CN105374479B - Cement resistor - Google Patents
Cement resistor Download PDFInfo
- Publication number
- CN105374479B CN105374479B CN201510477645.9A CN201510477645A CN105374479B CN 105374479 B CN105374479 B CN 105374479B CN 201510477645 A CN201510477645 A CN 201510477645A CN 105374479 B CN105374479 B CN 105374479B
- Authority
- CN
- China
- Prior art keywords
- porcelain shell
- thick
- resistor
- thermal diffusion
- diffusion plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
The present invention provides the cement resistor of energy low cost and the miniaturization of radiating efficiency highland.Cement resistor (1), which has, is printed with the porcelain shell (2) of thick-film resistor (4) in inner face, is filled with cement in porcelain shell in a manner of covering thick-film resistor and is allowed to solidify.Because thick-film resistor to be printed in the inner face of porcelain shell, the heat that thick-film resistor generates can be directly oriented to via porcelain shell to the outside of porcelain shell, can efficiently be radiated.Porcelain shell is installed on the substrate (2b) of opening and is constituted in a manner of including one of frame member (2a) and opening to occlude frame member, before substrate is installed on frame member, thick-film resistor is printed in the one side of substrate.Has the thermal diffusion plate (5) for the outer surface for being connected to porcelain shell, thus, it is possible to further increase radiating efficiency.Thermal diffusion plate can be made to be connected to the face of the opposite side in the face for being printed with thick-film resistor of substrate.
Description
Technical field
The present invention relates to cement resistors, more particularly to the resistance of cement seal after resistance is placed in porcelain shell
Device.
Background technique
Cement resistor generally as more high-power with being widely used, for example, as being shown in Fig. 3 and Fig. 4, by resistance
85 are placed in porcelain shell 82, are manufactured with the sealing of cement 89.2 cords of resistance 85 are connected to from the export of porcelain shell 82 in inside
(cord)87.When the cement resistor 81 is installed on mounting object object 91, also to consider that the heat for generating resistance 85 sheds
To outside, 86 face contact of metal plate installed with making the outer peripheral surface for covering cement resistor 81 in mounting object object 91 top surface,
Installation screw element 92 is set to be inserted through mounting hole 86a and metal plate 86 is fixed on mounting object object 91.
Summary of the invention
But the cement resistor 81 can not be incited somebody to action if the contact area not making metal plate 86 and porcelain shell 82 is larger
Radiating efficiency is maintained higher, so the metal plate 86 for needing flatness high, correspondingly cost also increases.
Also, other than in addition in terms of the cost the problem of, also cement resistor is required to minimize in recent years, in order to realize
Miniaturization must improve radiating efficiency.
Therefore, the present invention is made in view of the problems of the prior art point, and it is an object of the present invention to provide can be inexpensive and scattered
The cement resistor of thermal efficiency highland miniaturization.
In order to reach the purpose, the feature of cement resistor of the invention are as follows: have and be printed with thick-film resistor in inner face
Porcelain shell, filled with cement and being allowed to solidify in the porcelain shell in a manner of covering the thick-film resistor.
It according to the present invention, can be by the heat of thick-film resistor generation because the inner face in porcelain shell is printed with thick-film resistor
Directly via the outside of porcelain shell guiding porcelain shell, can efficiently radiate.Thereby, it is possible to provide low cost and high small of radiating efficiency
The cement resistor of type.
In the cement resistor, in a manner of can including one of frame member and opening to occlude the frame member
The substrate of the opening is installed on to constitute the porcelain shell, and before the substrate is installed on the frame member, by the thick film
Resistance is printed in the one side of the substrate.Thereby, it is possible to be easy to carry out the printing of thick-film resistor, and magnetic shell is simply assembled.
In the cement resistor, the thermal diffusion plate for being connected to the outer surface of the porcelain shell can be set.Thereby, it is possible into
One step improves radiating efficiency.
Further, it is possible to make the thermal diffusion plate be connected to the substrate the face for being printed with thick-film resistor opposite side face,
Radiating efficiency is further increased close to the face of thick-film resistor by enabling thermal diffusion plate to be connected to.
In the cement resistor, it can be arranged and cooperate with the porcelain shell come the support clamped to the thermal diffusion plate
Frame makes the outer surface of the porcelain shell and the thermal diffusion plate face contact, and presses the bracket to the thermal diffusion plate to make the heat
Diffuser plate and the bracket face contact.Thereby, it is possible to fully ensure the contact area of the outer surface of porcelain shell and thermal diffusion plate and heat
The contact area of diffuser plate and bracket can further increase radiating efficiency.
Such as with Shangdi, in accordance with the invention it is possible to provide the cement resistor of energy low cost and the miniaturization of radiating efficiency highland.
Detailed description of the invention
Fig. 1 is the figure for indicating an embodiment of cement resistor of the present invention, and (a) is the shape indicated before assembling
The perspective view of state, (b) be indicate assembling after and cement seal before state perspective view.
Fig. 2 is the figure of the state after indicating the assembling of the cement resistor of Fig. 1 and before cement seal, and (a) is main view,
(b) it is left side view, is (c) right side view.
Fig. 3 is the perspective view for indicating an example of existing cement resistor.
Fig. 4 is the diagrammatic cross-sectional view being illustrated for the work of the cement resistor to Fig. 3.
Specific embodiment
Fig. 1 and Fig. 2 indicates that cement resistor of the present invention is (following to be suitably referred to as " resistor ".) one implementation
Mode, the resistor 1 are included in inner face and are printed with the porcelain shell 2 of thick-film resistor (thick-film paste) 4, the bottom surface that is connected to porcelain shell 2
Thermal diffusion plate 5 cooperates with porcelain shell 2 and (does not scheme come the bracket 6 clamped to thermal diffusion plate 5 and the cement being sealed to porcelain shell 2
Show) etc. and constitute.
The structure including the flat substrate 2b that the opening ground of frame member 2a and occlusion frame member 2a is installed of porcelain shell 2
At.In the top surface of substrate 2b, thick-film resistor 4 is printed.When printing thick-film resistor 4, because must be in the table of flat component
Face is printed, so printing thick-film resistor in the top surface of substrate 2b before engaging to substrate 2b and frame member 2a
4。
Thermal diffusion plate 5 is used to promote the heat dissipation of the heat of the generation of thick-film resistor 4 and is arranged, and closes comprising aluminium, aluminium alloy, copper or copper
The metal of the high plate of the pyroconductivity of gold etc. and formed, including be connected to substrate 2b bottom surface base portion 5a and be formed with installation
The mounting portion 5c of hole 5b and constitute.
Bracket 6 clamps thermal diffusion plate 5 and makes the bendings such as iron to be formed for cooperating with porcelain shell 2, has and is formed
There is the mounting portion 6c of mounting hole 6b, and has base plate 6a, around the sidewall portion 6d of porcelain shell 2 and thermal diffusion plate 5 and in sidewall portion
The claw 6e of top surface multiple, that porcelain shell 2 is fixed on for caulk is arranged in the upper end of 6d.
When assembling the resistor 1, first with the bonding agent of glass etc. to the porcelain shell 2 for being printed with thick-film resistor 4
Substrate 2b is engaged with frame member 2a, and makes 5 face contact of thermal diffusion plate in the bottom surface of substrate 2b, makes thermal diffusion plate 5 and support
Bracket 6 is pressed to thermal diffusion plate 5 and fixes claw 6e in the top surface caulk of the frame member 2a of porcelain shell 2 by 6 face contact of frame.
Next, covering 4 ground of thick-film resistor on the substrate 2b of porcelain shell 2 in porcelain in the state of being shown in Fig. 1 (b) and Fig. 2
It filling concrete (not shown) and is allowed to be solidified to form resistor 1 in shell 2.It in the cement, can use: comprising sand shape or powder
The heat-resistant insulation material of quartz, zirconium dioxide, aluminium oxide, the mica of shape etc. is principal component, a small amount of splicing comprising silicone resin etc.
High temperature insulation filler of material etc..
From porcelain shell 2, exports and be connected to 2 cords 7 (7A, 7B) of thick-film resistor 4 in inside.
When using the resistor 1 with the composition, screw element (not shown) is made to be inserted through the mounting hole of thermal diffusion plate 5
The mounting hole 6b of 5b, bracket 6, clamp screw in the state of making the bottom surface of bracket 6 be connected to mounting object object therefrom will
Resistor 1 is mounted as a whole on mounting object object.The hot base portion 5a along thermal diffusion plate 5 of the generation of thick-film resistor 4, installation as a result,
Portion 5c, screw element conduct and are dispersed into mounting object object, and pass along the base portion 5a of thermal diffusion plate 5, base plate 6a of bracket 6 etc.
It leads and is dispersed into mounting object object, thus radiating efficiency improves, and resistor 1 can be made to minimize.
In addition, the shape and/or structure of the bracket 6 in present embodiment are not limited to the content and can use each
Kind shape etc., can also adopt in various manners to the installation method of porcelain shell 2.
The explanation of symbol
1 resistor
2 porcelain shells
2a frame member
2b substrate
4 thick-film resistors
5 thermal diffusion plates
5a base portion
5b mounting hole
5c mounting portion
6 brackets
6a base plate
6b mounting hole
6c mounting portion
6d sidewall portion
6e claw
7 (7A, 7B) cords
Claims (1)
1. a kind of cement resistor, which is characterized in that have:
Porcelain shell comprising the substrate of the opening is installed in a manner of one of frame member and the opening to occlude the frame member,
It is printed with thick-film resistor on one side in the substrate；
Cement is filled and is solidified in the porcelain shell in a manner of covering the thick-film resistor；
Thermal diffusion plate is connected to the face of the opposite side in the face for being printed with the thick-film resistor of the substrate；
Bracket surrounds the porcelain shell and the thermal diffusion plate, is carried out by cooperating with the porcelain shell to the thermal diffusion plate
Clamping makes outer surface and the thermal diffusion plate face contact, and the thermal diffusion plate face contact of the porcelain shell, and bottom surface is connected to
The mounting object object of the cement resistor, and there is the claw for the top surface that the porcelain shell is fixed on for caulk；And
Screw element, via each mounting hole for being inserted through the thermal diffusion plate and the bracket, by the thermal diffusion plate and
The bracket is connected to the mounting object object of the cement resistor together；
The heat that the thick-film resistor generates is dissipated via the porcelain shell, the thermal diffusion plate, the bracket and the screw element
It is dealt into the mounting object object of the cement resistor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-163324 | 2014-08-11 | ||
| JP2014163324A JP6420588B2 (en) | 2014-08-11 | 2014-08-11 | Cement resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105374479A CN105374479A (en) | 2016-03-02 |
| CN105374479B true CN105374479B (en) | 2019-05-07 |
Family
ID=55376588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510477645.9A Active CN105374479B (en) | 2014-08-11 | 2015-08-06 | Cement resistor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6420588B2 (en) |
| CN (1) | CN105374479B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6827749B2 (en) * | 2016-09-23 | 2021-02-10 | Koa株式会社 | Encapsulant |
| JP7309323B2 (en) * | 2018-03-13 | 2023-07-18 | ミクロン電気株式会社 | cement resistor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4881351U (en) * | 1971-12-31 | 1973-10-04 | ||
| JPH0329288A (en) * | 1989-06-26 | 1991-02-07 | Matsushita Electric Ind Co Ltd | Fixed resistor |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4711329U (en) * | 1971-03-08 | 1972-10-11 | ||
| US3955169A (en) * | 1974-11-08 | 1976-05-04 | The United States Of America As Represented By The Secretary Of The Air Force | High power resistor |
| JPS5544322Y2 (en) * | 1976-08-11 | 1980-10-17 | ||
| US5481241A (en) * | 1993-11-12 | 1996-01-02 | Caddock Electronics, Inc. | Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal heat sink |
| JPH09320804A (en) * | 1996-05-29 | 1997-12-12 | Micron Denki Kk | Resistor for at-solenoid valve current-limitating for automobile |
| JP2007201183A (en) * | 2006-01-26 | 2007-08-09 | Denso Corp | Mounting structure of power resistor |
| CN201315203Y (en) * | 2008-12-22 | 2009-09-23 | 东莞市晴远电子有限公司 | Novel ceramic resistor |
-
2014
- 2014-08-11 JP JP2014163324A patent/JP6420588B2/en active Active
-
2015
- 2015-08-06 CN CN201510477645.9A patent/CN105374479B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4881351U (en) * | 1971-12-31 | 1973-10-04 | ||
| JPH0329288A (en) * | 1989-06-26 | 1991-02-07 | Matsushita Electric Ind Co Ltd | Fixed resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6420588B2 (en) | 2018-11-07 |
| CN105374479A (en) | 2016-03-02 |
| JP2016039333A (en) | 2016-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6265693B2 (en) | Semiconductor device and manufacturing method thereof | |
| CN104994713B (en) | The radiator structure and mobile terminal of a kind of mobile terminal | |
| JP5379816B2 (en) | Power semiconductor device | |
| JP2013219267A (en) | Power module | |
| CN106847781B (en) | Power module package and its manufacturing method | |
| CN106104779A (en) | Power semiconductor apparatus | |
| TW201332066A (en) | Semiconductor device and method for manufacturing the same | |
| JP2010186931A (en) | Power semiconductor device | |
| WO2014155977A1 (en) | Heat dissipating sheet and heat dissipating structural body using same | |
| CN105374479B (en) | Cement resistor | |
| US20160268154A1 (en) | Insulating substrate and semiconductor device | |
| JP2016072354A (en) | Power module | |
| JP2008198921A (en) | Module component and manufacturing method | |
| JP5898575B2 (en) | Semiconductor device | |
| JP6420590B2 (en) | Cement resistor | |
| JP2016157835A (en) | Power module and power module manufacturing method | |
| CN211047616U (en) | Motorcycle voltage regulator | |
| JP3124624U (en) | Terminal box for solar panel | |
| TWM451518U (en) | Heat dissipating device | |
| JP5346866B2 (en) | Magnetic substrate and electronic circuit module | |
| JP2009016380A (en) | Semiconductor apparatus and manufacturing method thereof | |
| JP2006319084A (en) | Semiconductor device | |
| JP6339413B2 (en) | heater | |
| JP6338359B2 (en) | Cement resistor | |
| CN210291784U (en) | LED cabinet lamp power supply shell with bottom enhanced heat dissipation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |