CN105420793A - Method for preparing diamond micro-powder grinding tool - Google Patents
Method for preparing diamond micro-powder grinding tool Download PDFInfo
- Publication number
- CN105420793A CN105420793A CN201510750002.7A CN201510750002A CN105420793A CN 105420793 A CN105420793 A CN 105420793A CN 201510750002 A CN201510750002 A CN 201510750002A CN 105420793 A CN105420793 A CN 105420793A
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- diadust
- grinding tool
- powder
- electroforming solution
- electroforming
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a method for preparing a diamond micro-powder grinding tool. An electroforming-sintering compound method is adopted to manufacture the diamond micro-powder grinding tool. The method comprises the following steps: depositing metal solder powder and diamond micro-powder particles on a metal section mould by utilizing a dispersion-electroforming compound method, and thus obtaining a uniform mixed nickel-diamond micro-powder-metal solder abrasive layer; taking down the diamond-solder compound abrasive layer from the metal section mould, and heating and sintering by adopting a certain process to obtain the diamond micro-powder grinding tool. According to the technical scheme, the advantage that the electroforming and sintering method prepares the diamond micro-powder is fully combined, the dispersion is compounded with electroforming so that the micro-powder abrasive particles in the abrasive layer of the grinding tool can be uniformly distributed, the solder as a binding agent is used for sintering so that the holding force of the diamond abrasive particles can be increased, and the service life of the grinding tool is prolonged.
Description
Technical field
The invention belongs to grinding tool preparing technical field, be specifically related to a kind of preparation method of diadust grinding tool.
Background technology
At present, what use in the processing of hard and fragile material accurate grinding is resinoid bond or metallic bond fine-granularity diamond grinding tool substantially entirely, and the preparation method of this two classes grinding tool is made by compacting sintering method.The diadust grinding tool utilizing compacting sintering legal system standby also exists many intrinsic drawbacks, because in the preparation process of this kind of grinding tool, when diadust abrasive particle and bonding agent powder are carried out mechanically mixing, diadust may not be dispersed, compacting sintering makes the non-constant of its abrasive particle distributing homogeneity after grinding tool, it is caused in use easily to scratch workpiece and affect its working accuracy, simultaneously because bonding agent in sintering instrument is not high to the hold of diamond abrasive grain, and adamantine proud exposure is little, constantly grinding tool is repaired, this greatly reduces working (machining) efficiency, also the work-ing life of grinding tool is shortened.
Summary of the invention
The object of the invention is to overcome prior art defect, a kind of preparation method of diadust grinding tool is provided.
Concrete technical scheme of the present invention is as follows:
A preparation method for diadust grinding tool, comprises the steps:
(1) using metal shape mould as negative electrode, nickel plate is as anode, two-plate is put into the electroforming solution containing hydrated metal salt, and negative electrode is connect the negative pole of direct supply, anode connects the positive pole of direct supply, wherein the formula of electroforming solution is: nickel sulfamic acid 240 ~ 460g/L, nickelous chloride 4 ~ 32g/L, boric acid 28 ~ 42g/L and sodium lauryl sulphate 0.05 ~ 0.22g/L, pH are 3.3 ~ 4.8, and solvent is water;
(2) direct supply is connected, metal solder powder and diadust particle is added in electroforming solution, by controlling to carry out interval stirring to electroforming solution, metal solder powder in electroforming solution, diadust particle and metallic nickel ions are able to uniform deposition on negative electrode, obtain the compound mill bed of material of the Tetrastichus sp micro mist-metal solder of desired thickness, the design parameter of this step is: the concentration of diadust particle in electroforming solution is 4 ~ 12g/L, the concentration of metal solder powder in electroforming solution is 25 ~ 53g/L, and current density is 1 ~ 3.2A/dm
2, temperature 20 ~ 60 DEG C, stirring velocity 250 ~ 450r/min, at interval of 10 ~ 35s stir once, each churning time is 8 ~ 10s;
(3) taken off from metal shape mould by the compound mill bed of material of gained, cleaning is carried out heat-agglomerating after drying and is made described diadust grinding tool.
In a preferred embodiment of the invention, the formula of liquid is sunk in described electroforming: nickel sulfamic acid 250 ~ 450g/L, nickelous chloride 5 ~ 30g/L, boric acid 30 ~ 40g/L, sodium lauryl sulphate 0.06 ~ 0.2g/L, pH are 3.5 ~ 4.5, and solvent is water.
In a preferred embodiment of the invention, the design parameter of described step (2) is: the concentration of diadust particle in electroforming solution is 5 ~ 10g/L, the concentration of metal solder powder in electroforming solution is 30 ~ 50g/L, and current density is 1 ~ 3A/dm
2, temperature 20 ~ 55 DEG C, stirring velocity 300 ~ 450r/min, at interval of 10 ~ 30s stir once, each churning time is 10s.
In a preferred embodiment of the invention; the heat-agglomerating of described step (3) is specially: the compound mill bed of material obtained for step (2) is adopted argon shield high-frequency induction heating sintering processing or heating under vacuum sintering processing; 1 ~ 3min is sintered, Slow cooling at 1000 ~ 1050 DEG C.
In a preferred embodiment of the invention, described diadust particle is W40 diadust.
In a preferred embodiment of the invention, described metal solder powder is nickel chromium triangle borosilicate powder.Preferred further, described metal solder powder is 280# nickel chromium triangle borosilicate powder.
The invention has the beneficial effects as follows:
The present invention adopts the method for electroforming-sintered combined to manufacture diadust grinding tool, first utilize the method that disperse is composite electroformed, metal refining solder powder and diadust particle on metal shape mould, Tetrastichus sp micro mist-metal solder the abrasive material be uniformly mixed, again this diamond-solder compound mill bed of material is taken off from metal shape mould, take certain technique to carry out heat-agglomerating and obtain diadust grinding tool, technical scheme of the present invention fully combines the advantage that electroforming and sintering method prepare diadust, shaping micro mist abrasive particle in grinding tool abrasive material is uniformly distributed by disperse is composite electroformed, recycling solder carries out as bonding agent sintering the hold that can improve diamond abrasive grain, improve the grinding tool life-span.
Accompanying drawing explanation
Fig. 1 is the electroforming process schematic diagram of the embodiment of the present invention 1 and embodiment 2;
Fig. 2 is the structural representation of the compound mill bed of material prepared by the embodiment of the present invention 2.
Embodiment
By reference to the accompanying drawings below by way of embodiment technical scheme of the present invention is further detailed and is described.
Embodiment 1
As shown in Figure 1: contain in electrotyping bath 1 into electroforming solution 2, metal shape mould 3 connects the negative electrode of power supply 6, nickel plate 5 connects the anode of power supply, under agitator 4 stirring state, metal solder and diadust particle are suspended in electroforming solution, and after switching on power, metal solder, diadust and metallic nickel ions be uniform deposition on metal shape mould gradually, the mixer mill bed of material of obtained Tetrastichus sp micro mist-metal solder, concrete steps are as follows:
(1) using metal shape mould 3 as negative electrode, nickel plate 5 is as anode, two-plate is put into the electroforming solution containing hydrated metal salt, and negative electrode is connect the negative pole of direct supply, anode connects the positive pole of direct supply, wherein the formula of electroforming solution is: nickel sulfamic acid 240 ~ 460g/L, nickelous chloride 4 ~ 32g/L, boric acid 28 ~ 42g/L and sodium lauryl sulphate 0.05 ~ 0.22g/L, pH are 3.3 ~ 4.8, and solvent is water;
(2) direct supply is connected, 280# nickel chromium triangle borosilicate powder and W40 diadust is added in electroforming solution, by controlling to carry out interval stirring to electroforming solution, 280# nickel chromium triangle borosilicate powder, W40 diadust and metallic nickel ions in electroforming solution are able to uniform deposition on negative electrode, obtain the compound mill bed of material of the Tetrastichus sp micro mist-metal solder of desired thickness, the design parameter of this step is: the concentration of W40 diadust in electroforming solution is 4 ~ 12g/L, the concentration of 280# nickel chromium triangle borosilicate powder in electroforming solution is 25 ~ 53g/L, and current density is 1 ~ 3.2A/dm
2, temperature 20 ~ 60 DEG C, stirring velocity 250 ~ 450r/min, at interval of 10 ~ 35s stir once, each churning time is 8 ~ 10s;
(3) the compound mill bed of material of gained is taken off from metal shape mould 3; after cleaning is dried; this compound mill bed of material is clipped in specific mould; adopt argon shield high-frequency induction heating sintering; control suitable rate of heating; be incubated 1-2min when being heated to 1000 ~ 1050 DEG C, then Slow cooling can obtain described diadust grinding tool.
Embodiment 2
As shown in Figure 1: contain in electrotyping bath 1 into electroforming solution 2, metal shape mould 3 connects the negative electrode of power supply 6, nickel plate 5 connects the anode of power supply, under agitator 4 stirring state, metal solder and diadust particle are suspended in electroforming solution, and after switching on power, metal solder, diadust and metallic nickel ions be uniform deposition on metal shape mould gradually, the mixer mill bed of material of obtained Tetrastichus sp micro mist-metal solder, concrete steps are as follows:
(1) using metal shape mould 3 as negative electrode, nickel plate 5 is as anode, two-plate is put into the electroforming solution containing hydrated metal salt, and negative electrode is connect the negative pole of direct supply, anode connects the positive pole of direct supply, wherein the formula of electroforming solution is: nickel sulfamic acid 250 ~ 450g/L, nickelous chloride 5 ~ 30g/L, boric acid 30 ~ 40g/L, sodium lauryl sulphate 0.06 ~ 0.2g/L, pH are 3.5 ~ 4.5, and solvent is water;
(2) direct supply is connected, 280# nickel chromium triangle borosilicate powder and W40 diadust is added in electroforming solution, by controlling to carry out interval stirring to electroforming solution, 280# nickel chromium triangle borosilicate powder in electroforming solution, W40 diadust and metallic nickel ions are able to uniform deposition on negative electrode, obtain the compound mill bed of material of the Tetrastichus sp micro mist-metal solder of desired thickness (as shown in Figure 2, wherein 7 is 280# nickel chromium triangle borosilicate powder, 8 is W40 diadust, 9 is nickel), the design parameter of this step is: the concentration of W40 diadust in electroforming solution is 5 ~ 10g/L, the concentration of 280# nickel chromium triangle borosilicate powder in electroforming solution is 30 ~ 50g/L, current density is 1 ~ 3A/dm
2, temperature 20 ~ 55 DEG C, stirring velocity 300 ~ 450r/min, at interval of 10 ~ 30s stir once, each churning time is 10s,
(3) taken off from metal shape mould 3 by the compound mill bed of material of gained, cleaning by this compound mill bed of material clamping in specific mould, is put in vacuum oven carrying out heat-agglomerating after drying.Controlling, under suitable rate of heating, to be heated to 1000-1050 DEG C, and to be incubated 2-3min in a vacuum furnace, more namely can be made into described diadust grinding tool with stove Slow cooling.
The above, be only preferred embodiment of the present invention, therefore can not limit scope of the invention process according to this, the equivalence change namely done according to the scope of the claims of the present invention and description with modify, all should still belong in scope that the present invention contains.
Claims (7)
1. a preparation method for diadust grinding tool, is characterized in that: comprise the steps:
(1) using metal shape mould as negative electrode, nickel plate is as anode, two-plate is put into the electroforming solution containing hydrated metal salt, and negative electrode is connect the negative pole of direct supply, anode connects the positive pole of direct supply, wherein the formula of electroforming solution is: nickel sulfamic acid 240 ~ 460g/L, nickelous chloride 4 ~ 32g/L, boric acid 28 ~ 42g/L and sodium lauryl sulphate 0.05 ~ 0.22g/L, pH are 3.3 ~ 4.8, and solvent is water;
(2) direct supply is connected, metal solder powder and diadust particle is added in electroforming solution, by controlling to carry out interval stirring to electroforming solution, metal solder powder in electroforming solution, diadust particle and metallic nickel ions are able to uniform deposition on negative electrode, obtain the compound mill bed of material of the Tetrastichus sp micro mist-metal solder of desired thickness, the design parameter of this step is: the concentration of diadust particle in electroforming solution is 4 ~ 12g/L, the concentration of metal solder powder in electroforming solution is 25 ~ 53g/L, and current density is 1 ~ 3.2A/dm
2, temperature 20 ~ 60 DEG C, stirring velocity 250 ~ 450r/min, at interval of 10 ~ 35s stir once, each churning time is 8 ~ 10s;
(3) taken off from metal shape mould by the compound mill bed of material of gained, cleaning is carried out heat-agglomerating after drying and is made described diadust grinding tool.
2. the preparation method of a kind of diadust grinding tool as claimed in claim 1, it is characterized in that: the formula of liquid is sunk in described electroforming: nickel sulfamic acid 250 ~ 450g/L, nickelous chloride 5 ~ 30g/L, boric acid 30 ~ 40g/L, sodium lauryl sulphate 0.06 ~ 0.2g/L, pH is 3.5 ~ 4.5, and solvent is water.
3. the preparation method of a kind of diadust grinding tool as claimed in claim 1, it is characterized in that: the design parameter of described step (2) is: the concentration of diadust particle in electroforming solution is 5 ~ 10g/L, the concentration of metal solder powder in electroforming solution is 30 ~ 50g/L, and current density is 1 ~ 3A/dm
2, temperature 20 ~ 55 DEG C, stirring velocity 300 ~ 450r/min, at interval of 10 ~ 30s stir once, each churning time is 10s.
4. the preparation method of a kind of diadust grinding tool as claimed in claim 1; it is characterized in that: the heat-agglomerating of described step (3) is specially: the compound mill bed of material obtained for step (2) is adopted argon shield high-frequency induction heating sintering processing or heating under vacuum sintering processing; 1 ~ 3min is sintered, Slow cooling at 1000 ~ 1050 DEG C.
5. the preparation method of a kind of diadust grinding tool as described in claim arbitrary in Claims 1-4, is characterized in that: described diadust particle is W40 diadust.
6. the preparation method of a kind of diadust grinding tool as described in claim arbitrary in Claims 1-4, is characterized in that: described metal solder powder is nickel chromium triangle borosilicate powder.
7. the preparation method of a kind of diadust grinding tool as claimed in claim 6, is characterized in that: described metal solder powder is 280# nickel chromium triangle borosilicate powder.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108747867A (en) * | 2018-04-24 | 2018-11-06 | 华侨大学 | A kind of micro mist diamond abrasive tool realizes the uniformly distributed experimental provision of abrasive grain in preparing |
| CN109183079A (en) * | 2018-08-14 | 2019-01-11 | 华侨大学 | A kind of preparation method of high self-sharpening metal-base diamond cutting sheet |
| CN111101182A (en) * | 2020-03-23 | 2020-05-05 | 江苏聚成金刚石科技有限公司 | Method for improving sanding uniformity of plated diamond in online saw production process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108747867A (en) * | 2018-04-24 | 2018-11-06 | 华侨大学 | A kind of micro mist diamond abrasive tool realizes the uniformly distributed experimental provision of abrasive grain in preparing |
| CN109183079A (en) * | 2018-08-14 | 2019-01-11 | 华侨大学 | A kind of preparation method of high self-sharpening metal-base diamond cutting sheet |
| CN109183079B (en) * | 2018-08-14 | 2020-09-04 | 华侨大学 | Preparation method of high-self-sharpening metal-based diamond cutting blade |
| CN111101182A (en) * | 2020-03-23 | 2020-05-05 | 江苏聚成金刚石科技有限公司 | Method for improving sanding uniformity of plated diamond in online saw production process |
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