CN105403318B - A kind of method and system of surface multipoint temperature monitoring - Google Patents
A kind of method and system of surface multipoint temperature monitoring Download PDFInfo
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- CN105403318B CN105403318B CN201410466070.6A CN201410466070A CN105403318B CN 105403318 B CN105403318 B CN 105403318B CN 201410466070 A CN201410466070 A CN 201410466070A CN 105403318 B CN105403318 B CN 105403318B
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Abstract
The present invention relates to a kind of method and systems of surface multipoint temperature monitoring, including multiple temperature sensors and monitoring system, the temperature sensor is connected with monitoring system, the monitoring system includes processor, multiple temperature sensors are respectively separated default sampling period acquisition and correspond to the temperature value of temperature monitoring point, and the temperature value is transmitted to processor；Processor carries out the fitting of temperature jump response curve according to the multiple temperature values received, to obtain the temperature jump response curve on the corresponding monitored surface of multiple temperature monitoring points.Temperature jump response curve can reflect the temperature variations of temperature monitoring point in advance, and reasonable prediction can be carried out to the temperature variations of temperature monitoring point by obtaining temperature jump response curve.As it can be seen that the method and system of the surface multipoint temperature monitoring, the temperature value at temperature monitoring point by acquiring monitored surface helps to carry out accurate temperature control to the temperature variations reasonable prediction of temperature monitoring point.
Description
Technical field
The present invention relates to a kind of method of industrial temperature acquisition technique field more particularly to surface multipoint temperature monitoring and it is
System.
Background technique
Temperature is one of the important indicator that instrument and equipment can work normally.Remove household freezer, incubator these with temperature control
The equipment for being made as purpose necessarily requires the control of accurate temperature outer, applied to the industrial or agricultural equipment of other field, Medical Instruments or
The most basic circuit components of person, also can only work normally within the temperature range of restriction.Therefore, temperature detection has
Highly important meaning.Publication No. is the Chinese patent application of CN101852652A, discloses a kind of multi-point Temperature Acquisition System
And its acquisition method, including multiple one-wire bus formula temperature sensor DS18B20, PIC, RS232, liquid crystal display device and PC electricity
Brain main controller.PC machine controls temperature inversion, and can show multi-point temperature in computer interface.Publication No. is CN103630260A
Chinese patent application, disclose a kind of lower temperature acquisition terminal system, the system mainly include single-chip microcontroller MSP430F149,
Liquid crystal display circuit, thermosensitive resistor and circuit NTC and Monolithic RF transceiver nRF24L01, may be implemented achieving multipoint temperature detection
And remote wireless control.Both the above temperature acquisition mode, the temperature being only able to display at the temperature detecting point on instrument and equipment surface
Be worth size, to temperature detecting point outside temperature conditions know nothing, temperature detection is not comprehensive and can not carry out accurate temperature control
System.
Summary of the invention
It is an object of the invention to propose a kind of method and system of surface multipoint temperature monitoring, by acquiring monitored table
Temperature value at the temperature monitoring point in face helps to carry out precision to the temperature variations reasonable prediction of temperature monitoring point
Temperature control.
To achieve this purpose, the present invention adopts the following technical scheme:
In a first aspect, providing a kind of method of surface multipoint temperature monitoring, comprising:
Multiple temperature sensors are respectively separated the temperature value that default sampling period acquisition corresponds to temperature monitoring point, and should
Temperature value is transmitted to processor；
Processor carries out the fitting of temperature jump response curve according to the multiple temperature values received, to obtain multiple temperature
The temperature jump response curve on the corresponding monitored surface in monitoring point.
Wherein, the fitting of the temperature jump response curve, the mathematics including the first order inertial loop with hysteresis property
The foundation of model；
The mathematical model is G (s)=Ke^ (- τ s)/(Ts+1), wherein G (s) is temperature transmission function, and K is ratio
Coefficient, τ are delay time constant, and s is differential Control operators, and e^ (- τ s) is pure delay link part, and T is inertia time constant.
Wherein, the temperature sensor is infrared temperature sensor.
Wherein, the multiple temperature sensor is respectively separated the temperature that default sampling period acquisition corresponds to temperature monitoring point
Value, and the temperature value is transmitted to processor；Include:
Multiple temperature sensors are respectively separated the temperature value that default sampling period acquisition corresponds to temperature monitoring point, and should
Temperature value is transmitted to processor, multiple temperature monitoring points are located at drawn by co-ordination made of orthogonal grid line friendship
Point；
Processor is according to the multiple temperature values and preset temperature monitoring corresponding with multiple temperature value received
The location information of point, obtains the temperature-density figure on the corresponding monitored surface of multiple temperature monitoring points, and the temperature-density figure is logical
It crosses and interpolation algorithm is carried out to the temperature value matrix of multiple temperature values and the formation of multiple location informations and is obtained.
Wherein, the multiple temperature sensor is respectively separated the temperature that default sampling period acquisition corresponds to temperature monitoring point
Value, and the temperature value is transmitted to after processor, further includes:
Processor obtains being averaged for multiple temperature monitoring corresponding monitored surfaces of point according to the multiple temperature values received
Temperature, the number of the corresponding temperature monitoring point of the mean temperature=the sum of the temperature value received/temperature value received it
With.
Wherein, the multiple temperature sensor is respectively separated the temperature that default sampling period acquisition corresponds to temperature monitoring point
Value, and the temperature value is transmitted to after processor, further includes:
When any one temperature value is in except default safe temperature range, processor starts alarm, to issue report
Alert information.
Wherein, the multiple temperature sensor is respectively separated the temperature that default sampling period acquisition corresponds to temperature monitoring point
Value, and the temperature value is transmitted to after processor, further includes:
It is preset except safe average temperature range when average temperature value is in, processor starts alarm, to issue report
Alert information.
Wherein, after the temperature jump response curve to obtain the corresponding monitored surface of multiple temperature monitoring points,
Further include:
Processor saves the temperature data on monitored surface；Or,
The temperature data on monitored surface is sent to display screen to show by processor；Or,
The temperature data on monitored surface is sent to display screen and is shown with will pass through gui interface by processor.
Second aspect provides a kind of system of surface multipoint temperature monitoring, including multiple temperature sensors and monitoring system,
The temperature sensor is connected with monitoring system, and the monitoring system includes processor,
Multiple temperature sensors correspond to the temperature value of temperature monitoring point for being respectively separated default sampling period acquisition,
And the temperature value is transmitted to processor；
Processor is more to obtain for carrying out the fitting of temperature jump response curve according to the multiple temperature values received
The temperature jump response curve on the corresponding monitored surface of a temperature monitoring point.
Wherein, the fitting of the temperature jump response curve, the mathematics including the first order inertial loop with hysteresis property
The foundation of model；
The mathematical model is G (s)=Ke^ (- τ s)/(Ts+1), wherein G (s) is temperature transmission function, and K is ratio
Coefficient, τ are delay time constant, and s is differential Control operators, and e^ (- τ s) is pure delay link part, and T is inertia time constant.
Wherein, the temperature sensor is infrared temperature sensor.
Wherein, the monitoring system further includes bracket, and multiple consolidating for fixed temperature sensor are arranged on the bracket
Determine hole, the fixation hole and temperature sensor correspond, each fixation hole is located at drawn by co-ordination made of
The intersection point of orthogonal grid line；
After multiple temperature sensors are fixed on the fixation hole of bracket by preset order respectively, it is also used to be respectively separated default adopt
The acquisition of sample period corresponds to the temperature value of temperature monitoring point, and the temperature value is transmitted to processor,
Processor is also used to according to the multiple temperature values and preset temperature corresponding with multiple temperature value received
The location information for spending monitoring point, obtains the temperature-density figure on the corresponding monitored surface of multiple temperature monitoring points, the temperature is close
Degree figure obtains and the temperature value matrix to multiple temperature values and the formation of multiple location informations carries out interpolation algorithm.
Wherein, the processor is also used to that it is corresponding to obtain multiple temperature monitoring points according to the multiple temperature values received
The mean temperature on monitored surface, the mean temperature=the sum of the temperature value received/corresponding temperature of the temperature value received
Spend the sum of the number of monitoring point.
Wherein, the bracket includes frame body plane and frame body axis, the frame body plane and the orthogonal connection of frame body axis, the frame
25 fixation holes are arranged in body plane, and the fixation hole is round mouth shrinkage pool.
Wherein, the bracket includes frame body plane and frame body axis, the frame body plane and the orthogonal connection of frame body axis, the frame
The surface shape of body plane is the square of 30cm × 30cm.
Wherein, the monitoring system further includes monitoring subsystem, and the processor is host computer, the host computer and described
Monitoring subsystem is electrically connected, and the bracket and the monitoring subsystem are detachably connected.
Wherein, the monitoring subsystem includes single-chip microcontroller and multiple connecting and disconnecting of the circuit for being used to control each temperature sensor
Temperature sensor selection switch, the temperature sensor selection switch and temperature sensor correspond, the temperature sensor
Selection switch is connected with single-chip microcontroller.
Wherein, the single-chip microcontroller is the single-chip microcontroller of PIC16 type, and the monitoring subsystem further includes A/D expanded circuit, described
A/D expanded circuit is connected with single-chip microcontroller.
Wherein, the single-chip microcontroller is the single-chip microcontroller of ARM type or the single-chip microcontroller of DSP type.
Wherein, the monitoring subsystem further includes warning circuit, and the warning circuit is connected with single-chip microcontroller, the alarm electricity
Road includes alarm, and the alarm is buzzer.
Wherein, the monitoring subsystem further includes power circuit, and the power circuit is connected with single-chip microcontroller.
Wherein, the monitoring subsystem further includes display circuit, and the display circuit is connected with single-chip microcontroller, the display electricity
Road includes LCD display.
Wherein, the monitoring subsystem further includes serial communication circuit, one end of the serial communication circuit and single-chip microcontroller
Connection, the other end of serial communication circuit are connected with host computer.
Wherein, the monitoring subsystem includes a cabinet, and the surface setting control panel of the cabinet, multiple temperature pass
Sense device working indicator light, the alarm temperature for setting alarm temperature set the report of button and the alarm temperature for showing setting
Alert temperature display charactron, the alarm temperature setting button shows that charactron is connected with single-chip microcontroller with alarm temperature, described
LCD display and multiple temperature sensor selection switches are set to control panel, each temperature sensor work light
It is electrically connected with a temperature sensor selection switch, when the corresponding temperature sensor of temperature sensor selection switch connection
Circuit, then corresponding temperature sensor work light is lighted, when the corresponding temperature sensing of temperature sensor selection switch cutoff
The circuit of device, then corresponding temperature sensor work light extinguishes.
Wherein, the monitoring subsystem includes a cabinet, and power circuit interface, the electricity is arranged in a surface of the cabinet
Source circuit interface is connected with the power circuit.
Wherein, the monitoring subsystem includes a cabinet, and serial communication interface, the string is arranged in a surface of the cabinet
Port communications interface is connected with the serial communication circuit.
Wherein, temperature sensor interface is arranged in another surface of the cabinet, and each temperature sensor interface passes through conducting wire
It is connected with a temperature sensor.
Wherein, the monitoring subsystem includes a cabinet, and the cabinet is six face cabinets, and the upper end of six face cabinet is set
Fixing groove is set, the frame body axis and fixing groove cooperation are fixed, and frame body plane can be rotated around frame body axis, and the frame body axis can be along fixation
The center axis rotation of slot.
The beneficial effects of the present invention are: a kind of method and system of surface multipoint temperature monitoring, including multiple temperature pass
Sensor and monitoring system, the temperature sensor are connected with monitoring system, and the monitoring system includes processor, and multiple temperature pass
Sensor is respectively separated default sampling period acquisition and corresponds to the temperature value of temperature monitoring point, and the temperature value is transmitted to processing
Device；Processor carries out the fitting of temperature jump response curve according to the multiple temperature values received, to obtain multiple temperature monitorings
The temperature jump response curve on the corresponding monitored surface of point.Temperature jump response curve can reflect temperature monitoring point in advance
Temperature variations, reasonable prediction can be carried out to the temperature variations of temperature monitoring point by obtaining temperature jump response curve.
As it can be seen that the method and system of the surface multipoint temperature monitoring, the temperature value at temperature monitoring point by acquiring monitored surface,
To the temperature variations reasonable prediction of temperature monitoring point, help to carry out accurate temperature control.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, institute in being described below to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also implement according to the present invention
The content of example and these attached drawings obtain other attached drawings.
Fig. 1 is the process signal of method one embodiment of surface multipoint temperature monitoring provided in an embodiment of the present invention
Figure.
Fig. 2 is the process signal of second embodiment of method of surface multipoint temperature monitoring provided in an embodiment of the present invention
Figure.
Fig. 3 is interpolation 20 provided in an embodiment of the present invention several 40 several temperature-densities of temperature-density figure and interpolation
Figure.
Fig. 4 is the process signal of the method third embodiment of surface multipoint temperature monitoring provided in an embodiment of the present invention
Figure.
Fig. 5 be application surface multipoint temperature monitoring provided in an embodiment of the present invention method after the temperature monitoring GUI that shows
Interface.
Fig. 6 is the structural block diagram of the system of surface multipoint temperature monitoring provided in an embodiment of the present invention.
Fig. 7 is the solid that the first embodiment of 25 fixation holes is arranged in the frame body plane of bracket provided in an embodiment of the present invention
Structural schematic diagram.
Fig. 8 is the solid that the second embodiment of 25 fixation holes is arranged in the frame body plane of bracket provided in an embodiment of the present invention
Structural schematic diagram.
Fig. 9 is the circuit structure block diagram of monitoring subsystem provided in an embodiment of the present invention.
Figure 10 is the forward sight schematic perspective view of cabinet provided in an embodiment of the present invention.
Figure 11 is the rear view three-dimensional structure of cabinet provided in an embodiment of the present invention.
Detailed description of the invention is as follows:
20- cabinet；201- control panel；202-LCD display screen；2011- temperature sensor selection switch；
2012- temperature sensor work light；2013- alarm temperature sets button；
2014- alarm temperature shows charactron；2015- power circuit interface；2016- serial communication interface；
2017- temperature sensor interface；2018- fixing groove；30- bracket；301- frame body plane；
302- frame body axis.
Specific embodiment
To keep the technical problems solved, the adopted technical scheme and the technical effect achieved by the invention clearer, below
It will the technical scheme of the embodiment of the invention will be described in further detail in conjunction with attached drawing, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art exist
Every other embodiment obtained under the premise of creative work is not made, shall fall within the protection scope of the present invention.
Referring to FIG. 1, it is method one embodiment of surface multipoint temperature monitoring provided in an embodiment of the present invention
Flow diagram.The method of surface multipoint temperature monitoring provided in an embodiment of the present invention can be applied to various industrial or agricultural equipment, doctor
Treat the temperature monitoring on the surface of instrument or circuit components etc..
The method of the surface multipoint temperature monitoring, comprising:
Step S101, multiple temperature sensors are respectively separated the temperature that default sampling period acquisition corresponds to temperature monitoring point
Value, and the temperature value is transmitted to processor.
The default sampling period can according to need setting, be selected as 0.5s, 1s or 2s, more at interval of the default sampling period
The temperature value of acquisition can be all transmitted to processor by a temperature sensor.
Step S102, processor carries out the fitting of temperature jump response curve according to the multiple temperature values received, to obtain
Obtain the temperature jump response curve on the corresponding monitored surface of multiple temperature monitoring points.
Step response refers to a system when its input is a jump function, and the variation of output responds.In control field,
Step response refers to the input of a system when very short time becoming definite value by 0, the time domain specification exported.Analyze a system
Step response facilitates the characteristic of understanding system, can because having quickly and significantly changing when input is after long-time stable state
To find out the characteristic of each part of system, and it is also known that the stability of a system.As it can be seen that temperature jump response curve
Can reflect the temperature variations of temperature monitoring point in advance, can to the temperature variations reasonable prediction of temperature monitoring point,
Help to carry out accurate temperature control.
Wherein, the fitting of the temperature jump response curve, the mathematics including the first order inertial loop with hysteresis property
The foundation of model；
The mathematical model is G (s)=Ke^ (- τ s)/(Ts+1), wherein G (s) is temperature transmission function, and K is ratio
Coefficient, τ are delay time constant, and s is differential Control operators, and e^ (- τ s) is pure delay link part, and T is inertia time constant.
According to the temperature value of monitored body surface, it is fitted the temperature jump response curve of monitored body surface.Specifically
Implementation method includes:
A) curve type to be fitted is set in program.The inside for generally requiring monitored object includes heating or refrigeration
Equipment, temperature jump response curve are the mathematical models with the first order inertial loop of hysteresis property:
G (s)=Ke^ (- τ s)/(Ts+1)；
B) average temperature data TT and corresponding time t is saved；
C) it matched curve and shows.
Program the corresponding command of acquisition temperature jump response curve under Matlab environment are as follows:
Fun=inline (' a (1) .*exp (- a (3) .*t)/(a (2) .*t+1) ', ' a', ' t')；% sets curve side
Journey is K*e- τ s/ (Ts+1), and wherein a includes three parameters: a (1)=K, a (2)=T, a (3)=τ；
A=lsqcurvefit (fun, aa, t, TT)；% matched curve, aa represent the starting point of curve, temperature for the first time
Starting point of the mean temperature of sensor sample as curve is spent,
hold on；plot(t,TT,'bo')；% draws raw data points,
T0=fun (a, t)；% indicates the curve fitted with T0,
plot(t,T0,'r')；% picture fits curve,
hold off；Disp (a) % acquires and shows K, t, the value of T parameter.
Wherein, the temperature sensor is infrared temperature sensor.
Infrared temperature sensor be not required to contact monitored body surface can accurate measurements object surface temperature.
It in nature,, will be continuous due to the presence of its internal warm-up movement when the temperature of object is higher than absolute zero
Ground radiated electromagnetic wave around, wherein just containing the infrared ray that wave band is located at 0.75~100 μm.Infrared temperature sensor can
Incude the infrared ray of the wave band.The physical essence of infra-red radiation is heat radiation, and the temperature of object is higher, the infrared ray radiated
More, the energy of infra-red radiation is stronger.Infrared temperature sensor can be according to the energy size reflection of the infrared ray received
The temperature value size of body.
The method of surface multipoint temperature monitoring provided by the invention is monitored at the temperature monitoring point on surface by acquiring
Temperature value helps to carry out accurate temperature control to the temperature variations reasonable prediction of temperature monitoring point.
Referring to FIG. 2, it is second embodiment of method of surface multipoint temperature monitoring provided in an embodiment of the present invention
Method flow diagram.The present embodiment and the main distinction of method one embodiment of surface multipoint temperature monitoring are, are obtaining
On the basis of temperature jump response curve, the specific steps explanation for obtaining temperature-density figure is increased.
The method of the surface multipoint temperature monitoring, comprising:
Step S201, multiple temperature sensors are respectively separated the temperature that default sampling period acquisition corresponds to temperature monitoring point
Value, and is transmitted to processor for the temperature value, multiple temperature monitoring points are located at drawn by co-ordination made of it is orthogonal
The intersection point of grid lines.
Step S202, processor is according to multiple temperature values for receiving and preset corresponding with multiple temperature value
The location information of temperature monitoring point obtains the temperature-density figure on the corresponding monitored surface of multiple temperature monitoring points, the temperature
Density map obtains and the temperature value matrix to multiple temperature values and the formation of multiple location informations carries out interpolation algorithm.
Step S203, processor carries out the fitting of temperature jump response curve according to the multiple temperature values received, to obtain
Obtain the temperature jump response curve on the corresponding monitored surface of multiple temperature monitoring points.
Wherein, the interpolation algorithm includes:
20 values are inserted to the temperature value matrix that multiple temperature values and multiple location informations are formed；Or,
40 values are inserted to the temperature value matrix that multiple temperature values and multiple location informations are formed.
Wherein, the multiple temperature monitoring point is located at the intersection point by orthogonal grid line made of co-ordination drafting, packet
It includes:
The intersection point of orthogonal grid line made of 9 temperature monitoring points are located at and draw by co-ordination.
Preferably, 9 temperature monitoring points are located at drawn by co-ordination made of orthogonal grid line intersection point, it is corresponding
Temperature sensor in order place by squarely matrix, and processor is based on the corresponding temperature value of temperature monitoring point and location information,
Temperature interpolation calculating is carried out between corresponding two temperature monitorings point, analog goes out the temperature-density figure of monitored body surface.
To make temperature-density figure be of practical significance, temperature sensor must be placed according to preset order squarely matrix,
The temperature-density figure of the present embodiment is to be based on 9 temperature values of two-dimentional 3 × 3 data matrixes and obtain.Then preset order are as follows: respectively
After temperature sensor number, first temperature sensor is set to the first temperature monitoring point, second temperature sensor is set
It is placed in second temperature monitoring point, and so on, until the 9th temperature sensor is set to the 9th temperature monitoring point, then temperature
Sensor number and temperature monitoring point position input processor, so that temperature sensor and temperature monitoring point are formed correspondingly
Positional relationship.Temperature-density figure itself represents monitored body surface temperature conditions, therefore the temperature value of temperature sensor is in temperature
Spending the sequence of positions in density map (position in 3 × 3 matrixes) will be with temperature sensor in the position of monitored body surface
Sequence consensus is set just to be of practical significance.In addition, carrying out interpolation calculation between corresponding two temperatures value, interpolation number is more, temperature
The surface transition of density map is more smooth.
Referring to FIG. 3, it is that interpolation 20 provided in an embodiment of the present invention several 40, temperature-density figure and interpolation are several
Temperature-density figure.
A figure is interpolation 20 several temperature-density figures, and b figure is interpolation 40 several temperature-density figures.It can from figure
Out, the range of temperature of b figure is schemed smaller compared to a, and transition is smoother.As it can be seen that the interpolation number of the interpolation algorithm is got over
More, temperature transition is more smooth, more can accurately reflect the variation of temperature.
Program the corresponding command of acquisition temperature-density figure under Matlab environment are as follows:
Matrix=[Temp1 Temp2 Temp3；Temp4 Temp5 Temp6；Temp7 Temp8 Temp9]；% is built
Vertical 3 × 3 temperature matrices, TempN indicate the corresponding temperature value of each temperature sensor acquisition
[rows, cols]=size (matrix)；% finds out the number of matrix row, column
[x, y]=meshgrid (1:1:rows, 1:1:cols)；% establishes the position of former temperature Distribution value
[xi, yi]=meshgrid (1:0.05:rows, 1:0.05:cols)；% interpolation on the basis of former temperature number
It is worth to 1/0.05=20
Zi=interp2 (x, y, matrix', xi, yi, ' cubic')；% interpolation
H=imagesc (zi)；% draws temperature-density figure
colormap(gray)；% grayscale image displays temperature density map.
The method of surface multipoint temperature monitoring provided by the invention is monitored at the temperature monitoring point on surface by acquiring
Temperature value obtains the temperature jump response curve and temperature-density curve on the corresponding monitored surface of multiple temperature monitoring points, right
The temperature variations reasonable prediction of temperature monitoring point helps to carry out accurate temperature control.
Referring to FIG. 4, it is the method third embodiment of surface multipoint temperature monitoring provided in an embodiment of the present invention
Method flow diagram.The present embodiment and the main distinction of second embodiment of method of surface multipoint temperature monitoring are, are obtaining
On the basis of temperature jump response curve and temperature-density figure, the specific steps explanation for obtaining mean temperature and alarm is increased.
The method of the surface multipoint temperature monitoring, comprising:
Step S301, multiple temperature sensors are respectively separated the temperature that default sampling period acquisition corresponds to temperature monitoring point
Value, and the temperature value is transmitted to processor.
Step S302, processor carries out the fitting of temperature jump response curve according to the multiple temperature values received, to obtain
Obtain the temperature jump response curve on the corresponding monitored surface of multiple temperature monitoring points.
Step S303, it is corresponding monitored to obtain multiple temperature monitoring points according to the multiple temperature values received for processor
The mean temperature on surface, the mean temperature=the sum of the temperature value received/corresponding temperature monitoring of the temperature value received
The sum of the number of point.
Program the corresponding command of acquisition mean temperature under Matlab environment are as follows:
Assuming that the temperature of temperature sensor is Temp, the value of each temperature sensor is Temp1, Temp2 ... Temp9；
Each temperature sensor has a control switch N, N=1 when temperature sensor is enabled, N=0, Ge Gewen on the contrary
The parameter for spending sensor is N1, N2 ... N9；
Mean temperature=(N1*Temp1+N2*Temp2+ ...+N9*Temp9)/9；
Step S304a, when any one temperature value is in except default safe temperature range, processor starts alarm,
So as to alert.
Step S304b, it is preset except safe average temperature range when average temperature value is in, processor starts alarm,
So as to alert.
It should be noted that there is no sequencing relationships by step S304a and step S304b, it can be first implementation steps
S304a implementation steps S304b again, can also first implementation steps S304b implementation steps S304a again, can be with step S304a and step
Rapid S304b parallel practice or step S304a and step S304b select an implementation.
Step S305, processor saves the temperature data on monitored surface；Or,
The temperature data on monitored surface is sent to display screen to show by processor；Or,
The temperature data on monitored surface is sent to display screen and is shown with will pass through gui interface by processor.
Processor can record runing time and storage temperature data, and temperature data and corresponding runing time are established an a pair
It should be related to, provide data foundation for the control of further temperature.
Referring to FIG. 5, its be application surface multipoint temperature monitoring provided in an embodiment of the present invention method after the temperature that shows
Degree monitoring gui interface.
Serial communication parameter regulation part, enabled temperature sensor selector are respectively illustrated on temperature monitoring gui interface
Divide, temperature sensor collecting temperature value part, temperature variation curve part, temperature jump change curve part.Serial communication ginseng
Number adjustment portion point includes port, baud rate, check bit, data bit, stop position.Enabled temperature sensor selected section includes 9
A temperature sensor can select in enabled temperature sensor and choose corresponding operating temperature sensor in frame, to carry out accurately
Temperature value shows and calculates.Temperature sensor collecting temperature value part includes 9 temperature values.Temperature variation curve part and temperature
Step change plot part, for the real-time display temperature variation curve in reference axis.
The method of surface multipoint temperature monitoring provided by the invention is mainly used for monitoring various industrial or agricultural equipment, medical instrument
The monitored surface temperature of device or circuit components etc., and monitoring result real-time display is come out.This method uses infrared temperature
Sensor is spent, without contacting the surface of monitored object, so that it may the temperature value at effective monitoring and displays temperature monitoring point
And value situation of change.Temperature value and location information at combination temperature monitoring point substantially simulate the temperature on entire monitored surface
Spend density map.Meanwhile according to the mean temperature situation of change of monitored body surface, it is fitted the temperature rank of monitored body surface
Jump response curve, and the thermal property of monitored object is understood more intuitively.In addition, this method can also storage temperature data in real time,
Data foundation is provided for the control of further temperature, and this method can be with set temperature alarm range, when temperature value exceeds the model
It encloses, alarm will issue prompting message.
To sum up, the method for surface multipoint temperature monitoring provided by the invention, solves and how accurately to acquire monitored object
The multi-point temperature in body surface face, how real-time display temperature value size and situation of change, how using temperature-density figure acquisition supervised
Body surface bulk temperature situation is surveyed, the technical problem of temperature jump response curve of monitored body surface etc. how is obtained.
The following are the embodiments of the system of surface multipoint temperature monitoring provided by the invention.Surface multipoint temperature monitoring is
The embodiment of system and the embodiment of the method for above-mentioned surface multipoint temperature monitoring belong to same design, surface multipoint temperature monitoring
The detail content of not detailed description in the embodiment of system can refer to the embodiment of the method for above-mentioned surface multipoint temperature monitoring.
Referring to FIG. 6, it is the structural block diagram of the system of surface multipoint temperature monitoring provided in an embodiment of the present invention.
The system of the surface multipoint temperature monitoring, including multiple temperature sensors and monitoring system, the temperature sensor
It being connected with monitoring system, the monitoring system includes processor,
Multiple temperature sensors correspond to the temperature value of temperature monitoring point for being respectively separated default sampling period acquisition,
And the temperature value is transmitted to processor；
Processor is more to obtain for carrying out the fitting of temperature jump response curve according to the multiple temperature values received
The temperature jump response curve on the corresponding monitored surface of a temperature monitoring point.
The system of surface multipoint temperature monitoring provided by the invention is monitored at the temperature monitoring point on surface by acquiring
Temperature value helps to carry out accurate temperature control to the temperature variations reasonable prediction of temperature monitoring point.
Wherein, the fitting of the temperature jump response curve, the mathematics including the first order inertial loop with hysteresis property
The foundation of model；
The mathematical model is G (s)=Ke^ (- τ s)/(Ts+1), wherein G (s) is temperature transmission function, and K is ratio
Coefficient, τ are delay time constant, and s is differential Control operators, and e^ (- τ s) is pure delay link part, and T is inertia time constant.
Wherein, the temperature sensor is infrared temperature sensor.
Wherein, the processor is also used to that it is corresponding to obtain multiple temperature monitoring points according to the multiple temperature values received
The mean temperature on monitored surface, the mean temperature=the sum of the temperature value received/corresponding temperature of the temperature value received
Spend the sum of the number of monitoring point.
Fig. 7 and Fig. 8 are please referred to, is that the frame body plane 301 of bracket 30 provided in an embodiment of the present invention is arranged 25 admittedly
Determine the schematic perspective view of the first embodiment in hole and the schematic perspective view of second embodiment.
Wherein, the monitoring system further includes bracket 30, is arranged on the bracket 30 multiple for fixed temperature sensor
Fixation hole, the fixation hole and temperature sensor correspond, each fixation hole be located at draw by co-ordination and
At orthogonal grid line intersection point；
After multiple temperature sensors are fixed on the fixation hole of bracket 30 by preset order respectively, it is also used to be respectively separated default
Sampling period acquisition corresponds to the temperature value of temperature monitoring point, and the temperature value is transmitted to processor,
Processor is also used to according to the multiple temperature values and preset temperature corresponding with multiple temperature value received
The location information for spending monitoring point, obtains the temperature-density figure on the corresponding monitored surface of multiple temperature monitoring points, the temperature is close
Degree figure obtains and the temperature value matrix to multiple temperature values and the formation of multiple location informations carries out interpolation algorithm.
Wherein, the bracket 30 includes frame body plane 301 and frame body axis 302, the frame body plane 301 and frame body axis 302
25 fixation holes are arranged in orthogonal connection, the frame body plane 301, and the fixation hole is round mouth shrinkage pool.
Wherein, the bracket 30 includes frame body plane 301 and frame body axis 302, the frame body plane 301 and frame body axis 302
Orthogonal connection, the surface shape of the frame body plane 301 are the square of 30cm × 30cm.
Preferably, bracket 30 is used to place temperature sensor, including 30 body plane of bracket and frame body axis 302.Frame body plane
301 surface shape is the square of 30cm × 30cm.There are 5 × 5 round mouth shrinkage pools in frame body plane 301, in use, by temperature
Sensor is fixed in round mouth shrinkage pool, different round mouth shrinkage pools can be selected to place according to the size of monitored body surface area
Temperature sensor.If monitored body surface area is big, the solid line intersection position of the first embodiment of frame body plane 301 may be selected
9 round mouth shrinkage pools at place place temperature sensor, if monitored body surface area is small, the second of frame body plane 301 may be selected
Round mouth shrinkage pool at the dotted line intersection position of embodiment places temperature sensor.Only when temperature sensor presses preset order Cheng Fang
When shape matrix is placed, the temperature-density figure for the monitored body surface that processor die is drawn up just is of practical significance.If temperature sensing
Device is not placed according to square matrix, can also be monitored monitored body surface temperature and be carried out real-time display, only temperature at this moment
Degree density map no longer has reference significance.
Wherein, the monitoring system further includes monitoring subsystem, and the processor is host computer, the host computer and described
Monitoring subsystem is electrically connected, and the bracket 30 and the monitoring subsystem are detachably connected.
Multiple spot surface temperature monitoring system proposed by the present invention is mainly used for monitoring the temperature value of monitored body surface,
And pass through the LCD display 202 and host computer real-time display of monitoring subsystem.The system mainly includes monitoring subsystem and upper
Machine two parts.
Host computer can realize three zones, respectively the temperature value size of each temperature sensor monitoring of real-time display, flat
Equal temperature and temperature variation curve；Temperature value and location information at combination temperature monitoring point simulate entirely monitored table
The temperature-density figure in face；According to monitored average surface temperature situation of change, the temperature jump for being fitted monitored body surface is rung
Curve is answered, provides data foundation for the control of further temperature.
The temperature of temperature monitoring point based on infrared temperature sensor monitoring, may be selected to enable any 1-9 infrared temperature
Working sensor, the temperature value and change curve of the enabled infrared temperature sensor of host computer real-time display, and according to enabled
Infrared temperature sensor calculates average temperature value.Infrared temperature sensor, which can choose, to be placed on bracket 30 or directly places
In monitored body surface.When infrared temperature sensor is placed by preset order squarely matrix, quilt that host computer simulates
The temperature-density figure on monitoring object surface just has practical significance.Host computer changes according to the mean temperature of monitored body surface
Situation, can be fitted the temperature jump response curve of monitored body surface, and host computer can be believed with storage temperature data and time
Breath provides data foundation for the control of further temperature.
Monitoring subsystem can be used alone, at this point, the LCD display 202 of monitoring subsystem can show each temperature
The temperature value and mean temperature of sensor.
Referring to FIG. 9, it is the circuit structure block diagram of monitoring subsystem provided in an embodiment of the present invention.
Wherein, the monitoring subsystem includes single-chip microcontroller and multiple connecting and disconnecting of the circuit for being used to control each temperature sensor
Temperature sensor selects switch 2011, and the temperature sensor selection switch 2011 and temperature sensor correspond, the temperature
Degree sensor selection switch 2011 is connected with single-chip microcontroller.
Wherein, the single-chip microcontroller is the single-chip microcontroller of PIC16 type, and the monitoring subsystem further includes A/D expanded circuit, described
A/D expanded circuit is connected with single-chip microcontroller.
Wherein, the single-chip microcontroller is the single-chip microcontroller of ARM type or the single-chip microcontroller of DSP type.
Wherein, the monitoring subsystem further includes warning circuit, and the warning circuit is connected with single-chip microcontroller, the alarm electricity
Road includes alarm, and the alarm is buzzer.
Wherein, the monitoring subsystem further includes power circuit, and the power circuit is connected with single-chip microcontroller.
Wherein, the monitoring subsystem further includes display circuit, and the display circuit is connected with single-chip microcontroller, the display electricity
Road includes LCD display 202.
Wherein, the monitoring subsystem further includes serial communication circuit, one end of the serial communication circuit and single-chip microcontroller
Connection, the other end of serial communication circuit are connected with host computer.
Monitoring subsystem includes power circuit, single-chip microcontroller, A/D expanded circuit, serial communication circuit, warning circuit, temperature
Sensor selection switch 2011, display circuit.Power circuit is single-chip microcontroller power supply, and single-chip microcontroller selects the single-chip microcontroller of PIC16 type, this
Body is converted with 8 road A/D, 9 temperature sensors of proposed adoption in this system, and single-chip microcontroller of PIC16 type itself only includes 8 road A/D
Channel, therefore A/D conversion needs to be connected with A/D expanded circuit all the way, extends A/D ampling channel number.Serial communication circuit is used
The temperature value of monitoring is transferred to host computer.Warning circuit has alarm temperature setting and buzzer prompting function, if practical
The temperature value or mean temperature of monitoring are more than the alarm temperature of setting, and buzzer can give a warning prompting message.Each temperature
Sensor is all connected with a temperature sensor selection switch 2011, can choose whether corresponding temperature sensor works.
Figure 10 and Figure 11 are please referred to, is the forward sight schematic perspective view of cabinet 20 provided in an embodiment of the present invention respectively
And rear view three-dimensional structure.
Wherein, the monitoring subsystem includes a cabinet 20, the surface setting control panel 201, more of the cabinet 20
A temperature sensor work light 2012, the alarm temperature for setting alarm temperature set button 2013 and set for showing
The alarm temperature of fixed alarm temperature shows that charactron 2014, the alarm temperature setting button 2013 and alarm temperature show number
Code pipe 2014 is connected with single-chip microcontroller, and the LCD display 202 and multiple temperature sensor selection switches 2011 are set to
Control panel 201, each temperature sensor work light 2012 electrically connect with a temperature sensor selection switch 2011
It connects, when temperature sensor selection switch 2011 connects the circuit of corresponding temperature sensor, then corresponding temperature sensor works
Indicator light 2012 is lighted, when the circuit of the corresponding temperature sensor of the temperature sensor selection cutting of switch 2011, then corresponding temperature
Working sensor indicator light 2012 is spent to extinguish.
Wherein, the monitoring subsystem includes a cabinet 20, and power circuit interface is arranged in a surface of the cabinet 20
2015, the power circuit interface 2015 is connected with the power circuit.
Wherein, the monitoring subsystem includes a cabinet 20, and serial communication interface is arranged in a surface of the cabinet 20
2016, the serial communication interface 2016 is connected with the serial communication circuit.
Wherein, temperature sensor interface 2017, each temperature sensor interface is arranged in another surface of the cabinet 20
2017 are connected by conducting wire and a temperature sensor.
The surface connection LCD display 202 and temperature sensor of cabinet 20 select switch 2011, in LCD display 202
Lower section be arranged control panel 201.Control panel 201 includes that temperature sensor work light 2012 and alarm temperature setting are pressed
Button 2013.The another surface of cabinet 20 includes power circuit interface 2015 and serial communication interface 2016.Another table of cabinet 20
Face includes temperature sensor interface 2017.Temperature sensor interface 2017 and single-chip microcontroller are electrically connected.Temperature sensor is by leading
Line is connected to the temperature sensor interface 2017 on cabinet 20.Temperature sensor can be fixed on bracket 30, be moved easily and
Measurement, can also be directly placed at monitored body surface.
Wherein, the monitoring subsystem includes a cabinet 20, and the cabinet 20 is six face cabinets 20, six face cabinet 20
Upper end be arranged fixing groove 2018, the frame body axis 302 and fixing groove 2018 cooperation fix, frame body plane 301 can be around frame body axis
302 rotations, the frame body axis 302 can be along the center axis rotation of fixing groove 2018.
Frame body axis 302 and the fixing groove 2018 of cabinet 20 are fixedly connected, to Support bracket 30.Meanwhile frame body is flat
Face 301 can be rotated along frame body axis 302.When monitoring the temperature of monitored body surface, bracket 30 can be fixed on cabinet 20
It is upper or hand-held.When bracket 30 is fixed on cabinet 20, monitored object can be placed on cabinet 20 or near cabinet 20, pass through rotation
Pivoted frame body axis 302 makes temperature sensor perpendicular to monitored object top, carries out temperature monitoring；Also hand-holdable bracket 30, or
Frame body plane 301 is placed on monitored body surface, carries out multipoint temperature monitoring.Temperature sensor is placed in the fixation of bracket 30
Hole location is measured with directly temperature sensor being placed on monitored body surface there may be compared with sliding and change in location
It is more convenient, it is as a result also more accurate.Certainly, temperature sensor can also be not placed on bracket 30, be placed directly in monitored
Body surface.
LCD display 202 can show the temperature value and temperature averages of each temperature sensor monitoring.9 temperature
Sensor selection switch 2011 can select respectively whether corresponding temperature sensor works.The instruction pair of temperature sensor indicator light
Whether the temperature sensor answered works, if the corresponding temperature sensor of temperature sensor indicator light is in running order, the temperature
It is bright to spend sensor indicator light, it is on the contrary then do not work.Alarm temperature setting button 2013 can set the temperature of alarm, if actual temperature
Value is higher or lower than alarm temperature, then gives buzzer prompting；Alarm temperature shows that charactron 2014 can show the report of setting
Alert temperature.Power interface circuit and serial communication interface 2016 are respectively intended to connection power supply line and Serial Port Line.Temperature sensor connects
Mouth 2017 is connected by conducting wire with temperature sensor, and fixing groove 2018 is used to mounting bracket 30.
Multiple spot surface temperature monitoring system provided by the invention, including the temperature sensor for monitoring multi-point temperature, use
In the monitoring subsystem of simple displaying temperature value, for the host computer of displays temperature variation and monitored object thermal property curve
Three parts.Monitoring subsystem mechanical structure includes cabinet 20 and bracket 30.Bracket 30 includes frame body plane 301 and frame body axis 302.
Round mouth shrinkage pool is set in frame body plane 301, and round mouth shrinkage pool can be along frame body axis 302 to fixed temperature sensor, 30 plane of bracket
Rotation.Enabled arbitrary temp sensor may be selected in monitoring subsystem.LCD display 202 shows that corresponding temperature sensor is
It is no in running order.Host computer can be according to the temperature to work in the temperature sensor adjustment host computer enabled in monitoring subsystem
Sensor, calculating and data preservation etc. for carrying out the mean temperature of respective temperature sensor.Each work of host computer real-time display
Make the temperature value and temperature variation curve of temperature sensor.If temperature sensor is placed by preset order and according to square matrix,
Host computer also analog goes out the temperature-density figure for the monitored body surface being of practical significance, for reflecting monitored body surface
Substantially profiling temperatures.According to the situation of change of monitored body surface mean temperature, it is fitted the temperature of monitored object
Step response curve, to carry out accurate temperature control and to understand the hot property of monitored object.Host computer can also save
Runing time and corresponding temperature value facilitate further data to analyze.
Multiple spot surface temperature monitoring system provided by the invention, multi-point Temperature Collection and monitoring integration, can not only adopt
Collect monitored body surface multi-point temperature value, can with the temperature value size of each temperature monitoring point of real-time display, mean temperature and
Change curve.The system structure is simple, easy to operate.Monitoring subsystem is set in cabinet 20, and temperature sensor can be placed
It is electrical connected on the bracket 30 being fixedly connected with cabinet 20, and through the monitoring subsystem in conducting wire and cabinet 20.
A kind of method and system of surface multipoint temperature monitoring, the temperature at temperature monitoring point by acquiring monitored surface
Angle value helps to carry out accurate temperature control to the temperature variations reasonable prediction of temperature monitoring point.
Those of ordinary skill in the art will appreciate that realizing that all or part of the steps of above-described embodiment can pass through hardware
It completes, relevant hardware can also be instructed to complete by program, which can store in a computer-readable storage medium
In matter, storage medium may include memory, disk or CD etc..
The above is only a preferred embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (24)
1. a kind of method of surface multipoint temperature monitoring characterized by comprising
Multiple temperature sensors are respectively separated the temperature value that the acquisition of default sampling period corresponds to temperature monitoring point, and by the temperature
Value is transmitted to processor；
Processor carries out the fitting of temperature jump response curve according to the multiple temperature values received, to obtain multiple temperature monitorings
The temperature jump response curve on the corresponding monitored surface of point；
Wherein, the fitting of the temperature jump response curve, the mathematical model including the first order inertial loop with hysteresis property
Foundation；
The mathematical model is G (s)=Ke^ (- τ s)/(Ts+1), wherein G (s) is temperature transmission function, and K is ratio system
Number, τ are delay time constant, and s is differential Control operators, and e^ (- τ s) is pure delay link part, and T is inertia time constant；
Using the mean temperature of first time temperature sensor sampling as the starting point of curve；
The multiple temperature sensor is respectively separated the temperature value that default sampling period acquisition corresponds to temperature monitoring point, and should
Temperature value is transmitted to after processor, further includes:
Processor obtains the average temperature on the corresponding monitored surface of multiple temperature monitoring points according to the multiple temperature values received
Degree, the sum of the number of the corresponding temperature monitoring point of the mean temperature=the sum of the temperature value received/temperature value received.
2. the method for surface multipoint temperature monitoring according to claim 1, which is characterized in that the temperature sensor is red
Outer temperature sensor.
3. the method for surface multipoint temperature monitoring according to claim 1, which is characterized in that the multiple temperature sensor
It is respectively separated default sampling period acquisition and corresponds to the temperature value of temperature monitoring point, and the temperature value is transmitted to processor；Packet
It includes:
Multiple temperature sensors are respectively separated the temperature value that the acquisition of default sampling period corresponds to temperature monitoring point, and by the temperature
Value is transmitted to processor, multiple temperature monitoring points are located at drawn by co-ordination made of orthogonal grid line intersection point；
Processor is according to the multiple temperature values and preset temperature monitoring point corresponding with multiple temperature value received
Location information, obtains the temperature-density figure on the corresponding monitored surface of multiple temperature monitoring points, the temperature-density figure by pair
The temperature value matrix that multiple temperature values and multiple location informations are formed carries out interpolation algorithm and obtains.
4. the method for surface multipoint temperature monitoring according to claim 1, which is characterized in that the multiple temperature sensor
Be respectively separated the temperature value that the acquisition of default sampling period corresponds to temperature monitoring point, and by the temperature value be transmitted to processor it
Afterwards, further includes:
When any one temperature value is in except default safe temperature range, processor starts alarm, to issue alarm signal
Breath.
5. the method for surface multipoint temperature monitoring according to claim 1, which is characterized in that the multiple temperature sensor
Be respectively separated the temperature value that the acquisition of default sampling period corresponds to temperature monitoring point, and by the temperature value be transmitted to processor it
Afterwards, further includes:
It is preset except safe average temperature range when average temperature value is in, processor starts alarm, to issue alarm signal
Breath.
6. the method for surface multipoint temperature monitoring according to claim 1, which is characterized in that described to obtain multiple temperature
After the temperature jump response curve on the corresponding monitored surface in monitoring point, further includes:
Processor saves the temperature data on monitored surface；Or,
The temperature data on monitored surface is sent to display screen to show by processor；Or,
The temperature data on monitored surface is sent to display screen and is shown with will pass through gui interface by processor.
7. a kind of system of surface multipoint temperature monitoring, which is characterized in that described including multiple temperature sensors and monitoring system
Temperature sensor is connected with monitoring system, and the monitoring system includes processor,
Multiple temperature sensors correspond to the temperature value of temperature monitoring point for being respectively separated default sampling period acquisition, and will
The temperature value is transmitted to processor；
Processor, for carrying out the fitting of temperature jump response curve according to the multiple temperature values received, to obtain multiple temperature
Spend the temperature jump response curve on the corresponding monitored surface in monitoring point；
Wherein, the fitting of the temperature jump response curve, the mathematical model including the first order inertial loop with hysteresis property
Foundation；
The mathematical model is G (s)=Ke^ (- τ s)/(Ts+1), wherein G (s) is temperature transmission function, and K is ratio system
Number, τ are delay time constant, and s is differential Control operators, and e^ (- τ s) is pure delay link part, and T is inertia time constant；
Using the mean temperature of first time temperature sensor sampling as the starting point of curve；
The processor is also used to obtain the corresponding monitored table of multiple temperature monitoring points according to the multiple temperature values received
The mean temperature in face, the corresponding temperature monitoring point of the mean temperature=the sum of the temperature value received/temperature value received
The sum of number.
8. the system of surface multipoint temperature monitoring according to claim 7, which is characterized in that the temperature sensor is red
Outer temperature sensor.
9. the system of surface multipoint temperature monitoring according to claim 7, which is characterized in that the monitoring system further includes
Multiple fixation holes for fixed temperature sensor are arranged on the bracket in bracket, and the fixation hole and temperature sensor are one by one
It is corresponding, each fixation hole is located at drawn by co-ordination made of orthogonal grid line intersection point；
After multiple temperature sensors are fixed on the fixation hole of bracket by preset order respectively, it is also used to be respectively separated default sampling week
Phase acquisition corresponds to the temperature value of temperature monitoring point, and the temperature value is transmitted to processor,
Processor is also used to according to the multiple temperature values and preset temperature prison corresponding with multiple temperature value received
The location information of measuring point obtains the temperature-density figure on the corresponding monitored surface of multiple temperature monitoring points, the temperature-density figure
It is obtained and the temperature value matrix to multiple temperature values and the formation of multiple location informations carries out interpolation algorithm.
10. the system of surface multipoint temperature monitoring according to claim 9, which is characterized in that the bracket includes frame body
25 fixation holes, the fixation is arranged in plane and frame body axis, the frame body plane and the orthogonal connection of frame body axis, the frame body plane
Hole is round mouth shrinkage pool.
11. the system of surface multipoint temperature monitoring according to claim 9, which is characterized in that the bracket includes frame body
Plane and frame body axis, the frame body plane and the orthogonal connection of frame body axis, the surface shape of the frame body plane are 30cm × 30cm
Square.
12. the system of surface multipoint temperature monitoring according to claim 9, which is characterized in that the monitoring system is also wrapped
Include monitoring subsystem, the processor is host computer, and the host computer and the monitoring subsystem are electrically connected, the bracket and
The monitoring subsystem is detachably connected.
13. the system of surface multipoint temperature monitoring according to claim 12, which is characterized in that the monitoring subsystem packet
Single-chip microcontroller and multiple temperature sensor selection switches for controlling the connecting and disconnecting of the circuit of each temperature sensor are included, the temperature passes
Sensor selection switch and temperature sensor correspond, and the temperature sensor selection switch is connected with single-chip microcontroller.
14. the system of surface multipoint temperature monitoring according to claim 13, which is characterized in that the single-chip microcontroller is
The single-chip microcontroller of PIC16 type, the monitoring subsystem further include A/D expanded circuit, and the A/D expanded circuit is connected with single-chip microcontroller.
15. the system of surface multipoint temperature monitoring according to claim 13, which is characterized in that the single-chip microcontroller is ARM
The single-chip microcontroller of type or the single-chip microcontroller of DSP type.
16. the system of surface multipoint temperature monitoring according to claim 13, which is characterized in that the monitoring subsystem is also
Including warning circuit, the warning circuit is connected with single-chip microcontroller, and the warning circuit includes alarm, and the alarm is buzzing
Device.
17. the system of surface multipoint temperature monitoring according to claim 13, which is characterized in that the monitoring subsystem is also
Including power circuit, the power circuit is connected with single-chip microcontroller.
18. the system of surface multipoint temperature monitoring according to claim 13, which is characterized in that the monitoring subsystem is also
Including display circuit, the display circuit is connected with single-chip microcontroller, and the display circuit includes LCD display.
19. the system of surface multipoint temperature monitoring according to claim 13, which is characterized in that the monitoring subsystem is also
Including serial communication circuit, one end of the serial communication circuit is connected with single-chip microcontroller, the other end of serial communication circuit and upper
Position machine connection.
20. the system of surface multipoint temperature monitoring according to claim 18, which is characterized in that the monitoring subsystem packet
Include a cabinet, the surface setting control panel of the cabinet, multiple temperature sensor work lights, temperature of alarming for setting
The alarm temperature setting button of degree and the alarm temperature of the alarm temperature for showing setting show charactron, the alarm temperature
Setting button shows that charactron is connected with single-chip microcontroller with alarm temperature, the LCD display and multiple temperature sensors
Selection switch is set to control panel, and each temperature sensor work light is and a temperature sensor selects switch electrically
Connection, when the circuit of the corresponding temperature sensor of temperature sensor selection switch connection, then corresponding temperature sensor work refers to
Show that lamp is lighted, when the circuit of the corresponding temperature sensor of temperature sensor selection switch cutoff, then corresponding temperature sensor work
Make indicator light extinguishing.
21. the system of surface multipoint temperature monitoring according to claim 17, which is characterized in that the monitoring subsystem packet
A cabinet is included, power circuit interface is arranged in a surface of the cabinet, and the power circuit interface is connected with the power circuit.
22. the system of surface multipoint temperature monitoring according to claim 19, which is characterized in that the monitoring subsystem packet
A cabinet is included, serial communication interface, the serial communication interface and the serial communication circuit is arranged in a surface of the cabinet
Connection.
23. according to the system of surface multipoint temperature monitoring described in claim 20 to 22 any one, which is characterized in that described
Temperature sensor interface is arranged in another surface of cabinet, and each temperature sensor interface is connected by conducting wire and a temperature sensor
It connects.
24. the system of surface multipoint temperature monitoring according to claim 10, which is characterized in that the monitoring subsystem packet
A cabinet is included, the cabinet is six face cabinets, and fixing groove is arranged in the upper end of six face cabinet, and the frame body axis and fixing groove are matched
It closes and fixes, frame body plane can be rotated around frame body axis, and the frame body axis can be along the center axis rotation of fixing groove.
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| CN107782457B (en) * | 2017-10-16 | 2019-11-15 | 安徽容知日新科技股份有限公司 | A kind of temperature monitoring method, equipment and system |
| CN108168735A (en) * | 2017-12-06 | 2018-06-15 | 北京航天计量测试技术研究所 | A kind of high-temperature temperature step method |
| CN109000801B (en) * | 2018-05-14 | 2020-02-14 | 东莞市迈纳斯航空技术有限公司 | Method and system for acquiring surface temperature of planar multimedia equipment |
| CN112087443B (en) * | 2020-09-04 | 2021-06-04 | 浙江大学 | Sensing data anomaly detection method under physical attack of industrial sensing network information |
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