CN105458547B - A kind of active solder of cast aluminium based composites strengthened suitable for high-volume fractional SiC and preparation method thereof - Google Patents
A kind of active solder of cast aluminium based composites strengthened suitable for high-volume fractional SiC and preparation method thereof Download PDFInfo
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- CN105458547B CN105458547B CN201510997548.2A CN201510997548A CN105458547B CN 105458547 B CN105458547 B CN 105458547B CN 201510997548 A CN201510997548 A CN 201510997548A CN 105458547 B CN105458547 B CN 105458547B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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Abstract
The invention discloses a kind of active solder of cast aluminium based composites strengthened suitable for high-volume fractional SiC and preparation method thereof：The solder contains molten type active element Ga, the Mg of drop and rises molten type element ti, in terms of interface wet ability, the solder soaks excellent to high-volume fractional SiC particulate, the home position strengthening of brazed seam can be realized, in 500 DEG C × 1.5MPa × 30min solderings 70vol.%SiCp/ZL101, shear strength is 2~3 times of other solders, for the 98.8% of mother metal, fracture path is extended to inside mother metal, along mother metal and solder interfacial fracture, realizing high-volume fractional SiC particulate strengthens the home position strengthening active liquid-phase diffusion welding of cast aluminium based composites for few part.
Description
Technical field
The invention belongs to welding material preparation and welding procedure field, aluminum matrix composite active solder is related generally to
Composition design, preparation and soldering processes, strengthen cast aluminium based composites (70vol.% especially for high-volume fractional SiC particulate
SiCp/ZL101) " the home position strengthening active liquid-phase diffusion welding " under middle cryogenic conditions.
Background technology
Aluminum matrix composite is high because having high specific strength and specific stiffness, low thermal coefficient of expansion, high heat conductance, high-wearing feature
Antifatigue and croop property etc., is widely used in the fields such as space flight and aviation, automobile engine cylinder-body.However, due to aluminum-base composite
In material the traditional fusion welding method of the presence severe exacerbation of ceramic particle reinforced phase to the solderability of aluminum matrix composite (with reference to text
Offer [1]), SiC particulate is mainly manifested in overheating deleterious interfacial reaction (generation fragility, deliquescence, the Al of needle-like of aluminium liquid4C3) and
Ceramic particle is segregated in Weld pipe mill area.According to soldering, ceramic enhancement phase is degrading solder and composite parent material interface again
Wetability.Because composite material surface is metallic matrix and ceramic enhancement phase and the interface deposited, so composite and solder
Interface can be divided into two major classes：Metal solder and metallic matrix interface (M/M interfaces)；Ceramic particle and metal solder interface (P/M circle
Face).Aluminum matrix composite soldering mainly has two aspect problems：First, P/M interface wet abilities are poor, made pottery especially for high-volume fractional
The composite mother metal of porcelain particle enhancing, the wetability at P/M interfaces are worse；Second, the uniformity for strengthening distributed mutually in brazed seam is asked
Topic；Wherein the former more crucial (bibliography [2]).
, need to be distinctive in many-sided progress such as method for welding, brazing material and soldering metallurgy in order to solve the above problems
Specific aim linguistic term.Two classes are broadly divided into aluminum matrix composite soldering processes linguistic term both at home and abroad：First, it is conceived to
Improvement of the film purpose in terms of method for welding.Harbin Institute of Technology Yan long spring et al. proposes the method for welding of ultrasonic vibration auxiliary, uses
Zn-4Al-3Cu solders 30vol.%Al2O3P/ 6061Al, high intensity, large scale can be obtained under air, cryogenic conditions
Soldered fitting (bibliography [3-7]).Second, improvement is optimized to the composition design in intermediate layer or solder from different perspectives.It is vertical
The intermediate layer reported so far or solder are seen, is mainly had：(1) pure Cu, pure Ag intermediate layers etc.：Its shortcoming is to easily cause particle inclined
It is poly-, deteriorate strength of joint (bibliography [8,9]).Can using thinner simple substance intermediate layer, alloy interlayer or combination solder layer
Mitigate particle segregation (bibliography [10]).(2) powder intermediate layer：It is yellow to be mixed after China et al. using Al-40.7Ag-19.3Cu-3Ti
When closing powder brazing alloy welding 15vol.%SiCp/2009Al, strength of joint obtains to be lifted to a certain extent, but is generated inside brazed seam
More Al3Ti (around unfused Ti powder), Al2Cu、Ag2Al weld metal zone brittle intermetallic things, are degrading joint performance
(bibliography [11]).(3) preplating Ni layers：Ox Jinan-Tai'an et al. is in 55vol.%SiCp/ZL101 composites and kovar alloy
In 4J29 solderings, one layer of about 40 μ m-thick Ni are electroplated in composite material surface first, then using Zn-58Cd-2Ag-2Cu alloy prickers
Expect soldering, improve the wetability (bibliography [12]) of joint interface.(4) solder of low melting point containing Mg：Zou Jia life et al. for
10vol.%SiCp/2024Al low volume fraction composite mother metals, use Al-28Cu-5Si-2Mg solder alloys (fusing point 580
~590 DEG C) soldering connection is realized, Mg forms the Al-Si-Mg alloys of low melting point and melted together with the Si for diffusing into mother metal,
So as to destroy the combination of surface film oxide and mother metal, compared to Al-28Cu-5Si solders, interface wet ability (ginseng is greatly improved
Examine document [13]).However, most of such traditional aluminum matrix composite solders will mainly realize rupture of membranes, improve mother metal matrix/
The wetability at metal solder (M/M) interface is attached most importance to, and substantially have ignored the main reason for causing joint low shear strength, also
It is the improvement of mother metal hardening constituent/bad wetability in metal solder (P/M) interface.
2008, for the improvement of the bad wetability in P/M interfaces, Xi'an Communications University Zhang Guifeng (bibliography [14-
17] active transition liquid-phase diffusion welding (Active-Transient liquid phase bonding, A-TLP)) is proposed, i.e.,
The active element that Ti etc. can react with ceramic enhancement phase is added in conventional alloys solder.This method is intended on the one hand pass through Ti
Metallurgy action of the isoreactivity element in welding process, induce and striping is liquefied under the wetting of P/M interfacial reactions, reinforced film to improve P/
M interface wet abilities；On the other hand molten element (fusing point is higher than Al and with Al without eutectic reaction) is risen by adding, passes through isothermal solidification
During compound phase between the refractory metal that goes out of dispersed crystalline (by aluminium and rise molten element and formed) be used as isothermal solidification after be dissolved
The home position strengthening phase of body brazed seam, obtain home position strengthening brazed seam (bibliography [17]).This work for obtaining home position strengthening brazed seam
Property liquid-phase diffusion welding is referred to as " home position strengthening active liquid-phase diffusion welding " (In situ Active-TLP bonding, In situ
Active-TLP, bibliography [2]).For low volume fraction 10vol.%SiCp/ZL101 composites, applicant uses
Al-19Cu-1Ti intermediate layers, In situ A-TLP are realized, not only boundary moisture is good, and has obtained the pricker of home position strengthening
Seam, joints shear fracture path almost entirely inside composite mother metal, obtain the firm joint that coefficient of efficiency is up to 99%
(bibliography [2,17]).But applicant is in the high volume integral of above-mentioned Al-19Cu-1Ti intermediate layers soldering using early stage research and development
During number 70vol.%SiCp/ZL101 composites, wetability is poor (or even including M/M interfaces), and strength of joint is relatively low
(40MPa).Then, applicant have developed Al-Cu-Mg-Ti systems active solder again, and shearing strength of joint can be improved to about 60MPa
[16], brazing temperature higher (600 DEG C) but intensity and not bery high deficiency be present.
Because traditional Al-12Si eutectic solders (HL400) fusing point is too high (577 DEG C), it is impossible to be used in ZL101 based composites
(557 DEG C of solidus), so other researchers mainly employ in terms of ZL101 based composites are with the design improvement of solder
To conventional solder (HL401 and HL402 of such as low melting point, about 525 DEG C of solidus) addition Mg, Ni thinking, but no matter reducing
In terms of solder fusing point or effect is limited in terms of wetability improvement.For example, Wang Ke letters seminar uses the Al- containing Mg, Ni solder
Two kinds of powder prickers of 15Cu-8Si-4Ni-1.5Mg (593 DEG C of fusing point) and Al-20Cu-12.5Si-2Ni-1.5Mg (584 DEG C of fusing point)
Material carries out vacuum brazing at relatively high temperatures to 70vol.%SiCp/ZL101 aluminum matrix composites, its joint brazing shear strength
Up to 49.7MPa (bibliography [18]).Ox Jinan-Tai'an seminar, which uses, contains Mg, Ni solder Al-22Cu-7Si-1Mg-1Ni five
First solder alloy carries out vacuum brazing to 60vol%SiCP/6063A composites, the joints shear in 565 DEG C, insulation 15min
Maximum intensity is 89.6MPa (bibliography [19]).
Wetability during aluminum matrix composite soldering will become worse with the increase of wherein ceramic enhancement phase volume fraction, with
As for the very excellent active solder of low volume fraction mother metal (Al-19Cu-1Ti) to high-volume fractional (70vol.%) mother metal
Very poor wetability and very low intensity are showed, although the matrix composition of composite mother metal does not become with hardening constituent classification
Change, be only merely that the volume fraction of ceramic enhancement phase adds.Therefore, pole is necessary the high-volume fractional aluminium base for difficult wetting
Composite develops new active solder system, to realize " the home position strengthening active liquid-phase diffusion welding " expected.
Bibliography：
[1] the welding Chemical Industry Press of Chen Mao love composites, 2005.
[2] Zhang Guifeng, Liao Xianjin, Chen Bo, Zhang Linjie, the home position strengthening of Zhang Jianxun .SiCp/ZL101 aluminum matrix composites
Active liquid-phase diffusion welding method (In situ A-TLP) is welded, and 2014, (1):18-22.
[3] Yan Jiuchun, Yang Chunli, Liu Huijie, Cui Wei, Xie Weifeng, Guo soldier ULTRASONIC COMPLEXs weld present Research and science
Problem mechanical engineering journals, 2015.
[4]JC Yan,ZW Xu,L Shi,X Ma,SQ Yang.Ultrasonic assisted fabrication of
particle reinforced bonds joining aluminum metal matrix composites.Mater Des,
2011,32:343-347.
[5]JC Yan,HB Xu,L Shi,XH Wang,SQ Yang.Vibration assisted brazing of
SiCp/A356 composites:microstructureand mechanical behaviour.Sci Technol Weld
Join,2008,13(8):760-764.
[6]ZW Xu,JC Yan,C Wang,SQ Yang.Substrate oxide undermining by a Zn-Al
alloy during wetting of alumina reinforced 6061 Al matrix composite.Mater
ChemPhys,2008,112(3):831-837.
[7]YC Lei,HL Xue,WX Hu,ZZ Liu,JC Yan.Effect of arc ultrasonic
vibration on microstructure of joint of plasma arc‘in situ’welding of SiCp/
6061Al.SciTechnol Weld Join,2011；16(7):575–80.
[8]Z Li,Y Zhou,TH North.Counteraction of particulate segregation
during transient liquid-phase bonding of aluminum-based MMC materials.Journal
of Materials Science,1995,32:5571-5575.
[9]A Suzumura,YJ Xing.Diffusion brazing of short Al2O3 Fiber-
Reinforced Aluminum Composite.Materials Transactions,1996,37(5):1109-1115.
[10] Liu Weihong, Sun great Qian, Sun Dexin, Jia Shu contain the diffusion of .Al2O3P/6061Al composites transient liquid phase and connected
Connect welding journals, 2007,28 (3):57-60.
[11] Zhao Zude, Shu great Yu, Huang Jihua, Hu Chuankai, Kang Feng .Al-Ag-Cu-Ti Reaction-diffusion terms weld SiCP/
Strength of joint and fracture characteristics the welding journal of 2009Al composites, 2008,29 (11):100-104.
[12] Niu Jitai, Lu Jinbin, Mu Yunchao, the mutually luxuriant .SiCp/ZL101 composites of sieve and kovar alloy 4J29 solderings
Analysis welding journal, 2010,31 (5):37-40.
[13] the research light-alloy processing of Zou Jiasheng, Zhao Qizhang, Chen Zheng .SiC particle enhanced aluminum-based composite materials soldering tech
Technology, 2004,32 (3):48-52.
[14]GF Zhang,JX Zhang,Y Pei,SY Li,DL Chai.Joining of Al2O3p/Al
composite by transient liquid phase(TLP)bonding and a novel process of
active-transient liquid phase(A-TLP)bonding.Materials Science and Engineering
A,2008,488:146-156.
[15]GF Zhang,W Su,JX Zhang,ASuzumura.Wetting Behavior of a Novel Al-
Si-Ti Active Brazing Filler Metal Foil on Aluminum Matrix Composite.Journal
of Materials Engineering and Performance,2013,22(7):1982-1994.
[16]GF Zhang,B Chen,MZ Jin,JX Zhang.Active-Transient Liquid Phase(A-
TLP)Bonding of High VolumeFraction SiC Particle Reinforced A356 Matrix
Composite.Materials Transactions,2015,56(2):212–217.
[17]GF Zhang,XJ Liao,B Chen,LJ Zhang,JX Zhang.Approach to In-Situ
Producing Reinforcing Phase Within anActive-Transient Liquid Phase Bond Seam
for Aluminum MatrixComposite.Metallurgical and Materials Transactions A,2015,
46(6):2568-2578.
[18] the peaceful fillings Al-Cu-Si-Ni-Mg of Li Juan, Wang Kehong, Zhang Deku, Xu Jia 70vol.%SiCp/ZL101
The tissue and performance heat processing techniques of composite soldered fitting, 2015,44 (19):183-186.
[19] Wang Peng, Xu Dongxia, Chen Long, Niu Jitai high-volume fractional SiCP/6063Al composite vacuum brazing techniques
And wetting mechanism research heat processing techniques, 2014,43 (3):155-160.
The content of the invention
It is an object of the invention to provide a kind of cast aluminium based composites (extremely difficult profit strengthened suitable for high-volume fractional SiC
It is wet) active solder and preparation method thereof, to realize expected high-volume fractional SiC particulate enhancing cast aluminium based composites
" middle low temperature " " home position strengthening active liquid-phase diffusion welding " (home position strengthening refers to for brazed seam；Activity refers to interface wet ability
For).
To reach above-mentioned purpose, present invention employs following technical scheme：
A kind of medium temperature active solder for the cast aluminium based composites strengthened suitable for high-volume fractional SiC, for even Metal Substrate
Body/metal solder (M/M) interface high volume fraction particle reinforced composite (70vol.%SiCp/ZL101) that also hardly possible soaks, this hair
Bright to propose and be prepared for using Mg as core melting point depressant higher with active element, Mg and Ga contents, Mg-Ga-Ti is simultaneously deposited,
But the fusing point Al-Mg-Ga-Ti system active solder low more than conventional Al-12Si eutectics, wherein each element mass ratio are：10~
30% Mg, 10~20% Ga, 0.1~3% Ti, surplus Al.High Mg goes film reaction only to spend dependence M/M interfaces
In being split up for oxide-film, difficult high-volume fractional aluminum-base composite material is split up suitable for " thermal coefficient of expansion is smaller " matrix oxide-film
Material；Mg can may also react generation Mg with the Si in ZL101 matrixes and SiC hardening constituents2Si phases.High gallium is advantageous to the quick of solder
Softening, active solder solidus is reduced, suitable for the high volume fraction particle reinforced composite of " hardness and creep strength are high ", can made
Earlier, more broadly contact, close between solder and mother metal, oxygen barrier, promoting early stage low-temperature zone to react.On the one hand Ti addition is
Induced in ceramic particle interface, the reactive wetting in hot stage at reinforcing particle/solder metal (P/M) interface, it is another
Aspect makees home position strengthening to form containing Ti, high, the discrete distribution of fusing point, tiny intermetallic compound in brazed seam
Phase, in addition with beneficial to pressure at initial stage is born, prevent solidus reduce in the case of come into being liquid phase extruded too early；Mg-Ga is simultaneously
Depositing improves early stage low-temperature zone M/M boundary moisture；Mg-Ga-Ti simultaneously deposits the P/M boundary moistures reaction for taking into account low temperature and high temperature section.
The preferred Al-24Mg-16Ga-1Ti solders of Al-Mg-Ga-Ti systems active solder, the solder is according to mass fraction
It is composed of the following components：24% Mg, 16% Ga, 1% Ti, surplus Al.
The fusion range of the Al-24Mg-16Ga-1Ti solders is 383~497 DEG C
The preparation method of the active solder of the above-mentioned cast aluminium based composites strengthened suitable for high-volume fractional SiC, including with
Lower step：
Added after block pure Al, liquid Ga and block Al-5Ti intermediate alloys are mixed in crucible, then in flowing argon
Under gas (Ar) protective effect, by crucible since room temperature be heated to 750~800 DEG C and be incubated, added after 10~30min of insulation
Block pure Mg, 10~30min of insulation being then proceeded to, insulation stops argon gas protection when 150~200 DEG C are naturally cooled to after terminating,
Then proceed to naturally cool to room temperature, obtain melting block, the melting block is Al-Mg-Ga-Ti systems active solder.
The heating uses high-frequency induction heating.
Methods described is further comprising the steps of：The melting block is got rid of into band shaping through chilling, obtains solder foil.
In terms of soldering processes, Al-Mg-Ga-Ti systems active solder is using the micro- molten technique with elevated pressures of solder
Condition, to obtain high-strength joint；Wherein, micro- melt refers to that brazing temperature is slightly above the molten of (only high 2~10 DEG C) active solder
Point (by taking Al-24Mg-16Ga-1Ti solders as an example, i.e., higher than 497 DEG C 2~10 DEG C), it is therefore intended that in order to prevent in high volume integral
Low solidus liquid solder not yet with being extruded too early in the case of composite reactive wetting in the case of number SiC；It is higher
Pressure refers to that soldering pressure is 1~1.5MPa, and the creep resistant of high-volume fractional composite is using the purpose of elevated pressures
Intensity is high, apply high pressure be advantageous to such mother metal and the high Mg active solders containing Ti with the help of Ga earlier, larger range of connect
Reaction is touched, is also beneficial to prevent the lasting intrusion of air, shortens the isothermal solidification time.
The brazing temperature is preferably 480~510 DEG C.
The soldering processes specifically refer to home position strengthening active liquid-phase diffusion welding.
Another kind is suitable to the active solder for the cast aluminium based composites that high-volume fractional SiC strengthens, and the active solder is Al-
Mg-Ti systems active solder, Al-Mg-Ti systems active solder are composed of the following components by mass fraction：10~30% Mg,
0.1~3% Ti, surplus Al.
The present invention has following innovative point：
1) brazing filler metal improves Metal Substrate on the one hand by Mg, Ga melting point depressant (while being also active element) striping
Body and the wetability at solder metal (M/M) interface, and ceramic particle is almost completely eliminated by the triple active elements of Mg, Ga, Ti
With solder metal (P/M) interfacial gap, P/M interface wet abilities are improved, wherein Ga has excellent low temperature wetability, even
450 DEG C also can perfect continuously wetting large scale SiC (length is up to 100 μm), and Ti mainly play at high temperature wetting carbonization
The effect of silicon；On the other hand discrete crystalline goes out tiny Al-Mg-Ga-Ti quaternarys intermetallic compound in brazed seam, thus achieves
To the home position strengthening of solid solution brazed seam matrix obtained by isothermal solidification, brazed seam microhardness is Hv80, higher Hv20 than matrix, significantly
Enhance Joint intensity.
2) fusing point (383 DEG C~497 DEG C) of Al-24Mg-16Ga-1Ti active solders is less than ZL101 solidus temperatures (557
DEG C), far below common Al-Si systems and the fusing point (more than 577 DEG C) of Al-Si-Mg brazing filler metals, the soldering suitable for ZL101 mother metals.It is aobvious
So, the reduction (all lower with 525 DEG C of Al-Cu-Si ternary eutectics than 450 DEG C of Al-Mg eutectic) of wherein solidus has benefited from gallium (Ga)
Addition, this be solder fast softening and with the contacting on a large scale in advance of composite mother metal surface, subsequent active element Mg
Various diffusions and reaction create advantage.Active element contained by solder more at most requires that the protection to solder is stricter,
And the fusing point after Ga additions reduces, fast softening is equivalent in the high volume integral that quality is hard, modulus of elasticity is big, creep strength is high
Soft intermediate layer is prefixed between number composite material interface, to increasing closely sealed microcell quantity, closed intensity, preventing to foregoing closely sealed
The oxidation in area, the anti-oxidation of closing gap all have benifit very much.
3) brazing temperature is located at medium temperature (500 DEG C or so), i.e. solder is in welding under micro- molten or nearly semisolid, it is allowed to pressurizes
Without solder extrusion occurs；(such as 550 DEG C) ZL101 matrix excessive dissolutions are avoided under higher temperature simultaneously, into the Si of liquid phase
Home position strengthening phase (the Al-Ti-Si phases containing Si) coarsening for occurring in brazed seam will be caused.
4) boundary moisture is excellent, even for high-volume fractional 70vol.%SiCp/ZL101, or even in 450 DEG C of conditions
Under, large scale SiC particulate (being up to 100 μm) also can complete wetting；ZL101 matrixes can be dissolved simultaneously.
5) under the conditions of 500 DEG C × 1.5MPa × 30min, shearing strength of joint average value is 118.6MPa, is cut for mother metal
The 98.8% of shearing stress (120MPa)., it is worthwhile to note that the shear strength is up to other various solder brazings containing Mg of existing report
2~3 times of shearing strength of joint (about 40~60MPa).
In a word, the present invention is to conventional high-volume fractional 70vol.%SiCp/ZL101 composites, in order to further exist
In obtain higher shear strength under low brazing temperature, " home position strengthening active liquid-phase diffusion welding (the In proposed based on applicant
SituA-TLP) " thinking, " wetability for improving P/M interfaces using reactive wetting " and " home position strengthening is obtained using molten element is risen
The principle thinking of brazed seam ", new Al-Mg-Ga-Ti systems active solder is have developed, had both improved P/M interface wet abilities (even
At relatively low 450 DEG C), and home position strengthening phase is obtained in brazed seam, strength of joint coefficient of efficiency is up to the 98% of mother metal, improves
Effect protrudes again stable, it was demonstrated that the significant superiority of the brazing filler metal.It is worthy of note that the Al- provided using the present invention
Shearing strength of joint obtained by 24Mg-16Ga-1Ti solder brazing 70vol.%SiCp/ZL101 composites is up to existing report
2~3 times of other various shearing strength of joint of solder brazing containing Mg (about 40~60MPa [16,18])；For high-volume fractional aluminium
Based composites (70vol.%SiCp/ZL101) mother metal, in the case where allowing to use higher brazing temperature, Al- can be used
24Mg-1Ti brazing filler metals.
Brief description of the drawings
Fig. 1 is Al-24Mg-16Ga-1Ti (a) and Al-24Mg-1Ti (b) active solder bands DSC curve：The former consolidates
Phase line is with liquidus curve far below the improvement solder for addition Mg, the Ni having been reported that；
Fig. 2 (a) is Al-24Mg-1Ti solders foil to the micro- of 70vol.%SiCp/ZL101 aluminum matrix composite wetabilitys
See (550 DEG C × 30min of macrograph；Flow Ar)：P/M interface portions have soaked, and part does not soak, but wetted portions are also anti-
Mg-Ti certain beneficial effect is reflected；Fig. 2 (b) is the amplification of a-quadrant in Fig. 2 (a), and Fig. 2 (c) is dotted line frame in Fig. 2 (b)
The amplification in region, Fig. 2 (d) are the amplification of B area in Fig. 2 (a), and Fig. 2 (e) is the amplification in dotted line frame region in Fig. 2 (d)；
Fig. 3 (a) is that Al-24Mg-16Ga-1Ti solders foil soaks to 70vol.%SiCp/ZL101 aluminum matrix composites
(550 DEG C × 30min of the microstructure photo of property；Flow Ar)：P/M interfaces almost soak entirely；Fig. 3 (b) is a-quadrant in Fig. 3 (a)
Amplification, Fig. 3 (c) is the amplification in dotted line frame region in Fig. 3 (b), and Fig. 3 (d) is the amplification of B area in Fig. 3 (a), and Fig. 3 (e) is
The amplification in dotted line frame region in Fig. 3 (d)；
Fig. 4 (a) is (mother metal using joint obtained by Al-24Mg-1Ti intermediate layers：70vol.%SiCp/ZL101；500℃
×30min×1MPa；Flow Ar) microstructure photo：There is gap in P/M interface portions, but also reflects the one of Mg-Ti and be set for
With；Fig. 4 (b) is the amplification in dotted line frame region in Fig. 4 (a)；
Fig. 5 a be brazing temperature and pressure butt joint tissue influence schematic diagram (1000 ×, 450 DEG C of welding temperature, 1MPa
Pressure, it is incubated 30min, Ar protections, intermediate layer Al-24Mg-16Ga-1Ti)；
Fig. 5 b are the amplification (3000 ×) of dotted box portion in Fig. 5 a；
Fig. 5 c be brazing temperature and pressure butt joint tissue influence schematic diagram (1000 ×, 500 DEG C of welding temperature, 1MPa
Pressure, it is incubated 30min, Ar protections, intermediate layer Al-24Mg-16Ga-1Ti)；
Fig. 5 d are the amplification (3000 ×) of dotted box portion in Fig. 5 c；
Fig. 5 e be brazing temperature and pressure butt joint tissue influence schematic diagram (1000 ×, 500 DEG C of welding temperature,
1.25MPa pressure, it is incubated 30min, Ar protections, intermediate layer Al-24Mg-16Ga-1Ti)；
Fig. 5 f are the amplification (3000 ×) of dotted box portion in Fig. 5 e；
Fig. 5 g be brazing temperature and pressure butt joint tissue influence schematic diagram (1000 ×, 500 DEG C of welding temperature,
1.5MPa pressure, it is incubated 30min, Ar protections, intermediate layer Al-24Mg-16Ga-1Ti)；
Fig. 5 h are the amplification (3000 ×) of dotted box portion in Fig. 5 g：Boundary moisture is optimal；And in the pricker of solid solution
Tiny scattered Al-Mg-Ga-Ti hardening constituents are formed in situ in seam matrix；
Fig. 5 i be brazing temperature and pressure butt joint tissue influence schematic diagram (1000 ×, 500 DEG C of welding temperature,
1.75MPa pressure, it is incubated 30min, Ar protections, intermediate layer Al-24Mg-16Ga-1Ti)；
Fig. 5 j are the amplification (3000 ×) of dotted box portion in Fig. 5 i：Occurs more large scale bulk Al in seam3Ti skews
It is poly-；
Fig. 5 k be brazing temperature and pressure butt joint tissue influence schematic diagram (1000 ×, 550 DEG C of welding temperature, 1MPa
Pressure, it is incubated 30min, Ar protections, intermediate layer Al-24Mg-16Ga-1Ti)；
Fig. 5 l are the amplification (3000 ×) of dotted box portion in Fig. 5 k：There are 8~10 μm of strip Al-Si-Ti phase segregations；
Mother metal in Fig. 5 a~Fig. 5 k is 70vol.%SiCp/ZL101；Interface can quilt under 500 DEG C × 30min × 1.5MPa
Densely soak, there is point-like home position strengthening mutually to be formed (referring to Fig. 5 g, Fig. 5 h) in the brazed seam matrix of solid solution；
Fig. 6 is that Al-24Mg-16Ga-1Ti solders " brazed seam home position strengthening " under the conditions of 500 DEG C × 30min × 1.5MPa are imitated
Fruit schematic diagram (brazed seam is up to Hv80, is higher by nearly 1 times of mother metal matrix)；
Fig. 7 is Al-24Mg-16Ga-1Ti, the Al-24Mg-1Ti without Ga, the Al-24Mg-16Ga solder connectors without Ti are cut
Shearing stress comparison diagram：Demonstrate the superiority of the Al-24Mg-16Ga-1Ti solders containing Mg, Ga and Ti simultaneously；
Fig. 8 be Al-24Mg-16Ga-1Ti solders foil weld 70vol.%SiCp/ZL101 composite joints temperature-
Shear strength (a), pressure-shear strength (b) change curve：Under the conditions of 500 DEG C × 30min × 1.5MPa, joints shear is strong
Degree is up to 118MPa, is the 98% of mother metal, it was demonstrated that its medium temperature, high-strength outstanding advantage；
Fig. 9 (a) is that Al-24Mg-16Ga-1Ti solders foil welding 70vol.%SiCp/ZL101 composite joints break
Split path schematic diagram (it is expansible enter composite mother metal, show that one side ceramic interface can also soak very well, even if high volume integral
Number mother metal, another aspect brazed seam are also strengthened, and fracture path can just entered inside composite mother metal)；Fig. 9 (b) is Fig. 9
(a) amplification of a-quadrant in, Fig. 9 (c) are the amplification in dotted line frame region in Fig. 9 (b), and Fig. 9 (d) is that B area is put in Fig. 9 (a)
Greatly, Fig. 9 (e) is the amplification in dotted line frame region in Fig. 9 (d).
Embodiment
Invention is elaborated with reference to the accompanying drawings and examples.
The molten type (Ga, Mg) of drop is had concurrently the invention discloses one kind and rises the low melting point Al- of three kinds of active elements of molten type (Ti)
Mg-Ga-Ti systems quaternary active solder, realize " home position strengthening active liquid-phase diffusion welding ".The brazing filler metal drops molten member by Mg, Ga
Element (while being also active element) striping, improves metallic matrix and solder interface low temperature wetability；Pass through the taskwork of Mg, Ga, Ti tri-
Property element eliminate ceramic particle and solder interfacial gap, improve P/M interface wet abilities, wherein Ga has low temperature wetability, even
Also can perfect continuously wetting large scale SiC at 450 DEG C；Discrete crystalline goes out between tiny Al-Mg-Ga-Ti metals in brazed seam simultaneously
Compound, brazed seam microhardness are Hv82, higher than matrix nearly 1 times, home position strengthening brazed seam.
The present invention is not only direct for the high-volume fractional (70vol.%SiCp/ZL101 composites) of ceramic enhancement phase
Cause P/M interfaces to be difficult to soak, and cause M/M interfaces to be also difficult to soak this special difficult point indirectly, in order to further compared with
Higher shear strength is obtained under low brazing temperature, it then follows " home position strengthening active liquid-phase diffusion welding " (this that applicant proposes
Home position strengthening in term be to brazed seam itself；Activity is for interface wet ability) principle ideas, enter one
Step optimization melting point depressant (improving M/M interface wet abilities) and active element (improving P/M interface wet abilities) and the molten element of liter are (strong
Change weld seam) prepare reactive alloys intermediate layer.
For the common problem of existing report addition Mg, Ni solder connector shear strength relatively low (only 40~60MPa), propose
Al-Mg-Ga-Ti alloy system active solders.Mg, Ga effect are to ensure the low-temperature zone wetability of M/M interface early stages；Mg、Ga、
Addition is to improve the wetability at P/M interfaces jointly by Ti, and wherein Ga can play a part of soaking SiC in low-temperature zone, and Ti is main
Play a part of soaking SiC at high temperature；Simultaneously the high-melting-point containing Ti that is gone out using in-situ crystallization mutually realize to after isothermal solidification
It is changed into the home position strengthening effect of the brazed seam matrix of solid solution；By above-mentioned improvement M/M and P/M interface wet abilities with obtaining original simultaneously
Brazed seam is strengthened in position, forces fracture path to enter composite mother metal, greatly improves shearing strength of joint.The present invention can be without any
Under the conditions of complicated ancillary technique (such as brazing flux, scraping, vibration, packing ring), even if the aluminum-base composite material strengthened to high-volume fractional SiC
Expect mother metal (70vol.%SiCp/ZL101 composites), by optimization solder composition design, obtain shear strength
(118MPa) extremely approaches the high-strength joint (98.8%) of mother metal.
Compared with classical melting point depressant Cu, Si, Zn, Mg is expected to play a part of active element to M/M and P/M.It is former
Because being, for P/M interfaces, Mg can be by reacting to form Mg with SiC2Si improves P/M interface wet abilities；For M/M interfaces,
Mg can by chemical mechanism (limited reduction-oxidation film, independent of being split up for oxide-film, the high volume integral small suitable for the coefficient of expansion
Number aluminum matrix composite；Can also be with forming Mg after the Si reactive crystallizations in ZL101 matrixes2Si) with physical mechanism (film subsurface flow)
Two kinds of approach equably striping (compared with Zn), improve the wetability at M/M interfaces.Therefore, also become to be difficult to for M/M interfaces
The high volume fraction particle reinforced composite mother metal of wetting, in terms of the optimization of melting point depressant, preferred Mg as core melting point depressant,
To improve the wetability at M/M and P/M interfaces simultaneously.In view of the palpus intensified pressure of solder containing Mg with anti-oxidation and promotion and mother metal
The contact (especially high Mg situations) on surface, although so solder be possible in the solid state i.e. with mother metal surface oxidation film reaction,
Solder containing Mg itself is harder hinder its with mother metal surface earlier, larger range of contact and reaction, therefore add fusing point pole
(Ga is easy to make solder heat fast softening gallium that is low and not making Al embrittlement；And the solidus of solder is greatly reduced, increase solid phase
Line-liquidus curve spacing), for active element Mg, Ti and mother metal surface earlier, larger range of contact that (including solder is still in
The stage of solid-state), interface closure isolation air and interfacial reaction create favorable conditions (in addition, applicant currently proves Ga
Also can be reacted with SiC, so as to improve the wetability at P/M interfaces by chemical mechanism)；Consider ceramic phase volume fraction simultaneously
Greatly, ratio shared by P/M interfaces is big, then increases Mg contents in the lump and be aided with larger welding pressure, be Mg and mother from another side
Material surface earlier, larger range of contact and reflect and create favorable conditions.Analyzed based on such scheme, applicant is according to three
First alloy phase diagram devises that Mg, Ga content are higher, and Mg-Ga-Ti is simultaneously deposited, but the low-melting active pricker of Al-Mg-Ga-Ti systems
Material, wherein each element mass ratio are：10~30% Mg, 10~20% Ga, 0.1~3% Ti, remaining is Al.
For the high volume fraction particle reinforced composite at metallic matrix/metal solder (M/M) interface also difficult wetting, at this
It is in active solder, using Mg as core melting point depressant, high Mg goes film reaction only to spend dependent on oxide-film M/M interfaces
It is split up, suitable for high volume fraction particle reinforced composite mother metal；High gallium is advantageous to the fast softening of solder, reduces solidus, can make
Between solder and mother metal earlier, more broadly closure, oxygen barrier, contact, reaction；Ti addition is on the one hand in order in ceramic particle circle
Induced at face, the reactive wetting in hot stage at reinforcing particle/solder metal (P/M) interface, on the other hand in order in brazed seam
Middle formation containing Ti, high, the discrete distribution of fusing point, tiny intermetallic compound make home position strengthening phase, in addition with beneficial to
Pressure at initial stage is born, prevents that nascent liquid phase is extruded too early in the case of solidus reduces.
In terms of soldering processes, using the micro- molten process conditions with elevated pressures of solder, to obtain high-strength joint.Its
In, micro- molten fusing point for referring to brazing temperature and being slightly above (only high several years) active solder, it is therefore intended that in order to prevent in high volume
Liquid solder not yet with being extruded too early in the case of composite reactive wetting in the case of fraction；Avoid temperature mistake simultaneously
Height makes the excessive Si dissolvings in matrix enter liquid solder, and the home position strengthening phase (Al-Ti-Si phases) resulted in is excessively thick
Greatly.It is that the creep strength of high-volume fractional composite is high using the purpose of elevated pressures, application high pressure is advantageous to such
Mother metal and the high Mg active solders containing Ti with the help of Ga earlier, larger range of contact and reaction, be also beneficial to shortening isothermal
Setting time.It should be noted that Al-Mg-Ga-Ti systems active solder (such as Al-24Mg- provided just because of the present invention
16Ga-1TGi) excellent wetability can allow to use condition of high voltage (otherwise can be extruded).
Example 1
In this example, the preparation method of aluminum matrix composite Al-24Mg-16Ga-1Ti systems quaternary active solder, including
Following steps：
1) sorting
Select original material for：Block pure Al, block pure Mg, liquid 99.99%Ga, block Al-5Ti intermediate alloys.
2) dispensing and charging
For proportion scale according to 24% Mg, 16% Ga, 1% Ti, remaining is Al.By the pure Al of 12 grams of bulks, 4.8 grams of liquid
State Ga and 6 grams of block Al-5Ti intermediate alloys are mixed in corundum crucible (can not use glass tube) in the lump.
3) melting
In the case where flowing Ar protective effects, using high-frequency induction heating, dispensing in crucible is heated to 750~800 from room temperature
DEG C and start to be incubated, add 7.2 grams of Mg immediately after 10min is incubated, continue afterwards be incubated 20min, be cooled to after the completion of insulation
200 DEG C of pass gas, are subsequently reduced to room temperature, obtain melting block.
4) band shaping is got rid of
After melting block remelting obtained by step 3), laminated band using chilling belt-rejecting technology.
Example 2
In this example, solder, the preparation of close similar solder Al-24Mg-1Ti systems ternary active solder as a comparison includes
Following steps：
1) sorting
Select original material for：Block pure Al, block pure Mg, block Al-5Ti intermediate alloys.
2) dispensing and charging
For proportion scale according to 24% Mg, 1% Ti, remaining is Al.By the pure Al of 16.8 grams of bulks, 6 grams of block Al-5Ti
Intermediate alloy is mixed in corundum crucible in the lump.
3) melting
In the case where flowing Ar protective effects, using high-frequency induction heating, dispensing in crucible is heated to 750~800 from room temperature
DEG C and start to be incubated, add 7.2 grams of Mg of corresponding content immediately after 10min is incubated, continue afterwards be incubated 20min, be incubated
200 DEG C of pass gas are cooled to after, room temperature is subsequently reduced to, obtains melting block.
4) band shaping is got rid of
After melting block remelting obtained by step 3), laminated band using chilling belt-rejecting technology.
Fusing point test implementation method：Using differential scanning calorimetry (DSC:Differential scanning
Calorimeter the fusing point of Al-Mg-Ga-Ti systems active solder foil) has been surveyed.As shown in Fig. 1 (a), Fig. 1 (b), Al-
The melting region of 24Mg-16Ga-1Ti solder foils is 383~497 DEG C, and the melting region of Al-24Mg-1Ti solder foils is
446~537 DEG C.Two kinds of brazing filler metal melts sections of contrast can find that Al-24Mg-16Ga-1Ti solder fusing points are substantially less than Al-
The fusing point of 24Mg-1Ti solder foils, 16wt.%Ga can reduce about 40~60 DEG C of solder fusing point, can be used as melting point depressant (MPD)
Use；And liquidus temperature is below composite mother metal matrix (ZL101) solidus temperature (557 DEG C), suitable for soldering.
Wetability method for experiment implement：It is 70vol.%SiCp/ZL101 aluminum matrix composites from mother metal, specimen size
For 15mm × 15mm × 3mm.Before welding, mother metal is successively using 240# diamond disks, 600# diamond disks, 600# water sands
Paper is polished, and then carries out solder foil (size is 7mm × 5mm × 0.15mm) and the mother metal after polishing in acetone
10min is cleaned by ultrasonic.Wetting experiment uses high-frequency induction heating tubular steel cavity wall, and sample and solder are positioned in steel cavity
Portion, 5L/min Ar gas shieldeds, holding temperature are set as 550 DEG C, soaking time 30min.Al-24Mg-1Ti solders pair
The wetting behavior of 70vol.%SiCp/ZL101 aluminum matrix composites can be found, metal referring to Fig. 2 (a)~(e) from low power figure
Interface is very fine and close between solder and mother metal, and in the case of magnification at high multiple, surface of SiC wetting in part is very fine and close, and (this is mainly obtained
Reactive wetting beneficial to active Ti to SiC), but also can substantially find that even there is up to 30 μm of company at part P/M interfaces
Continuous gap, and a little SiC particulate surface does not soak completely.By contrast, substantially can be found from Fig. 3 (a)~(e), Al-
24Mg-16Ga-1Ti solders are very good to the wetability of 70vol.%SiCp/ZL101 aluminum matrix composites, and not only M/M interfaces cause
It is close, and P/M interfaces are also very fine and close, and in the absence of obvious gap or hole, this mainly has benefited from Ga and Ti to the double of SiC
Wetting action again, greatly improve the wetability at P/M interfaces.And from Fig. 2 (a)~(e), Fig. 3 (a)~(e) remaining solder and
Mg2Si phases are found in mother metal matrix, show that Si dissolvings enter solder in mother metal matrix, and Mg also diffuses into mother in solder
Material matrix, so as to reach the effect that striping improves M/M interfaces.The above results show Al-24Mg-16Ga-1Ti solders pair
The wetability of 70vol.%SiCp/ZL101 aluminum matrix composites is better than Al-24Mg-1Ti solders.
Brazing tests implementation：It is 70vol.%SiCp/ZL101 aluminum matrix composites from mother metal, upper plate sample chi
Very little is 7.5mm × 7.5mm × 3mm, and lower plate specimen size is 15mm × 15mm × 3mm, and before welding, mother metal uses 240# successively
Diamond disk, 600# diamond disks, 600# waterproof abrasive papers are polished, then by solder foil (size be 9mm × 9mm ×
0.15mm) 10min ultrasonic cleaning is carried out in acetone with the mother metal after polishing.Welding experiment is added using radio-frequency induction coil
Heat, 5L/min Ar gas shieldeds, soaking time 30min.
Using joint microstructure of the Al-24Mg-1Ti intermediate layers under 500 DEG C, 1MPa pressure referring to Fig. 4 (a), Fig. 4 (b), by
Figure understands that its M/M interface and part P/M interfaces are very fine and close, but also has a little gap to be present in part P/M circle with hole
Face, so as to have impact on joint performance.Therefore in view of its fusing point is higher, and interface is poor, not as most preferably solder scheme.
Using Microstructure of Joint of the Al-24Mg-16Ga-1Ti intermediate layers under different welding parameters referring to Fig. 5 a~figure
5l, it can be found by figure, in the case of 450 DEG C × 1MPa, M/M and P/M interfaces are very fine and close, and there is one layer around SiC
The white transition layer that thickness is about 0.5 μm, so as to show that Ga plays a part of reactive wetting SiC (only Ti and Ga originals really
Sub- sequence number is high could to form bright layers, and the Ti contents measured are few, and Ga is more, and it is beneficial to illustrate that Ga serves to P/M boundary moistures
Effect)；And it is found that the netted phase of thick white of high Mg contents is present in brazed seam, this is weld metal zone brittle intermetallic thing, greatly
It is degrading strength of joint.And as welding temperature is increased to 550 DEG C, can substantially it find, there is the reinforcing of segregation inside brazed seam
Phase and the IMC/SiC interfaces for belonging to weak binding area, this two kinds of defects can be the formation of crack in fracture process.And suitably welding
500 DEG C of temperature (is only above 3 DEG C of solder liquidus curve), during 1MPa pressure, can substantially find in brazed seam both without the thick of high Mg contents
The netted phase of white is present, and brazed seam matrix turns into solid solution, and segregation phenomenon is not present in tiny hardening constituent Dispersed precipitate, such to change
It is kind to enhance joint performance.But need badly and be eliminated there is gap at its part P/M interfaces, therefore applicant is at 500 DEG C
Under continue increase pressure, in the case of 500 DEG C × 1.5MPa, whole M/M and P/M interfaces are very fine and close, discrete crystalline in brazed seam
Go out to refine the point-like phase (about Al-2.0Mg-1.0Ga-0.4Ti (at.%)) of Dispersed precipitate, size is about 0.2~0.8 μm, pricker
Seam microhardness is Hv82 (see Fig. 6), higher Hv40 than matrix, significantly enhances weld strength, can play home position strengthening brazed seam
Effect.But when welding pressure increases to 1.75MPa, P/M interfaces, which exist in very wide arc gap and joint, generates bulk
Al3Ti phases, are greatly degrading joint performance.
Al-24Mg-16Ga-1Ti, the Al-24Mg-1Ti without Ga, the Al-24Mg-16Ga solder connector shear strengths without Ti
Contrast is referring to Fig. 7, it was demonstrated that the superiority of the Al-24Mg-16Ga-1Ti solders containing Ga and Ti simultaneously.Thus can be optimized
For Al-24Mg-16Ga-1Ti solders as primary study object, wherein Mg, Ga effect are to ensure the wetability at M/M interfaces, Mg,
Addition is to improve the wetability at P/M interfaces jointly by Ga, Ti, and wherein Ga can play a part of soaking carborundum in low temperature, and Ti will
Work at high temperature, improve the wetability of high temperature section.
To the Al-24Mg-16Ga-1Ti intermediate layers preferably gone out, welding condition (temperature and pressure) is to using its soldering
The impact effect of shearing strength of joint participates in Fig. 8 (a), Fig. 8 (b) obtained by 70vol.%SiCp/ZL101.In 500 DEG C × 1.5MPa
Optimal conditions under, strength of joint is maximum, up to 119.3MPa.It is multiple according to identical implementation, welding for checking repeatability
Sample, the joint average shear strength under the conditions of this can be measured and be up to 118.6MPa, account for strength of parent 98.8% (mother metal is cut
Shearing stress is about 120MPa), it was demonstrated that strength of joint dispersiveness very little.For different temperature, under 1MPa pressure, welding temperature
Degree strength of joint at 500 DEG C is maximum, its average shear strength up to 90.6MPa, account for strength of parent 75.5% (mother metal is cut
Shearing stress is about 120MPa).If temperature is too high (550 DEG C), strength of joint reduces on the contrary, and this is due to the Al- of segregation in brazed seam
Si-Ti phases weaken the performance of interface and brazed seam.Above-mentioned soldering test demonstrates the Al-24Mg-16Ga-1Ti that the present invention provides
The advantage of quaternary active solder is：(1) brazing temperature is relatively low (500 DEG C)；(2) shearing strength of joint height (118MPa, is mother metal
98%)；(3) stable performance, it is reproducible.
Using Al-24Mg-16Ga-1Ti intermediate layers 500 DEG C × 1.5MPa optimize welding condition under fracture path referring to
Fig. 9 (a)~(e).As seen from the figure, except small part is broken along metal solder/parent material interface, fracture path can largely extend to mother
Inside material (most of along mother metal base fracture, to least partially penetrate SiC particulate in mother metal and be broken), show the intensity of interface and brazed seam
It is sufficiently high, it can just force fracture path to enter inside composite mother metal.This fracture path behavior and strength of joint result
It is consistent.
In summary, Al-Mg-Ga-Ti systems quaternary active solder proposed by the present invention is successfully realized to high-volume fractional
(home position strengthening refers to " middle low temperature " " the home position strengthening active liquid-phase diffusion welding " that SiC particulate enhancing cast aluminium based composites are expected
For brazed seam；Activity refers to for interface wet ability).The solder advantage is shown：(1) in terms of wetability is activated：One
Aspect improves the wetability at M/M interfaces by Mg, Ga melting point depressant striping；On the other hand the triple active elements of Mg, Ga, Ti are passed through
P/M gaps are completely eliminated, improve P/M interface wet abilities, wherein Ga has low temperature wetability, can eliminated at relatively low 450 DEG C
P/M (even up to 100 microns of large scale SiC particulates) interfacial gap, improves P/M interface wet abilities.(2) in brazed seam reinforcing side
Face, Al-2.5Mg-1.5Ga-0.3Ti (at.%) tiny hardening constituent of Dispersed precipitate is successfully obtained, is realized to solid solution base pricker
The home position strengthening of seam.The composition characteristic of the home position strengthening phase is " micro- Ti shows because the temperature feature of medium temperature welding is female without Si "
Material matrix dissolution is limited (the film subsurface flow striping mechanism for being different from traditional TLP), and Mg and Ga chemical striping mechanism serve not
Negligible effect.(3) joint performance is made to obtain tremendous lifting：In 500 DEG C × 1.5MPa × 30min solderings 70vol.%
SiCp/ZL101, shear strength are 2~3 times of other solders, are the 98.8% of mother metal, and fracture path is extended to inside mother metal,
Seldom partly along mother metal and solder interfacial fracture.(4) brazing temperature is low：500 DEG C can obtain good wet and diffusion, brazed seam base
Body is able to be changed into solid solution (Al-1.3Mg-0.8Ga).(5) fusing for solving high-melting-point element ti in solder preparation process adds
Add.Therefore, it is fully compatible for middle temperature brazing (500 DEG C or so) high-volume fractional SiC particulate enhancing cast aluminium based composites.
Claims (8)
- A kind of 1. active solder for the cast aluminium based composites strengthened suitable for high-volume fractional SiC, it is characterised in that：The active pricker Expect for Al-Mg-Ga-Ti systems active solder, Al-Mg-Ga-Ti systems active solder is composed of the following components by mass fraction： 10~30% Mg, 10~20% Ga, 0.1~3% Ti, surplus Al.
- 2. the active solder of the cast aluminium based composites according to claim 1 strengthened suitable for high-volume fractional SiC, it is special Sign is：The preferred Al-24Mg-16Ga-1Ti solders of Al-Mg-Ga-Ti systems active solder, the solder according to mass fraction by Following components forms：24% Mg, 16% Ga, 1% Ti, surplus Al.
- 3. the active solder of the cast aluminium based composites according to claim 2 strengthened suitable for high-volume fractional SiC, it is special Sign is：The fusion range of the Al-24Mg-16Ga-1Ti solders is 383~497 DEG C.
- 4. the active solder of the cast aluminium based composites according to claim 1 strengthened suitable for high-volume fractional SiC, it is special Sign is：The brazing process parameter of Al-Mg-Ga-Ti systems active solder includes：Brazing temperature is higher than the Al-Mg-Ga-Ti It is 2~10 DEG C of the fusing point of active solder, soldering pressure is 1~1.5MPa.
- 5. the active solder of the cast aluminium based composites according to claim 4 strengthened suitable for high-volume fractional SiC, it is special Sign is：The brazing temperature is 480~510 DEG C.
- 6. the active solder of the cast aluminium based composites according to claim 4 strengthened suitable for high-volume fractional SiC, it is special Sign is：The soldering processes specifically refer to home position strengthening active liquid-phase diffusion welding.
- A kind of 7. active pricker for preparing the cast aluminium based composites as claimed in claim 1 strengthened suitable for high-volume fractional SiC The method of material, it is characterised in that：Comprise the following steps：Add in crucible after block pure Al, liquid Ga and block Al-5Ti intermediate alloys are mixed, then protected in flowing argon gas Under shield effect, crucible is heated to 750~800 DEG C and starts to be incubated, block pure Mg is added after 10~30min of insulation, then Continue 10~30min of insulation, insulation stops argon gas protection, it is cold to then proceed to nature when 150~200 DEG C are naturally cooled to after terminating But to room temperature, melting block is obtained, the melting block is Al-Mg-Ga-Ti systems active solder.
- 8. according to the method for claim 7, it is characterised in that：Methods described is further comprising the steps of：By the melting block Band shaping is got rid of, obtains solder foil.
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| CN107470795B (en) * | 2017-08-20 | 2019-10-25 | 东北石油大学 | Active solder and its welding application method for SiC ceramic low temperature brazing |
| CN111566074B (en) * | 2018-01-25 | 2022-04-22 | 三菱综合材料株式会社 | Copper-ceramic joined body, insulated circuit board, method for producing copper-ceramic joined body, and method for producing insulated circuit board |
| JP7192451B2 (en) | 2018-01-25 | 2022-12-20 | 三菱マテリアル株式会社 | COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, METHOD FOR MANUFACTURING COPPER/CERAMIC JOINT, AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD |
| WO2020044590A1 (en) | 2018-08-28 | 2020-03-05 | 三菱マテリアル株式会社 | Copper/ceramic bonded body, insulation circuit board, method for producing copper/ceramic bonded body, and method for manufacturing insulation circuit board |
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