CN105515784A - High speed interface board card and setting method for communication equipment - Google Patents
High speed interface board card and setting method for communication equipment Download PDFInfo
- Publication number
- CN105515784A CN105515784A CN201510870654.4A CN201510870654A CN105515784A CN 105515784 A CN105515784 A CN 105515784A CN 201510870654 A CN201510870654 A CN 201510870654A CN 105515784 A CN105515784 A CN 105515784A
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- Prior art keywords
- interface
- high speed
- speed
- sfp
- communication equipment
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/02—Details
Abstract
The invention relates to the communication field, specifically provides a high speed interface board card for communication equipment, and aims to solve the problem that the existing communication equipment board card cannot realize a function of a high speed interface. For this purpose, the high speed interface board card of the invention comprises six SFP+ optical module interfaces; six corresponding high speed interface chips; and high speed connectors connected at downstream of the high speed interface chips and connected with a processing chip of a mainboard of ATCA (Advanced Telecom Computing Architecture) equipment. Since the above structure or operating steps are adopted, an RTM board card of the invention can realize the access of six 10G POSs/LANs (Local Area Network)/WANs (Wide Area Network) and enrich a function of the RTM board card in an ATCA standard framework, which can not only satisfy the function of debugging interfaces, but can also realize the access function of the high speed interface.
Description
Technical field
The present invention relates to the communications field, a kind of high-speed interface board for communication equipment and the method arranging high-speed interface are specifically provided.
Background technology
ATCA (AdvancedTelecomComputingArchitecture), namely advanced telecommunications computing platform, be derived from the mainstream industry computing technique-CompactPCI standard of new generation in field extensive uses such as telecommunications, space flight, Industry Control, medicine equipment, intelligent transportation, military equipments, be the high performance-price ratio provided for converged communication of future generation and data network application, based on modular construction, compatible and extendible hardware architecture."
3.0-Revision
baseSpecification " define the limit for height etc. of the size of the PCB of plug-in card (that is, RTM board) after in standard A TCA equipment, thickness and components and parts in agreement, but do not specify the using function of RTM board.
RTM board in existing ATCA standard architecture realizes the miscellaneous function of debugging interface more, as provided the debugging interface of serial ports and network interface.But these ATCA device do not have high-speed interface function, the access function of such as 10GPOS/LAN/WAN all can not be provided.Therefore, this area needs a kind of novel board to solve this kind of problem.
Summary of the invention
In order to solve foregoing problems, be the problem that the board solving existing communication equipment does not have high-speed interface function, the invention provides a kind of high-speed interface board for communication equipment, the feature of this high-speed interface board is to comprise: at least one SFP+ interface; At least one interface chip, each interface chip is connected to a described SFP+ interface accordingly in downstream; And being connected to the high speed plug connector in described interface chip downstream, described high speed plug connector is connected with the process chip of the mainboard of described communication equipment.
In the preferred implementation of above-mentioned high-speed interface board, described high-speed interface board comprises six SFP+ interfaces and six corresponding interface chips.
In the preferred implementation of above-mentioned high-speed interface board, described SFP+ interface is SFP+ optical module interface, for realizing the access of 10GPOS/LAN/WAN.
In the preferred implementation of above-mentioned high-speed interface board, described interface chip is used for converting the signal from described SFP+ interface to high speed interlaken protocol signal.
In the preferred implementation of above-mentioned high-speed interface board, described high speed plug connector is high speed MOLEX connector.
In the preferred implementation of above-mentioned high-speed interface board, described communication equipment is ATCA device, and/or described high-speed interface board is RTM board.
According to another aspect of the present invention, provide a kind of method for arranging high-speed interface to the board of communication equipment, the method is characterized in that and comprise the following steps: to provide at least one SFP+ interface; There is provided at least one interface chip, each interface chip is connected to a described SFP+ interface accordingly in downstream; And high speed plug connector is set in the downstream of described interface chip, described high speed plug connector is connected with the process chip of the mainboard of described communication equipment.
In the preferred implementation of above-mentioned high-speed interface method to set up, described high-speed interface board comprises six SFP+ interfaces and six corresponding interface chips.
In the preferred implementation of above-mentioned high-speed interface method to set up, described SFP+ interface is SFP+ optical module interface, for realizing the access of 10GPOS/LAN/WAN.
In the preferred implementation of above-mentioned high-speed interface method to set up, described interface chip is used for converting the signal from described SFP+ interface to high speed interlaken protocol signal; And/or described high speed plug connector is high speed MOLEX connector; And/or described communication equipment is ATCA device; And/or described high-speed interface board is RTM board.
Those skilled in the art it is easily understood that, owing to have employed said structure or operating procedure, RTM board of the present invention can realize the access of 6 10GPOS/LAN/WAN, enrich the function of RTM board in ATCA standard architecture, not only debugging interface function can be met, also high-speed interface access function can be realized.
Accompanying drawing explanation
Fig. 1 is the structure chart of the high-speed interface board for communication equipment of the present invention.
Embodiment
With reference to the accompanying drawings the preferred embodiment of the present invention is described.One skilled in the art will appreciate that these execution modes only for explaining know-why of the present invention, and not intended to be limits the scope of the invention.Such as, although hereafter describe technical scheme of the present invention in conjunction with ATCA, those skilled in the art are it is easily understood that technical scheme of the present invention obviously can be applied to other communication equipments outside ATCA.
With reference to the structure chart that Fig. 1, this figure are according to the high-speed interface board RTM10 for ATCA device of the present invention.As shown in Figure 1, the high-speed interface board RTM10 for ATCA device of the present invention comprises: at least one SFP+ interface 100 (that is, SFP interface); At least one interface chip 200, each interface chip 200 is connected to a described SFP+ interface 100 accordingly in downstream; And being connected to the high speed plug connector 300 in described interface chip 200 downstream, described high speed plug connector 300 is connected with the process chip of the mainboard of described ATCA device.It should be noted that, although the high-speed interface board RTM10 shown in Fig. 1 comprises six SFP+ interfaces 100 and six corresponding interface chips 200, but, those skilled in the art it is easily understood that, this quantity should not be construed as limiting the invention, under the prerequisite not departing from principle of the present invention, those skilled in the art can make adjustment to this quantity as required.
In a preferred embodiment, described SFP+ interface 100 can be SFP+ optical module interface, for realizing the access of 10GPOS/LAN/WAN.In addition, described interface chip 200, for converting the signal from described SFP+ interface 100 to high speed interlaken protocol signal, then through high speed connector 300, is connected to the process chip on mainboard.It should be noted that, interface chip 200 can select any suitable form, such as programmable interface chip, non-programmable interface chip, common interface chip or Special Interface Chip, as long as described interface chip 200 can convert the signal from described SFP+ interface 100 to high speed interlaken protocol signal.Moreover described high speed plug connector 300 can be high speed MOLEX connector, certainly, it also can be other forms of high speed plug connector.
Corresponding with said apparatus, the present invention also provides a kind of method for arranging high-speed interface to the board RTM10 of ATCA device.The method comprises the following steps: to provide at least one SFP+ interface 100; There is provided at least one interface chip 200, each interface chip 200 is connected to a described SFP+ interface 100 accordingly in downstream; And high speed plug connector 300 is set in the downstream of described interface chip 200, described high speed plug connector 300 is connected with the process chip of the mainboard of described ATCA device.
Same corresponding with said apparatus, described high-speed interface board RTM10 can comprise six SFP+ interfaces 100 and six corresponding interface chips 200.Described SFP+ interface 100 can be SFP+ optical module interface, for realizing the access of 10GPOS/LAN/WAN.Described interface chip 200 is for converting the signal from described SFP+ interface 100 to high speed interlaken protocol signal.Described high speed plug connector 300 can be high speed MOLEX connector.
In sum, the present invention is according to the requirement of ATCA standard device, and independent research RTM high speed fishplate bar card, is connected with mainboard by high speed MOLEX connector, can realizes the access function of 6 10GPOS/LAN/WAN.This improvement can enrich the function of RTM board in ATCA standard architecture, not only can meet debugging interface function, also can realize high-speed interface access function.
So far, shown by reference to the accompanying drawings preferred implementation describes technical scheme of the present invention, but those skilled in the art are it is easily understood that protection scope of the present invention is obviously not limited to these embodiments.Under the prerequisite not departing from principle of the present invention, those skilled in the art can make equivalent change or replacement to correlation technique feature, and these changes or the technical scheme after replacing it all will fall within protection scope of the present invention.
Claims (10)
1., for a high-speed interface board for communication equipment, it is characterized in that comprising:
At least one SFP+ interface;
At least one interface chip, each interface chip is connected to a described SFP+ interface accordingly in downstream; And
Be connected to the high speed plug connector in described interface chip downstream, described high speed plug connector is connected with the process chip of the mainboard of described communication equipment.
2. the high-speed interface board for communication equipment according to claim 1, is characterized in that, described high-speed interface board comprises six SFP+ interfaces and six corresponding interface chips.
3. the high-speed interface board for communication equipment according to claim 1 and 2, is characterized in that, described SFP+ interface is SFP+ optical module interface, for realizing the access of 10GPOS/LAN/WAN.
4. the high-speed interface board for communication equipment according to any one of claim 1 to 3, is characterized in that, described interface chip is used for converting the signal from described SFP+ interface to high speed interlaken protocol signal.
5. the high-speed interface board for communication equipment according to any one of claim 1 to 4, is characterized in that, described high speed plug connector is high speed MOLEX connector.
6. the high-speed interface board for communication equipment according to any one of claim 1 to 5, it is characterized in that, described communication equipment is ATCA device, and/or described high-speed interface board is RTM board.
7. the method for arranging high-speed interface to the board of communication equipment, is characterized in that comprising the following steps:
At least one SFP+ interface is provided;
There is provided at least one interface chip, each interface chip is connected to a described SFP+ interface accordingly in downstream; And
Arrange high speed plug connector in the downstream of described interface chip, described high speed plug connector is connected with the process chip of the mainboard of described communication equipment.
8. method according to claim 7, is characterized in that, described high-speed interface board comprises six SFP+ interfaces and six corresponding interface chips.
9. the method according to claim 7 or 8, is characterized in that, described SFP+ interface is SFP+ optical module interface, for realizing the access of 10GPOS/LAN/WAN.
10. the method according to any one of claim 7 to 9, is characterized in that, described interface chip is used for converting the signal from described SFP+ interface to high speed interlaken protocol signal; And/or
Described high speed plug connector is high speed MOLEX connector; And/or
Described communication equipment is ATCA device; And/or
Described high-speed interface board is RTM board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510870654.4A CN105515784A (en) | 2015-12-02 | 2015-12-02 | High speed interface board card and setting method for communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510870654.4A CN105515784A (en) | 2015-12-02 | 2015-12-02 | High speed interface board card and setting method for communication equipment |
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| Publication Number | Publication Date |
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| CN105515784A true CN105515784A (en) | 2016-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510870654.4A Pending CN105515784A (en) | 2015-12-02 | 2015-12-02 | High speed interface board card and setting method for communication equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018076636A1 (en) * | 2016-10-31 | 2018-05-03 | 深圳市中兴微电子技术有限公司 | Interlaken package cutting and scheduling method and apparatus, and computer storage medium |
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| CN202856775U (en) * | 2012-02-15 | 2013-04-03 | 南京贝伦思网络科技有限公司 | Data message processing plate of 12 port 10-gigabit Ethernet and 40Gbps POS interface based on ATCT |
| CN103067179A (en) * | 2012-07-19 | 2013-04-24 | 曙光信息产业(北京)有限公司 | 24 kilomega Ethernet back plug-in card achieved by utilizing two-layer connector |
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- 2015-12-02 CN CN201510870654.4A patent/CN105515784A/en active Pending
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| US20120210416A1 (en) * | 2011-02-16 | 2012-08-16 | Fortinet, Inc. A Delaware Corporation | Load balancing in a network with session information |
| CN202856775U (en) * | 2012-02-15 | 2013-04-03 | 南京贝伦思网络科技有限公司 | Data message processing plate of 12 port 10-gigabit Ethernet and 40Gbps POS interface based on ATCT |
| CN102882689A (en) * | 2012-07-19 | 2013-01-16 | 曙光信息产业(北京)有限公司 | 120-gigabit Ethernet rear transition module |
| CN103067179A (en) * | 2012-07-19 | 2013-04-24 | 曙光信息产业(北京)有限公司 | 24 kilomega Ethernet back plug-in card achieved by utilizing two-layer connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018076636A1 (en) * | 2016-10-31 | 2018-05-03 | 深圳市中兴微电子技术有限公司 | Interlaken package cutting and scheduling method and apparatus, and computer storage medium |
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