CN105441911A - Chemical plating solution used for chemically plating Ni-B/GO composite coating on surface of SiCp/Al material and application thereof - Google Patents
Chemical plating solution used for chemically plating Ni-B/GO composite coating on surface of SiCp/Al material and application thereof Download PDFInfo
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- CN105441911A CN105441911A CN201510799716.7A CN201510799716A CN105441911A CN 105441911 A CN105441911 A CN 105441911A CN 201510799716 A CN201510799716 A CN 201510799716A CN 105441911 A CN105441911 A CN 105441911A
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Abstract
The invention discloses a chemical plating solution used for chemically plating an Ni-B/GO composite coating on the surface of an SiCp/Al material and an application thereof. The chemical plating solution comprises, by weight, 35-45 g/L of nickel acetate, 0.3-0.7 g/L of sodium borohydride, 40-50 g/L of ethidene diamine, 30-40 g/L of sodium hydroxide, 8-15 g/L of boric acid, 0.2-0.4 g/L of sodium dodecyl sulfate (SDS), 0.25-1 g/L of graphene oxide (GO) and the balance distilled water. A composite material obtained by applying the chemical plating solution to plating the Ni-B/GO composite coating on the surface of the SiCp/Al material is resistant to high temperature, higher in oxidation resistance, and good in welding performance and corrosion resistance.
Description
Technical field
The present invention relates to materials science field, specifically, relate to a kind of chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite and application thereof.
Background technology
Enhancing aluminum-base composite material by silicon carbide particles (SiCp/Al matrix material) is composited by silicon carbide and granular aluminium, has that high specific strength, high ratio modulus, low thermal coefficient of expansion, antiwear property are strong, high-dimensional stability, high-wearing feature and good heat-conductivity conducting, high-temperature behavior and a fatigue property.Enhancing aluminum-base composite material by silicon carbide particles has future in engineering applications widely in fields such as aerospace, boats and ships, automobile, electronics and space technologies, is one of the most competitive universally recognized metal-base composites kind at present.But because in material, SiC grain volume fraction is higher, its welding property is poor, and is easily oxidized in welding process, higher to shielding gas purity requirement.For this reason, the imagination at its coating surface layer of metal protective layer is proposed.The metal level of surface coverage should be combined firmly with matrices of composite material, himself must have the characteristics such as high temperature resistant, anti-oxidant again, also good with solder.
Nowadays, along with the further investigation to enhancing aluminum-base composite material by silicon carbide particles, the method of carrying out electroless plating on enhancing aluminum-base composite material by silicon carbide particles surface is numerous, and also nobody carries out chemical nickel boron alloy on enhancing aluminum-base composite material by silicon carbide particles surface at present.
WUMao group is studied the surface reaction between chemical nickel phosphorus plating SiCp/Al matrix material and tin 2.5Ag-2.0Ni solder, finds that different P content will cause different solder joint microtextures.When the content of P is 10%, Ni in solder, produces Ni with high speed diffusion
3sn
4.From this, we can find, P has played huge effect in welding reaction.E.Correa group carries out Electroless Plating Ni-B on AZ91D magnesium alloy He on pure magnesium, and characterizes two coating, detects its wear resistance and erosion resistance, effective than in pure magnesium top of the effect finding coating on magnesium alloy.Illustrate that B is very helpful to the corrosion-resistant of coating and rub resistance.And Graphene is that extremely the concern energetically of scientific research institution, has become the hot research problem in the fields such as chemistry, physics with the two-dirnentional structure of its uniqueness and excellent electricity, optics, warm blood and mechanical property.A large amount of theory and experimental study show, Graphene and derivative thereof have potential significant application value in fields such as nano-device, semiconductor material, biosensor, information storage, solar cell and hydrogen storage materials.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a kind of chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite and application thereof.Chemical plating fluid composition of the present invention is simple, and for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite, the matrix material obtained has good welding property and corrosion resistance nature.
Technical scheme of the present invention is specific as follows.
The invention provides a kind of chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite, chemical plating fluid by often liter of calculatings, its form and content as follows:
Surplus is distilled water.
In the present invention, the preparation method of the above-mentioned chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite, concrete steps are as follows:
(1), after graphene oxide sodium lauryl sulphate being carried out surface modification, ultrasonic disperse is stand-by;
(2) graphene oxide of the modification in nickelous acetate, sodium borohydride, quadrol, boric acid, sodium lauryl sulphate and step (1) is dissolved in distilled water, obtain mixing solutions;
(3) by the mixing solutions of step (2) by sodium hydroxide adjust ph to 10-14, namely obtain chemical plating fluid.
The present invention also provides a kind of application of the above-mentioned chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite.The concrete steps of application method are as follows:
1. adopt the pretreatment technology of no-palladium activating, pre-treatment is carried out to SiCp/Al material surface;
2. by step 1. SiCp/Al material after pretreatment put into chemical plating fluid, after passing into air 20-40min, take out, with distilled water cleaning, drier at 15-25 DEG C of temperature, namely obtain the SiCp/Al matrix material of surface chemical plating Ni-B/GO composite deposite.
Above-mentioned steps 1. in, the pre-treatment step of SiCp/Al material surface process comprises oil removing, alligatoring and activation three step.
Beneficial effect of the present invention is:
1, hydroborate is for reductive agent the strongest in chemical nickel plating, and any one water-soluble boron hydride can use, and the relative molecular mass of hydroborate is little, but the equivalent that can be used for reducing is very high.Generally, the reducing equivalent of hydroborate is higher than hypophosphite, and 1 borohydride molecule is equivalent to 4 hypophosphite molecules, and therefore, it is both economical with sodium borohydride to be that reductive agent carries out chemical nickel plating.In basic solution, Ni-B coating has higher solidity to corrosion and good Weldability;
2, Graphene is that extremely the concern energetically of scientific research institution, has become the hot research problem in the fields such as chemistry, physics with the electricity of the two-dirnentional structure of its uniqueness and excellence, optics, warm blood and mechanical property.A large amount of theory and experimental study show, Graphene and derivative thereof have potential significant application value in fields such as nano-device, semiconductor material, biosensor, information storage, solar cell and hydrogen storage materials;
3, SiCp/Al material surface Electroless Deposited Ni-B Alloy, improve material welding property, the application for material is very helpful; Adopt electroless plating method, the dispersive ability of coating is good, without obvious fringing effect;
4, SiCp/Al material has the excellent physicals such as higher specific tenacity, specific rigidity, Young's modulus, wear resistance and low thermal expansivity, have lot of advantages, and cost is low than single material.
Embodiment
Below in conjunction with specific embodiment, technical scheme of the present invention is further described, but the present invention is not limited to following embodiment.
Various raw materials used in various embodiments of the present invention, if no special instructions, are commercially available.
Embodiment 1
For a chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite, by often liter of calculatings, its form and content as follows:
Surplus is distilled water;
Above-mentioned chemical nickel plating boron plating solution is prepared by the method for following step:
Nickelous chloride, sodium borohydride, quadrol, sodium lauryl sulphate, graphene oxide are added in distilled water successively and dissolves, then use 10% sodium hydroxide adjust ph to 10-13, namely obtain chemical plating fluid.
Application Example 1
The nickel boron chemical plating fluid of embodiment 1 is applied to enhancing aluminum-base composite material by silicon carbide particles surface to form the method for Ni-B/GO Composite Coatings coating, specifically comprises the steps:
(1) pre-treatment on SiCp/Al material work piece surface
First by SiCp/Al material surface successively through the polishing of 1,4, No. 6 abrasive paper for metallograph, then in acetone soln ultrasonic cleaning 4min, except degreasing.
Then in the mixing solutions of nitric acid, hydrogen peroxide, deionized water (Volume fraction is 1:1:1), room temperature, alligatoring 10min.
Finally material is put into by Ni (Ac)
2(g), NaH
2pO
2(g) and CH
3cH
2in the no-palladium activating liquid that OH (ml) forms with 1:1:15 ratio, ultrasonic assistant, room temperature, after dipping 9min, puts into thermostat container in 170 DEG C, constant temp. heating process 20min.
(2) SiCp/Al material after pretreatment for step (1) is put into Ni-B/GO plating solution, after passing into air 40min, take out, after after carrying out cleaning control temperature 15 DEG C carries out drying, namely obtain the sample A that surface is coated with Ni-B/GO chemical composite plating with distilled water.
Embodiment 2
For a chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite, by often liter of calculatings, its form and content as follows:
Surplus is distilled water;
Above-mentioned chemical nickel plating boron plating solution is prepared by the method for following step:
Nickelous chloride, sodium borohydride, quadrol, sodium lauryl sulphate, graphene oxide are added in distilled water successively and dissolves, then use 10% sodium hydroxide adjust ph to 11, namely obtain chemical plating fluid.
Application Example 2
The nickel boron chemical plating fluid of embodiment 2 is applied to enhancing aluminum-base composite material by silicon carbide particles surface to form the method for Ni-B/GO Composite Coatings coating, specifically comprises the steps:
(1) pre-treatment on SiCp/Al material work piece surface
First by SiCp/Al material surface successively through the polishing of 1,4, No. 6 abrasive paper for metallograph, then in acetone soln ultrasonic cleaning 4min, except degreasing.
Then in the mixing solutions of nitric acid, hydrogen peroxide, deionized water (Volume fraction is 1:1:1), room temperature, alligatoring 10min.
Finally material is put into by Ni (Ac)
2(g), NaH
2pO
2(g) and CH
3cH
2in the no-palladium activating liquid that OH (ml) forms with 1:1:15 ratio, ultrasonic assistant, room temperature, after dipping 9min, puts into thermostat container in 170 DEG C, constant temp. heating process 20min.
(2) SiCp/Al material after pretreatment for step (1) is put into Ni-B/GO plating solution, after passing into air 30min, take out, after after carrying out cleaning control temperature 20 DEG C carries out drying, namely obtain the sample B that surface is coated with Ni-B/GO chemical composite plating with distilled water.
Embodiment 3
For a chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite, by often liter of calculatings, its form and content as follows:
Surplus is distilled water.
Above-mentioned chemical nickel plating boron plating solution is prepared by the method for following step:
Nickelous acetate, sodium borohydride, quadrol, sodium lauryl sulphate, graphene oxide are added in distilled water successively and dissolves, then use 10% sodium hydroxide adjust ph to 11, namely obtain chemical plating fluid.
Application Example 3
The nickel boron chemical plating fluid of embodiment 3 is applied to enhancing aluminum-base composite material by silicon carbide particles surface to form the method for Ni-B/GO Composite Coatings coating, specifically comprises the steps:
(1) pre-treatment on SiCp/Al material work piece surface
First by SiCp/Al material surface successively through the polishing of 1,4, No. 6 abrasive paper for metallograph, then in acetone soln ultrasonic cleaning 4min, except degreasing.
Then in the mixing solutions of nitric acid, hydrogen peroxide, deionized water (Volume fraction is 1:1:1), room temperature, alligatoring 10min.
Finally this material is put into by Ni (Ac)
2(g), NaH
2pO
2(g) and CH
3cH
2in the no-palladium activating liquid that OH (ml) forms with 1:1:15 ratio, ultrasonic assistant, room temperature, after dipping 9min, puts into thermostat container in 170 DEG C, constant temp. heating process 20min.
(2) SiCp/Al material after pretreatment for step (1) is put into Ni-B/GO plating solution, after passing into air 20min, take out, after after carrying out cleaning control temperature 25 DEG C carries out drying, namely obtain the sample C that surface is coated with Ni-B/GO chemical composite plating with distilled water.
Claims (4)
1., for a chemical plating fluid for SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite, it is characterized in that, chemical plating fluid by often liter of calculatings, its form and content as follows:
Surplus is distilled water.
2., as claimed in claim 1 for the chemical plating fluid of SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite, it is characterized in that, its preparation method is as follows:
(1), after graphene oxide sodium lauryl sulphate being carried out surface modification, ultrasonic disperse is stand-by;
(2) graphene oxide of the modification in nickelous acetate, sodium borohydride, quadrol, boric acid, sodium lauryl sulphate and step (1) is dissolved in distilled water, obtain mixing solutions;
(3) by the mixing solutions of step (2) by sodium hydroxide adjust ph to 10-14, namely obtain chemical plating fluid.
3. the application for the chemical plating fluid of SiCp/Al material surface Electroless Plating Ni-B/GO composite deposite as claimed in claim 1.
4. apply as claimed in claim 3, it is characterized in that, the concrete steps of application method are as follows:
1. adopt the pretreatment technology of no-palladium activating, pre-treatment is carried out to SiCp/Al material surface;
2. by step 1. SiCp/Al material after pretreatment put into chemical plating fluid, after passing into air 20-40min, take out, with distilled water cleaning, drier at 15-25 DEG C of temperature, namely obtain surface chemical plating Ni-B/GO matrix material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510799716.7A CN105441911A (en) | 2015-11-19 | 2015-11-19 | Chemical plating solution used for chemically plating Ni-B/GO composite coating on surface of SiCp/Al material and application thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105839082A (en) * | 2016-06-13 | 2016-08-10 | 上海应用技术学院 | Ce-Ni-B/GO chemical composite deposition layer and ultrasonic-assisted preparation method thereof |
| CN110438496A (en) * | 2019-09-23 | 2019-11-12 | 兰州理工大学 | Vacuum cladding+chemical plating is molten-structure and preparation method thereof of plating composite coating |
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| CN1827851A (en) * | 2006-03-15 | 2006-09-06 | 厦门大学 | Method for chemical plating of nickel-boron alloy on magnesium alloy surface |
| CN101293294A (en) * | 2008-05-30 | 2008-10-29 | 北京科技大学 | Sealing-in method for packaging outer shell with aluminum silicon carbide |
| CN103833231A (en) * | 2014-03-06 | 2014-06-04 | 上海应用技术学院 | Glass with graphene oxide nickel-phosphorus composite coating and preparation method of glass |
| CN104862676A (en) * | 2015-03-25 | 2015-08-26 | 上海应用技术学院 | Graphene oxide nickel-phosphorus composite plating solution, preparation method and applications thereof |
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2015
- 2015-11-19 CN CN201510799716.7A patent/CN105441911A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1827851A (en) * | 2006-03-15 | 2006-09-06 | 厦门大学 | Method for chemical plating of nickel-boron alloy on magnesium alloy surface |
| CN101293294A (en) * | 2008-05-30 | 2008-10-29 | 北京科技大学 | Sealing-in method for packaging outer shell with aluminum silicon carbide |
| CN103833231A (en) * | 2014-03-06 | 2014-06-04 | 上海应用技术学院 | Glass with graphene oxide nickel-phosphorus composite coating and preparation method of glass |
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| 李东光: "《金属表面处理剂配方手册》", 30 June 2015, 化学工业出版社 * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105839082A (en) * | 2016-06-13 | 2016-08-10 | 上海应用技术学院 | Ce-Ni-B/GO chemical composite deposition layer and ultrasonic-assisted preparation method thereof |
| CN110438496A (en) * | 2019-09-23 | 2019-11-12 | 兰州理工大学 | Vacuum cladding+chemical plating is molten-structure and preparation method thereof of plating composite coating |
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