CN105374699A - High-efficient concentrating photovoltaic chip binding method - Google Patents
High-efficient concentrating photovoltaic chip binding method Download PDFInfo
- Publication number
- CN105374699A CN105374699A CN201510693584.XA CN201510693584A CN105374699A CN 105374699 A CN105374699 A CN 105374699A CN 201510693584 A CN201510693584 A CN 201510693584A CN 105374699 A CN105374699 A CN 105374699A
- Authority
- CN
- China
- Prior art keywords
- circuit substrate
- photovoltaic battery
- condensation photovoltaic
- conductive wire
- high efficiency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000009833 condensation Methods 0.000 claims description 37
- 230000005494 condensation Effects 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 238000010248 power generation Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241000127225 Enceliopsis nudicaulis Species 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention relates to a high-efficient concentrating photovoltaic chip binding method and belongs to the technical field of solar power generation. The method comprises steps of binding a short metallic conductive wire to the cathode of a concentrating photovoltaic battery and extending the metallic conductive wire to the negative pole of a circuit board. The method may effectively guarantee the conduction of the cathode of the concentrating photovoltaic battery and prevents the metallic conductive wire from entering the effective area of the concentrating photovoltaic battery. The metallic conductive wire led out of three end faces of the concentrating photovoltaic battery may timely and rapidly export current generated by the concentrating photovoltaic battery so as to greatly increase efficiency.
Description
Technical field
The present invention relates to a kind of condensation photovoltaic battery chip processing technology, be specifically related to a kind of high efficiency condensing photovoltaic chip bonding method, belong to concentrating photovoltaic power generation technical field.
Background technology
Light gathering photovoltaic power generating system mainly utilizes lens to be converged on condensation photovoltaic battery chip by sunray, thus reaches the object of generating.Anode on condensation photovoltaic battery chip is connected most important with negative electrode, if connect bad, breaking phenomena can occur, and enters in condensation photovoltaic battery chip effective area, can have a strong impact on the conversion efficiency of light gathering photovoltaic power generating system if connect the end of a thread.
Summary of the invention
The invention provides a kind of high efficiency condensing photovoltaic chip bonding method, the method technical problem to be solved overcomes the deficiencies in the prior art.
In order to realize above-mentioned technical purpose, the present invention has following process and step: first heat-conductivity conducting fixing glue is coated in the condensation photovoltaic battery fixed area on circuit substrate by (1); (2) condensation photovoltaic battery held with suction pen and is placed in the condensation photovoltaic battery fixed area on circuit substrate; (3) in curing oven, heat-conductivity conducting glue is cured, makes the condensation photovoltaic battery firm end be pasted onto on circuit substrate; (4) circuit substrate fixing condensation photovoltaic battery is placed on the fixed station of binding machine; (5) on a negative electrode of condensation photovoltaic battery, a short metallic conduction line segment is bound; (6) continue this metal conductive wire to extend on the negative pole of circuit board; (7) connection of other electrodes has been continued according to (5) and (6) step.
Circuit substrate is divided into positive pole and negative pole by the etching tank on described circuit substrate.
A condensation photovoltaic battery fixed area is had in positive pole zone on described circuit substrate.
Short metallic conduction line segment and a cathode parallel bound by described condensation photovoltaic cell cathode.
The line segment that described metal conductive wire extends on the negative pole on circuit board is vertical with condensation photovoltaic cell cathode.
Advantage of the present invention and good effect are: this binding method effectively can ensure the conducting of condensation photovoltaic battery chip negative electrode, also have simultaneously and ensure that metal conductive wire head can not enter on the effective area of condensation photovoltaic battery chip, from the conducting metal wire that condensation photovoltaic battery three end faces guide, can promptly the electric current that condensation photovoltaic battery produces be derived in time, thus greatly improve efficiency.
Accompanying drawing explanation
Fig. 1 is a kind of high efficiency condensing photovoltaic chip bonding method schematic diagram.
Wherein: 1, circuit substrate, 2, circuit substrate negative pole, 3, circuit substrate positive pole, 4, etching tank, 5, short metallic conduction line segment, 6, metal conductive wire, 7, condensation photovoltaic battery.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further illustrated.
A kind of high efficiency condensing photovoltaic chip bonding method, as shown in Figure 1, has following process and step: first heat-conductivity conducting fixing glue is coated in condensation photovoltaic battery 7 fixed area on circuit substrate 1 by (1); (2) condensation photovoltaic battery 7 held with suction pen and is placed in condensation photovoltaic battery 7 fixed area on circuit substrate 1; (3) in curing oven, heat-conductivity conducting glue is cured, makes the condensation photovoltaic battery firm end be pasted onto on circuit substrate 1; (4) circuit substrate 1 fixing condensation photovoltaic battery 7 is placed on the fixed station of binding machine; (5) on a negative electrode of condensation photovoltaic battery 7, a short metallic conduction line segment 5 is bound; (6) continue this metal conductive wire 6 to extend on the negative pole of circuit board; (7) connection of other electrodes has been continued according to (5) and (6) step, circuit substrate 1 is divided into circuit substrate positive pole 3 and circuit substrate negative pole 2 by the etching tank 4 on circuit substrate 1, described condensation photovoltaic battery 7 negative electrode binds short metallic conduction line segment 5 and a cathode parallel, so just can ensure that metal conductive wire 6 can not enter into condensation photovoltaic battery 7 effective area and get on, simultaneously, the negative electrode that this short metallic conduction line segment 5 has two or more and condensation photovoltaic battery 7 contacts, and so just effectively can ensure the conducting of condensation photovoltaic battery chip negative electrode.
In the present invention, as change row embodiment, the angle between short metallic conduction line segment and metal conductive wire can be acute angle or obtuse angle, and metal conductive wire can be any bar, therefore the scope that the scope of the present invention limits with claims is as the criterion.
Claims (5)
1. a high efficiency condensing photovoltaic chip bonding method, is characterized in that having following process and step: first heat-conductivity conducting fixing glue is coated in the condensation photovoltaic battery fixed area on circuit substrate by (1); (2) condensation photovoltaic battery held with suction pen and is placed in the condensation photovoltaic battery fixed area on circuit substrate; (3) in curing oven, heat-conductivity conducting glue is cured, makes the condensation photovoltaic battery firm end be pasted onto on circuit substrate; (4) circuit substrate fixing condensation photovoltaic battery is placed on the fixed station of binding machine; (5) on a negative electrode of condensation photovoltaic battery, a short metallic conduction line segment is bound; (6) continue this metal conductive wire to extend on the negative pole of circuit board; (7) connection of other electrodes has been continued according to (5) and (6) step.
2. a kind of high efficiency condensing photovoltaic chip bonding method according to claim 1, is characterized in that circuit substrate is divided into circuit substrate positive pole and circuit substrate negative pole by the etching tank on described circuit substrate.
3. a kind of high efficiency condensing photovoltaic chip bonding method according to claim 1, is characterized in that there is a condensation photovoltaic battery fixed area in the positive pole zone on described circuit substrate.
4. a kind of high efficiency condensing photovoltaic chip bonding method according to claim 1, is characterized in that short metallic conduction line segment and a cathode parallel bound by described condensation photovoltaic cell cathode.
5. a kind of high efficiency condensing photovoltaic chip bonding method according to claim 1, is characterized in that the line segment on the negative pole that described metal conductive wire extends on circuit board is vertical with condensation photovoltaic cell cathode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510693584.XA CN105374699A (en) | 2015-10-24 | 2015-10-24 | High-efficient concentrating photovoltaic chip binding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510693584.XA CN105374699A (en) | 2015-10-24 | 2015-10-24 | High-efficient concentrating photovoltaic chip binding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105374699A true CN105374699A (en) | 2016-03-02 |
Family
ID=55376776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510693584.XA Pending CN105374699A (en) | 2015-10-24 | 2015-10-24 | High-efficient concentrating photovoltaic chip binding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105374699A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405922A (en) * | 2015-11-01 | 2016-03-16 | 成都聚合科技有限公司 | Method for binding chip onto concentrating photovoltaic photoelectric conversion receiver |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090084435A1 (en) * | 2007-10-01 | 2009-04-02 | International Business Machines Corporation | Techniques for Cooling Solar Concentrator Devices |
| CN201829511U (en) * | 2010-09-15 | 2011-05-11 | 天津蓝天太阳科技有限公司 | Solar cell unit |
| CN103633174A (en) * | 2013-11-05 | 2014-03-12 | 成都聚合科技有限公司 | Efficient concentrating photovoltaic photoelectric conversion receiver with protection function |
-
2015
- 2015-10-24 CN CN201510693584.XA patent/CN105374699A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090084435A1 (en) * | 2007-10-01 | 2009-04-02 | International Business Machines Corporation | Techniques for Cooling Solar Concentrator Devices |
| CN201829511U (en) * | 2010-09-15 | 2011-05-11 | 天津蓝天太阳科技有限公司 | Solar cell unit |
| CN103633174A (en) * | 2013-11-05 | 2014-03-12 | 成都聚合科技有限公司 | Efficient concentrating photovoltaic photoelectric conversion receiver with protection function |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405922A (en) * | 2015-11-01 | 2016-03-16 | 成都聚合科技有限公司 | Method for binding chip onto concentrating photovoltaic photoelectric conversion receiver |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160302 |
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| WD01 | Invention patent application deemed withdrawn after publication |