CN105511570B - Back board structure and mainboard package assembly - Google Patents
Back board structure and mainboard package assembly Download PDFInfo
- Publication number
- CN105511570B CN105511570B CN201510862180.9A CN201510862180A CN105511570B CN 105511570 B CN105511570 B CN 105511570B CN 201510862180 A CN201510862180 A CN 201510862180A CN 105511570 B CN105511570 B CN 105511570B
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- CN
- China
- Prior art keywords
- opening
- insulating trip
- metal backing
- mainboard
- board structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
Abstract
The invention discloses a kind of back board structure and mainboard package assemblies.The back board structure is to carry a mainboard and include insulating trip and metal backing, and insulating trip has the first opening and the second opening, and the second opening is open relative to first toward the adjacent formation of an assembly orientation.Insulating trip coincides on metal backing, and prominent on the position of corresponding second opening of metal backing to be formed with button hook, button hook has the first buckling part for bending arm and extending from the first bending arm toward the first opening.When insulating trip coincides when on metal backing so that button hook is across the second opening and insulating trip mobile toward assembly orientation relative to metal backing, second opening is mobile relative to button hook so that the first bending arm leans against the second opening and buckling part clasps the first opening, insulating trip to be fixed on metal backing, so that metal backing and mainboard be made to insulate when mainboard is carried on back board structure.
Description
Technical field
The present invention relates to computer assembling field more particularly to a kind of back board structure and mainboard package assemblies.
Background technique
In general, the mainboard assembling mode on computer installation (such as personal computer or server) is usually to utilize
Insulating trip is attached on metal backing by gum bonding mode, and screw locking mode is then recycled to be pasted with mainboard locking
On the metal backing of insulating trip, in this way, not only provide enough bottom branch using the high rigidity of metal backing for mainboard
Support, while metal backing and mainboard can also be made to insulate by the configuration of insulating trip.However, above-mentioned pasted insulating trip using gum
The assembling cost that the mode being attached on metal backing frequently can lead to metal backing and insulating trip excessively high is asked with not easy to be processed
Topic.
Summary of the invention
Engaged the purpose of the present invention is to provide a kind of using metal backing with the structure on insulating trip to consolidate insulating trip
The back board structure and mainboard package assembly being scheduled on metal backing, to solve the above problems.
According to one embodiment of present invention, to carry a mainboard, which includes back board structure of the invention
One insulating trip and a metal backing.The insulating trip has at least one first opening and at least one second opening, this at least one
Second opening at least 1 first is open toward the adjacent formation of an assembly orientation relative to this.The insulation is arranged in the metal backing surface
Piece, and the insulating trip coincides on the metal backing, which corresponds to prominent shape on the position of at least one second opening
Cheng Youyi button hook, the button hook have one first bending arm and extend from the first bending arm toward at least one first opening
A buckling part.When the insulating trip coincides on the metal backing so that the button hook passes through at least one second opening and the insulation
When piece is mobile toward the assembly orientation relative to the metal backing, at least one second opening it is mobile relative to the button hook so that this
One bending arm leans against at least one second opening and the buckling part clasps at least one first opening, which is fixed
On the metal backing, so that the mainboard makes the metal backing and the mainboard insulate when being carried on the back board structure.
According to another embodiment of the present invention, mainboard package assembly of the invention includes a mainboard and a back board structure.
The back board structure is set under the mainboard to be used to carry the mainboard, which is back board structure as described above.
Insulating trip is attached at the design on metal backing, present invention benefit in the way of gum bonding compared with the prior art
Engaged with metal backing with the structure on insulating trip insulating trip to be fixed on metal backing, in this way, being without the use of
In the case where high-cost gum bonding mode, the present invention can be effectively reduced being assembled into for metal backing and insulating trip
This, further, since the assembly and disassembly of metal backing and insulating trip can be can be completed by simple operations, therefore the present invention also may be used
Greatly improve the machinability of metal backing and insulating trip.
Detailed description of the invention
Fig. 1 is the perspective view of the explosion of mainboard package assembly according to the present invention；
Fig. 2 is that the insulating trip of Fig. 1 coincides the schematic diagram on metal backing；
Fig. 3 is that the insulating trip of Fig. 2 is fixed on the schematic diagram on metal backing.
Specific embodiment
It is further detailed to back board structure provided by the invention and mainboard package assembly below in conjunction with the drawings and specific embodiments
It describes in detail bright.According to following explanation and claims, advantages and features of the invention will be become apparent from.It should be noted that attached drawing is equal
Using simplified form, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Referring to Fig. 1, Fig. 1 is the perspective view of the explosion of mainboard package assembly according to the present invention, as shown in Figure 1, mainboard group
Assembling structure 10 includes a mainboard 12 and a back board structure 14, wherein the structure design in order to clearly show that back board structure 14, main
Plate 12 is only shown in Fig. 1 with dotted line.Mainboard 12 is preferably disposed on general common computer device (such as personal computer, clothes
Be engaged in device etc., but be not limited) in be used to carry out signal transmission and to the control of computer installation, associated description is common in
In the prior art, it is repeated no more in this.
Back board structure 14 is set under mainboard 12 to be used to carry mainboard 12, back board structure 14 include an insulating trip 16 and
One metal backing 18.In this embodiment, insulating trip 16 can be preferably a wheat membrane piece, but be not limited, and also can be
Other have effects that the diaphragm of insulation, such as gel silica membrane, as shown in Figure 1, insulating trip 16 can have at least one first opening 20,
At least one second opening 22, and at least third opening 24, the second opening 22 is relative to the first opening 20 toward an assembly orientation A
(i.e. as shown in Figure 1-Y direction) adjacent formation, wherein the first opening 20 and the second opening 22 respectively show two in Fig. 1
A, third opening 24 shows three in Fig. 1, and but not limited to this.In practical applications, as shown in Figure 1, first opening 20 and
Second opening 22 is arranged in the edge of insulating trip 16, is opened 16 button hook of insulating trip in what is generated on metal backing 18 with average
Power.
As for the structure design aspect in metal backing 18, as shown in Figure 1,18 surface of metal backing is used to that insulating trip is arranged
16 so that insulating trip 16 can coincide on metal backing 18, and protrusion is formed on the position of corresponding second opening 22 of metal backing 18
One button hook 26, the button that button hook 26 has one first bending arm 28 and extends from the first bending arm 28 toward the first opening 20
The first opening 20 is lived to be used to button hook in hook part 30, wherein the second opening 22 of the first bending arm 28 of button hook 26 and insulating trip 16
Mutually abut against, to limit sliding of the insulating trip 16 on metal backing 18, and the buckling part 30 of button hook 26 and the first opening 20 and the
16 phase of insulating trip between two openings 22 abuts against, (i.e. as shown in Figure 1 in the normal direction of metal backing 18 to limit insulating trip 16
± Z axis) on movement.In addition to this, it can be protruded on the position of the corresponding third opening 24 of metal backing 18 and be formed with a clamping
Piece 32, clamping piece 32 can have one second bending arm 34 and from second bending arm 34 it is oppositely extending (i.e. toward assembly orientation A
Toward it is shown in FIG. 1+Y direction extend) a clamping piece portion 36 be used to clamp insulating trip 16 jointly with metal backing 18.
Assembly and disassembly below for mainboard package assembly 10 are described in detail, and please refer to Fig. 2 and Fig. 3, Fig. 2
For the schematic diagram that the insulating trip 16 of Fig. 1 coincides on metal backing 18, Fig. 3 is that the insulating trip 16 of Fig. 2 is fixed on metal backing 18
On schematic diagram.Firstly, user only needs the second opening on insulating trip 16 first in terms of the assembling of mainboard package assembly 10
22 and third opening 24 be respectively aligned to the button hook 26 and clamping piece 32 of metal backing 18, and then insulating trip 16 is coincided
On metal backing 18, so that the button hook 26 and clamping piece 32 of metal backing 18 are each passed through the second opening 22 and third opening
24 (as shown in Figure 2).Next, user can push insulating trip 16 (such as to scheme relative to metal backing 18 toward assembly orientation A
Shown in 2-Y direction) mobile, so that the second opening 22 is mobile relative to button hook 26 and makes third opening 24 relative to clamping
Piece 32 is mobile, until the first bending arm 28 leans against the second opening 22 and the second bending arm 34 is against third opening 24,
At this point, as shown in figure 3, buckling part 30 can clasp the first opening 20, and clamp as insulating trip 16 is toward the movement of assembly orientation A
Piece portion 34 can clamp jointly insulating trip 16 with metal backing 18.In this way, past ± the X-axis of insulating trip 16, ± Y-axis and ± Z
The displacement of axis can be open against, the second bending arm 34 and third by the first bending arm 28 and the second opening 22 and 24 support
It leans on, buckling part 30 limits the clamping of insulating trip 16 with metal backing 18 with the engaging of the first opening 20 and clamping piece portion 34
Firmly, it is one or three axially position mechanism, therefore insulating trip 16 can be firmly secured on metal backing 18.Finally, user is only
Mainboard 12 need to be fixed on to the metal backing for being assembled with insulating trip 16 using general common fixed form (such as screw locks)
On 18, the assembling of mainboard package assembly 10, which so can be completed, and reach carries on the back mainboard 12 and metal via the configuration of insulating trip 16
The purpose that plate 18 insulate.
In addition, in terms of the disassembly of mainboard package assembly 10, in the case where user dismantles mainboard 12 from back board structure 14
After coming (such as in a manner of screwdriver disassembly etc.), user only needs to pull buckling part 30 and clamping piece portion 34, to release
Buckling part 30 pushes away the engaging of the first opening 20 and clamping piece portion 34 and clamping of the metal backing 18 to insulating trip 16 simultaneously
The opposite direction (i.e. as shown in Figure 3+Y direction) of dynamic 16 opposing metallic backboard 18 of insulating trip toward assembly orientation A are mobile, until
Until insulating trip 16 returns to position as shown in Figure 2, at this point, since buckling part 30 has no longer clasped the first opening 20 and insulating trip
16 no longer clamped piece portion 34 is with clamped by metal backing 18, and therefore, user can be successfully by insulating trip 16 from metal
It is disassembled on backboard 18, thus disassembly that is quick and easily completing mainboard package assembly 10.
It is worth noting that, the third opening on above-mentioned insulating trip and the clamping piece on metal backing are omissible set
Meter, to simplify the structure design of back board structure, that is to say, that in another embodiment for omitting third opening and the configuration of clamping piece
In, back board structure can be bent merely with the first of button hook second opening of arm and insulating trip against and buckling part and insulation
The engaging of first opening of piece, insulating trip is fixed on metal backing.
Insulating trip is attached at the design on metal backing, present invention benefit in the way of gum bonding compared with the prior art
Engaged with metal backing with the structure on insulating trip insulating trip to be fixed on metal backing, in this way, being without the use of
In the case where high-cost gum bonding mode, the present invention can be effectively reduced being assembled into for metal backing and insulating trip
This, further, since the assembly and disassembly of metal backing and insulating trip can be can be completed by simple operations, therefore the present invention also may be used
Greatly improve the machinability of metal backing and insulating trip.
Obviously, those skilled in the art can carry out various modification and variations without departing from spirit of the invention to invention
And range.If in this way, these modifications and changes of the present invention belong to the claims in the present invention and its equivalent technologies range it
Interior, then the invention is also intended to include including these modification and variations.
Claims (6)
1. a kind of back board structure, to carry a mainboard, which includes:
One insulating trip has at least one first opening and at least one second opening, and at least one second opening is relative to this
At least 1 first is open toward the adjacent formation of an assembly orientation；And
One metal backing, the insulating trip is arranged in surface, and the insulating trip coincides on the metal backing, and the metal backing is corresponding
This at least one second opening position on protrusion be formed with a button hook, the button hook have one first bending arm and from this first
The buckling part that arm extends toward at least one first opening is bent, when the insulating trip coincides on the metal backing so that the button
When hooking across at least one second opening and the insulating trip mobile toward the assembly orientation relative to the metal backing, this at least 1 the
Two openings are mobile relative to the button hook so that the first bending arm leans against at least one second opening and the buckling part clasps this
At least one first opening, which is fixed on the metal backing, and the buckling part and the insulating trip this at least one
Part between first opening and at least one second opening mutually abuts against, to limit the insulating trip in a normal of the metal backing
Movement on direction, so that the mainboard makes the metal backing and the mainboard insulate when being carried on the back board structure.
2. back board structure as described in claim 1, which is characterized in that the insulating trip separately has at least third opening, the gold
Category backboard corresponds to protrusion on the position of at least third opening and is formed with a clamping piece, which has one second bent over arms
Portion and a clamping piece portion oppositely extending toward the assembly orientation from the second bending arm, when the insulating trip coincides in the metal
On backboard so that the clamping piece pass through an at least third be open and the insulating trip relative to the metal backing toward the assembly orientation
When mobile, at least third opening is mobile relative to the clamping piece, and so that the second bending arm leans against this, at least a third is opened
Mouth and the clamping piece portion and the metal backing clamp the insulating trip, which is fixed on the metal backing.
3. back board structure as claimed in claim 2, which is characterized in that the insulating trip is a wheat membrane piece.
4. back board structure as described in claim 1, which is characterized in that at least one first opening and at least one second opening
It is arranged in the edge of the insulating trip, averagely by the insulating trip button hook in the tension generated on the metal backing.
5. back board structure as described in claim 1, which is characterized in that the first bending arm and at least one second opening phase
It abuts against, to limit the insulating trip in the sliding on the metal backing.
6. a kind of mainboard package assembly comprising:
One mainboard；And
One back board structure is set under the mainboard to be used to carry the mainboard, which is as appointed in claim 1-5
Back board structure described in meaning one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510862180.9A CN105511570B (en) | 2015-11-30 | 2015-11-30 | Back board structure and mainboard package assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510862180.9A CN105511570B (en) | 2015-11-30 | 2015-11-30 | Back board structure and mainboard package assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105511570A CN105511570A (en) | 2016-04-20 |
| CN105511570B true CN105511570B (en) | 2019-03-08 |
Family
ID=55719623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510862180.9A Active CN105511570B (en) | 2015-11-30 | 2015-11-30 | Back board structure and mainboard package assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105511570B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201336018Y (en) * | 2009-01-07 | 2009-10-28 | 北京奇宏科技研发中心有限公司 | Self-dismountable radiator back plate component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8385060B2 (en) * | 2009-08-31 | 2013-02-26 | Apple Inc. | Handheld computing device |
-
2015
- 2015-11-30 CN CN201510862180.9A patent/CN105511570B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201336018Y (en) * | 2009-01-07 | 2009-10-28 | 北京奇宏科技研发中心有限公司 | Self-dismountable radiator back plate component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105511570A (en) | 2016-04-20 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201231 Address after: Room 204, 158 Yaozhuang Avenue, Yaozhuang Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee after: Jiashan Linhu Xincheng Industrial Co.,Ltd. Address before: 201114 Shanghai City Caohejing export processing zone of Minhang District Pu Xing Road No. 789 Patentee before: INVENTEC TECHNOLOGY Co.,Ltd. Patentee before: Yingda Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160420 Assignee: Jiashan County Dachangwei Real Estate Co.,Ltd. Assignor: Jiashan Linhu Xincheng Industrial Co.,Ltd. Contract record no.: X2023330000548 Denomination of invention: Backboard structure and motherboard assembly structure Granted publication date: 20190308 License type: Common License Record date: 20230822 |
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| EE01 | Entry into force of recordation of patent licensing contract |