷酰氧基)钛酸异丙酯、三异硬脂酸基钛酸异丙酯。
所述的热稳定剂为亚磷酸三苯酯、亚磷酸三(壬基苯基)酯中的一种。
所述的助流剂为粒度为5~10μm的滑石粉或硫酸钡中的一种。
一种3D打印用聚芳酯粉末材料的制备方法,其特征在于:制备方法包括以下步骤:
1)将60~80重量份聚芳酯、10~20重量份硼酸铝晶须、0.2~0.5重量份偶联剂、0.5~2重量份助流剂加入到高速混合机中,在150-200℃条件下混合均匀,送入啮合同向双螺杆挤出机熔融,在双螺杆机机头串联高压均质机,将碳微球泵入均质机,在高压作用下熔融的聚芳酯包覆在碳微球表面,从均质机出口以喷射状喷出;
2)将喷射得到的物料与热稳定剂0.1-0.3份送入圆盘研磨机研磨,通过研磨盘之间的碾压使聚芳酯逐渐渗透碳微球的微孔,并牢镶嵌至碳微球表面,通过上磨盘旋转达到研磨和滚球成型,得到球形3D打印用聚芳酯粉末材料。
本发明一种3D打印用聚芳酯粉末材料及其制备方法,通过将聚芳酯包裹在多孔碳微球表面从而获得一种高流动性的粉末,能满足3D打印SLS技术对粉体材料的要求。进一步选用多孔的碳微球,通过均质机和磨盘作用下使聚芳酯牢固镶嵌在碳微球表面,得到球形3D打印用聚芳酯粉末材料。
本发明具有以下的突出特点和有益效果:
1、本发明聚芳酯粉末材料具有聚芳酯包裹碳微球的就够,改善了聚芳酯的耐应力开裂性,提高复合材料热氧稳定性。
2、本发明通过均质机和磨盘使聚芳酯牢固镶嵌在碳微球表面,得到球形3D打印用聚芳酯粉末材料,流动性好,满足3D打印SLS技术对材料的要求。
3、本发明克服了通过溶剂制备污染大的缺陷,生产工艺简短,成本低廉。大幅拓展了聚芳酯在3D打印领域的应用。
具体实施方案
以下通过具体实施方式对本发明作进一步的详细说明,但不应将此理解为本发明的范围仅限于以下的实例。在不脱离本发明上述方法思想的情况下,根据本领域普通技术知识和惯用手段做出的各种替换或变更,均应包含在本发明的范围内。
实施例1
一种3D打印用聚芳酯粉末材料,原料组分按重量份计包括:
聚芳酯60重量份,
碳微球20重量份,
硼酸铝晶须10重量份,
偶联剂0.2重量份,
热稳定剂0.1重量份,
助流剂0.2重量份;
聚芳酯经过苯酚封端剂进行封端处理;硼酸铝晶须直径为0.5~2μm,长度为10~40μm;碳微球为粒径在50-100μm;的偶联剂为三(十二烷基苯磺酰基)钛酸异丙酯;热稳定剂为亚磷酸三苯酯;助流剂为粒度为5~10μm的滑石粉。
制备方法包括以下步骤:
1)将聚芳酯、硼酸铝晶须、偶联剂、助流剂加入到高速混合机中,在150-200℃条件下混合均匀,送入啮合同向双螺杆挤出机熔融,在双螺杆机机头串联高压均质机,将碳微球泵入均质机,在高压作用下熔融的聚芳酯包覆在碳微球表面,从均质机出口以喷射状喷出;
2)将喷射得到的物料与热稳定剂送入圆盘研磨机研磨,通过研磨盘之间的碾压使聚芳酯逐渐渗透碳微球的微孔,并牢镶嵌至碳微球表面,通过上磨盘旋转达到研磨和滚球成型,得到球形3D打印用聚芳酯粉末材料。
实施例2
一种3D打印用聚芳酯粉末材料,原料组分按重量份计包括:
聚芳酯80重量份,
碳微球30重量份,
硼酸铝晶须20重量份,
偶联剂0.5重量份,
热稳定剂0.3重量份,
助流剂2重量份;
聚芳酯经过苯甲酸封端剂进行封端处理;硼酸铝晶须直径为0.5~2μm,长度为10~40μm;碳微球为粒径在50-100μm的多孔碳微球;的偶联剂为三异硬脂酸基钛酸异丙酯;热稳定剂为亚磷酸三苯酯;助流剂为粒度为5~10μm的硫酸钡。
制备方法包括以下步骤:
1)将聚芳酯、硼酸铝晶须、偶联剂、助流剂加入到高速混合机中,在150-200℃条件下混合均匀,送入啮合同向双螺杆挤出机熔融,在双螺杆机机头串联高压均质机,将碳微球泵入均质机,在高压作用下熔融的聚芳酯包覆在碳微球表面,从均质机出口以喷射状喷出;
2)将喷射得到的物料与热稳定剂送入圆盘研磨机研磨,通过研磨盘之间的碾压使聚芳酯逐渐渗透碳微球的微孔,并牢镶嵌至碳微球表面,通过上磨盘旋转达到研磨和滚球成型,得到球形3D打印用聚芳酯粉末材料。
实施例3
一种3D打印用聚芳酯粉末材料,原料组分按重量份计包括:
聚芳酯790重量份,
碳微球25重量份,
硼酸铝晶须15重量份,
偶联剂0.2重量份,
热稳定剂0.3重量份,
助流剂1重量份;
聚芳酯经过甲基苯甲酸封端剂进行封端处理;硼酸铝晶须直径为0.5~2μm,长度为10~40μm;碳微球为粒径在50-100μm的多孔碳微球;偶联剂为三(二辛基焦磷酰氧基)钛酸异丙酯;热稳定剂为亚磷酸三(壬基苯基)酯;助流剂为粒度为5~10μm的滑石粉。
制备方法包括以下步骤:
1)将聚芳酯、硼酸铝晶须、偶联剂、助流剂加入到高速混合机中,在150-200℃条件下混合均匀,送入啮合同向双螺杆挤出机熔融,在双螺杆机机头串联高压均质机,将碳微球泵入均质机,在高压作用下熔融的聚芳酯包覆在碳微球表面,从均质机出口以喷射状喷出;
2)将喷射得到的物料与热稳定剂送入圆盘研磨机研磨,通过研磨盘之间的碾压使聚芳酯逐渐渗透碳微球的微孔,并牢镶嵌至碳微球表面,通过上磨盘旋转达到研磨和滚球成型,得到球形3D打印用聚芳酯粉末材料。
Claims (5)
1.一种3D打印用聚芳酯粉末材料,其特征在于具有聚芳酯包覆碳微球的结构,原料组分按重量份计包括:
聚芳酯60~80重量份,
碳微球20~30重量份,
硼酸铝晶须10~20重量份,
偶联剂0.2~0.5重量份,
热稳定剂0.1-0.3重量份,
助流剂0.2~2重量份;
所述的聚芳酯数均分子量为40000~100000,聚芳酯经过封端剂进行封端处理,所述的封端剂为苯酚、甲基苯酚、苯甲酸、甲基苯甲酸;所述的硼酸铝晶须直径为0.5~2μm,长度为10~40μm;所述的碳微球为粒径在50-100μm的多孔碳微球。
2.根据权利要求1所述的一种3D打印用聚芳酯粉末材料,其特征在于:所述的偶联剂为三(十二烷基苯磺酰基)钛酸异丙酯、三(二辛基焦磷酰氧基)钛酸异丙酯、三异硬脂酸基钛酸异丙酯。
3.根据权利要求1所述的一种3D打印用聚芳酯粉末材料,其特征在于:所述的热稳定剂为亚磷酸三苯酯、亚磷酸三(壬基苯基)酯中的一种。
4.根据权利要求1所述的一种3D打印用聚芳酯粉末材料,其特征在于:所述的助流剂为粒度为5~10μm的滑石粉或硫酸钡中的一种。
5.权利要求1~4任一项所述的一种3D打印用聚芳酯粉末材料的制备方法,其特征在于:制备方法包括以下步骤:
1)将60~80重量份聚芳酯、10~20重量份硼酸铝晶须、0.2~0.5重量份偶联剂、0.5~2重量份助流剂加入到高速混合机中,在150-200℃条件下混合均匀,送入啮合同向双螺杆挤出机熔融,在双螺杆机机头串联高压均质机,将碳微球泵入均质机,在高压作用下熔融的聚芳酯包覆在碳微球表面,从均质机出口以喷射状喷出;
2)将喷射得到的物料与热稳定剂0.1-0.3份送入圆盘研磨机研磨,通过研磨盘之间的碾压使聚芳酯逐渐渗透碳微球的微孔,并牢镶嵌至碳微球表面,通过上磨盘旋转达到研磨和滚球成型,得到球形3D打印用聚芳酯粉末材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511010352.6A CN105524429A (zh) | 2015-12-30 | 2015-12-30 | 一种3d打印用聚芳酯粉末材料及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511010352.6A CN105524429A (zh) | 2015-12-30 | 2015-12-30 | 一种3d打印用聚芳酯粉末材料及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105524429A true CN105524429A (zh) | 2016-04-27 |
Family
ID=55766973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201511010352.6A Pending CN105524429A (zh) | 2015-12-30 | 2015-12-30 | 一种3d打印用聚芳酯粉末材料及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105524429A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107603201A (zh) * | 2017-09-07 | 2018-01-19 | 金华市聚臻新材料科技有限公司 | 一种饰品和牙科精密铸造用3d打印光敏树脂 |
US11718732B2 (en) | 2016-08-30 | 2023-08-08 | Otsuka Chemical Co., Ltd | Resin composition, filament and resin powder for three-dimensional printer, and shaped object and production process therefor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103980672A (zh) * | 2014-04-30 | 2014-08-13 | 中国科学院化学研究所 | 一种3d打印芳香族聚酯材料及其制备方法 |
CN104647760A (zh) * | 2015-02-12 | 2015-05-27 | 华中科技大学 | 一种短纤维增强热固性树脂复合产品的3d打印制造方法 |
CN104801704A (zh) * | 2015-03-26 | 2015-07-29 | 成都新柯力化工科技有限公司 | 一种用于三维打印的形状记忆合金材料及其制备方法 |
-
2015
- 2015-12-30 CN CN201511010352.6A patent/CN105524429A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103980672A (zh) * | 2014-04-30 | 2014-08-13 | 中国科学院化学研究所 | 一种3d打印芳香族聚酯材料及其制备方法 |
CN104647760A (zh) * | 2015-02-12 | 2015-05-27 | 华中科技大学 | 一种短纤维增强热固性树脂复合产品的3d打印制造方法 |
CN104801704A (zh) * | 2015-03-26 | 2015-07-29 | 成都新柯力化工科技有限公司 | 一种用于三维打印的形状记忆合金材料及其制备方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11718732B2 (en) | 2016-08-30 | 2023-08-08 | Otsuka Chemical Co., Ltd | Resin composition, filament and resin powder for three-dimensional printer, and shaped object and production process therefor |
CN107603201A (zh) * | 2017-09-07 | 2018-01-19 | 金华市聚臻新材料科技有限公司 | 一种饰品和牙科精密铸造用3d打印光敏树脂 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Carneiro et al. | Fused deposition modeling with polypropylene | |
US20180201737A1 (en) | Compositions for use in fused filament 3d fabrication and method for manufacturing same | |
EP3257658B1 (en) | Method for manufacturing composite product made of short-fibre reinforced thermosetting resin by means of 3d printing | |
KR102322498B1 (ko) | 스크랩 또는 미사용 에폭시 수지 프리프레그를 재생하는 방법 | |
CN102705410A (zh) | 一种复合摩擦片及其制备方法 | |
CN107151443A (zh) | 一种聚醚酰亚胺基石墨烯3d打印复合材料及其制备方法 | |
CN104650587A (zh) | 一种适用于3d打印的改性聚苯硫醚树脂材料及其制备方法和应用 | |
CN105504749A (zh) | 一种3d打印用聚碳酸酯复合材料及其制备方法 | |
CN104109343A (zh) | 一种高流动性塑料复合粉体材料及其制备方法 | |
CN105524398A (zh) | 一种用于3d打印的abs快速成型材料及其制备方法 | |
Singh et al. | On development of functionally graded material through fused deposition modelling assisted investment casting from Al 2 O 3/SiC reinforced waste low density polyethylene | |
CN104191615A (zh) | 一种3d打印用高分子聚合物粉末材料的制备方法 | |
CN105524429A (zh) | 一种3d打印用聚芳酯粉末材料及其制备方法 | |
CN103980698A (zh) | 一种可用于3d打印的高粘尼龙粉体及其制备方法 | |
CN106832885B (zh) | 含聚多巴胺粒子的聚合物复合材料及其应用 | |
CN103980484A (zh) | 一种可应用于3d打印的导热高分子量尼龙粉体及其制备方法 | |
Godec et al. | Introduction to additive manufacturing | |
CN105524448B (zh) | 一种聚合物加工助剂在3d打印中的应用 | |
Liu et al. | Additive manufacturing of silicone composite structures with continuous carbon fiber reinforcement | |
JP2009012441A (ja) | 再生可能な繊維強化樹脂成形品の製造方法 | |
CN107189423A (zh) | 基于fdm3d打印的减磨材料及其制备方法和增强该材料制品减磨性能的方法 | |
CN105195679A (zh) | 一种用于3d打印快速成型环氧树脂覆膜砂制备方法 | |
US11046004B2 (en) | Apparatus for treatment of residual thermoplastic powder | |
Kishore et al. | Polymer and composites additive manufacturing: material extrusion processes | |
CN105542371A (zh) | 一种应用于3d打印的低热收缩性聚苯乙烯复合微球 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160427 |
|
RJ01 | Rejection of invention patent application after publication |