CN105390515A - Image sensor - Google Patents

Image sensor Download PDF

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Publication number
CN105390515A
CN105390515A CN201510668647.6A CN201510668647A CN105390515A CN 105390515 A CN105390515 A CN 105390515A CN 201510668647 A CN201510668647 A CN 201510668647A CN 105390515 A CN105390515 A CN 105390515A
Authority
CN
China
Prior art keywords
photosensitive
imageing sensor
area
light sensing
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510668647.6A
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Chinese (zh)
Inventor
蔡旭东
姜惠启
孙淼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Zhongke Software Co Ltd
Original Assignee
Qingdao Zhongke Software Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Zhongke Software Co Ltd filed Critical Qingdao Zhongke Software Co Ltd
Priority to CN201510668647.6A priority Critical patent/CN105390515A/en
Publication of CN105390515A publication Critical patent/CN105390515A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an image sensor which comprises a light sensing chip and an optical imaging lens. The light sensing chip comprises one or a plurality of pixel units and a peripheral circuit area. Each pixel unit comprises a light sensing area and a pixel circuit area. The surface of the light sensing area is higher than the surface of the pixel circuit area and the surface of the peripheral circuit area. The light sensing area comprises a first light sensing area and a second light sensing area. The first light sensing area is arranged at the central part, and the second light sensing area is arranged at the edge. The dimension of the second light sensing area is larger than that of the first light sensing area. A first micro lens is arranged above the first light sensing area. A second micro lens is arranged above the second light sensing area. A glass plate which carries a red light filtering film, a green light filtering film and a blue light filtering film is arranged between the light sensing chip and the optical imaging lens of the image sensor. The glass plate is connected with motor driving equipment. The light sensing pixel array area of the image sensor is not provided with a color filter array. The image sensor has advantages of high sensitivity, high image quality and high imaging quality.

Description

A kind of imageing sensor
Technical field
The present invention relates to sensor field, be specifically related to a kind of imageing sensor.
Background technology
Along with developing rapidly of semiconductor technology, cmos image sensor extensive use in electronic equipment of various, uses as providing the image capture device of digital imagery function.Imageing sensor use sense light pixel array acquisition image information, is converted to the pixel light signal of telecommunication by pixel image signal, then operates the true picture information of each pixel of reduction through picture signal process.Imageing sensor of the prior art generally adopts the photosensitive pixel array arrangement mode of Bayer pattern, along with the fast development of electrical technology and electronic technology, the modern mobile electronic product of more and more image application sensor technology, obtains develop rapidly as smart mobile phone, digital camera, notebook computer etc. and popularizes.At present, the consumption proportion of people on the electronic products such as mobile phone is more and more higher, to quality and personal experience's requirement more and more harshness of product.Present electronic product all possesses photograph and camera function, and pixel, by original hundreds of thousands, develops into 500,8,000,000 even higher.Image sensor is as the critical piece of electronic product imaging, also more and more higher to the requirement of its image quality.
But the performance of existing imageing sensor still has much room for improvement.
Summary of the invention
The object of this invention is to provide and a kind ofly have that sensitivity is higher, image quality is high, the imageing sensor of good imaging quality.
A kind of imageing sensor, described imageing sensor comprises sensitive chip, optical imaging lens, described sensitive chip comprises one or more pixel cell and peripheral circuit region, each pixel cell comprises photosensitive region and pixel circuit region, and the surface of described photosensitive region is higher than the surface of described pixel circuit region and described peripheral circuit region, described photosensitive region comprises the first photosensitive region and the second photosensitive area, the first described photosensitive region is positioned at central authorities, the second described photosensitive region is positioned at edge, the size of the second photosensitive area is greater than the size of the first photosensitive area, the first lenticule is provided with above first photosensitive area, the second lenticule is provided with above second photosensitive area, be provided with between described imageing sensor sensitive chip and optical imaging lens and be loaded with redness, the sheet glass of green and blue filter film, described sheet glass is connected with motor driving apparatus, the photosensitive pixel array region of this imageing sensor does not arrange colorful optical filter array.
Further, also to comprise one or more layers in passivation layer and described passivation layer metal interconnected for described imageing sensor.
Further, described sheet glass is parallel with described sensitive chip.
Further, described first lenticule and the second lenticular size comprise diameter and height, or comprise diameter or height, or comprise volume.
Further, the size of described second photosensitive area and the size of the first photosensitive area comprise length and width, or comprise length or width, or comprise area.
Beneficial effect:
In imageing sensor of the present invention, photosensitive region by imageing sensor photosurface outwardly, shorten the light path that photosensitive region is photosensitive, thus decrease the impact that the metal interconnect structure on photosurface gathers light, effectively improve the sensitivity of imageing sensor; During due to image sensor exposure, after obtaining the picture signal of redness, green, blue light respectively, three is synthesized real pixel image information, effectively prevent the optical crosstalk problem between neighbor, enable photosensitive pixel collect the true three look information of original image, improve the image quality that imageing sensor gathers; Improve the uniformity of image quality.
Embodiment
Embodiment 1
A kind of imageing sensor, it is characterized in that, described imageing sensor comprises sensitive chip, optical imaging lens, described sensitive chip comprises a pixel cell and peripheral circuit region, each pixel cell comprises photosensitive region and pixel circuit region, and the surface of described photosensitive region is higher than the surface of described pixel circuit region and described peripheral circuit region, described photosensitive region comprises the first photosensitive region and the second photosensitive area, the first described photosensitive region is positioned at central authorities, the second described photosensitive region is positioned at edge, the size of the second photosensitive area is greater than the size of the first photosensitive area, the first lenticule is provided with above first photosensitive area, the second lenticule is provided with above second photosensitive area, be provided with between described imageing sensor sensitive chip and optical imaging lens and be loaded with redness, the sheet glass of green and blue filter film, described sheet glass is connected with motor driving apparatus, the photosensitive pixel array region of this imageing sensor does not arrange colorful optical filter array.
Further, described imageing sensor also comprises the layer of metal interconnection in passivation layer and described passivation layer.
Further, described sheet glass is parallel with described sensitive chip.
Further, described first lenticule and the second lenticular size comprise diameter and height.
Further, the size of described second photosensitive area and the size of the first photosensitive area comprise length and width.
Embodiment 2
A kind of imageing sensor, it is characterized in that, described imageing sensor comprises sensitive chip, optical imaging lens, described sensitive chip comprises 3 pixel cells and peripheral circuit region, each pixel cell comprises photosensitive region and pixel circuit region, and the surface of described photosensitive region is higher than the surface of described pixel circuit region and described peripheral circuit region, described photosensitive region comprises the first photosensitive region and the second photosensitive area, the first described photosensitive region is positioned at central authorities, the second described photosensitive region is positioned at edge, the size of the second photosensitive area is greater than the size of the first photosensitive area, the first lenticule is provided with above first photosensitive area, the second lenticule is provided with above second photosensitive area, be provided with between described imageing sensor sensitive chip and optical imaging lens and be loaded with redness, the sheet glass of green and blue filter film, described sheet glass is connected with motor driving apparatus, the photosensitive pixel array region of this imageing sensor does not arrange colorful optical filter array.
Further, described imageing sensor also comprises the three layer metal interconnect in passivation layer and described passivation layer.
Further, described sheet glass is parallel with described sensitive chip.
Further, described first lenticule and the second lenticular size comprise diameter.
Further, the size of described second photosensitive area and the size of the first photosensitive area comprise length.
Embodiment 3
A kind of imageing sensor, it is characterized in that, described imageing sensor comprises sensitive chip, optical imaging lens, described sensitive chip comprises four pixel cells and peripheral circuit region, each pixel cell comprises photosensitive region and pixel circuit region, and the surface of described photosensitive region is higher than the surface of described pixel circuit region and described peripheral circuit region, described photosensitive region comprises the first photosensitive region and the second photosensitive area, the first described photosensitive region is positioned at central authorities, the second described photosensitive region is positioned at edge, the size of the second photosensitive area is greater than the size of the first photosensitive area, the first lenticule is provided with above first photosensitive area, the second lenticule is provided with above second photosensitive area, be provided with between described imageing sensor sensitive chip and optical imaging lens and be loaded with redness, the sheet glass of green and blue filter film, described sheet glass is connected with motor driving apparatus, the photosensitive pixel array region of this imageing sensor does not arrange colorful optical filter array.
Further, described imageing sensor five layers of also comprising in passivation layer and described passivation layer are metal interconnected.
Further, described sheet glass is parallel with described sensitive chip.
Further, described first lenticule and the second lenticular size comprise volume.
Further, the size of described second photosensitive area and the dimension width of the first photosensitive area.
Embodiment 4
A kind of imageing sensor, described imageing sensor comprises sensitive chip, optical imaging lens, described sensitive chip comprises eight pixel cells and peripheral circuit region, each pixel cell comprises photosensitive region and pixel circuit region, and the surface of described photosensitive region is higher than the surface of described pixel circuit region and described peripheral circuit region, described photosensitive region comprises the first photosensitive region and the second photosensitive area, the first described photosensitive region is positioned at central authorities, the second described photosensitive region is positioned at edge, the size of the second photosensitive area is greater than the size of the first photosensitive area, the first lenticule is provided with above first photosensitive area, the second lenticule is provided with above second photosensitive area, be provided with between described imageing sensor sensitive chip and optical imaging lens and be loaded with redness, the sheet glass of green and blue filter film, described sheet glass is connected with motor driving apparatus, the photosensitive pixel array region of this imageing sensor does not arrange colorful optical filter array.
Further, described imageing sensor six layers of also comprising in passivation layer and described passivation layer are metal interconnected.
Further, described sheet glass is parallel with described sensitive chip.
Further, described first lenticule and the second lenticular size comprise height.
Further, the size of described second photosensitive area and the dimensions length of the first photosensitive area.
Above-mentioned explanation is not limitation of the present invention, and the present invention is also not limited in above-mentioned citing, and the change that those skilled in the art make in essential scope of the present invention, remodeling, interpolation or replacement also should belong to protection scope of the present invention.

Claims (5)

1. an imageing sensor, it is characterized in that, described imageing sensor comprises sensitive chip, optical imaging lens, described sensitive chip comprises one or more pixel cell and peripheral circuit region, each pixel cell comprises photosensitive region and pixel circuit region, and the surface of described photosensitive region is higher than the surface of described pixel circuit region and described peripheral circuit region, described photosensitive region comprises the first photosensitive region and the second photosensitive area, the first described photosensitive region is positioned at central authorities, the second described photosensitive region is positioned at edge, the size of the second photosensitive area is greater than the size of the first photosensitive area, the first lenticule is provided with above first photosensitive area, the second lenticule is provided with above second photosensitive area, be provided with between described imageing sensor sensitive chip and optical imaging lens and be loaded with redness, the sheet glass of green and blue filter film, described sheet glass is connected with motor driving apparatus, the photosensitive pixel array region of this imageing sensor does not arrange colorful optical filter array.
2. a kind of imageing sensor according to claim 1, is characterized in that, it is metal interconnected that described imageing sensor also comprises one or more layers in passivation layer and described passivation layer.
3. a kind of imageing sensor according to claim 1, it is characterized in that, described sheet glass is parallel with described sensitive chip.
4. a kind of imageing sensor according to claim 1, is characterized in that, described first lenticule and the second lenticular size comprise diameter and height, or comprises diameter or height, or comprises volume.
5. a kind of imageing sensor according to claim 1, it is characterized in that, the size of described second photosensitive area and the size of the first photosensitive area comprise length and width, or comprise length or width, or comprise area.
CN201510668647.6A 2015-10-13 2015-10-13 Image sensor Pending CN105390515A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510668647.6A CN105390515A (en) 2015-10-13 2015-10-13 Image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510668647.6A CN105390515A (en) 2015-10-13 2015-10-13 Image sensor

Publications (1)

Publication Number Publication Date
CN105390515A true CN105390515A (en) 2016-03-09

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Family Applications (1)

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Country Status (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107919373A (en) * 2017-11-07 2018-04-17 德淮半导体有限公司 Back side illumination image sensor
CN111527744A (en) * 2017-12-28 2020-08-11 伟摩有限责任公司 Single optics for low and high light level imaging
CN112004011A (en) * 2020-08-27 2020-11-27 北京三快在线科技有限公司 Image acquisition method and device and light path conversion element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107919373A (en) * 2017-11-07 2018-04-17 德淮半导体有限公司 Back side illumination image sensor
CN107919373B (en) * 2017-11-07 2019-03-12 德淮半导体有限公司 Back side illumination image sensor
CN111527744A (en) * 2017-12-28 2020-08-11 伟摩有限责任公司 Single optics for low and high light level imaging
CN111527744B (en) * 2017-12-28 2022-05-17 伟摩有限责任公司 Single optical system for low and high light level imaging
CN112004011A (en) * 2020-08-27 2020-11-27 北京三快在线科技有限公司 Image acquisition method and device and light path conversion element

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Application publication date: 20160309