CN105440660A - High-efficiency composite PA heat conduction and dispersion material, and preparation method and applications thereof - Google Patents
High-efficiency composite PA heat conduction and dispersion material, and preparation method and applications thereof Download PDFInfo
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- CN105440660A CN105440660A CN201510957567.2A CN201510957567A CN105440660A CN 105440660 A CN105440660 A CN 105440660A CN 201510957567 A CN201510957567 A CN 201510957567A CN 105440660 A CN105440660 A CN 105440660A
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- heat sink
- sink material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a high-efficiency composite PA heat conduction and dispersion material, and a preparation method and applications thereof. The high-efficiency composite PA heat conduction and dispersion material is prepared from 50 to 70% of polyamide, 5 to 10% of a metal oxide, 10 to 20% of a metal nitride, and 15 to 25% of polyester fiber. The preparation method comprises following steps: the metal oxide, the metal nitride, and polyester fiber are mixed, an obtained mixture is mixed with polyamide, and an obtained mixed material is subjected to extrusion so as to obtain the high-efficiency composite PA heat conduction and dispersion material. The high-efficiency composite PA heat conduction and dispersion material is a halogen-free environment-friendly flame-retardant material, possesses excellent mechanical properties, low density, and high insulating properties, is convenient to process, is low in cost, is a heat conduction and dispersion material with excellent comprehensive properties, and can be widely applied to the fields such as LED illumination, heat conduction and heat dispersion plates, and electric products; heat conductivity coefficient is as high as 1.2W/m.k; and flame resistance is capable of reaching V0 grade.
Description
Technical field
The invention belongs to and lead heat sink material field, relate to a kind of PA and lead heat sink material and its preparation method and application, particularly relate to a kind of high efficiency composition PA and lead heat sink material and its preparation method and application.
Background technology
Along with all kinds of electronic devices and components run high speed and superpower, requirement equipment can produce relative high heat energy in use with operational process, electronic devices and components in use overheated is caused to lead loose, thus damage its performance and reduce safe reliability, even significantly reduce the life-span of a whole set of electronic system.Conventional engineering plastics, comprise thermoplasticity and thermosetting resin, there is satisfactory mechanical property, chemically stable, the advantages such as electrical isolation, be widely used in the fields such as microelectronics electrical equipment, but because of its thermal conductivity too low, belong to heat poor conductor, not only can not solve high heat dissipation problem, and can not effectively be transmitted due to heat, some heat sensitive components and parts may be made overheated, thus significantly reduce system lifetim or operational efficiency.Meanwhile, based on the consideration of security, key is that requirement material used has highly effective flame-retardant characteristic, such as reaches UL94V0 flame-retardant standard.Nylon is a kind of conventional plastic material, but due to its fire-retardant rank lower, not by UL94V0 thin-walled testing standard.
Therefore, a kind of nylon guide heat sink material with high thermal conductivity coefficient and good flame-retardance of exploitation is needed badly in this area.
Summary of the invention
For the deficiencies in the prior art, the object of the present invention is to provide a kind of PA to lead heat sink material and its preparation method and application, especially provide a kind of high efficiency composition PA to lead heat sink material and its preparation method and application.
For reaching this object, the present invention by the following technical solutions:
On the one hand, the invention provides a kind of PA and lead heat sink material, described PA leads heat sink material and is prepared by following raw material:
Lead in the raw material of heat sink material at PA of the present invention, the consumption of polymeric amide is 50-70%, such as 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 61%, 62%, 63%, 64% or 65%.
Lead in the raw material of heat sink material at PA of the present invention, the consumption of metal oxide is 5-10%, such as 5.5%, 5.8%, 6%, 6.3%, 6.5%, 6.8%, 7%, 7.4%, 7.8%, 8%, 8.5%, 8.8%, 9%, 9.5% or 9.8%.
Lead in the raw material of heat sink material at PA of the present invention, the consumption of metal nitride is 10-20%, such as 10.5%, 11%, 11.5%, 12%, 12.5%, 13%, 13.5%, 14%, 14.5%, 15%, 15.5%, 16%, 16.5%, 17%, 17.5%, 18%, 18.5%, 19% or 19.5%.
Lead in the raw material of heat sink material at PA of the present invention, the consumption of trevira is 15-25%, such as 15.5%, 16%, 16.5%, 17%, 17.5%, 18%, 18.5%, 19%, 20%, 21%, 22%, 23%, 24% or 24.5%.
Preferably, PA of the present invention leads heat sink material and is prepared by following raw material:
In the present invention, described metal oxide is the combination of any one or at least two kinds in silicon-dioxide, titanium dioxide, antimonous oxide or alchlor.Described combination can be but be not limited to the combination of silicon-dioxide and titanium dioxide, the combination of titanium dioxide and antimonous oxide, the combination of silicon-dioxide, titanium dioxide and antimonous oxide, the combination of the combination of antimonous oxide and alchlor or titanium dioxide, antimonous oxide and alchlor.
In the present invention, described metal nitride is the combination of any one or at least two kinds in magnesium nitride, aluminium nitride, titanium nitride or tantalum nitride.Described combination can be but be not limited to the combination of magnesium nitride and aluminium nitride, the combination of aluminium nitride and titanium nitride, the combination of aluminium nitride, titanium nitride and tantalum nitride, the combination of magnesium nitride, aluminium nitride and titanium nitride.
On the other hand, the PA that the invention provides as described in relation to the first aspect leads the preparation method of heat sink material, said method comprising the steps of:
(1) blended to metal oxide, metal nitride and trevira doping is obtained mixture;
(2) step (1) described mixture is mixed with polymeric amide, extrude and obtain described PA and lead heat sink material.
In the preparation process in accordance with the present invention, step (1) described blended doping time stir speed (S.S.) be 100-200r/min, such as 105r/min, 110r/min, 115r/min, 120r/min, 125r/min, 130r/min, 135r/min, 140r/min, 145r/min, 150r/min, 155r/min, 160r/min, 165r/min, 170r/min, 175r/min, 180r/min, 185r/min, 190r/min or 195r/min.
Preferably, step (2) described mixing time stir speed (S.S.) be 150-250r/min, such as 155r/min, 160r/min, 165r/min, 170r/min, 175r/min, 180r/min, 190r/min, 200r/min, 210r/min, 220r/min, 230r/min, 235r/min, 240r/min or 245r/min.
Preferably, extrude described in step (2) and carry out in twin screw extruder.
Preferably, the preheating temperature in described double-screw extruder screw region is 260-380 DEG C, such as 265 DEG C, 270 DEG C, 275 DEG C, 280 DEG C, 285 DEG C, 290 DEG C, 295 DEG C, 300 DEG C, 305 DEG C, 310 DEG C, 320 DEG C, 330 DEG C, 340 DEG C, 350 DEG C, 360 DEG C or 370 DEG C.
Preferably, the screw speed of described twin screw extruder is 250-400r/min, such as 255r/min, 260r/min, 270r/min, 280r/min, 290r/min, 300r/min, 320r/min, 340r/min, 350r/min, 370r/min, 380r/min or 390r/min.
As the preferred technical solution of the present invention, the preparation method that PA of the present invention leads heat sink material comprises the following steps:
(1) the blended doping under the stir speed (S.S.) of 100-200r/min of metal oxide, metal nitride and trevira is obtained mixture;
(2) mixed under the stir speed (S.S.) of 150-250r/min with polymeric amide by step (1) described mixture, utilize twin screw extruder to extrude, the preheating temperature in described double-screw extruder screw region is 260-380 DEG C; , screw speed is 250-400r/min, obtains described PA and leads heat sink material.
On the other hand, the invention provides PA as described in relation to the first aspect and lead the application of heat sink material in electronic apparatus material.
Relative to prior art, the present invention has following beneficial effect:
PA of the present invention leads heat sink material by 50-70% polymeric amide, 5-10% metal oxide, 10-20% metal nitride and 15-25% trevira prepare, by by metal oxide, metal nitride and the blended doping of trevira, then mix with polymeric amide, extrude and obtain described PA and lead heat sink material, it is halogen-free environment-friendly flame-proof material that this PA leads heat sink material, its thermal conductivity is up to 1.2W/m.k, flame retardant resistance reaches V0 level, there is good mechanical property, density is low, high insulation, easy processing, cost is low, be a kind of over-all properties good lead heat sink material, LED illumination can be widely used in, heat conduction and heat radiation plate, the fields such as electronic apparatus.
Embodiment
Technical scheme of the present invention is further illustrated below by embodiment.Those skilled in the art should understand, described embodiment is only help to understand the present invention, should not be considered as concrete restriction of the present invention.
Embodiment 1
In the present embodiment, PA leads heat sink material and is prepared by following raw material:
Preparation method is as follows:
(1) the blended doping under the stir speed (S.S.) of 200r/min of metal oxide, metal nitride and trevira is obtained mixture;
(2) mixed under the stir speed (S.S.) of 200r/min with polymeric amide by step (1) described mixture, utilize twin screw extruder to extrude, the preheating temperature in described double-screw extruder screw region is 300 DEG C; , screw speed is 300r/min, obtains PA and leads heat sink material.
Embodiment 2
In the present embodiment, PA leads heat sink material and is prepared by following raw material:
Preparation method is as follows:
(1) the blended doping under the stir speed (S.S.) of 100r/min of metal oxide, metal nitride and trevira is obtained mixture;
(2) mixed under the stir speed (S.S.) of 250r/min with polymeric amide by step (1) described mixture, utilize twin screw extruder to extrude, the preheating temperature in described double-screw extruder screw region is 380 DEG C; , screw speed is 250r/min, obtains PA and leads heat sink material.
Embodiment 3
In the present embodiment, PA leads heat sink material and is prepared by following raw material:
Preparation method is as follows:
(1) the blended doping under the stir speed (S.S.) of 150r/min of metal oxide, metal nitride and trevira is obtained mixture;
(2) mixed under the stir speed (S.S.) of 150r/min with polymeric amide by step (1) described mixture, utilize twin screw extruder to extrude, the preheating temperature in described double-screw extruder screw region is 260 DEG C; , screw speed is 400r/min, obtains PA and leads heat sink material.
Embodiment 4
In the present embodiment, PA leads heat sink material and is prepared by following raw material:
Preparation method is as follows:
(1) the blended doping under the stir speed (S.S.) of 180r/min of metal oxide, metal nitride and trevira is obtained mixture;
(2) mixed under the stir speed (S.S.) of 250r/min with polymeric amide by step (1) described mixture, utilize twin screw extruder to extrude, the preheating temperature in described double-screw extruder screw region is 380 DEG C; , screw speed is 280r/min, obtains PA and leads heat sink material.
Embodiment 5
In the present embodiment, PA leads heat sink material and is prepared by following raw material:
Preparation method is as follows:
(1) the blended doping under the stir speed (S.S.) of 100r/min of metal oxide, metal nitride and trevira is obtained mixture;
(2) mixed under the stir speed (S.S.) of 150r/min with polymeric amide by step (1) described mixture, utilize twin screw extruder to extrude, the preheating temperature in described double-screw extruder screw region is 280 DEG C; , screw speed is 350r/min, obtains PA and leads heat sink material.
Comparative example 1
As different from Example 1, PA leads heat sink material and is prepared by following raw material this comparative example:
Polyamide 6 8%
Metal nitride 12%
Trevira 20%
Preparation method is identical with embodiment 1.
Comparative example 2
As different from Example 1, PA leads heat sink material and is prepared by following raw material this comparative example:
Polymeric amide 70%
Metal oxide 8%
Trevira 22%
Preparation method is identical with embodiment 1.
Comparative example 3
As different from Example 1, PA leads heat sink material and is prepared by following raw material this comparative example:
Preparation method is identical with embodiment 1.
Comparative example 4
As different from Example 1, PA leads heat sink material and is prepared by following raw material this comparative example:
Preparation method is identical with embodiment 1.
The performance that the PA prepared embodiment 1-5 and comparative example 1-4 leads heat sink material is tested, testing method and test result as shown in table 1.
Table 1
Applicant states, by above-described embodiment, the present invention illustrates that high efficiency composition PA of the present invention leads heat sink material and its preparation method and application, but the present invention is not limited to above-described embodiment, does not namely mean that the present invention must rely on above-described embodiment and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (10)
1. PA leads a heat sink material, it is characterized in that, described PA leads heat sink material and prepared by following raw material:
2. PA according to claim 1 leads heat sink material, it is characterized in that, described PA leads heat sink material and prepared by following raw material:
3. PA according to claim 1 and 2 leads heat sink material, it is characterized in that, described metal oxide is the combination of any one or at least two kinds in silicon-dioxide, titanium dioxide, antimonous oxide or alchlor.
4. the PA according to any one of claim 1-3 leads heat sink material, it is characterized in that, described metal nitride is the combination of any one or at least two kinds in magnesium nitride, aluminium nitride, titanium nitride or tantalum nitride.
5. the PA according to any one of claim 1-4 leads the preparation method of heat sink material, it is characterized in that, said method comprising the steps of:
(1) blended to metal oxide, metal nitride and trevira doping is obtained mixture;
(2) step (1) described mixture is mixed with polymeric amide, extrude and obtain described PA and lead heat sink material.
6. preparation method according to claim 5, is characterized in that, step (1) described blended doping time stir speed (S.S.) be 100-200r/min.
7. the preparation method according to claim 5 or 6, is characterized in that, step (2) described mixing time stir speed (S.S.) be 150-250r/min.
8. the preparation method according to any one of claim 5-7, is characterized in that, extrudes and carry out in twin screw extruder described in step (2);
Preferably, the preheating temperature in described double-screw extruder screw region is 260-380 DEG C;
Preferably, the screw speed of described twin screw extruder is 250-400r/min.
9. the preparation method according to any one of claim 5-8, is characterized in that, said method comprising the steps of:
(1) the blended doping under the stir speed (S.S.) of 100-200r/min of metal oxide, metal nitride and trevira is obtained mixture;
(2) mixed under the stir speed (S.S.) of 150-250r/min with polymeric amide by step (1) described mixture, utilize twin screw extruder to extrude, the preheating temperature in described double-screw extruder screw region is 260-380 DEG C; , screw speed is 250-400r/min, obtains described PA and leads heat sink material.
10. the PA according to any one of claim 1-4 leads the application of heat sink material in electronic apparatus material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510957567.2A CN105440660A (en) | 2015-12-17 | 2015-12-17 | High-efficiency composite PA heat conduction and dispersion material, and preparation method and applications thereof |
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| CN201510957567.2A CN105440660A (en) | 2015-12-17 | 2015-12-17 | High-efficiency composite PA heat conduction and dispersion material, and preparation method and applications thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220289A (en) * | 1993-12-24 | 1999-06-23 | 可乐丽股份有限公司 | Polyamide composition |
| CN101747643A (en) * | 2008-12-05 | 2010-06-23 | 上海神沃电子有限公司 | Voltage sensitive material, preparation and application thereof |
| CN101899209A (en) * | 2010-03-30 | 2010-12-01 | 金发科技股份有限公司 | Heat conductive insulation material and preparation method thereof |
| CN102070898A (en) * | 2010-12-30 | 2011-05-25 | 金发科技股份有限公司 | Red phosphorus and fire-retarding polyamide composite and preparation method thereof |
| CN102304284A (en) * | 2011-08-22 | 2012-01-04 | 金发科技股份有限公司 | Heat-conductive resin composition and preparation method thereof |
| CN102558609A (en) * | 2011-12-13 | 2012-07-11 | 金发科技股份有限公司 | Method for improving thermal conductivity of thermal conductive polymer |
| CN102719099A (en) * | 2012-06-08 | 2012-10-10 | 金发科技股份有限公司 | Thermal conductive molding compound and preparation method thereof |
-
2015
- 2015-12-17 CN CN201510957567.2A patent/CN105440660A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220289A (en) * | 1993-12-24 | 1999-06-23 | 可乐丽股份有限公司 | Polyamide composition |
| CN101747643A (en) * | 2008-12-05 | 2010-06-23 | 上海神沃电子有限公司 | Voltage sensitive material, preparation and application thereof |
| CN101899209A (en) * | 2010-03-30 | 2010-12-01 | 金发科技股份有限公司 | Heat conductive insulation material and preparation method thereof |
| CN102070898A (en) * | 2010-12-30 | 2011-05-25 | 金发科技股份有限公司 | Red phosphorus and fire-retarding polyamide composite and preparation method thereof |
| CN102304284A (en) * | 2011-08-22 | 2012-01-04 | 金发科技股份有限公司 | Heat-conductive resin composition and preparation method thereof |
| CN102558609A (en) * | 2011-12-13 | 2012-07-11 | 金发科技股份有限公司 | Method for improving thermal conductivity of thermal conductive polymer |
| CN102719099A (en) * | 2012-06-08 | 2012-10-10 | 金发科技股份有限公司 | Thermal conductive molding compound and preparation method thereof |
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