CN105448309A - Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads - Google Patents
Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads Download PDFInfo
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- CN105448309A CN105448309A CN201510608260.1A CN201510608260A CN105448309A CN 105448309 A CN105448309 A CN 105448309A CN 201510608260 A CN201510608260 A CN 201510608260A CN 105448309 A CN105448309 A CN 105448309A
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Abstract
The invention relates to a head suspension having a flexure tail with a covered conductive layer and a structural layer bond pads. The head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.
Description
The cross reference of related application
This application claims as on May 20th, 2013 submit to, title for " there is the disk drive head suspension assembly (Diskdriveheadgimbalassemblyhavingaflexuretailwithfoldedb ondpads) of the flexure afterbody with fold joint pad " at careful U.S. Patent Application Serial No.13/897, the rights and interests of the part continuation of 609 (attorney docket T4496.D1), above-mentioned application itself is submit on October 29th, 2010, the U.S. Patent Application Serial No.12/916 that title is " having the disk drive head suspension assembly (Diskdriveheadgimbalassemblyhavingaflexuretailwithfoldedb ondpads) of the flexure afterbody with fold joint pad ", the divisional application of 237 (attorney docket T4496) (is delivered as United States Patent (USP) 8, 467, 153), and the right of priority of this application is also required by priority chain.
Background technology
Information storing device is used for retrieval and/or storage data in computing machine and other consumer electronics product equipment.Magnetic hard drive is that comprise can the example of information storing device of one or more magnetic heads of both read and writes, but other information storing devices also comprise magnetic head-sometimes comprise the magnetic head that can not write.Herein, the magnetic head that can read can be called " reading head ", even if it comprises other 26S Proteasome Structure and Functions, as the transducer for writing, well heater, micro-actuator, electronics grinding guiding element (electroniclappingguide), laser diode etc.
In modem magnetic hard disk drive device, each magnetic head is the sub-component of the magnetic head-suspended rack assembly (head-gimbalassembly, HGA) of the lamination flex member (laminatedflexure) usually comprising the electric signal carrying round magnetic head.HGA and then be the sub-component of the head-stack assembly (head-stackassembly, HSA) usually comprising multiple HGA, actuator and flexible print wiring (FPC).Multiple HGA is attached to the various arms of actuator.
Modern lamination flex member comprises conduction copper tracing wire usually, this trace and stainless steel structure layer is kept apart by polymide dielectric layer.Make the signal of round magnetic head can arrive FPC on actuator body, each HGA flex member comprises and to extend away from magnetic head along corresponding actuator arm and to be finally attached to the flexure afterbody of the FPC closing on actuator body.That is, flex member comprises and extends from closing on magnetic head and continue to extend to the trace of electric connection point along flexure afterbody.FPC comprises the conducting terminal of the electric connection point corresponding to flexure afterbody.
In order to the electrical connection of the conductive trace to the conducting terminal of FPC that promote the flexure afterbody during HAS manufacturing process, first, must suitably place flexure afterbody relative to FPC, the flexure conductive trace of afterbody is alignd with the conducting terminal of FPC.Then, (solderjetbonding), solder impact backflow (solderbumpreflow) or incorgruous conducting membranes (anisotropicconductivefilm is being engaged by ultrasonic joint, solder jetting, ACF), when joint carries out aforesaid electrical connection, must keep relative to the conducting terminal of FPC or constraint flexure afterbody.
Modem magnetic reading head tends to the increasing additional structure and the function that comprise needs electrical connection.Such as, electrical connection to reading head can be read transducer (such as, tunnel magneto-resistive sensor), write transducer (such as, respond to cd-rom recorder (inductivewriter)), the well heater that controls for dynamic fly height, the micro-actuator for accurate tracing control, the electronics grinding guiding element strengthening the control of magnetic head manufacturing step and/or heating are used for so-called HAMR (Heat Assisted Magnetic Recording) closes on the laser diode of the regional area of disk.But bent afterbody modern age and have very little space for other conducting stratum trace in the engaging zones of this flexure afterbody, particularly because in conducting stratum, the flexure afterbody in modern age also comprises flexure joint pad.
Except need structural sheet (such as, stainless steel) and the first conducting stratum is (such as, comprise the layers of copper of flexure joint pad) outside, by adding the second conducting stratum (such as, second layers of copper), the flexure afterbody design in some past adapts to the increase of many electrical connections.But the second conducting stratum added like this increases cost and the complicacy of flexure afterbody.Therefore, this area needs new flexure afterbody design, and it can adapt to the increase of number of traces in the first conducting stratum.
Accompanying drawing explanation
Fig. 1 is the top perspective of the disc driver that can comprise embodiments of the invention.
Fig. 2 is the skeleton view of the head-stack assembly (HSA) that can comprise embodiments of the invention.
Fig. 3 is the skeleton view of a part for the flexible print wiring (FPC) used together with embodiments of the present invention.
Fig. 4 A describes and bends rear terminal region according to an embodiment of the invention.
Fig. 4 B is the exploded view of the flexure afterbody of Fig. 4 A.
The flexure rear terminal region of Fig. 5 A before to describe according to another embodiment of the invention folding.
Fig. 5 B is the exploded view of the flexure afterbody of Fig. 5 A.
Fig. 5 C describes the flexure rear terminal region of partially folded Fig. 5 A.
Fig. 5 D describes the flexure rear terminal region of Fig. 5 A after folding.
Embodiment
Fig. 1 is the top perspective of the disc driver 100 that can comprise embodiments of the invention.Disc driver 100 comprises disc driver collet 102 and two annular disks 104.Disc driver 100 comprises main shaft 106 further, and it is rotatably installed on disc driver collet 102, rotates for making disk 104.The rotation of disk 104 produces is flowed by the air of recirculating filter 108.In other embodiments, disc driver 100 can only have single disk, or alternatively, can have more than two disks.
Disc driver 100 comprises the actuator 116 be pivotably mounted on disc driver collet 102 further.Voice coil motor 112 pivoted actuator 116 makes at least one head suspension assembly (HGA) 114 place with being supposed to relative to one or more magnetic track information of corresponding one about disk 104 by limited angular region.In the embodiment in figure 1, actuator 116 comprises three arms, and four HGA114 are attached to described arm, and each arm corresponds to the surface of in two disks 104.But, in other embodiments, whether reduce the number of disk 104 according to the number of comprised disk 104 and disc driver 100, less or more HGA114 can be comprised.
Preferably, each HGA114 comprises the reading head 150 for coming and going the read and write of a disk 104.It, magnetic head 150 can be called reading head herein, even if also can perform other functions and contain such as writing other structures such as cd-rom recorder, micro-actuator, well heater, laser instrument, grinding guiding element of data.Once in a while, can breech lock (latch) 120 be passed through, actuator 116 is latched in the great Angle Position place in limited angular region.Via the flexible print wiring comprising elastic creel 122 (preferably comprising preamplifier circuit) and elastic creel frame 124, the electric signal of round HGA114 is carried to other drive electronics.
Fig. 2 is the skeleton view of the head-stack assembly (HSA) 200 that can comprise embodiments of the invention.Multiple actuator arms 226,236,238 that HSA200 comprises actuator body 232 and extends from actuator body 232.Actuator body 232 comprises the pivot bearings shell 220 be arranged in actuator bore, and support coils 235 coil supports 234 extended from actuator body 232 in the direction roughly contrary with actuator arm 226,236,238.HSA200 also comprises the multiple magnetic head-suspended rack assemblies (HGA) 240,242,244,254 being attached to actuator arm 226,236,238.Such as, die forging (swage) can be passed through and form this type of attachment.Note, internal actuator arm 226 comprises two HGA242,244, and each in external actuator arm 236,238 only comprises a HGA.This is because in the disc driver of Complete Dense, inner arm is placed between magnetic disk surface, and external actuator arm to be placed on above single magnetic disk surface (or below).But in sparse disc driver, any one in actuator arm can have one or zero HGA, may replace to emulate body block.
Each HGA comprises for the reading head read the magnetic disk surface closed on and/or write (such as, HGA254 comprises reading head 280).Reading head 280 is attached to the ligule part 272 of lamination flex member 270.Lamination flex member 270 is parts of HGA254, and is attached to load beam (part of HGA254, digital label 254 points to this part).Lamination flex member 270 can comprise structural sheet (such as, stainless steel), dielectric layer (such as, polyimide) and conducting stratum (such as, copper), and trace is patterned (pattern) in this conducting stratum.HAS200 also comprises the flexible print wiring (FPC) 260 closing on actuator body 232.FPC260 comprises elastic creel 262 and prime amplifier 266.FPC260 can comprise laminate, and it comprises two or more Conventional dielectric layer materials and conducting stratum material (such as, one or more of polymeric material, copper etc.).Lamination flex member 270 comprises flexure afterbody 274, and it advances to the terminal area 278 of lamination flex member 270 along actuator arm 238, and this terminal area 278 is electrically connected to the bond pad of FPC260.
Flexure afterbody (such as, flexure afterbody 274) comprise the ultrasonic joint of Gold plated Layer thereon to the method for the electrical connection of FPC260, solder reflow, solder ball spray (SBJ) and incorgruous conducting membranes (ACF) joint, and preferably but not necessarily robotization.In order to be electrically connected and regularly flexure afterbody is attached to FPC260, first, flexure afterbody is alignd with FPC260, and then press to FPC260 (at least temporarily), now set up and be electrically connected and complete fixing attachment.Maintaining the alignment of bond pad group and enough uniform pressure and temperature during this technique may be expect.
Fig. 3 is described in such as, FPC260 before the sub-end regions of flexure afterbody (that is, the part of each overlapping with FPC260 flexure afterbody, bends tail region 278) is engaged to FPC260.FPC260 comprises the extraction spool 382 ending at FPC bond pad 380 place, and the flexure joint pad that itself and HGA bend the terminal area (such as, bending rear terminal region 278) of afterbody aligns and is connected to described flexure joint pad.FPC draws spool 382 and can comprise copper and can be connected to preamplifier chip 315.Two in HGA flexure afterbody can be passed FPC slit 310, to help lend some impetus to their support and alignment.
FPC260 can comprise optional insulating cover 320, and it has the window exposed as lower area, and flexure rear terminal region and preamplifier chip 315 are engaged to described region.At Fig. 3 depending on there is shown excision overlayer 320, make it possible to better describe draw spool 382.FPC260 also can comprise dielectric base 330, FPC is drawn spool 382 and is placed in described dielectric base.
Fig. 4 A describes the terminal area bending afterbody 400 according to an embodiment of the invention.Fig. 4 B is the exploded view of the terminal area of flexure afterbody 400.With reference now to Fig. 4 A and 4B, lamination flex member 400 comprises metal conductive layers 430 (such as, copper), and it comprises elongated and narrow and be electrically connected to many conductive traces 436,438 of reading head (such as, the reading head 280 of Fig. 2).Lamination flex member 400 also comprises the structured metal layer 410 (such as, stainless steel) harder than conducting stratum 430.First dielectric layer 420 (such as, polyimide) is arranged between structural sheet 410 and conducting stratum 430.Second dielectric layer 440 (such as, polyimide) covers the conducting stratum 430 in flexure afterbody engaging zones 460 (region overlapping with FPC) substantially.Note, in the view of Fig. 4 A, partially illustrate the second cut dielectric layer 440, make feature below can be visible.
In the embodiment of Fig. 4 A and Fig. 4 B, structural sheet 410 is included in the multiple flexure joint pads 412,414 in flexure afterbody engaging zones 460.Each in multiple flexure joint pads 412,414 in structural sheet 410 is configured for aliging to corresponding (such as, as the FPC bond pad 380 of Fig. 3) in multiple FPC bond pad, towards and be engaged to described corresponding one.Note, in the embodiment of Fig. 4 A and Fig. 4 B, flexure afterbody must be prescribed route (rout) and (at bending position 462 place) bends, make structural sheet 410 towards FPC, violate the conventional practice making flexure afterbody bending, so that conducting stratum 430 (in the region exposed by overlayer) is towards FPC.As herein subsequently by description, interchangeable embodiments more of the present invention and the routine of flexure afterbody are selected approach and bend to coexist.
In the embodiment of Fig. 4 A and Fig. 4 B, by through in more than first through hole 426 of the first dielectric layer 420, by corresponding one in multiple conductive traces 436,438 that in the multiple flexure joint pads 412,414 in structural sheet 410, each is electrically connected in conducting stratum 430.The hole through the first dielectric layer 420 can be comprised alternatively through each in more than first through hole 426 of the first dielectric layer 420, described hole is filled up by conductive material, and the through hole widened in this conductive material contacts conducting stratum 430 connects convex surface (land) 432 or 434.Note, through hole 426 too little to such an extent as in fact in Figure 4 A with dotted line describe, even if in Figure 4 A, they covered by conducting stratum below feature.
Advantageously, in the embodiment of Fig. 4 A and Fig. 4 B, through hole connects convex surface 432,434 and does not need as the bond pad 412,414 in structural sheet 410 is so large, does not need to mate the encapsulation of FPC bond pad because through hole connects convex surface 432,434 or joins solder or the bonding agent of FPC bond pad even as big as accommodation to.Therefore, with bend in routine afterbody design in compared with, more space can be used in the trace 436,438 in conducting stratum 430.Such as, the less size (relative to corresponding bond pad 414) of through hole connection convex surface 434 allows more space for the trace 438 in conducting stratum 430.
In the embodiment of Fig. 4 A and Fig. 4 B, each in the flexure joint pad 412,414 in structural sheet 410 can comprise Gold plated Layer alternatively, such as, to help lend some impetus to the joint of FPC bond pad.Note, the engaging zones 460 of flex member 400 can comprise the multiple windows 422 through the first dielectric layer 420 and the corresponding multiple windows 442 through the second dielectric layer 440, such as, alternatively, to control the distribution of bonding agent or solder between joint aging time.In the embodiment of Fig. 4 A and Fig. 4 B, but window 422 and 442 is preferably not necessarily positioned at following position, namely in this position they by any part of the not conducting stratum 430 of exposure pattern.
With reference now to Fig. 3, Fig. 4 A and Fig. 4 B, by comprising the incorgruous conducting membranes (ACF) of the bonding agent of multiple conduction beads of diameter similar substantially of adulterating, each in the flexure joint pad 412,414 of structural sheet 410 can be joined to corresponding in multiple FPC bond pad 380 alternatively.In certain embodiments, ACF can adopt the bead of non-spherical shape, as cylindrical bead.In certain embodiments, before flexure joint pad 412,414 snaps to FPC bond pad 380, bonding agent can be deposited on FPC bond pad 380.Alternatively, make before thermode instrument contacts the second dielectric layer 440 (deviating from FPC bond pad 380), adhesive material is deposited to (towards FPC bond pad 380) on flexure joint pad 412,414, flex member 400 to be pressed to the FPC260 a period of time in engaging zones 460.
Thermode instrument can comprise any one plane be greater than substantially in multiple flexure joint pad 412,414 alternatively.But preferably not necessarily, pressure during engaging time section between flexure joint pad 412,414 and FPC bond pad 380 can arrange multiple conduction bead with individual layer, each and flexure joint pad 412,414 and corresponding FPC bond pad 380 electrical contact wherein in multiple conduction bead.Thermode instrument also can transmit heat by flex member 400 during engaging time section, and during this time period, raises the temperature of jointing material, such as, so that the solidification of speed adhesive material.
In certain embodiments, during the time period of the heat curing of adhesive material, the power applied by thermode enough causes elastic deformation substantially in the compression of conduction bead between flexure joint pad 412,414 and corresponding FPC bond pad 380.After removal thermode instrument, from the solidification temperature raised (utilizing the bonding agent after solidification) cooling conduction bead.This cooling makes conduction bead shrink relative to their dilation dimension during the heat curing of adhesive material.
But, preferably select enough large power, make the solidification post shrinkage of conduction bead fully can not alleviate the compression deformation of the conduction bead during curing experienced.Therefore, after adhesive material solidification, and after the removal of thermode instrument, conduction bead can remain on the compression (with compression deformation in a way) between flexure joint pad 412,414 and corresponding FPC bond pad 380.
Although the residual compressive of conduction bead can be equivalent to some residual tensions in the jointing material after solidifying, this type of residual compressive of conduction bead may be expected, thus strengthen and guarantee the reliable electric conductivity of ACF.Such as, when conduction bead is spherical, residual compressive can cause the little flat spot that can provide limited contact area instead of point cantact, and this desirably can reduce the resistance of ACF.
Fig. 5 A describes the terminal area of flexure afterbody 500 before folding according to another embodiment of the invention.Fig. 5 B is the exploded view of flexure afterbody 500.Fig. 5 C describes partially folded flexure rear terminal region 500.Folding direction illustrated by this view; During manufacturing process, flexure afterbody 500 not necessarily reaches so accurate configuration.Fig. 5 D describes the flexure afterbody 500 after folding.
With reference now to Fig. 5 A-5D, lamination flex member 500 comprises metal conductive layers 530 (such as, copper), and it comprises elongated and narrow and be electrically connected to multiple conductive traces 536 of reading head (such as, the reading head 280 of Fig. 2).Lamination flex member 500 also comprises the structured metal layer 510 (such as, stainless steel) harder than conducting stratum 530.First dielectric layer 520 (such as, polyimide) is arranged between structural sheet 510 and conducting stratum 530.Second dielectric layer 540 (such as, polyimide) covers the conducting stratum 530 in flexure afterbody engaging zones 560 (region overlapping with FPC) substantially.Note, show the second dielectric layer 440 of Partial Resection in the view of fig. 5, make feature below can be visible.
In the embodiment of Fig. 5 A-5D, structural sheet 510 comprises the multiple flexure joint pads 512,514,516,518 in flexure afterbody engaging zones 560.Each in multiple flexure joint pads 514,516,518 in structural sheet 510 be configured with in multiple FPC bond pad (such as, as the FPC bond pad 380 of Fig. 3) corresponding one align, in the face of and be engaged to described corresponding one.Note, in the embodiment of Fig. 5 A-5D, flexure afterbody should by fixed course routinely, structural sheet 510 (before folding) is made to deviate from FPC, except after folding, bond pads 514,516,518 some or all of in structural sheet towards and be engaged to (violation joins the conventional practice of the bond pad of the conducting stratum of flexure instead of the exposure of structural sheet to) outside FPC bond pad.
In the embodiment of Fig. 5 A-5D, by through in more than first through hole 526 of the first dielectric layer 520, each in the multiple flexure joint pads 512,514,516 in structural sheet 510 is electrically connected to corresponding in many conductive traces 536 in conducting stratum 530.Can comprise the hole through the first conducting stratum 530 alternatively through each of more than first through hole 526 of the first conducting stratum 530, described hole is filled up by conductive material, and the through hole widened in this conductive material contacts conducting stratum 530 connects convex surface 532 or 534.Note, through hole 526 is too little to such an extent as to utilize dotted line to describe in fact in fig. 5, though in fig. 5 they covered by conducting stratum below feature.
Advantageously, in the embodiment of Fig. 5 A-5D, through hole connects convex surface 532,534 and does not need as the bond pad 512,514,516 in structural sheet 510 is so large, does not need to mate the encapsulation of FPC bond pad because through hole connects convex surface 532,534 or joins solder or the bonding agent of FPC bond pad even as big as accommodation to.Therefore, compared with in designing with the flexure afterbody in routine, more space can be used in the trace 536 in conducting stratum 530.Such as, the less size (relative to corresponding bond pad 514) of through hole connection convex surface 534 allows more space for the trace 536 in conducting stratum 530.
In the embodiment of Fig. 5 A-5D, flexure afterbody 500 folds self in flexure afterbody engaging zones 560, conducting stratum 530 is made to become internal layer (namely, be arranged in the flexure joint pad 512,514 of structural sheet 510, and between the flexure joint pad 514,516,518 of structural sheet 510).In the embodiment of Fig. 5 A-5D, structural sheet 510 can comprise the isolated region 511 of multiple edges stiffened alternatively, and it can strengthen the edge of the flexure afterbody 500 in engaging zones 560 after folding.After folding, in the embodiment of Fig. 5 A-5D, outside on two sides that structural sheet 510 is arranged in the conducting stratum 530 in flexure afterbody engaging zones 560, wherein the flexure joint pad 512,514,516,518 of structural sheet 510 is towards outside.
In the embodiment of Fig. 5 A-5D, the second dielectric layer 540 comprises more than second through hole 546, and each comprises through the second dielectric layer 540, the hole filled up by conductive solder.The embodiment of Fig. 5 A-5D also comprises the 3rd many through holes 528 through the first dielectric layer 520, and it is arranged in below the bond pad 518 of structural sheet 510.After folding, more than second through hole 546 allows (by the first and second dielectric layers 520,540) that bond pad 518 is arranged connection convex surface 532 in the centre one be electrically connected in conducting stratum 530 in conjunction with the 3rd many through holes 528.The 3rd many through holes 528 can be filled effectively by utilizing conductive metal (such as, copper) in optional conduction backing region 538, help to form such electrical connection.
With reference now to the embodiment of Fig. 5 D after folding, can by making the structural sheet 510 on the second lateral surface of thermode instrument contact flexure afterbody 500, complete the joint of ACF to FPC, multiple flexure joint pads 514,516,518 of the structural sheet 510 on the first lateral surface to be pressed to multiple FPC bond pad (such as, the FPC bond pad 380 of Fig. 3) a period of time.Flexure joint pad 514,516,518 in structural sheet 510 can comprise Gold plated Layer alternatively, such as, to help lend some impetus to or to be increased to the electric conductivity of such joint of FPC bond pad.
In aforesaid instructions, describe the present invention with reference to concrete exemplary embodiment, but those skilled in the art will recognize that, the invention is not restricted to those.Should expect, can use in various characteristic sum of the present invention in different environment or application individually or jointly and possibly.Therefore, instructions and accompanying drawing are considered to illustrative and exemplary, instead of restrictive.Such as, word " preferably " and phrase " but preferably not necessarily " herein synonymously for as one man comprising " not necessarily " or implication alternatively." comprise ", " comprising " and " having " mean open-ended term.
Claims (20)
1. a disc driver, it comprises:
Disc driver collet;
Rotatably be mounted to the disk of described disc driver collet;
Be mounted to the actuator of described disc driver collet pivotally, described actuator comprises flexible print wiring and FPC, and it comprises multiple conduction FPC bond pad; With
Be attached at least one head suspension assembly of described actuator, at least one head suspension assembly described comprises
Reading head; With
Suspension module, it comprises
Load beam, and
Lamination flex member, it comprises the ligule part being connected to described reading head and the flexure afterbody extending to the flexure afterbody engaging zones overlapping with described FPC, described lamination flex member comprises conducting stratum, structural sheet, first dielectric layer and the second dielectric layer, described conducting stratum is metal and comprises elongated and narrow and be electrically connected to multiple conductive traces of described reading head, described structural sheet is metal and harder than described conducting stratum, described first dielectric layer is between described structural sheet and described conducting stratum, described second dielectric layer covers the described conducting stratum in described flexure afterbody engaging zones substantially,
Wherein said structural sheet comprises the multiple flexure joint pads in described flexure afterbody engaging zones, each in described multiple flexure joint pads in described structural sheet is alignd to corresponding in described multiple FPC bond pad, towards described corresponding one, and is engaged to described corresponding one; With
Wherein by through in more than first through hole of described first dielectric layer, each in described multiple flexure joint pad is electrically connected to corresponding in described multiple conductive trace.
2. disc driver according to claim 1, wherein said structural sheet comprises stainless steel, and described first dielectric layer comprises polyimide, and described conducting stratum comprises copper.
3. disc driver according to claim 2, at least one in described multiple flexure joint pads of wherein said structural sheet comprises Gold plated Layer.
4. disc driver according to claim 1, wherein by comprising the incorgruous conducting membranes of multiple conduction bead, joins described corresponding in described multiple FPC bond pad to by each in the described flexure joint pad of described structural sheet.
5. disc driver according to claim 1, wherein comprises through described first conducting stratum, the hole filled up with conductive material through each in described more than first through hole of described first conducting stratum.
6. disc driver according to claim 1, wherein said flexure afterbody folds self in described flexure afterbody engaging zones, described conducting stratum is made to be internal layer between the flexure joint pad of the described structural sheet be arranged in described flexure afterbody engaging zones, described structural sheet is arranged in the outside of the both sides of the described conducting stratum in described flexure afterbody engaging zones, and the described flexible engagement pad of wherein said structural sheet is towards outside.
7. disc driver according to claim 6, wherein said second dielectric layer comprises more than second through hole, and each comprises through described second conducting stratum, the hole filled up by conductive solder.
8. head suspension assembly and a HGA, described HGA comprises:
Reading head; With
Suspension module, it comprises
Load beam, and
Lamination flex member, it comprises the ligule part being connected to described reading head and the flexure afterbody extending to flexure afterbody engaging zones away from described ligule part, described lamination flex member comprises conducting stratum, structural sheet, first dielectric layer and the second dielectric layer, described conducting stratum is metal and comprises elongated and narrow and be electrically connected to multiple conductive traces of described reading head, described structural sheet is metal and harder than described conducting stratum, described first dielectric layer is between described structural sheet and described conducting stratum, described second dielectric layer covers the described conducting stratum in described flexure afterbody engaging zones substantially,
Wherein said structural sheet comprises the multiple flexure joint pads in described flexure afterbody engaging zones, by passing in more than first through hole of described first dielectric layer, each in described multiple flexure joint pad is electrically connected to corresponding in described multiple conductive trace, described flexure afterbody folds self in described flexure afterbody engaging zones.
9. HGA according to claim 8, wherein said structural sheet comprises stainless steel, and described first dielectric layer comprises polyimide, and described conducting stratum comprises copper.
10. HGA according to claim 9, at least one in described multiple flexure joint pads of wherein said structural sheet comprises Gold plated Layer.
11. HGA according to claim 8, wherein said conducting stratum is the internal layer between the flexure joint pad of the described structural sheet be arranged in described flexure afterbody engaging zones, described structural sheet is arranged in the outside of the both sides of the described conducting stratum in described flexure afterbody engaging zones, and the described flexure joint pad of wherein said structural sheet is towards outside.
12. HGA according to claim 8, wherein comprise through described first conducting stratum, the hole filled up with conductive material through each in described more than first through hole of described first conducting stratum.
13. HGA according to claim 8, wherein said second dielectric layer comprises more than second through hole, and each comprises through described second conducting stratum, the hole filled up by conductive solder.
14. 1 kinds of methods manufacturing head-stack assembly, described method comprises:
There is provided actuator, described actuator comprises the flexible print wiring and FPC with multiple flexible print wiring bond pad;
Head suspension assembly and HGA are provided, it comprises reading head and flexure afterbody, described flexure afterbody comprises conducting stratum, structural sheet, first dielectric layer and the second dielectric layer, described conducting stratum is metal and comprises elongated and narrow and be electrically connected to multiple conductive traces of described reading head, described structural sheet is metal and multiple flexure joint pads that are harder than described conducting stratum and that comprise in the flexure afterbody engaging zones of described flexure afterbody, described first dielectric layer is between described structural sheet and described conducting stratum, described second dielectric layer covers the described conducting stratum in described flexure afterbody engaging zones substantially,
Described HGA is attached to described actuator;
Described multiple flexure joint pad is alignd with described multiple FPC bond pad;
Each and described multiple FPC bond pad in described multiple flexure joint pad more corresponding between introduce the adhesive material comprising multiple conduction bead; And
Thermode instrument is contacted with described second dielectric layer in described flexure afterbody engaging zones, and described multiple flexure joint pads of described structural sheet are pressed to described multiple FPC bond pad a period of time by wherein said thermode instrument.
15. methods according to claim 14, wherein said thermode kit is containing any one plane be greater than substantially in described multiple flexure joint pad.
16. methods according to claim 14, wherein said thermode instrument transmits heat by described flexure afterbody engaging zones during described a period of time, and during described a period of time, raise the temperature of described adhesive material.
17. methods according to claim 14, are wherein attached to described actuator and comprise die forging and install to the forging of the described HGA of the arm of described actuator by described HGA.
18. methods according to claim 14, wherein introduce described adhesive material and are included in before described multiple FPC bond pad aligns with described multiple flexure joint pad, deposited to by described adhesive material on described multiple FPC bond pad.
19. methods according to claim 14, wherein introduce described adhesive material to be included in and to make before described thermode instrument contacts with described second dielectric layer of the described flexure afterbody in described flexure afterbody engaging zones, described adhesive material to be deposited on described multiple flexure joint pad.
20. 1 kinds of methods manufacturing head-stack assembly, described method comprises:
There is provided actuator, described actuator comprises the flexible print wiring and FPC with multiple flexible print wiring bond pad;
Head suspension assembly and HGA are provided, it comprises reading head and flexure afterbody, described flexure afterbody comprises conducting stratum, structural sheet, first dielectric layer and the second dielectric layer, described conducting stratum is metal and comprises elongated and narrow and be electrically connected to multiple conduction trace lines of described reading head, described structural sheet is metal and multiple flexure joint pads that are harder than described conducting stratum and that comprise in the flexure afterbody engaging zones of described flexure afterbody, described first dielectric layer is between described structural sheet and described conducting stratum, described second dielectric layer covers the described conducting stratum in described flexure afterbody engaging zones substantially, wherein said flexure afterbody folds self in described flexure afterbody engaging zones, described conducting stratum is made to be internal layer between the flexure joint pad of the described structural sheet be arranged in described flexure afterbody engaging zones, described structural sheet is arranged in the outside of the both sides of the described conducting stratum in described flexure afterbody engaging zones, on first lateral surface of the described flexure afterbody wherein in described flexure afterbody engaging zones and the second lateral surface, the described flexure joint pad of described structural sheet is towards outside,
Described HGA is attached to described actuator;
Described multiple flexure joint pad is alignd with described multiple FPC bond pad;
Each and described multiple FPC bond pad in described multiple flexure joint pad more corresponding between introduce the adhesive material comprising multiple conduction bead; And
Thermode instrument is contacted with described structural sheet on described second lateral surface of described flexure afterbody, thus makes described multiple flexure joint pads of the described structural sheet on described first lateral surface press to described multiple FPC bond pad a period of time.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/492,266 | 2014-09-22 | ||
| US14/492,266 US9633680B2 (en) | 2010-10-29 | 2014-09-22 | Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105448309A true CN105448309A (en) | 2016-03-30 |
| CN105448309B CN105448309B (en) | 2019-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510608260.1A Active CN105448309B (en) | 2014-09-22 | 2015-09-22 | Flexure tail portion is covered with the head suspension float of conducting shell and structure sheaf landing pad |
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| Country | Link |
|---|---|
| CN (1) | CN105448309B (en) |
| HK (1) | HK1223191A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112530464A (en) * | 2019-09-19 | 2021-03-19 | 株式会社东芝 | Disk device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8218268B1 (en) * | 2009-05-27 | 2012-07-10 | Western Digital Technologies, Inc. | Head gimbal assembly having a load beam aperature over conductive heating pads that are offset from head bonding pads |
| US8295013B1 (en) * | 2010-10-29 | 2012-10-23 | Western Digital Technologies, Inc. | Disk drive head stack assembly having a flexible printed circuit with heat transfer limiting features |
| US8295014B1 (en) * | 2010-10-29 | 2012-10-23 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with transverse flying leads |
| US8325446B1 (en) * | 2010-10-29 | 2012-12-04 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with features to facilitate bonding |
| US8467153B1 (en) * | 2010-10-29 | 2013-06-18 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with folded bond pads |
| US8477459B1 (en) * | 2010-10-29 | 2013-07-02 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with dual conductive layers and features to facilitate bonding |
-
2015
- 2015-09-22 CN CN201510608260.1A patent/CN105448309B/en active Active
-
2016
- 2016-09-28 HK HK16111358.5A patent/HK1223191A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8218268B1 (en) * | 2009-05-27 | 2012-07-10 | Western Digital Technologies, Inc. | Head gimbal assembly having a load beam aperature over conductive heating pads that are offset from head bonding pads |
| US8295013B1 (en) * | 2010-10-29 | 2012-10-23 | Western Digital Technologies, Inc. | Disk drive head stack assembly having a flexible printed circuit with heat transfer limiting features |
| US8295014B1 (en) * | 2010-10-29 | 2012-10-23 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with transverse flying leads |
| US8325446B1 (en) * | 2010-10-29 | 2012-12-04 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with features to facilitate bonding |
| US8467153B1 (en) * | 2010-10-29 | 2013-06-18 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with folded bond pads |
| US8477459B1 (en) * | 2010-10-29 | 2013-07-02 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with dual conductive layers and features to facilitate bonding |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112530464A (en) * | 2019-09-19 | 2021-03-19 | 株式会社东芝 | Disk device |
| CN112530464B (en) * | 2019-09-19 | 2022-06-24 | 株式会社东芝 | Disk device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105448309B (en) | 2019-04-26 |
| HK1223191A1 (en) | 2017-07-21 |
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