CN105419055A - Method for enhancing waste polyolefin plastic by adopting non-metallic powder of waste printed circuit board - Google Patents
Method for enhancing waste polyolefin plastic by adopting non-metallic powder of waste printed circuit board Download PDFInfo
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- CN105419055A CN105419055A CN201510970549.8A CN201510970549A CN105419055A CN 105419055 A CN105419055 A CN 105419055A CN 201510970549 A CN201510970549 A CN 201510970549A CN 105419055 A CN105419055 A CN 105419055A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/20—Recycled plastic
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Abstract
The invention relates to a method for enhancing waste polyolefin plastic by adopting non-metallic powder of a waste printed circuit board. In order to achieve the purpose of the invention, the technical scheme comprises: separately drying matrix resin and screening non-metallic powder of the waste printed circuit board to 100-200-mesh powder; drying the powder by a surface coating agent and a flexibilizer; uniformly spraying a surfacant on the surface of the non-metallic powder of the waste printed circuit board, adding the surface coating agent, the flexibilizer, a lubricant, an antioxidant and a deodorant, and putting the mixture in a high-speed mixer for being stirred at a high speed; cooling the mixture; mixing the cooled mixture with the recovered matrix resin to obtain a premix of the composite material; feeding the premix of the composite material into extruding equipment to obtain aggregates of the premix; and adding the aggregates of the premix into injection molding equipment for injection molding to obtain a composite material product. The plastic prepared by the method provided by the invention is coated by multiple layers, so that the matrix layer thickness between the resin matrix and the enhancer is increased; various compatilizers are compounded, so that the thickness of the matrix layer of the composite material can be increased, thereby better inhibiting leaching of heavy metals and enhancing the mechanical property of the composite material.
Description
Technical field
The present invention relates generally to renewable resource high-qualityization and utilizes, and is specifically related to a kind of method that waste printed circuit board nonmetal powder strengthens waste polyolefine plastics.
Background technology
The interface compatibility and the mobility that improve matrix material are significant for the performance improving matrix material.In recent years, along with the rising of wood powder price, find and wood powder can be replaced to have become a current large focus as the matrix material of filler.On the other hand, along with the quickening of electric equipment products renewal speed, increasing useless electronic waste will be produced.And circuit card is as a part that is the most indispensable in electric equipment products, that be difficult to disposal most, the recycling for waste printed circuit board has become current whole world joint research focus.This is because containing a large amount of rare precious metals in one side circuit card, as gold and silver, palladium etc., there is high recycling and be worth; On the other hand, in waste printed circuit board, Non-metallic components accounts for more than 70% of total mass, and primarily of thermosetting epoxy resin and glass fibre composition, wherein glass accounts for more than 70% of Non-metallic components quality.Because thermosetting resin indissoluble infusibility and glass are difficult to burn, if will cause great threat to the health of environment, people to Non-metallic components is mishandling.In non-metal powder, glass fiber content is high, recycling value is low, amount is large, non-metal powder is used for alternative wood powder and makes the concern that matrix material has slowly been subject to people.Utilize non-metal powder to substitute matrix material that wood powder makes has that physical strength is large, good weatherability, raw materials enjoy stable sources and products thereof low cost and other advantages, but on the one hand because non-metal powder surface is containing a large amount of hydroxyls, non-metal powder is made to have extremely strong polarity, very poor with common resin matrix (PE, PP etc.) consistency, in order to improve the consistency of matrix material, traditional modified method is by adding each analog assistant to improve two alternate interface compatibilities and mobility.On the other hand due to metal recovery technical limitation, inevitably containing a small amount of heavy metal in non-metal powder, as copper, zinc, chromium etc., if do not take the necessary measures, a large amount of heavy metal in the matrix material made in use slowly can leach from goods, causes environmental pollution.
In order to improve the alternate interface compatibility of matrix material two and mobility, at present, the interface modification method reported mainly contains: (1) adopts Macromolecular Compatibilizer as POE-g-MAH, POE-g-GMA etc., utilize GMA (glycidyl methacrylate)/MAH (maleic anhydride) good ring-opening reaction can occur with the hydroxyl in circuit board non-metal powder, therefore good increase-volume reaction can be played at interfacial layer, POE is a kind of elastomerics on the other hand, can play good toughening effect in composite system; (2) adopt Macromolecular Compatibilizer as PE-g-MAH, PE-g-GMA, PE wax-g-MAH, PE wax-g-GMA etc., the hydroxyl in GMA, MAH and circuit board non-metal powder is utilized well to react on the one hand, utilize PE or PE wax and matrix resin to have good consistency on the other hand, thus improve the consistency of matrix material; (3) utilize coupling agent as silane coupling agent, titanate coupling agent, aluminate coupling agent etc., this utilizes coupling agent to have two kinds of functional groups of different nature, and one is the group of close inorganics, easily and mineral surfaces react with; Another is close organic group, with synthetic resins or other polymkeric substance generation chemical reaction or hydrogen bond can be generated, due to coupling agent in the composite can with the hydroxyl reaction of circuit board non-metal powder, can react with matrix resin again, an interfacial layer is formed between strongthener and resin matrix, interfacial layer can transmit stress, thus enhances bond strength between strongthener and resin, improves the performance of matrix material.
But, use single component adjuvants to bring following fatal problem: the glass fibre major part in (1) circuit board non-metal powder is coated by thermosetting resin institute, can not effectively utilize glass to the enhancement of resin matrix; (2) single component adjuvants is often while raising matrix material in a certain respect performance, matrix material performance on the other hand can be reduced, in a lot of patents delivered, the loading level of NOT-circuit plate is general lower, run-of-the-mill part is no more than 100 parts (Chinese patents: the method adopting waste printed circuit board nonmetal powder activeness and quietness waste polypropylene plastic, 201110094260.6).This be due to one side circuit board non-metal powder and plastic substrate consistency poor, strengthen matrix when addition is larger and Plastic Resin interface cohesion effect poor, thus affect the use of composite product; Heavy metal on the other hand containing part in waste printed circuit board nonmetal powder, if when circuit board non-metal powder loading level is too large, easily cause the Leaching of Heavy Metals value of composite product too large, exceed the various Leaching of Heavy Metals values that " Hazardous wastes judging standard leaching characteristic identification " (GB5085.3-2007) specifies.Therefore, following 4 needs must be had at present to solve: the first improves waste printed circuit board nonmetal powder and recycled plastic basal body interface mobility and consistency, improve its interface cohesion with recovery resin matrix; It two is improve waste printed circuit board nonmetal powder at the loading level of recycled plastic matrix; It three is the leachings suppressing heavy metal in matrix material; Its four, must overcome waste printed circuit board nonmetal powder small organic molecule decompose time produce unpleasant peculiar smell.This four problems fails the solution of acquisition system up to now.
Summary of the invention
Based on above-mentioned background and problem, the object of the invention is for above-mentioned four problems, a kind of preparation method that can fill waste printed circuit board nonmetal powder matrix material in recycled plastic is in a large number provided, matrix material that the method obtains can not only keep good mechanical properties, and effectively can also reduce Leaching Heavy Metals.
For realizing the object of the invention, the technical solution adopted in the present invention is:
(1) with parts by weight composition of raw materials:
Reclaim matrix resin 100
Waste printed circuit board non-golden 100 ~ 200
Belong to powder
(2) prepare
A. raw materials pretreatment
Matrix resin is placed in the dry 4 ~ 8h of 80 ~ 110 DEG C of baking ovens;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 100 ~ 200 order powder, is placed in the dry 1 ~ 4h of 90 ~ 120 DEG C of baking ovens;
Surface capping agents, toughner are placed in the dry 3 ~ 8h of 60 ~ 75 DEG C of baking ovens;
B. interface modification
Surfactant is evenly sprayed at waste printed circuit board nonmetal powder on the surface, add surface capping agents, toughner, lubricant, oxidation inhibitor and deodovization agent successively afterwards, be placed in high mixer high speed stirring 5 ~ 30min that temperature is 85 ~ 120 DEG C, obtain modified waste printed circuit board nonmetal powder; After being cooled to normal temperature, modified waste printed circuit board nonmetal powder is mixed high-speed stirring 2 ~ 5min again with recovery matrix resin, obtain the matrix material Preblend mixed with recovery matrix resin with waste printed circuit board nonmetal powder of interface modification;
C. injection moulding is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, and screw extrusion press parameter is: 90 ~ 110 DEG C, a district, two 100 ~ 120 DEG C, districts, three 110 ~ 145 DEG C, districts, four 120 ~ 150 DEG C, districts, five 140 ~ 170 DEG C, districts, six 160 ~ 220 DEG C, districts, seven 160 ~ 220 DEG C, districts, eight 160 ~ 220 DEG C, districts, nine district 150-185 DEG C, die head 150 ~ 180 DEG C, adjustment vacuum pump pressure is 0.02 ~ 0.08MPa, obtains matrix material Preblend pellet; Then joined in injection-moulding device by matrix material Preblend pellet and carry out injection moulding, injection moulding machine parameter is: 160 ~ 220 DEG C, a district, two 160 ~ 220 DEG C, districts, and three 160 ~ 220 DEG C, districts, injection moulding obtains composite product.
Described recovery matrix resin refers to recycle polyethylene, reclaims polypropylene or reclaim polyvinyl chloride, or the recycled plastic that above-mentioned two or three arbitrary proportion reclaiming matrix resin mixes.
Described recycle polyethylene refers to Recycled HDPE, reclaims Low Density Polyethylene, reclaims linear low density polyethylene or reclaim ultrahigh molecular weight polyethylene(UHMWPE), or the recycle polyethylene that the arbitrary proportion of two or more recycle polyethylene above-mentioned mixes.
Described recovery polypropylene refers to and reclaims atactic polypropylene(APP), reclaim Isotactic polypropylene or reclaim syndiotactic polypropylenes, or above-mentioned two or more reclaims the recovery polypropylene that polyacrylic arbitrary proportion mixes.
Described recovery polyvinyl chloride refers to and reclaims universal polyethylene, high-polymerization degree polyvinyl resin or cross-linked polyethylene resin, or the recycle polyethylene that the arbitrary proportion of two or more recycle polyethylene above-mentioned mixes.
The industrial waste produced during described waste printed circuit board nonmetal powder refers to discarded one side print brush board, perfecting brush board, multilayer board, copper-clad plate and printing plate cutting and produces crosses remaining non-metal powder after metal component through sorting, or the mixing non-metal powder that the waste printed circuit board of above-mentioned more than two or three mixes through arbitrary proportion.
Surfactant of the present invention refers to Weak monoacid, weak diacid and Multiple Weak Acid, or is mixed by any ratio of two or more weak acid above-mentioned.
Weak monoacid of the present invention refers to boronation acid, acetic acid, formic acid, hydrofluoric acid, sodium bicarbonate, saleratus, Calcium hydrogen carbonate, disodium-hydrogen or potassium phosphate,monobasic.
Weak diacid of the present invention is oxysuccinic acid, pentanedioic acid, pimelic acid, SA, succinic acid, hexanodioic acid, suberic acid, nonane diacid, carbonic acid, sodium bisulfite or sodium bioxalate.
Multiple Weak Acid of the present invention is phosphoric acid, polycarboxylic acid or polyvalent alcohol.
Described surface capping agents is PE-g-MAH, PE-g-GMA, PE wax-g-MAH, PE wax-g-GMA, or is mixed by two or more any ratio above-mentioned.
Described toughner refers to coupling agent, carboxylic acid type compatilizer, epoxy compatilizer, cyclic acid anhydride type compatilizer, oxazoline type type compatilizer or imide-type compatilizer, or by above-mentioned two kinds and two or more toughner arbitrarily than mixing.Above-mentioned toughner is response type compatilizer, be namely can be compatible with the non-polar polymer in blend containing non-polar high polymer main body on a class segment, and polar group can react with the active group of the polar polymer of blend or the toughner of bonding.
Lubricant of the present invention is stearic acid, butyl stearate, ethylene bis stearic acid amide, oleylamide, polyol ester, fatty amide, ethylene bis stearamide, native paraffin, whiteruss (white oil), microcrystalline wax, polyethylene wax or low-molecular polypropylene, or mixed by any ratio of two or more lubricant above-mentioned.
Oxidation inhibitor of the present invention is tea-polyphenol, phytic acid, four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester (1010), three [2.4-di-tert-butyl-phenyl] phosphorous acid ester (168) or dipentaerythritol diphosphites (626), or any ratio of two or more oxidation inhibitor above-mentioned mixes.
Deodovization agent of the present invention is carbonate based compounds, specifically refers to calcium carbonate, magnesiumcarbonate, sodium carbonate or sodium bicarbonate.
The present invention adopt first with surfactant to enhancing matrix surface process, the interfacial layer thickness of matrix material is improved afterwards with surface capping agents, toughner multilayer coating structure, this technique is to present invention offers following application advantage: (1) is to the surface treatment of circuit board non-metal powder surfactant, significantly increase the degree of exposure of glass fibre in waste printed circuit board nonmetal powder, improve waste printed circuit board nonmetal powder and matrix resin is mechanical interlocked, enhance composite materials property; (2) employing surface capping agents, toughner carry out multilayer coating structure to matrix material, improve the matrix ligament thickness between resin matrix and reinforcement.The transformation of matrix material by " crisp to tough " can be realized on the one hand, improve the mechanical property of matrix material, adopt complex process to reduce industrial cost simultaneously, greatly improve the loading level of circuit board non-metal powder in plastic substrate; Multiple compatilizer is composite on the other hand improves the matrix ligament thickness of matrix material thus better suppresses Leaching of Heavy Metals.In a word, invention not only avoids the deficiency of existing composite materials property, also improve the loading level of waste printed circuit board nonmetal powder in plastic substrate, eliminate residual heavy metal to a great extent to the disadvantageous effect of environment, and can effectively reduce the cost preparing matrix material, be not only obtain intensity and toughness all preferably matrix material new reference is provided, and the impact of goods on environment can be reduced.The present invention is also by for being strengthen the application that matrix prepares matrix material to bring new opportunity with circuit board non-metal powder.
Embodiment
The preparation of contrast sample:
By waste printed circuit board nonmetal powder dry 2h at 120 DEG C, by recycle polyethylene dry 10h at 90 DEG C, for subsequent use.When not adding other auxiliary agents, adopt the preparation method described in content of the present invention, by waste printed circuit board nonmetal powder and recovery matrix resin, be placed in high-speed mixer to mix, obtain matrix material Preblend, then matrix material Preblend is evenly joined injection moulding in twin screw extruder extruding pelletization, injection moulding machine and make composite product.
Below by way of specific embodiment the present invention be described in more detail or describe, instead of limiting the invention.
Embodiment 1
(1) as follows with parts by weight composition of raw materials:
(2) step
A. raw materials pretreatment
Recycle polyethylene is placed in 90 DEG C of dry 6h of baking oven;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 150 order powder, is placed in 105 DEG C of dry 4h of baking oven;
Toughner is placed in 65 DEG C of dry 5h of baking oven;
B. interface modification
Citric acid is evenly sprayed at waste printed circuit board nonmetal powder on the surface, adds POE-g-MAH, antioxidant 1010 and sodium carbonate successively afterwards, be placed in the high mixer high speed stirring 15min that temperature is 85 DEG C, obtain modified waste printed circuit board nonmetal powder; Mixing high-speed stirring 2min again by obtaining modified waste printed circuit board nonmetal powder at normal temperatures with recovery matrix resin, obtaining the matrix material Preblend mixed with recovery matrix resin with waste printed circuit board nonmetal powder of interface modification;
C. pellet is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend and obtains pellet, screw extrusion press parameter is: 90 DEG C, a district, two 110 DEG C, districts, three 135 DEG C, districts, four 145 DEG C, districts, five 155 DEG C, districts, six 165 DEG C, districts, seven 165 DEG C, districts, eight 165 DEG C, districts, nine 150 DEG C, districts, die head 145 DEG C, adjustment vacuum pump pressure is 0.02MPa
D. injection moulding
Joined by pellet in injection-moulding device, injection moulding machine parameter is: 165 DEG C, a district, two 165 DEG C, districts, and three 165 DEG C, districts, injection moulding obtains composite product.
Test by GB sample preparation, obtain mechanics correlation data and the Leaching of Heavy Metals value of the present invention and ordinary method gained matrix material, performance comparison
as table 1-1 and
table 1shown in-2.
table 1-1 the present embodiment method and ordinary method mechanical property contrast
table 1-2 the present embodiment methods and ordinary method heavy metal leaching value affect
Therefrom can find out, compared with ordinary method, the present invention can not only promote the shock strength of matrix material greatly, namely by 2.13 ± 0.28kJ/m
2be promoted to 7.53 ± 0.91kJ/m
2, tensile strength is promoted to 13.54 ± 0.57MPa by 10.13 ± 0.23MPa, and flexural strength, the modulus in flexure of matrix material also have lifting; The Leaching of Heavy Metals value that nitric acid-sulfuric acid method records matrix material drops to 0.713mg/L by 5.668mg/L, and the Leaching of Heavy Metals value that method of acetic acid records matrix material drops to 0.985mg/L by 6.731mg/L.
Embodiment 2
(1) fill a prescription
(2) step
A. raw materials pretreatment
Recycle polyethylene is placed in 90 DEG C of dry 6h of baking oven;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 150 order powder, is placed in 105 DEG C of dry 4h of baking oven;
Surface capping agents, toughner are placed in 65 DEG C of dry 5h of baking oven;
B. interface modification
In waste printed circuit board nonmetal powder, add PE wax-g-MAH, POE-g-MAH, antioxidant 1010 and magnesiumcarbonate successively, be placed in the high mixer high speed stirring 10min that temperature is 80 DEG C, obtain modified waste printed circuit board nonmetal powder; The modified waste printed circuit board nonmetal powder obtained is mixed high-speed stirring 2min more at normal temperatures with recovery matrix resin, obtains the matrix material Preblend mixed with recovery matrix resin with waste printed circuit board nonmetal powder of interface modification;
C. pellet is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, and screw extrusion press parameter is: 90 DEG C, a district, two 110 DEG C, districts, three 135 DEG C, districts, four 145 DEG C, districts, five 155 DEG C, districts, six 165 DEG C, districts, seven 165 DEG C, districts, eight 165 DEG C, districts, nine 150 DEG C, districts, die head 145 DEG C, adjustment vacuum pump pressure is 0.04MPa
D. injection moulding
Join in injection-moulding device by the pellet obtained, injection moulding machine parameter is: 165 DEG C, a district, two 165 DEG C, districts, and three 165 DEG C, districts, injection moulding obtains composite product.
Test by GB sample preparation, obtain mechanics correlation data and the Leaching of Heavy Metals value of the present invention and ordinary method gained matrix material, performance comparison
as table 2-1 and
table 2shown in-2.
table 2-1 the present embodiment method and ordinary method mechanical property contrast
table 2-2 the present embodiment methods and ordinary method heavy metal leaching value affect
From
in tablecan find out, compared with ordinary method, the present invention can not only improve composite materials property greatly, and namely shock strength is by 3.06 ± 0.24kJ/m
2bring up to 6.48 ± 0.09kJ/m
2, the tensile strength of matrix material, flexural strength and modulus in flexure have and to promote or constant; The Leaching of Heavy Metals value that nitric acid-sulfuric acid method records matrix material drops to 0.154mg/L by 2.641mg/L, and the Leaching of Heavy Metals value that method of acetic acid records matrix material drops to 0.258mg/L by 3.594mg/L.
Embodiment 3
(1) fill a prescription
(2) step
A. raw materials pretreatment
Recycle polyethylene is placed in 90 DEG C of dry 6h of baking oven;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 150 order powder, is placed in 105 DEG C of dry 4h of baking oven;
PE wax-g-MAH, POE-g-MAH are placed in 65 DEG C of dry 3h of baking oven;
B. interface modification
Citric acid is evenly sprayed at waste printed circuit board nonmetal powder on the surface, add PE wax-g-MAH, POE-g-MAH, antioxidant 1010 and calcium carbonate afterwards successively, be placed in the high mixer high speed stirring 20min that temperature is 105 DEG C, obtain modified waste printed circuit board nonmetal powder; The modified waste printed circuit board nonmetal powder obtained is mixed high-speed stirring 5min more at normal temperatures with recovery matrix resin, obtains the matrix material Preblend mixed with recovery matrix resin with waste printed circuit board nonmetal powder of interface modification;
C. pellet is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, and screw extrusion press parameter is: 90 DEG C, a district, two 110 DEG C, districts, three 135 DEG C, districts, four 145 DEG C, districts, five 155 DEG C, districts, six 165 DEG C, districts, seven 165 DEG C, districts, eight 165 DEG C, districts, nine 150 DEG C, districts, die head 145 DEG C, adjustment vacuum pump pressure is 0.04MPa
D. injection moulding
Join in injection-moulding device by the pellet obtained, injection moulding machine parameter is: 165 DEG C, a district, two 165 DEG C, districts, and three 165 DEG C, districts, injection moulding obtains composite product.
Test by GB sample preparation, obtain mechanics correlation data and the Leaching of Heavy Metals value of the present invention and ordinary method gained matrix material, performance comparison
as table 3-1 and
table 3shown in-2.
table 3-1 the present embodiment method and ordinary method mechanical property contrast
table 3-2 the present embodiment methods and ordinary method heavy metal leaching value affect
From
in tablecan find out, compared with ordinary method, the present invention can not only improve the mechanical property of matrix material greatly, and namely shock strength is by 5.56 ± 0.65kJ/m
2rise to 8.78 ± 0.1kJ/m
2, the tensile strength of matrix material, flexural strength and modulus in flexure have lifting; The Leaching of Heavy Metals value that nitric acid-sulfuric acid method records matrix material drops to 0.087mg/L by 2.021mg/L, and the Leaching of Heavy Metals value that method of acetic acid records matrix material drops to 0.156mg/L by 3.034mg/L.
Embodiment 4
(1) fill a prescription
(2) step
A. raw materials pretreatment
Recycle polyethylene is placed in 90 DEG C of dry 6h of baking oven;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 180 order powder, is placed in 105 DEG C of dry 4h of baking oven;
PE wax-g-MAH is placed in 65 DEG C of dry 4h of baking oven;
B. interface modification
In waste printed circuit board nonmetal powder, add PE wax-g-MAH, antioxidant 1010 and sodium carbonate successively, be placed in the high mixer high speed stirring 15min that temperature is 100 DEG C, obtain modified waste printed circuit board nonmetal powder; By the modified waste printed circuit board nonmetal powder that obtains with reclaim matrix resin high-speed stirring 5min at normal temperatures, obtain interface modification with waste printed circuit board nonmetal powder and the matrix material Preblend of reclaiming matrix resin and mixing;
C. pellet is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, and screw extrusion press parameter is: 90 DEG C, a district, two 110 DEG C, districts, three 135 DEG C, districts, four 145 DEG C, districts, five 155 DEG C, districts, six 165 DEG C, districts, seven 165 DEG C, districts, eight 165 DEG C, districts, nine 150 DEG C, districts, die head 145 DEG C, adjustment vacuum pump pressure is 0.04MPa
D. injection moulding
Join in injection-moulding device by the pellet obtained, injection moulding machine parameter is: 165 DEG C, a district, two 165 DEG C, districts, and three 165 DEG C, districts, injection moulding obtains composite product.
Test by GB sample preparation, obtain mechanics correlation data and the Leaching of Heavy Metals value of the present invention and ordinary method gained matrix material, performance comparison
as table 4-1 and
table 4shown in-2.
table 4-1 the present embodiment method and ordinary method mechanical property contrast
table 4-2 the present embodiment methods and ordinary method heavy metal leaching value affect
From
in tablecan find out, compared with ordinary method, the present invention can not only improve the mechanical property of matrix material greatly, and namely shock strength is by 3.06 ± 0.24kJ/m
2rise to 4.000 ± 0.06kJ/m
2, the tensile strength of matrix material, flexural strength and modulus in flexure have lifting; The Leaching of Heavy Metals value that nitric acid-sulfuric acid method records matrix material drops to 0.415mg/L by 2.641mg/L, and the Leaching of Heavy Metals value that method of acetic acid records matrix material drops to 0.512mg/L by 3.594mg/L.
Embodiment 5
(1) fill a prescription
(2) step
A. raw materials pretreatment
Recycle polyethylene is placed in 95 DEG C of dry 6h of baking oven;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 200 order powder, is placed in 105 DEG C of dry 4h of baking oven;
B. interface modification
Citric acid is evenly sprayed at waste printed circuit board nonmetal powder on the surface, add antioxidant 1010 and calcium carbonate successively afterwards, be placed in the high mixer high speed stirring 15min that temperature is 95 DEG C, by the modified waste printed circuit board nonmetal powder that obtains with reclaim matrix resin high-speed stirring 3min at normal temperatures, obtain modified waste printed circuit board nonmetal powder; Obtain the matrix material Preblend mixed with recovery matrix resin with waste printed circuit board nonmetal powder of interface modification;
C. pellet is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, and screw extrusion press parameter is: 90 DEG C, a district, two 110 DEG C, districts, three 135 DEG C, districts, four 145 DEG C, districts, five 155 DEG C, districts, six 165 DEG C, districts, seven 165 DEG C, districts, eight 165 DEG C, districts, nine 150 DEG C, districts, die head 145 DEG C, adjustment vacuum pump pressure is 0.03MPa
D. injection moulding
Join in injection-moulding device by the pellet obtained, injection moulding machine parameter is: 165 DEG C, a district, two 165 DEG C, districts, and three 165 DEG C, districts, injection moulding obtains composite product.
Test by GB sample preparation, obtain mechanics correlation data and the Leaching of Heavy Metals value of the present invention and ordinary method gained matrix material, performance comparison
as table 5-1 and
table 5shown in-2.
table 5-1 the present embodiment method and ordinary method mechanical property contrast
table 5-2 the present embodiment methods and ordinary method heavy metal leaching value affect
From
in tablecan find out, compared with ordinary method, the present invention can not only improve the mechanical property of matrix material greatly, and namely shock strength is by 3.02 ± 0.13kJ/m
2rise to 4.324 ± 0.18kJ/m
2, the tensile strength of matrix material, flexural strength and modulus in flexure have lifting; The Leaching of Heavy Metals value that nitric acid-sulfuric acid method records matrix material drops to 0.566mg/L by 3.214mg/L, and the Leaching of Heavy Metals value that method of acetic acid records matrix material drops to 1.051mg/L by 4.974mg/L.
Embodiment 6
(1) fill a prescription
(2) step
A. raw materials pretreatment
Recycle polyethylene is placed in 95 DEG C of dry 6h of baking oven;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 150 order powder, is placed in 95 DEG C of dry 4h of baking oven;
P0E-g-MAH is placed in 70 DEG C of dry 5h of baking oven;
B. interface modification
POE-g-MAH, antioxidant 1010 and sodium carbonate is added successively in waste printed circuit board nonmetal powder, be placed in the high mixer high speed stirring 10min that temperature is 105 DEG C, by the modified waste printed circuit board nonmetal powder that obtains with reclaim matrix resin high-speed stirring 5min at normal temperatures, obtain modified waste printed circuit board nonmetal powder; Obtain the matrix material Preblend mixed with recovery matrix resin with waste printed circuit board nonmetal powder of interface modification;
C. pellet is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, and screw extrusion press parameter is: 90 DEG C, a district, two 110 DEG C, districts, three 135 DEG C, districts, four 145 DEG C, districts, five 155 DEG C, districts, six 165 DEG C, districts, seven 165 DEG C, districts, eight 165 DEG C, districts, nine 150 DEG C, districts, die head 145 DEG C, adjustment vacuum pump pressure is 0.06MPa
D. injection moulding
Join in injection-moulding device by the pellet obtained, injection moulding machine parameter is: 165 DEG C, a district, two 165 DEG C, districts, and three 165 DEG C, districts, injection moulding obtains composite product.
Test by GB sample preparation, obtain mechanics correlation data and the Leaching of Heavy Metals value of the present invention and ordinary method gained matrix material, performance comparison
as table 6-1 and
table 6shown in-2.
table 6-1 the present embodiment method and ordinary method mechanical property contrast
table 6-2 the present embodiment methods and ordinary method heavy metal leaching value affect
From
in tablecan find out, compared with ordinary method, the present invention can not only improve the mechanical property of matrix material greatly, and namely shock strength is by 3.06 ± 0.24kJ/m
2rise to 4.840 ± 0.24kJ/m
2, the tensile strength of matrix material, flexural strength and modulus in flexure have and to promote or constant; The Leaching of Heavy Metals value that nitric acid-sulfuric acid method records matrix material drops to 0.502mg/L by 2.641mg/L, and the Leaching of Heavy Metals value that method of acetic acid records matrix material drops to 0.836mg/L by 3.594mg/L.
Embodiment 7
(1) fill a prescription
(2) step
A. raw materials pretreatment
Matrix resin is placed in 95 DEG C of dry 6h of baking oven;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 150 order powder, is placed in 95 DEG C of dry 4h of baking oven;
PE wax is placed in 65 DEG C of dry 5h of baking oven;
B. interface modification
PE wax, antioxidant 1010 and sodium bicarbonate is added successively in waste printed circuit board nonmetal powder, be placed in the high mixer high speed stirring 25min that temperature is 95 DEG C, by the modified waste printed circuit board nonmetal powder that obtains with reclaim matrix resin high-speed stirring 5min at normal temperatures, obtain modified waste printed circuit board nonmetal powder; Obtain the matrix material Preblend mixed with recovery matrix resin with waste printed circuit board nonmetal powder of interface modification;
C. pellet is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, and screw extrusion press parameter is: 90 DEG C, a district, two 110 DEG C, districts, three 135 DEG C, districts, four 145 DEG C, districts, five 155 DEG C, districts, six 165 DEG C, districts, seven 165 DEG C, districts, eight 165 DEG C, districts, nine 150 DEG C, districts, die head 145 DEG C, adjustment vacuum pump pressure is 0.06MPa
D. injection moulding
Join in injection-moulding device by the pellet obtained, injection moulding machine parameter is: 165 DEG C, a district, two 165 DEG C, districts, and three 165 DEG C, districts, injection moulding obtains composite product.
Test by GB sample preparation, obtain mechanics correlation data and the Leaching of Heavy Metals value of the present invention and ordinary method gained matrix material, performance comparison
as table 7-1 and
table 7shown in-2.
table 7-1 the present embodiment method and ordinary method mechanical property contrast
table 7-2 the present embodiment methods and ordinary method heavy metal leaching value affect
From
in tablecan find out, compared with ordinary method, the present invention can not only improve the mechanical property of matrix material greatly, and namely shock strength is by 3.06 ± 0.24kJ/m
2rise to 4.08 ± 0.21kJ/m
2, the tensile strength of matrix material, flexural strength and modulus in flexure have and to promote or constant; The Leaching of Heavy Metals value that nitric acid-sulfuric acid method records matrix material drops to 0.573mg/L by 2.641mg/L, and the Leaching of Heavy Metals value that method of acetic acid records matrix material drops to 0.826mg/L by 3.594mg/L.
Embodiment 8
(1) fill a prescription
(3) step
A. raw materials pretreatment
Recovery polypropylene is placed in 95 DEG C of dry 4h of baking oven;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 180 order powder, is placed in 95 DEG C of dry 4h of baking oven;
POE-g-MAH is placed in 65 DEG C of dry 5h of baking oven;
B. interface modification
In waste printed circuit board nonmetal powder, add POE-g-MAH, antioxidant 1010 and sodium bicarbonate successively, be placed in the high mixer high speed stirring 20min that temperature is 95 DEG C, obtain modified waste printed circuit board nonmetal powder; By the modified waste printed circuit board nonmetal powder that obtains with reclaim polypropylene high-speed stirring 5min at normal temperatures, obtain interface modification with waste printed circuit board nonmetal powder and the matrix material Preblend of reclaiming polypropylene and mixing;
C. pellet is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, and screw extrusion press parameter is: 120 DEG C, a district, two 140 DEG C, districts, three 155 DEG C, districts, four 165 DEG C, districts, five 175 DEG C, districts, six 185 DEG C, districts, seven 185 DEG C, districts, eight 185 DEG C, districts, nine 170 DEG C, districts, die head 165 DEG C, adjustment vacuum pump pressure is 0.06MPa
D. injection moulding
Join in injection-moulding device by the pellet obtained, injection moulding machine parameter is: 185 DEG C, a district, two 185 DEG C, districts, and three 185 DEG C, districts, injection moulding obtains composite product.
Test by GB sample preparation, obtain mechanics correlation data and the Leaching of Heavy Metals value of the present invention and ordinary method gained matrix material, performance comparison
as table 7-1 and
table 7shown in-2.
table 8-1 the present embodiment method and ordinary method mechanical property contrast
table 8-2 the present embodiment methods and ordinary method heavy metal leaching value affect
From
in tablecan find out, compared with ordinary method, the present invention can not only improve the mechanical property of matrix material greatly, and namely shock strength is by 8.56 ± 0.38kJ/m
2rise to 10.34 ± 0.12kJ/m
2, the tensile strength of matrix material, flexural strength and modulus in flexure have lifting; The Leaching of Heavy Metals value that nitric acid-sulfuric acid method records matrix material drops to 0.723mg/L by 3.567mg/L, and the Leaching of Heavy Metals value that method of acetic acid records matrix material drops to 1.076mg/L by 4.283mg/L.
Embodiment 1 ~ 8 shows compared with ordinary method; the present invention can not only promote composite materials property greatly; and in the prerequisite rolling up waste printed circuit board nonmetal powder addition; also obviously can reduce Leaching of Heavy Metals value in matrix material; adopt the inventive method to need less compatilizer than employing ordinary method, namely the present invention effectively can reduce the cost prepared needed for matrix material and reach better environmental protection requirement.
GB described above is specific as follows:
1, Mechanics Performance Testing: tensile strength presses GB/T1040.2-2006 test, and draw speed is 50mm/min; Flexural strength presses GB/T9341-2000 test, and loading velocity is 2mm/min; Notched Izod impact strength presses GB/T1043-1993 test; More than experiment is room temperature condition (20 DEG C), and atmospheric moisture is 60%, tests 5 battens, averages.
2, Leaching Heavy Metals: carry out Leaching Heavy Metals experiment by " solid waste Leaching leaching method sulfonitric method " (HJ/T299-2007) and " solid waste Leaching leaching method hac buffer method " (HJ/T300-2007).
Claims (14)
1. adopt waste printed circuit board nonmetal powder to strengthen a method for waste polyolefine plastics, comprise the steps:
(1) with parts by weight composition of raw materials:
Reclaim matrix resin 100
Waste printed circuit board nonmetal powder 100 ~ 200
Surfactant 0 ~ 6
Surface capping agents 0 ~ 6
Toughner 0 ~ 20
Lubricant 0 ~ 4
Oxidation inhibitor 1 ~ 2
Deodovization agent 1 ~ 10
(2) prepare
A. raw materials pretreatment
Matrix resin is placed in the dry 4 ~ 8h of 80 ~ 110 DEG C of baking ovens;
Waste printed circuit board nonmetal powder sieves process, and obtaining particle diameter is 100 ~ 200 order powder, is placed in the dry 1 ~ 4h of 90 ~ 120 DEG C of baking ovens;
Surface capping agents, toughner are placed in the dry 3 ~ 8h of 60 ~ 75 DEG C of baking ovens;
B. interface modification
Surfactant is evenly sprayed at waste printed circuit board nonmetal powder on the surface, add surface capping agents, toughner, lubricant, oxidation inhibitor and deodovization agent successively afterwards, be placed in high mixer high speed stirring 5 ~ 30min that temperature is 85 ~ 120 DEG C, obtain modified waste printed circuit board nonmetal powder; After being cooled to normal temperature, modified waste printed circuit board nonmetal powder is mixed high-speed stirring 2 ~ 5min again with recovery matrix resin, obtain the matrix material Preblend mixed with recovery matrix resin with waste printed circuit board nonmetal powder of interface modification;
C. injection moulding is extruded
Extrusion equipment is sent in above-mentioned matrix material Preblend, obtains matrix material Preblend pellet; Then matrix material Preblend pellet is joined in injection-moulding device and carry out injection moulding and obtain composite product.
2. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, when it is characterized in that extrusion equipment is sent in matrix material Preblend, screw extrusion press parameter is: 90 ~ 110 DEG C, a district, two 100 ~ 120 DEG C, districts, three 110 ~ 145 DEG C, districts, four 120 ~ 150 DEG C, districts, five 140 ~ 170 DEG C, districts, six 160 ~ 220 DEG C, districts, seven 160 ~ 220 DEG C, districts, eight 160 ~ 220 DEG C, districts, nine district 150-185 DEG C, die head 150 ~ 180 DEG C, adjustment vacuum pump pressure is 0.02 ~ 0.08Mpa.
3. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that described being joined in injection-moulding device by matrix material Preblend pellet carries out injection moulding, injection moulding machine parameter is: 160 ~ 220 DEG C, a district, two 160 ~ 220 DEG C, districts, three 160 ~ 220 DEG C, districts, injection moulding obtains composite product.
4. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that described recovery matrix resin refers to recycle polyethylene, reclaims polypropylene or reclaim polyvinyl chloride, or the recycled plastic that above-mentioned two or three arbitrary proportion reclaiming matrix resin mixes.
5. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 4, it is characterized in that described recycle polyethylene refers to Recycled HDPE, reclaims Low Density Polyethylene, reclaims linear low density polyethylene or reclaim ultrahigh molecular weight polyethylene(UHMWPE), or the recycle polyethylene that the arbitrary proportion of two or more recycle polyethylene above-mentioned mixes.
6. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 4, it is characterized in that described recovery polypropylene refers to reclaim atactic polypropylene(APP), reclaim Isotactic polypropylene or reclaim syndiotactic polypropylenes, or above-mentioned two or more reclaims the recovery polypropylene that polyacrylic arbitrary proportion mixes.
7. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 4, it is characterized in that described recovery polyvinyl chloride refers to and reclaim universal polyethylene, high-polymerization degree polyvinyl resin or cross-linked polyethylene resin, or the recycle polyethylene that the arbitrary proportion of two or more recycle polyethylene above-mentioned mixes.
8. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that the industrial waste produced during described waste printed circuit board nonmetal powder refers to discarded one side print brush board, perfecting brush board, multilayer board, copper-clad plate and printing plate cutting and produces crosses remaining non-metal powder after metal component through sorting, or the mixing non-metal powder that the waste printed circuit board of above-mentioned more than two or three mixes through arbitrary proportion.
9. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that described surfactant refers to Weak monoacid, weak diacid and Multiple Weak Acid, or mixed by any ratio of two or more weak acid above-mentioned;
Described Weak monoacid refers to boronation acid, acetic acid, formic acid, hydrofluoric acid, sodium bicarbonate, saleratus, Calcium hydrogen carbonate, disodium-hydrogen or potassium phosphate,monobasic;
Weak diacid of the present invention is oxysuccinic acid, pentanedioic acid, pimelic acid, SA, succinic acid, hexanodioic acid, suberic acid, nonane diacid, carbonic acid, sodium bisulfite or sodium bioxalate;
Described Multiple Weak Acid is phosphoric acid, polycarboxylic acid or polyvalent alcohol.
10. a kind of method adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that described surface capping agents refers to PE-g-MAH, PE-g-GMA, PE wax-g-MAH, PE wax-g-GMA, or mixed by two or more any ratio above-mentioned.
11. a kind of methods adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that described toughner refers to coupling agent, carboxylic acid type compatilizer, epoxy compatilizer, cyclic acid anhydride type compatilizer, oxazoline type type compatilizer or imide-type compatilizer, or by above-mentioned two kinds and two or more toughner arbitrarily than mixing.
12. a kind of methods adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that described lubricant is stearic acid, butyl stearate, ethylene bis stearic acid amide, oleylamide, polyol ester, fatty amide, ethylene bis stearamide, native paraffin, whiteruss (white oil), microcrystalline wax, polyethylene wax or low-molecular polypropylene, or mixed by any ratio of two or more lubricant above-mentioned.
13. a kind of methods adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that oxidation inhibitor of the present invention is tea-polyphenol, phytic acid, four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester (1010), three [2.4-di-tert-butyl-phenyl] phosphorous acid ester (168) or dipentaerythritol diphosphites (626), or any ratio of two or more oxidation inhibitor above-mentioned mixes.
14. a kind of methods adopting waste printed circuit board nonmetal powder to strengthen waste polyolefine plastics according to claim 1, it is characterized in that deodovization agent of the present invention is carbonate based compounds, specifically refer to calcium carbonate, magnesiumcarbonate, sodium carbonate or sodium bicarbonate.
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