CN105517479A - Adhesive cleaner - Google Patents

Adhesive cleaner Download PDF

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Publication number
CN105517479A
CN105517479A CN201480049094.XA CN201480049094A CN105517479A CN 105517479 A CN105517479 A CN 105517479A CN 201480049094 A CN201480049094 A CN 201480049094A CN 105517479 A CN105517479 A CN 105517479A
Authority
CN
China
Prior art keywords
bonding
cleaner
aqueous solid
adhesive
solid chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201480049094.XA
Other languages
Chinese (zh)
Other versions
CN105517479B (en
Inventor
柿田富夫
土屋和之
柴田和成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitoms Inc
Original Assignee
Nitoms Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitoms Inc filed Critical Nitoms Inc
Publication of CN105517479A publication Critical patent/CN105517479A/en
Application granted granted Critical
Publication of CN105517479B publication Critical patent/CN105517479B/en
Active legal-status Critical Current
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Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L25/00—Domestic cleaning devices not provided for in other groups of this subclass 
    • A47L25/005—Domestic cleaning devices not provided for in other groups of this subclass  using adhesive or tacky surfaces to remove dirt, e.g. lint removers
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L13/00—Implements for cleaning floors, carpets, furniture, walls, or wall coverings
    • A47L13/10—Scrubbing; Scouring; Cleaning; Polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/54—Aqueous solutions or dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

This invention provides a adhesive cleaner that is good at cleaning up solid debris that has moisture on the surface thereof. The adhesive cleaner provided by this invention is provided with a solid-debris-trapping section that traps solid debris. Said solid-debris-trapping section has a pressure-sensitive adhesive surface comprising a pressure-sensitive adhesive. In a wet-solid-debris adhesion test that measures how much of a wet-solid-debris sample adheres to a surface, the amount (AC) of said wet-solid-debris sample that adheres to each square meter of the aforementioned pressure-sensitive adhesive surface is at least 190 g/m2. Said wet-solid-debris sample is obtained by adding 20 weight parts of an aqueous solution, said aqueous solution containing a surfactant in the amount of 5 wt.%, to 100 weight parts of an aggregate that has a central particle diameter between 1.20 and 1.50 mm, inclusive.

Description

Bonding cleaner
Technical field
The present invention relates to bonding cleaner.The Japanese patent application 2013-183166 CLAIM OF PRIORITY that the application applied for based on September 4th, 2013, the full content of this application is merged in this description as reference.
Background technology
As the cleaning means of floor, carpet etc., widely use the bonding cleaner utilizing adhesive to catch foreign matter (dust, chip etc. remove object).Such bonding cleaner is such as formed as follows: have rotating roll-shape, by limit, the adhesive being configured at volume surface is contacted with cleaned region, while this volume that rolls, can catch the foreign matter on this cleaned region with above-mentioned adhesive.As the document disclosing this kind of prior art, patent document 1 can be enumerated.
Prior art document
Patent document
Patent document 1: Japanese Patent Application Publication 2004-237023 publication
Summary of the invention
the problem that invention will solve
Existing bonding cleaner the common solid debris of effects on surface drying can play good seizure, but the residual limit for the vegetables be such as present in the tank in kitchen is attached with the solid debris of moisture like that, compared with the situation of common solid debris, there is the tendency that seizure property reduces.Therefore, about the removal comprising surface and have the foreign matter of the solid debris of moisture, may not be easy to use.Common solid debris can not only be removed well if can provide and the bonding cleaner that surface has the solid debris of moisture can be removed well, then bonding cleaner improves for the removal function of foreign matter entirety, and the range of application of bonding cleaner expands, and is useful.
The present invention relates to the improvement of above-mentioned prior art, its object is to, provide and can remove the bonding cleaner that surface has the solid debris of moisture well.
for the scheme of dealing with problems
In order to reach above-mentioned purpose, according to the present invention, the bonding cleaner possessing the solid debris capture unit catching solid debris can be provided.Aforesaid solid chip capture unit has the cohesive surface be made up of adhesive.And aforementioned adhesion is surperficial in the aqueous solid chip adhiesion test of adhesion amount measuring aqueous solid chip sample, every 1m 2the aqueous solid chip sample adhesion amount A on cohesive surface cbe shown as 190g/m 2above; Herein, aforementioned aqueous solid chip sample is add the aqueous solution comprising the surfactant of 5 % by weight in the aggregate of 1.20 ~ 1.50mm to obtain at medium particle diameter, and the addition of aqueous solution is 20 weight portions relative to aforementioned aggregate 100 weight portion.The seizure meeting the aqueous solid chip sample of the bonding cleaner of above-mentioned formation and characteristic is excellent, therefore can have the solid debris (following, also referred to as aqueous solid chip) of moisture by catch surface fully.Therefore, the removal of the foreign matter (comprising the removal object of the solid debris such as dust, chip, liquid stain etc.) comprising aqueous solid chip can be preferred for.
In a preferred scheme of technology disclosed herein, aforementioned adhesion cleaner to fall to hard surface at this bonding cleaner making to be attached with aforementioned aqueous solid chip sample aqueous solid chip from the height of 5cm comes off test, aqueous solid chip sample expulsion rate A ddisplay is less than 50%.The retentivity meeting the aqueous solid chip sample of the bonding cleaner of above-mentioned characteristic is excellent, therefore can keep the aqueous solid chip be captured securely, suppresses or prevents the above-mentioned aqueous solid chip be captured in the generation of the unfavorable conditions such as midway comes off.The bonding cleaner meeting above-mentioned characteristic can be particularly preferred for the removal of the foreign matter comprising aqueous solid chip.
It should be noted that, in this description, aqueous solid chip refers to the solid debris on surface as described above with moisture, also can refer to the chip being attached with the solid shape of moisture at least partially on surface.Such as can enumerate: comprise moisture and its part is present in the such solid debris in surface.
In a preferred scheme of technology disclosed herein, aforementioned adhesion surface demonstrates the 180 degree of peel strengths being less than 10N/20mm.Peel strength is excellent by the clean operation of the bonding cleaner suppressed as described above below for setting.Usually, as described above suppress peel strength time, have the tendency that the seizure power of solid debris reduces, although and bonding cleaner peel strength disclosed herein is suppressed to below setting, to aqueous solid chip can play excellence seizure.
In a preferred scheme of technology disclosed herein, aforementioned adhesion agent contains acrylic polymer with the ratio of more than 50 quality %.In addition, foregoing acrylic polymer carries out being polymerized obtaining containing the raw material monomer of Alkoxy monomeric preferably through by comprising.
In a preferred scheme of technology disclosed herein, aforementioned adhesion agent is formed by the adhesive composition containing foregoing acrylic polymer and crosslinking agent.By compounding crosslinking agent, the adhesive exhibits after crosslinked goes out good water-swellable.Utilize this water-swellable, adhesive can keep this solid debris after catching aqueous solid chip securely.
In a preferred scheme of technology disclosed herein, aforementioned adhesion agent contains water-soluble plasticizer.By compounding water-soluble plasticizer, the seizure of aqueous solid chip improves.
In a preferred scheme of technology disclosed herein, aforesaid solid chip capture unit is formed with the form of one side bonding sheet, and described one side bonding sheet possesses: the supporting substrate of sheet and be configured at a surface of this supporting substrate and form the adhesive phase on aforementioned adhesion surface.By formation like this, utilize the bonding force of adhesive layer surface (cohesive surface) that supports by supporting substrate to catch aqueous solid chip.It should be noted that, above-mentioned adhesive phase typically is the adhesive phase that disclosed adhesive is from here formed.
In addition, aforementioned one side bonding sheet preferably by with aforementioned adhesive phase for outside carry out reeling thus with bonding sheet volume form formed.By formation like this, can be contacted with cleaned region by the outer peripheral face making bonding sheet roll up and catch aqueous solid chip well.In addition, according to the adhesion amount etc. of frequency of utilization, aqueous solid chip etc., roll away except used outer peripheral portion (such as, peeling off this outer peripheral portion) clean from this, make untapped adhesive phase expose at this outer peripheral face thus.That is, easily can upgrade and do not use adhesive phase exposing at above-mentioned outer surface.By above-mentioned renewal, the clean-up performance (such as, aqueous solid chip catches performance) maintaining expectation for a long time can be gone through.
In a preferred scheme of technology disclosed herein, possess cylindric rolling member, aforementioned adhesion sheet volume is configured at the outer peripheral face of this rolling member.Utilize the bonding cleaner with such formation, rolling member is rolled along the circumferencial direction of above-mentioned cylinder, thus the solid debris capture unit efficiency being positioned at its outer peripheral face can be utilized to catch the aqueous solid chip etc. in cleaned region well, and removed from this region.
Bonding cleaner disclosed herein also possesses: the mode can rotated with rolling member supports the holding component of aforementioned rolling member.By formation like this, user, by holding component make rolling member roll, efficiency can remove the aqueous solid chip etc. in cleaned region well.
As mentioned above, the seizure of the aqueous solid chip of bonding cleaner disclosed herein is excellent.Therefore, according to this description, can be provided for removing the bonding cleaner that surface has the solid debris of moisture.
Accompanying drawing explanation
Fig. 1 is the front elevation of the bonding cleaner schematically showing an embodiment.
Fig. 2 is the side view of the bonding cleaner schematically showing an embodiment.
Fig. 3 is the sectional view of the solid debris capture unit of the bonding cleaner schematically showing an embodiment.
Fig. 4 is the figure of the method schematically illustrating aqueous solid chip adhiesion test.
Fig. 5 schematically illustrates aqueous solid chip to come off the figure of method of test, and (a), for illustrating the figure of the state before the falling of bonding cleaner, (b) is for illustrating the figure of the state after above-mentioned falling.
Fig. 6 is the image of the attachment state of the aqueous solid chip sample of the test cleaner that example 1 is shown.
Fig. 7 is the image of the attachment state of the aqueous solid chip sample of the test cleaner that example 2 is shown.
Fig. 8 is the image of the attachment state of the aqueous solid chip sample of the test cleaner that example 3 is shown.
Detailed description of the invention
Below, illustrate preferred embodiment of the present invention.It should be noted that, beyond the item mentioned especially in this description, implement item essential to the invention and can be used as those skilled in the art and hold based on the design item of the prior art in this area.The present invention can implement according to the technology general knowledge in content disclosed in this description and this field.In addition, in figures in the following, the component/position with phase same-action is given to identical symbol to be described, sometimes omit or simplify the explanation repeated.
< bonds the removal object > of cleaner
The removal object of bonding cleaner disclosed herein is not particularly limited, and the various foreign matter such as dust, chip can become removal object.The seizure that bonding cleaner effects on surface disclosed herein has the solid debris (aqueous solid chip) of moisture is excellent, therefore can preferably use as the bonding cleaner for removing aqueous solid chip.In above-mentioned situation, as long as there is aqueous solid chip in its application region, as long as be so just not particularly limited.
As the concrete example of aqueous solid chip, such as, can enumerate the solid debris that surface attachment has moisture such as the fragment of the vegetables in the tank being present in kitchen.In addition, comprise solid food materials and fall to floor with the cooking of moisture together with the containers such as glass, glass fragment and food materials scatter with the state being attached with moisture to be deposited in such a situation, from the view point of security on the basis of the seizure of aqueous solid chip, also bonding cleaner disclosed herein preferably can be used.As the region that aqueous solid chip as described above exists, can enumerate: floor, carpet, interior space etc.One of interior preference as above-mentioned application region of tank that can also list kitchen.Bonding cleaner disclosed herein is preferably as the bonding cleaner used in region as described above.
< bonds the structure example > of cleaner
Below, the bonding cleaner limit of an embodiment is described with reference to accompanying drawing limit.As shown in Figure 1, 2, bonding cleaner (following, also referred to as cleaner) 10 possesses bonding sheet volume 30.Cleaner 10 also possesses the retaining member (core) 20 for keeping bonding sheet to roll up 30, and bonding sheet volume 30 forms one by being held in the outer peripheral face of cylindric retaining member 20 with retaining member 20.Cleaner 10 also possesses cleaner main member 15, and this cleaner main member 15 possesses: columned rolling member 40 and the bar-shaped holding component 50 of mode roller component 40 that can rotate with rolling member 40.Rolling member 40 is removably fixed with retaining member 20, together links with the rotation of rolling member 40 with retaining member 20 and bonding sheet volume 30, thus the mode of also rotating along volume circumferencial direction is formed.
Bonding sheet volume 30 is formed as the bonding sheet 31 of solid debris capture unit by winding.Specifically, bonding sheet (solid debris capture unit) 31 as shown in Figure 3, formed with the form of one side bonding sheet 31, described one side bonding sheet 31 possesses: the supporting substrate of rectangular sheet (band shape) 36 and be configured at the adhesive phase 32 of a face 36A of this supporting substrate 36.One side bonding sheet 31 is reeled by the mode being outside with this adhesive phase 32, thus is formed with the form of bonding sheet volume 30.It should be noted that, although be not particularly limited, the bonding sheet volume of cylindrical shape is of a size of diameter and (refers to the diameter (external diameter) when not using.Identical below) 10 ~ 200mm (such as 30 ~ 100mm, typically be 40 ~ 60mm) left and right, width 50 ~ 700mm (such as 60 ~ 350mm, typically be 80 ~ 160mm) left and right.
On the rolling member 40 forming cleaner main member 15, specifically, the position of the central shaft as this cylinder is formed with centre bore (not shown).By inserting the end (one end) holding component 50 at this centre bore, thus rolling member 40 is installed on holding component 50 in the mode that can rotate in a circumferential direction.In addition, at the other end holding component 50, the handle 52 as the component forming cleaner main member 15 is installed.It should be noted that, the material of retaining member is not particularly limited, and preferably can use the synthetic resin system such as polyolefin, Polyester, material made of paper.In addition, the material of rolling member, holding component, handle is also not particularly limited, such as, also can adopt the metal materials such as the synthetic resin system such as polyolefin, Polyester, stainless steel.
The cleaner 10 with formation as described above such as may be used for removing the stain (foreign matter) comprising aqueous solid chip be present in the cleaned region such as floor, carpet.Its suitable occupation mode as described below.That is, operator rolls up 30 parts at the bonding sheet of cleaned area configurations cleaner 10, holds the external force that handle 52 pairs of cleaners 10 apply regulation.So, this external force is passed to rolling member 40 from holding component 50, and rolling member 40 rolls.Thus, the adhesive phase 32 being configured at the bonding sheet volume 30 of the outer peripheral face of rolling member 40 moves together with the rolling of rolling member 40 on cleaned region.So, surface (cohesive surface) 32A of the bonded oxidant layer 32 of the foreign matter comprising aqueous solid chip on cleaned region catches, and can realize the removal of foreign matter from cleaned region.
In addition, bonding sheet volume in, bonding sheet preferably substantially week about length be provided with cut off crack (not shown).This crack is the cut-out means that the adhesive layer surface (outer surface of solid debris capture unit) for effectively reducing (stain removal) performance clean after repeatedly using cleaner upgrades.Can be such as: make the interrupted slits etc. such as the crack of the slit arrangement of elongated hole, waveform, fold line.Above-mentioned crack is preferably to arrange the mode of bonding sheet (direction orthogonal to the longitudinal direction) crosscut in the width direction.It should be noted that, the renewal of the outer peripheral face of solid debris capture unit is not limited to above-mentioned cut-out means.Such as, the direction that also interrupted slits such as fold line can be intersected along the sheet take-up direction relative to bonding sheet volume (typically, relative to above-mentioned width with the direction of the angle of intersection of 30 ~ 60 °) is formed as helical form.Or can also the interrupted slits such as fold line be replaced, slit (continuous print crack) is added at predetermined intervals to the bonding sheet forming bonding sheet volume.In which, the bonding sheet forming bonding sheet volume is formed based on the interrupted slits of fold line along the take-up direction of volume every the periphery length of 1 week in advance, therefore, can peel the outer surface of bonding sheet volume, can easily upgrade this outer surface with each above-mentioned slit.Repeat above-mentioned renewal, the retaining member 20 shown in Fig. 1,2 is such as pulled down from rolling member 40 after being finished bonding sheet volume by result, is replaced by new bonding sheet volume, thus can again for clean.
Bonding cleaner as described above can by suitably adopting known gimmick to make.The bonding sheet volume of such as cleaner can utilize the gimmick same with roll-shape cleaner in the past to make.That is, on the surface of the supporting substrate of rectangular sheet, smear adhesive composition by known various coating means, then carry out drying process etc., form adhesive phase thus.Then, bonding sheet is wound in retaining member by the mode becoming outer peripheral face with adhesive phase, thus forms the bonding sheet volume of web-like.And then, by retaining member is installed on rolling member, thus can cleaner be constructed.It should be noted that, the structure of the mounting structure of retaining member on rolling member, cleaner main member can be the structure same with roll-shape cleaner in the past, owing to not giving the part of feature to the present invention, therefore omits detailed description.
It should be noted that, bonding cleaner is not limited to above-mentioned embodiment.Bonding cleaner such as can be only made up of solid debris capture unit.In addition, in above-mentioned embodiment, solid debris capture unit is made up of supporting substrate and adhesive phase, but is not limited to this.Such as, solid debris capture unit can only be formed (such as without the adhesive of base material) by adhesive.Or when solid debris capture unit has supporting substrate, the shape of this supporting substrate etc. are not particularly limited.Such as, solid capture unit can be formed with adhesive phase at the outer surface of the supporting substrate of drum.And then in above-mentioned embodiment, bonding sheet volume is pivotally installed on holding component by rolling member, but is not limited to this.Such as, hold component can directly or indirectly be connected with above-mentioned solid debris capture unit (link or removably connect).As such bonding cleaner, such as, can enumerate the bonding cleaner being fixed with cylindric, rectangular-shaped adherend in one end of bar-shaped holding component.
< bonds the characteristic > of cleaner
Bonding cleaner disclosed herein is measuring aqueous solid chip sample in the aqueous solid chip adhiesion test of the adhesion amount on the cohesive surface of this bonding cleaner, every 1m 2the aqueous solid chip sample adhesion amount A on cohesive surface cpreferably be shown as 190g/m 2above.The seizure meeting the aqueous solid chip of the bonding cleaner of this characteristic is excellent.Above-mentioned adhesion amount A cbe more preferably 250g/m 2above, more preferably 300g/m 2above, 350g/m is particularly preferably 2(typically be 400g/m above 2above).Above-mentioned aqueous solid chip adhiesion test can be carried out as following.
[aqueous solid chip adhiesion test]
Prepare the aqueous solid chip sample for test.As aqueous solid chip sample, use the sample formed by the aqueous solution being dissolved with surfactant in aggregate and water.Specifically, the aqueous solution that aqueous solid chip sample adds the surfactant comprising 5 % by weight in aggregate obtains, and the addition of this aqueous solution in aggregate is 20 weight portions relative to aggregate 100 weight portion.As aggregate, use and utilize that sieve test method obtains, that medium particle diameter is in the scope of 1.20 ~ 1.50mm material.As aggregate, preferably use silica sand.For the silica sand being added with aqueous surfactant solution, be such as used in polybag carry out fully vibration etc. make moisture overall and the sample spread all over equably as aqueous solid chip sample.The mode that ready aqueous solid chip sample spreads out with the bottom surface of the pallet (pallet of the stainless steel of such as 240mm × 320mm) smooth in bottom surface entirety configures.Press thereon by overall with it for the cohesive surface of bonding cleaner with the mode of aqueous solid chip sample contacts, make aqueous solid chip sample be attached to the cohesive surface of bonding cleaner.The consumption of aqueous solid chip sample is set to about 200g.Then, measure the weight W1 (g) of bonding cleaner after aqueous solid chip sample is adhered to, the difference according to initial weight W0 (g) of the bonding cleaner before adhering to the aqueous solid chip sample measured in advance obtains aqueous solid chip sample adhesion amount W2 (W2 (g)=W1-W0).With the area (m of this W2 (g) divided by the cohesive surface of bonding cleaner 2), obtain every 1m thus 2the aqueous solid chip sample adhesion amount A on cohesive surface c(g/m 2).
It should be noted that, as the silica sand used in above-mentioned test, can use: Shintocolorsand34 series (Xin Dongtao expects colored aggregate that Co., Ltd. manufactures (at the surface of silica sand (natural silica, corundum, basalt, sandstone, volcanic ash float stone etc.) sintering deposition pottery chinaware inorganic pigment), medium particle diameter 1.20 ~ 1.50mm, size specification 0.5 ~ 2.4mm).Water can use distilled water or deionized water (ion exchange water).As surfactant, 40% triethanolamine lauryl sulfate solution (Wako Pure Chemical Industries, Ltd.'s manufacture) can be used.
In addition, when the solid debris capture unit of bonding cleaner is one side bonding sheet, it is desirable to implement aqueous solid chip adhiesion test as described below, described one side bonding sheet possesses the supporting substrate of sheet and is configured at a surface of this supporting substrate and forms the adhesive phase on cohesive surface.
The solid debris capture unit (one side bonding sheet) of the bonding cleaner as determination object is cut into the size of 150mm × 150mm, make test sample, as the mode in outside, test samples stick roll up the entirety of the outer surface (outer peripheral face) of (diameter (external diameter) 48mm, width 160mm) 30 in the bonding sheet of the bonding cleaner 10 shown in Fig. 1,2 using this cohesive surface, making test cleaner thus.Then, the mode that the above-mentioned aqueous solid chip sample of 200g spreads out with the bottom surface of the pallet (pallet of the stainless steel of 240mm × 320mm) smooth in bottom surface entirety is configured.Herein, as shown in Figure 4, the cohesive of the test cleaner 10 ' made surface 32A is made to carry out contacting and rotating, make its scope one end of the length direction from pallet T to the other end reciprocate 2 times, thus make aqueous solid chip sample 100 be attached to cohesive surface 32A.Measure the weight W1 (g) of the test cleaner 10 ' after aqueous solid chip sample 100 is adhered to, according to the difference of initial weight W0 (g) of the test cleaner 10 ' before adhering to the aqueous solid chip sample measured in advance, obtain aqueous solid chip sample adhesion amount W2 (W2 (g)=W1-W0).Area (the m of the cohesive surface 32A exposed divided by test sample with this W2 (g) 2), obtain every 1m thus 2the aqueous solid chip sample adhesion amount A on cohesive surface c(g/m 2).
As the test cleaner used in mensuration, be not particularly limited, such as, gross weight can be used to be about 100 ~ 500g, bonding sheet rolls up the cleaner that weight is about 10 ~ 250g, rolling member weight is about 10 ~ 50g.As aqueous solid chip sample, above-mentioned sample can be used.Aqueous solid chip adhiesion test more specifically can be undertaken by the assay method described in embodiment described later.It should be noted that, about above-mentioned aqueous solid chip sample adhesion amount A cfeature can be used as a specific preferred feature of the present invention and held, formation non-essential for the purpose of the present invention.Therefore, the present invention also comprises not restriction about above-mentioned aqueous solid chip sample adhesion amount A cthe formation of feature.
Bonding cleaner disclosed herein makes to be attached with this bonding cleaner of above-mentioned aqueous solid chip sample (typically, bonding cleaner by the method for above-mentioned aqueous solid chip adhiesion test makes aqueous solid chip sample adhere to) the aqueous solid chip that falls to hard surface from the height of 5cm comes off test, aqueous solid chip sample expulsion rate A dpreferred display is less than 50%.Even if the impact that the bonding cleaner meeting this characteristic applies to specify also can suppress the amount of coming off of aqueous solid chip sample, therefore, the retentivity of aqueous solid chip is excellent.Above-mentioned expulsion rate A dbe more preferably less than 40%, more preferably less than 30%, be particularly preferably less than 20%.The test that comes off of above-mentioned aqueous solid chip can be carried out as following.
[aqueous solid chip come off test]
After carrying out above-mentioned aqueous solid chip adhiesion test, aqueous solid chip can be carried out in succession to come off test.On hard surface (typically, the rigid planar face by metal, plastics or wood formation), the mode of the height being 5cm apart from above-mentioned hard surface with the foot of solid debris capture unit configures bonding cleaner.Then, bonding cleaner is highly made to fall from this, measure the weight W4 (g) of the bonding cleaner after falling, according to measure in advance fall before the difference of weight W3 (g) (also can for W1) of bonding cleaner, obtain the aqueous solid chip sample amount of coming off W5 (W5 (g)=W3-W4) after above-mentioned falling.Then, according to formula: A d(%)=W5/ (W3-W0) × 100; Obtain aqueous solid chip sample expulsion rate A d(%).It should be noted that, in above formula, W0 is the initial weight (g) of bonding cleaner before the attachment of aqueous solid chip sample.
In addition, when the solid debris capture unit of bonding cleaner is one side bonding sheet, it is desirable to implement as in the following manner in succession aqueous solid chip after the aqueous solid chip adhiesion test using one side bonding sheet to come off test, the supporting substrate that described one side bonding sheet possesses sheet and the surface being configured at this supporting substrate and form the adhesive phase on cohesive surface.
As shown in (a) of Fig. 5, on the G of rigid planar face, to make the bonding sheet of test cleaner 10 ' roll up the Cylindorical rod of 30 to the mode of the height (height shown in the symbol h in (a) of Fig. 5) being 5cm apart from above-mentioned rigid planar face G for lower end that is vertical and bonding sheet volume 30, the end of handle 52 side holding component 50 is fixed in the mode can rotated along the vertical direction on fixture J.Configuration space thing (not shown) etc. between the lower end of 30 and rigid planar face G can be rolled up at bonding sheet and test cleaner 10 ' is remained above-mentioned height.Then, pump above-mentioned sept etc., as shown in (b) of Fig. 5, make the bonding sheet of test cleaner 10 ' roll up 30 sides and fall.Measure the weight W4 (g) of the test cleaner 10 ' after falling, according to measure in advance fall before the difference of weight W3 (g) (also can for W1) of test cleaner 10 ', obtain the aqueous solid chip sample amount of coming off W5 (W5 (g)=W3-W4) after above-mentioned falling.Then, according to formula: A d(%)=W5/ (W3-W0) × 100; Obtain aqueous solid chip sample expulsion rate A d(%).As the test cleaner used in mensuration, be not particularly limited, such as, gross weight can be used to be about 100 ~ 500g, bonding sheet rolls up the cleaner that weight is about 10 ~ 250g, rolling member weight is about 10 ~ 50g.As aqueous solid chip sample, above-mentioned sample can be used.Aqueous solid chip is come off to test and more specifically can be undertaken by the assay method described in embodiment described later.
The cohesive surface of bonding cleaner disclosed herein preferably demonstrates the 180 degree of peel strengths being less than 14N/20mm (be such as less than 10N/20mm, be typically less than 8N/20mm).As described above, peel strength is suppressed to the clean operation excellence of the bonding cleaner of below setting.Above-mentioned 180 degree of peel strengths are the measured value based on the 180 degree of disbonded tests to stainless steel (SUS304) plate specified in JISZ0237.From the view point of solid debris seizure property, the lower limit of above-mentioned 180 degree of peel strengths is preferably set to more than 3N/20mm (such as more than 5N/20mm).
The mensuration of above-mentioned peel strength is specifically carried out in the steps below.Prepare test film solid debris capture unit (typically being bonding sheet) being cut into rectangle sheet.Test film is preferably set to length about 100 ~ 200mm, and width is preferably set to about 15 ~ 30mm.When width is not 20mm, (conversion) [N/20mm] can be calculated according to the width of reality and the ratio of datum width 20mm.Thickness is not particularly limited.Make the roller round trip of 2kg, make the cohesive surface of gained test film (such as adhesive phase side surface) adhere to stainless steel (SUS304) plate.Test film is two sides such as two sides bonding sheet when having fusible test film, preferably carries out lining to PETG (PET) film being in the surface thickness about 25 μm of opposition side with mensuration face.By its 23 DEG C, keep 30 minutes under the environment of RH50%, then cupping machine is used, according to JISZ0237,23 DEG C, under the environment of RH50%, with the condition of peel angle 180 degree, draw speed 300mm/ minute, measure 180 degree of peel strengths (to SUS bonding force [N/20mm].Cupping machine is not particularly limited, and can use known cupping machine." Tensilon " that Shimadzu Scisakusho Ltd such as can be used to manufacture measures.
In addition, when bonding cleaner disclosed herein has bonding sheet volume, bonding sheet volume has coordinated bonding force (typically being above-mentioned 180 degree of peel strengths) and debatching power preferably in the generation of track drawing (raildrawing) phenomenon suppressed on cleaned region (such as floor, carpet).Herein, debatching power refers to, extracts power needed for bonding sheet (namely to the resistance of debatching, also can hold as the bonding force at the back side (typically being the back side of supporting substrate) to bonding sheet) out from bonding sheet volume.Such as, compared with bonding force, when debatching power is too low setting, when bonding sheet being twisted in roll in cleaned region, debatching power is had to be defeated by the bonding force between bonding sheet (typically being adhesive phase) and above-mentioned surface and to produce the worry of track drawing.On the other hand, when debatching power is too high, there is the tendency that bonding sheet cannot be drawn out of smoothly.
Debatching power can be evaluated as follows.Namely, can obtain as follows: cupping machine bonding sheet volume being installed on regulation, under the environment of temperature 23 DEG C, RH50%, outer circumferential side front end through Juan Rao bonding sheet is installed on the chuck of testing machine, stretch with the speed of 300mm/ minute, thus bonding sheet is rolled up debatching in tangential direction, debatching power is now scaled the value (N/150mm) of the per unit width (such as 150mm) of the adhesive phase of such as bonding sheet, thus obtains.Such as debatching power is preferably about 0.5 ~ 2.5N/150mm.
< adhesive >
The adhesive (such as adhesive phase) forming solid debris capture unit (such as bonding sheet) disclosed herein is not particularly limited, such as, can be the adhesive formed by adhesive compositions such as the aqueous adhesive such as aqueous adhesive composition, water-dispersed pressure-sensitive adhesive composition composition or solvent type adhesive compositions.In addition, also the non-solvent adhesive formed by active energy ray curable adhesive composition can preferably be used.Wherein, preferred water system adhesive composition, more preferably aqueous adhesive composition.
As above-mentioned adhesive, can enumerate: elastomeric adhesive, acrylic adhesives, carbamate system adhesive, silicon-type adhesive etc.From the view point of bond properties, cost, can preferably adopt elastomeric adhesive or acrylic adhesives.Wherein, particularly preferably acrylic adhesives.
As elastomeric adhesive, can enumerate: by the natural rubber based polymers such as natural rubber, its modifier, isoprene rubber, neoprene, SIS, SBS, styrene-ethylene/butylene-styrene block copolymer one kind or two or more based on the adhesive of polymer.It should be noted that, base polymer refers to main component, main adhesive composition in component of polymer.The compounding ratio of the base polymer in adhesive disclosed herein is in solid constituent benchmark preferably more than about 50 quality % (such as more than 60 quality %), and the upper limit of its compounding ratio can be below 100 quality % (such as below 90 quality %).
As acrylic adhesives, the acrylic adhesives containing polymer based on acrylic polymer preferably can be used.Acrylic polymer can synthesize by comprising the raw material monomer of acrylic monomer as principal monomer.Acrylic monomer refers in 1 molecule the monomer at least with (methyl) acryloyl group herein.In addition, principal monomer refers to the monomer component of more than the 50 quality % (such as more than 70 quality %, typically be more than 80 quality %) accounting for whole monomer component (raw material monomer).It should be noted that, in this description, acrylic monomer refers to monomer, the oligomer with (methyl) acrylic acid structure, (methyl) acrylate structural.In addition, in this description, " (methyl) acrylate " refers to the implication comprising acrylate and methacrylate.Similarly, " (methyl) acryloyl group " refers to the implication comprising acryloyl group and methacryl, and " (methyl) acrylic acid " refers to the implication comprising acrylic acid and methacrylic acid.
As the above-mentioned raw material monomer comprising acrylic monomer, can enumerate: containing Alkoxy monomeric, carboxyl group-containing monomer, (methyl) alkyl acrylate, containing anhydride group monomer, hydroxyl (hydroxy) monomer, amide-containing monomer, emulsion stability, have nitrogen atom ring monomer, containing epoxy radicals (glycidyl) monomer, containing alkoxysilyl monomer, containing sulfonic group monomer, vinyl acetate system monomer, aromatic ethenyl compound.They can be used alone a kind or combine two or more use.
As the concrete example containing Alkoxy monomeric, such as, can enumerate: alkoxy polyalkyleneglycol (methyl) acrylate such as methoxy poly (ethylene glycol) (methyl) acrylate, ethoxydiglycol (methyl) acrylate, butoxy diethylene glycol (methyl) acrylate (being more specifically alkoxyl polyethylene glycol (methyl) acrylate); (methyl) alkoxyalkyl acrylates etc. such as (methyl) methoxyethyl acrylate, (methyl) ethoxyethyl acrylate, (methyl) acrylic acid fourth oxygen ester.They can be used alone a kind or combine two or more use.As (methyl) alkoxyalkyl acrylate, preferably use (methyl) acrylic acid alkoxy ester with the alkoxyl of carbon number 1 ~ 4 (more preferably 1 or 2).
As carboxyl group-containing monomer, such as, can enumerate: the ethylenically unsaturated dicarboxylics etc. such as olefinic unsaturated monocarboxylic, itaconic acid, maleic acid, fumaric acid, citraconic acid such as acrylic acid, methacrylic acid, crotonic acid, (methyl) carboxyethyl acrylates, (methyl) acrylic acid carboxyl pentyl ester.In addition, (methyl) acrylic acid caprolactone addition product can also preferably be used.
As (methyl) acrylic acid caprolactone addition product, specifically, caprolactone (methyl) acrylate shown in following formula (1) is preferably:
(in formula (1), R 1represent hydrogen atom or methyl, n is in the scope of 1 ~ 10).More preferably the R in formula (1) 1n for hydrogen atom and in formula (1) is in the scope of 1 ~ 5.As carboxyl group-containing monomer, when combinationally using (methyl) acrylic acid caprolactone addition product and carboxyl group-containing monomer (such as acrylic acid, methacrylic acid) beyond it, the ratio that (methyl) acrylic acid caprolactone addition product accounts for the total amount of carboxyl group-containing monomer is preferably set to more than 50 quality % (such as more than 70 quality %, typically be more than 90 quality %).Carboxyl group-containing monomer also can be in fact all (methyl) acrylic acid caprolactone addition product.In other words, technology disclosed herein can be implemented not use the mode of the carboxyl group-containing monomer beyond (methyl) acrylic acid caprolactone addition product.
As the concrete example of (methyl) alkyl acrylate, such as, can enumerate: (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate, (methyl) isoamyl acrylate, (methyl) acrylic acid peopentyl ester, (methyl) Hexyl 2-propenoate, (methyl) heptylacrylate, (methyl) 2-ethyl hexyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) acrylic acid-2-ethyl caproite, (methyl) acrylic acid ester in the ninth of the ten Heavenly Stems, (methyl) acrylic acid ester in the different ninth of the ten Heavenly Stems, (methyl) decyl acrylate, (methyl) isodecyl acrylate, (methyl) acrylic acid norbornene ester, (methyl) isobornyl acrylate, (methyl) acrylic acid hendecane ester, (methyl) lauryl ester etc.Acrylic polymer disclosed herein also can be use not containing the polymer that the raw material monomer of the composition of above-mentioned (methyl) alkyl acrylate synthesizes.
As containing anhydride group monomer, such as, can enumerate: the acid anhydrides etc. of the above-mentioned ethylenically unsaturated dicarboxylic such as maleic anhydride, itaconic anhydride etc.
As hydroxyl (hydroxy) monomer, such as, can enumerate: the unsaturated alcohols etc. such as (methyl) hydroxyalkyl acrylates class, N-methylol (methyl) acrylamide, vinyl alcohol, allyl alcohol, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl base ether such as (methyl) acrylic acid 2-hydroxy methacrylate, (methyl) 2-hydroxypropyl acrylate, (methyl) acrylic acid-3-hydroxy propyl ester, (methyl) acrylic acid-2-hydroxybutyl, (methyl) acrylic acid-4-hydroxybutyl.
As amide-containing monomer, such as can enumerate: (methyl) acrylamide, N, N-dimethyl (methyl) acrylamide, N-butyl (methyl) acrylamide, N-methylol (methyl) acrylamide, N-hydroxymethyl-propane (methyl) acrylamide, N-methoxy (methyl) acrylamide, N-butoxymethyl (methyl) acrylamide etc.
As emulsion stability, such as, can enumerate: (methyl) acrylate, (methyl) acrylic acid-N, N-dimethylamino ethyl ester, (methyl) tbutylaminoethylacrylate etc.
As the monomer with nitrogen atom ring, such as, can enumerate: NVP, N-methyl ethylene pyrrolidones, N-vinylpyridine, N-vinylpiperidone, N-vinyl pyrimidine, N-vinyl piperazine, N-vinylpyrazine, N-vinyl pyrrole, N-vinyl imidazole, N-Yi Xi Ji oxazole, N-polyvinyl morpholinone, N-caprolactam, N-(methyl) acryloyl morpholine etc.
As containing epoxy radicals (glycidyl) monomer, such as, can enumerate: (methyl) glycidyl acrylate, (methyl) acrylic acid methylglycidyl esters, allyl glycidyl ether etc.
As containing alkoxysilyl monomer, such as, can enumerate: 3-(methyl) acryloxypropyl trimethoxy silane, 3-(methyl) acryloxypropyl triethoxysilane, 3-(methyl) acryloxypropyl dimethoxysilane, 3-(methyl) acryloxypropyl diethoxy silane etc.
As containing sulfonic group monomer, can enumerate: sodium vinyl sulfonate, SSS, 2-acrylamide-2-methyl propane sulfonic acid sodium etc.
As vinyl acetate system monomer, can enumerate: vinyl acetate, propionate etc.
As aromatic ethenyl compound, can enumerate: styrene, substituted phenylethylene (AMS etc.), vinyltoluene etc.
When acrylic polymer disclosed herein to comprise containing Alkoxy monomeric and/or carboxyl group-containing monomer as monomer component, the total copolymerization ratio containing Alkoxy monomeric and carboxyl group-containing monomer in aforesaid propylene acids polymers is preferably more than 15 quality %.Thus, give hydrophily to above-mentioned polymer, the adsorptivity of aqueous solid chip improves, and the retentivity of the aqueous solid chip caught due to the raising of water-swellable improves.The total copolymerization ratio containing Alkoxy monomeric and carboxyl group-containing monomer in aforesaid propylene acids polymers is more preferably more than 50 quality % (such as more than 80 quality %, typically be more than 90 quality %).The above-mentioned upper limit containing total copolymerization ratio of Alkoxy monomeric and carboxyl group-containing monomer is not particularly limited, as long as be below 100 quality %, such as, also can be below 95 quality % (typically being below 85 quality %).It should be noted that, in this description, copolymerization ratio and the compounding ratio corresponding (consistent) for the synthesis of each monomer component in the raw material monomer of polymer of each monomer component in polymer.
When acrylic polymer disclosed herein is the polymer obtained containing Alkoxy monomeric and carboxyl group-containing monomer copolymerization, mass ratio containing Alkoxy monomeric (such as (methyl) alkoxyalkyl acrylate, specifically for methoxyethyl acrylate) and carboxyl group-containing monomer (such as (methyl) acrylic acid caprolactone addition product, be specifically caprolactone acrylate) is not particularly limited, such as, be preferably set to 3:7 ~ 8:2 (typically being 5:5 ~ 7:3).
When acrylic polymer disclosed herein is the polymer obtained containing Alkoxy monomeric and/or carboxyl group-containing monomer copolymerization, for objects such as the raising of bonding force, the raisings being imported the cohesive force brought by crosslinking points, herein in disclosed acrylic polymer, also can copolymerization can with above-mentioned other monomers containing Alkoxy monomeric and/or carboxyl group-containing monomer copolymerization.As this can other monomers of copolymerization, such as can enumerate above-mentioned various monomer ((methyl) alkyl acrylate, containing anhydride group monomer, hydroxyl (hydroxy) monomer, amide-containing monomer, emulsion stability, have nitrogen atom ring monomer, containing epoxy based monomers, containing alkoxysilyl monomer, containing sulfonic group monomer, vinyl acetate system monomer, aromatic ethenyl compound etc.).
Use above-mentioned can other monomers of copolymerization time, the copolymerization ratio of these monomer components in acrylic polymer is below 85 quality % (such as below 50 quality %, typically be below 20 quality % and then be below 10 quality %) left and right.The lower limit of above-mentioned copolymerization ratio can be such as more than 5 quality % (typically being more than 15 quality %).Acrylic polymer disclosed herein also can for use in fact containing above-mentioned can the polymer that synthesizes of the raw material monomer of other monomers of copolymerization.
The method of above-mentioned monomer or its polymerization of mixtures is not particularly limited, known general polymerization can be adopted.As such polymerization, such as, can enumerate: polymerisation in solution, emulsion polymerisation, polymerisation in bulk, suspension polymerisation.Wherein, preferred solution polymerization.The mode of polymerization is not particularly limited, and can suitably select the use composition (polymerization initiator etc.) beyond known monomer supply method, polymerizing condition (temperature, time, pressure etc.), monomer to carry out.Such as monomer supply method, can by disposable for whole monomer mixture supply (supplying in the lump) to reaction vessel, also can drip lentamente and carry out supplying (supplying continuously), can also be divided into and several times supply each component (segmentation supply) every the stipulated time.Above-mentioned monomer or its mixture can also with make its part or all be dissolved in the form supply of the form of the solution in solvent or the dispersion liquid of emulsification in a solvent.
As polymerization initiator, be not particularly limited, such as can enumerate: 2, the combination etc. of replacement ethane series initiators, peroxide and the sodium ascorbates such as the peroxide series initiators such as azo series initiators, the benzoyl peroxides such as 2 '-azodiisobutyronitrile, phenyl replacement ethane is combined with the redox series initiators etc. of peroxide and reducing agent.The consumption of polymerization initiator suitably can be selected according to kind of the kind of polymerization initiator, monomer (composition of monomer mixture) etc., usually relative to whole monomer component 100 mass parts, it is suitable for such as selecting from the scope about 0.005 ~ 1 mass parts.Polymerization temperature such as can be set to 20 DEG C ~ 100 DEG C (typically being 40 DEG C ~ 80 DEG C) left and right.
In addition, preferred compounding crosslinking agent in adhesive composition.Such as the crosslinking agent of acrylic adhesives, the organic metal salt such as zinc stearate, barium stearate, epoxy crosslinking agent, isocyanate-based crosslinking agent etc. can be enumerated as suitable example.Also can to make with oxazoline system crosslinking agent, aziridine system crosslinking agent, metal-chelating system crosslinking agent, melamine series crosslinking agent.These crosslinking agents can be used alone a kind or combinationally use two or more.Wherein, from can carrying out aptly being cross-linked with carboxyl and easily obtaining the also excellent aspect of good operability (typically being light fissility) and then acid resistance, preferred epoxy crosslinking agent, isocyanate-based crosslinking agent, particularly preferably epoxy crosslinking agent.
As the concrete example of epoxy crosslinking agent, can enumerate: the epoxy crosslinking agent in molecule with more than 2 epoxy radicals (glycidyl).As such epoxy crosslinking agent, such as can enumerate: the epoxy resin of bisphenol-A/epoxychloropropane type, D-sorbite polyglycidyl ether, polyglycereol polyglycidyl ether, pentaerythrite polyglycidyl ether, two glycerine polyglycidyl ethers, glycerine polyglycidyl ether, trimethylolpropane polyglycidyl ether, neopentylglycol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, ethylene glycol diglycidylether, diethylene glycol diglycidyl glycerin ether, polyethyleneglycol diglycidylether, propylene glycol diglycidylether, polypropylene glycol diglycidyl ether, 2-glycidyl aniline, N, N, N ', N '-four glycidols-m-xylene diamine, 1, two (the N of 3-, N '-2-glycidyl amino methyl) cyclohexane etc.Wherein, from the view point of the water-swellable after crosslinked, preferred polyethyleneglycol diglycidylether.
The compounding amount of crosslinking agent is not particularly limited, from the view point of obtain good bonding force viewpoint, make crosslinked after water-swellable be the seizure that good scope improves aqueous solid chip, relative to base polymer (such as acrylic polymer) 100 mass parts, be preferably set to 0.01 ~ 10 mass parts (such as 0.05 ~ 5 mass parts, typically be 0.1 ~ 5 mass parts) left and right.
In addition, as the solvent used, can enumerate: water; The alcohol such as methyl alcohol, ethanol, butanols, isobutanol, cyclohexanol, 2 methyl cyclohexanol, tridecanol; The aliphatic hydrocarbons such as hexane, heptane, mineral spirits; The ester ring type hydrocarbon such as cyclohexane; The aromatic hydrocarbons such as toluene, dimethylbenzene, solvent naphtha, tetrahydronaphthalene, cinene; The ester classes such as methyl acetate, ethyl acetate, isopropyl acetate, butyl acetate; The ketone such as acetone, MEK; Deng.Wherein, the mixed solvent etc. of the alcohol such as the aqueous solvent be preferably only made up of water, water and methyl alcohol.
It should be noted that, use the molecular weight (Mw: weight average molecular weight) of the base polymer (such as acrylic polymer) of (synthesis) to be not particularly limited, the polymer (such as acrylic polymer) of the weight average molecular weight (Mw) with roughly 30 ten thousand ~ about 1,000,000 can be used aptly.
Adhesive in technology disclosed herein preferably comprises water-soluble plasticizer.As such water-soluble plasticizer, various polyalcohol (preferred, polyethers polyalcohol) can be used.Specifically, can enumerate: polyethylene glycol, polypropylene glycol, polyoxypropylene sorbose alcohol ether, polyglycereol, polyoxyethylene glycerol ether etc.They can be used alone a kind or combine two or more use.
The compounding amount of water-soluble plasticizer is not particularly limited, relative to base polymer (such as acrylic polymer) 100 mass parts, be preferably set to more than 10 mass parts (more than such as 20 mass parts, typically being more than 30 mass parts) left and right.Thus, the tendency that the bonding force of adhesive improves, the seizure of aqueous solid chip improves is had.In addition, the upper limit of the compounding amount of water-soluble plasticizer is not particularly limited, from the view point of the reduction suppressing shearing force, relative to base polymer (such as acrylic polymer) 100 mass parts, be preferably set to below 100 mass parts (below such as 70 mass parts, typically being below 50 mass parts).
Tackifier can be comprised as required in adhesive herein in disclosed technology.As tackifier, known tackifying resin etc. in the field of adhesive can be used.Such as can enumerate: hydrocarbon system tackifying resin, terpenic series tackifying resin, rosin series tackifying resin, phenol system tackifying resin, epoxy tackifying resin, polyamide-based tackifying resin, elastic system tackifying resin, ketone system tackifying resin etc.They can be used alone a kind or combine two or more use.
As the example of hydrocarbon system tackifying resin, can enumerate: the resin of the various hydrocarbon system such as fatty family hydrocarbon resin, fragrant family hydrocarbon resin (xylene resin etc.), fatty family cyclic hydrocarbon resin, aliphatic/aromatic through-stone oleoresin (styrene-olefin based copolymer etc.), aliphatic/alicyclic through-stone oleoresin, hydrogenated hydrocarbon resins, coumarone system resin, coumarone-indenes system resin.As the example of terpenic series tackifying resin, can enumerate: the terpene system resins such as australene polymer, beta-pinene polymer; By the modified terpene system resin (such as terpenes phenol resin, styrenated terpene system resin, hydriding terpene system resin, hydriding terpene phenol resin etc.) of these terpenic series resin modifieds (phenol modification, aromatic modified, hydrogenation modification etc.); Deng.As the example of rosin series tackifying resin, can enumerate: the unmodified rosin such as gum rosin, wood rosin (pine gum); By the modified rosin (Foral, disproportionated rosin, newtrex, other rosin etc. through chemical modification) of these unmodified rosin by modifications such as hydrogenation, disproportionation, polymerizations; Other various rosin derivatives; Deng.As the example of the tackifying resin of phenol system, can enumerate: the alkyl phenolic resin of resol type or phenolic varnish type.Wherein, as preferred tackifier, can enumerate: terpenic series resin, modified terpene system resin and alkyl phenolic resin.
The softening point of tackifier is not particularly limited, and obtains solid debris seizure property, preferably less than 160 DEG C, more preferably less than 140 DEG C from the view point of raising bonding force.In addition, from the view point of the excessive rising avoiding bonding force, preferably more than 60 DEG C, more preferably more than 80 DEG C.
The compounding amount of tackifier is not particularly limited, from the view point of the excessive rising avoiding bonding force, such as relative to base polymer (such as acrylic polymer) 100 mass parts, below 50 mass parts can be set to, it is suitable for being generally below 40 mass parts, preferably below 30 mass parts.In addition, from the view point of the compounding effect brought playing tackifier better, it is suitable that the compounding amount relative to base polymer 100 mass parts is such as set to more than 1 mass parts.Or also can be in fact not containing the adhesive of such tackifier.
In adhesive composition (or adhesive, adhesive phase) herein in disclosed technology, than that described above, can also water-soluble polymer, age resistor, antioxidant, ultra-violet absorber, light stabilizer, antistatic additive, the colouring agent (pigment, dyestuff etc.) etc. such as compounding polyvinyl alcohol, PVP, nertralizer (ammoniacal liquor, NaOH, potassium hydroxide etc.), adhesive field in known various adding ingredient.The kind of the adding ingredient of these nonessential compositions, compounding amount are set to identical with compounding amount with the common kind in this kind of adhesive.
< adhesive phase >
When disclosed adhesive composition forms adhesive (such as adhesive phase) from here, its formation method is not particularly limited.Such as can with the following method: use mould to be coated with the known applicator means such as machine, gravure coater, adhesive composition directly to be given on (typically be and smear) to supporting substrate and to make it dry.In addition, also can adopt with the following method (transfer printing): by above-mentioned adhesive composition is imparted to the good surface of fissility (such as, the surface of release liner, the supporting substrate back side etc. through demoulding process) and make it dry, thus form adhesive phase on a surface, this adhesive phase is transferred to supporting substrate.Also can be the adhesive phase without base material type above-mentioned adhesive composition being imparted to the good surface of fissility and making its drying.
The thickness of adhesive phase suitably can be selected according to object, is not particularly limited.From the view point of obtaining sufficient aqueous solid chip seizure property, the thickness of adhesive phase is preferably set to more than about 5 μm (such as more than 10 μm, typically be more than 20 μm), in addition, be preferably set to less than 300 μm (such as less than 150 μm, typically be less than 100 μm and then less than 50 μm).
When forming adhesive phase on the surface of supporting substrate, adhesive phase can be formed throughout of a supporting substrate surperficial four corner, or also such as can have along the two ends of the width of supporting substrate the non-adhering portion (dry edge) not forming adhesive phase.In addition, adhesive phase is typically formed continuously, but also can be formed as rule or the random pattern such as point-like, striated according to object and purposes.And then adhesive phase also can comprise the sandwich construction of more than 2 layers.Also the adhesive phase of 2 following Rotating fields can be made: the adhesive phase in technology disclosed herein is formed as continuous print film on a surface of supporting substrate, and known adhesive phase is formed as 2 Rotating fields of striated etc. thereon.Also the adhesive phase of 2 following Rotating fields can be made on the contrary: known adhesive phase is formed as continuous print film on a surface of supporting substrate, and the adhesive phase in technology disclosed herein is formed as 2 Rotating fields of striated etc. thereon.
< supporting substrate >
Solid debris capture unit disclosed herein, such as when possessing supporting substrate as embodiment described above, as supporting substrate, can use the material be made up of various synthetic resin, non-woven fabrics or paper.The material of supporting substrate can be cloth, sheet rubber, foaming body piece, metal forming, their complex etc.
As the example of synthetic resin, can enumerate: polyolefin (polyethylene, polypropylene, ethylene-propylene copolymer etc.), polyester (PETG etc.), vinyl chloride resin, vinyl acetate resin, polyimide resin, polyamide, fluororesin etc.Especially the supporting substrate that PETG (PET) is made can be used aptly.In addition, as paper, can enumerate: Japan paper, brown paper, glassine paper, good quality paper, synthetic paper, coated paper etc.As the example of cloth, can enumerate: various fibrous material make separately or utilize blending etc. and make weave cotton cloth, non-woven fabrics etc.As above-mentioned fibrous material, can enumerate: cotton, staple fiber, abaca, paper pulp, artificial silk, typel, polyester fiber, vinal, Fypro, polyolefine fiber etc.As the example of sheet rubber, can enumerate: natural rubber sheet, butyl rubber sheet etc.As the example of foaming body piece, can enumerate: polyurathamc sheet, foaming neoprene latex sheet etc.As the example of metal forming, can enumerate: aluminium foil, Copper Foil etc.Can the various additive such as compounding filler (inorganic filler, organic filler etc.), age resistor, antioxidant, ultra-violet absorber, light stabilizer, antistatic additive, lubricant, plasticizer, colouring agent (pigment, dyestuff etc.) as required in supporting substrate.
In addition, as solid debris capture unit, adopt when being formed with the one side bonding sheet of adhesive phase on the one side of supporting substrate, that preferably implements organosilicon series stripping agent to the back side (non-adhesive layers forming surface) of above-mentioned supporting substrate the surface treatment (typically being the lift-off processing preventing debatching power from becoming too high) being adjusted to suitable scope for the debatching power of being rolled up by bonding sheet such as to smear.
The thickness of above-mentioned supporting substrate suitably can be selected according to object, is not particularly limited.In general, preferably above-mentioned thickness is set to more than about 20 μm (such as more than 30 μm, typically be more than 40 μm), be set to less than 200 μm (such as less than 150 μm, typically be less than 100 μm so that be less than 70 μm) left and right is suitable.Such as, above-mentioned thickness can preferably be adopted to synthetic resin, non-woven fabrics, supporting substrate made of paper.When supporting substrate is for foaming body piece, its thickness is preferably about 0.6 ~ 3mm (such as about 0.6 ~ 2mm, typically be about 0.8 ~ 1.2mm).
Below, illustrate about embodiments of the invention, but not limit the invention to the scope shown in these concrete examples.It should be noted that, if do not mentioned especially, " part " and " % " in below illustrating is quality criteria.
< example 1 >
Under non-active gas atmosphere, by the caprolactone acrylate (trade name " AronixM-5300 " that Toagosei Co., Ltd manufactures, the mean value of the n in above-mentioned formula (1) is about the ω-carboxyl-polycaprolactone single-acrylate of 1.8) 24 parts, acrylic acid-2-methoxy acrylate 33 parts, 5 parts, potassium hydroxide (being dissolved in purified water 28 parts), SSS 5 parts (being dissolved in purified water 30 parts) dissolves equably and is mixed in methyl alcohol 73 parts, add 2 as polymerization initiator, 2 '-azodiisobutyronitrile 0.1 part, carry out polymerisation, prepare the solution of acrylic polymer.Then, relative to acrylic polymer 100 parts, mixing water-soluble plasticizer 40 parts and crosslinking agent 2 parts, prepare acrylic pressure-sensitive adhesive compositions.
As water-soluble plasticizer, use polyoxypropylene sorbose alcohol ether (poly-hexahydroxylic alcohols, SanyoChemicalIndustries, Ltd., the trade name " SannixSP750 " of manufacture).As crosslinking agent, use 2 functional epoxide compound (trade name " DENACOLEX-830 " that NagaseChemteXCorporation manufactures, the degree of polymerization (n) are about the diglycidyl ether of the polyethylene glycol of 9).
Acrylic pressure-sensitive adhesive compositions obtained above is applied in a surface of supporting substrate, then at 110 DEG C, carry out the drying process of 3 minutes, thus the one side being produced on supporting substrate is formed with the one side bonding sheet that thickness (glue is thick) is about the adhesive phase of 20 μm.As supporting substrate, another surface (being in face, the i.e. back side of opposition side with the face the being formed with adhesive phase) upper strata being used in the paper of thickness 50 μm is pressed with the supporting substrate of the polyethylene film of thickness 20 μm.The lift-off processing utilizing silicon-type remover is implemented to the surface of this polyethylene film.Gained one side bonding sheet is wound in the surface of cylindric retaining member made of paper, thus forms bonding sheet volume.Then, prepare the cleaner main member 15 as being schematically shown in Fig. 1,2, the rolling member of cylindric (there is hollow space) of this polypropylene installs above-mentioned retaining member, constructs the bonding cleaner of example 1 thus.
< example 2 >
Prepare the elastomeric adhesive composition of the styrene-isoprene-styrene copolymer-(SIS) 100 parts of polymer based on comprising, tackifying resin 100 parts, process oil 100 parts.It is extruded under heating and melting state, the face spreading upon supporting substrate is carried out drying process, thus the one side being produced on supporting substrate is formed with the one side bonding sheet that thickness (glue is thick) is about the adhesive phase of 15 μm.As SIS, use the trade name " Quintac3520 " that ZeonCorporation manufactures.As tackifying resin, use the trade name " Escorez1310 " that TonenChemicalCorporation manufactures.As process oil, use the trade name " KnifeRex222B " that JAPANCHEMTECHLTD. manufactures.Use above-mentioned one side bonding sheet, in addition, construct the bonding cleaner of example 2 in the same manner as example 1.
< example 3 >
The elastomeric adhesive composition of preparation in example 2 is extruded under heating and melting state, the face spreading upon supporting substrate is carried out drying process, thus the one side being produced on supporting substrate is formed with the one side bonding sheet that thickness (glue is thick) is about striated (width of fringe 1.0mm, the spacing 1.0mm) adhesive phase of 20 μm.Use above-mentioned one side bonding sheet, in addition, construct the bonding cleaner of example 3 in the same manner as example 1.
[aqueous solid chip adhiesion test]
The one side bonding sheet of each example is cut into 150mm × 150mm (area 0.0225m on cohesive surface 2) size, make test sample.Be the entirety that the mode in outside adheres to the outer surface (outer peripheral face) of bonding sheet volume (diameter 48mm, the width 160mm) 30 of the bonding cleaner 10 shown in Fig. 1,2 by this test sample to make its cohesive surface, make test cleaner.Rolling member (about weight 26.5g) 40 and the handle 52 of this test cleaner are polypropylene system, and to hold the bar-like portion of component 50 be diameter is the stainless steel component of 5mm.In addition, the total length of test cleaner is about 40cm, and gross weight is about 241g, and the weight of bonding sheet volume 30 is about 113g, and the weight of cleaner main member 15 is about 128g.Bonding sheet volume 30 is by be wound on by the one side bonding sheet of example 2 on cylindric retaining member made of paper until reach thickness and be about about 1cm and formed.
In addition, the aqueous solid chip sample for test is prepared.As aqueous solid chip sample, prepare in as the silica sand of aggregate with relative to this silica sand 100 weight portion be the ratio of 20 weight portions add aqueous surfactant solution and in polybag fully vibration make the aqueous solution at silica sand on the whole equably throughout the sample obtained.As silica sand, Xin Dongtao is used to expect the colored aggregate (trade name: Shintocolorsand34 series, medium particle diameter 1.20 ~ 1.50mm, size specification 0.5 ~ 2.4mm) that Co., Ltd. manufactures.As aqueous surfactant solution, use the aqueous solution surfactant of 5 % by weight (40% triethanolamine lauryl sulfate solution (Wako Pure Chemical Industries, Ltd.'s manufacture)) being dissolved in water (distilled water).
The aqueous solid chip sample 200g of above-mentioned preparation is configured equably in the mode spread out in the smooth bottom surface entirety of pallet (pallet of the stainless steel of 240mm × 320mm).As shown in Figure 4, the cohesive of the test cleaner 10 ' made surface 32A is made to contact with the pallet T being configured with this aqueous solid chip sample 100 and roll, scope one end of the length direction from above-mentioned pallet T to the other end makes it reciprocate 2 times, thus makes aqueous solid chip sample 100 be attached to cohesive surface 32A.
Measure the weight W1 (g) of the test cleaner 10 ' after aqueous solid chip sample 100 is adhered to, according to the difference of initial weight W0 (g) with the test cleaner 10 ' measured in advance, obtain the adhesion amount W2 (W2 (g)=W1-W0) of aqueous solid chip sample, the area (m of the cohesive surface 32A exposed divided by test sample with W2 (g) 2), obtain every 1m thus 2the aqueous solid chip sample adhesion amount A on cohesive surface c(g/m 2).For each example, carry out 5 above-mentioned tests, record its mean value.Show the result in table 1.In addition, for each example, the image of the state gained after the attachment of shooting aqueous solid chip sample is shown in Fig. 6,7,8.
[aqueous solid chip come off test]
After carrying out above-mentioned aqueous solid chip adhiesion test, carry out aqueous solid chip with following main points in succession and to come off test.As shown in (a) of Fig. 5, on the rigid planar face G formed by plastics, to make the bonding sheet of test cleaner 10 ' roll up the Cylindorical rod of 30 to the mode of the height (height shown in the symbol h in (a) of Fig. 5) being 5cm apart from above-mentioned rigid planar face G for lower end that is vertical and bonding sheet volume 30, the end of handle 52 side holding component 50 is fixed in the mode can rotated along the vertical direction on fixture J.Configuration space thing (not shown) between the lower end and rigid planar face G of bonding sheet volume 30, remains above-mentioned height by test cleaner 10 '.Then, above-mentioned sept is extracted out between bonding sheet volume 30 and rigid planar face G, as shown in (b) of Fig. 5, makes the bonding sheet of test cleaner 10 ' roll up 30 sides and fall.More specifically, it is made along the arrow A direction in (b) of Fig. 5 to fall close to free-falling state.Measure the weight W4 (g) of the test cleaner 10 ' after falling, according to measure in advance fall before the difference of weight W3 of test cleaner 10 ', obtain the aqueous solid chip sample amount of coming off W5 (W5 (g)=W3-W4) after above-mentioned falling.Then, aqueous solid chip sample expulsion rate A is obtained according to following formula d(%).
A D(％)＝W5/(W3-W0)×100
It should be noted that, in each example, W3 and W1 is identical value.For each example, carry out 5 above-mentioned tests, record its mean value.Show the result in table 1.
[180 degree of peel strengths]
The bonding sheet of each example is cut into 200mm × 20mm, prepares OBL test film.Make the roller round trip of 2kg and the adhesive surface (cohesive surface) of above-mentioned test film is adhered to stainless steel (SUS304) plate, by its 23 DEG C, keep 30 minutes under the environment of RH50%, then cupping machine is used, according to JISZ0237,23 DEG C, under the environment of RH50%, under the condition of peel angle 180 degree, draw speed 300mm/ minute, measure 180 degree of peel strengths (N/20mm) to SUS.Measure " Tensilon " that use Shimadzu Scisakusho Ltd to manufacture to carry out.Show the result in table 1.
[table 1]
As shown in table 1, Fig. 6 ~ 8, in example 1, the aqueous solid chip sample adhesion amount A in aqueous solid chip adhiesion test cbe shown as 190g/m 2(be more specifically 400g/m above 2above).On the other hand, in example 2,3, above-mentioned aqueous solid chip sample adhesion amount A cdisplay is less than 190g/m 2.According to these results, the seizure of the aqueous solid chip of the bonding cleaner of example 1 is excellent.In addition, in example 1, aqueous solid chip come off test in aqueous solid chip sample expulsion rate A ddisplay is less than 50% (being more specifically less than 20%).On the other hand, in example 2,3, above-mentioned aqueous solid chip sample expulsion rate A dbe more than 50%.According to these results, the bonding cleaner of example 1 maintains the aqueous solid chip after seizure securely, can suppress or prevent the above-mentioned aqueous solid chip be captured in the generation of the unfavorable conditions such as midway comes off.
Above, concrete example of the present invention has been described in detail, but these are only illustration, and the protection domain of non-limiting claim.Technology described in claims comprises various distortion, the change of above illustrative concrete example.
description of reference numerals
10 bonding cleaners
15 cleaner main members
20 retaining members
30 bonding sheet volumes
31 bonding sheets (solid debris capture unit)
32 adhesive phases
32A cohesive surface
36 supporting substrates
40 rolling members
50 hold component
52 handles
100 aqueous solid chip samples

Claims (12)

1. a bonding cleaner, it possesses the solid debris capture unit catching solid debris,
Described solid debris capture unit has the cohesive surface be made up of adhesive,
Described cohesive is surperficial in the aqueous solid chip adhiesion test of adhesion amount measuring aqueous solid chip sample, every 1m 2the aqueous solid chip sample adhesion amount A on cohesive surface cbe shown as 190g/m 2above; Herein, described aqueous solid chip sample is add the aqueous solution comprising the surfactant of 5 % by weight in the aggregate of 1.20 ~ 1.50mm to obtain at medium particle diameter, and the addition of the described aqueous solution is 20 weight portions relative to described aggregate 100 weight portion.
2. bonding cleaner according to claim 1, wherein, described bonding cleaner to fall to hard surface at this bonding cleaner making to be attached with described aqueous solid chip sample aqueous solid chip from the height of 5cm comes off test, aqueous solid chip sample expulsion rate A ddisplay is less than 50%.
3. bonding cleaner according to claim 1 and 2, wherein, described cohesive surface demonstrates the 180 degree of peel strengths being less than 10N/20mm.
4. the bonding cleaner according to any one of claims 1 to 3, wherein, described adhesive contains acrylic polymer with the ratio of more than 50 quality %.
5. bonding cleaner according to claim 4, wherein, described acrylic polymer is by carrying out being polymerized obtaining containing the raw material monomer of Alkoxy monomeric by comprising.
6. the bonding cleaner according to claim 4 or 5, wherein, described adhesive is formed by the adhesive composition containing described acrylic polymer and crosslinking agent.
7. the bonding cleaner according to any one of claim 1 ~ 6, wherein, described adhesive contains water-soluble plasticizer.
8. the bonding cleaner according to any one of claim 1 ~ 7, wherein, described solid debris capture unit is formed with the form of one side bonding sheet, and described one side bonding sheet possesses: the supporting substrate of sheet and be configured at a surface of this supporting substrate and form the adhesive phase on described cohesive surface.
9. bonding cleaner according to claim 8, wherein, described one side bonding sheet be by with described adhesive phase for outside carry out reeling thus with bonding sheet volume form formed.
10. bonding cleaner according to claim 9, it possesses cylindric rolling member, and described bonding sheet volume is configured at the outer peripheral face of this rolling member.
11. bonding cleaners according to claim 10, it also possesses the holding component that the mode can rotated with rolling member supports described rolling member.
12. bonding cleaners according to any one of claim 1 ~ 11, it has the solid debris of moisture for removing surface.
CN201480049094.XA 2013-09-04 2014-09-03 Bond cleaner Active CN105517479B (en)

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JP2013183166 2013-09-04
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JP7211732B2 (en) * 2018-08-22 2023-01-24 株式会社ニトムズ adhesive cleaner
DE102020132780A1 (en) * 2020-05-28 2021-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. CLEANING PROCEDURES FOR PHOTO MASKS AND APPARATUS

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CN105517479B (en) 2018-05-15
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KR101888279B1 (en) 2018-08-13
JPWO2015033962A1 (en) 2017-03-02

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