CN105365061A - Precise cutting instrument for sapphires - Google Patents
Precise cutting instrument for sapphires Download PDFInfo
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- CN105365061A CN105365061A CN201510792689.0A CN201510792689A CN105365061A CN 105365061 A CN105365061 A CN 105365061A CN 201510792689 A CN201510792689 A CN 201510792689A CN 105365061 A CN105365061 A CN 105365061A
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- pressure water
- water pipe
- cutter head
- laser marking
- sapphires
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Abstract
The invention discloses a precise cutting instrument for sapphires. The precise cutting instrument comprises a machining platform, a laser marking device, a cutting tool bit, a high-pressure water pipe and a high-pressure water generator. A supporting cross beam is horizontally arranged over the machining platform, the laser marking device is connected to the supporting cross beam, and the cutting tool bit is connected to the high-pressure water pipe; the high-pressure water pipe is connected to the supporting cross beam and in parallel to the laser marking device, and the high-pressure water generator is connected with the cutting tool bit through the high-pressure water pipe; the high-pressure water generator is connected with a machining platform numerical control servo part, and the laser marking device is connected with a computer. In this way, the mode that laser marking and high-pressure water cutting are matched is adopted by the precise cutting instrument for the sapphires, laser grooving and scribing are fine, lines can reach the millimeter dimension to the micron dimension, the precise cutting instrument is efficient, environmentally friendly and free of pollution, and the cutting precision of the sapphires is improved; the computer and automatic control are adopted, the machining efficiency is high, and the finished product percent of pass is high.
Description
Technical field
The present invention relates to technical field of sapphire treatment, particularly relate to a kind of sapphire fine cut instrument.
Background technology
Sapphire crystal chemical property is highly stable, generally water insoluble, acid and alkali, caustic corrosion, and sapphire crystal hardness is very high, is Mohs' hardness 9 grades, is only second to the hardest diamond.It has good light transmission, heat conductivity and electric insulating quality, mechanics good mechanical property, and has wear-resisting and weather-proof feature.The fusing point of sapphire crystal is 2050 DEG C, and boiling point 3500 DEG C, maximum operating temperature can reach 1900 DEG C.Therefore, sapphire, as a kind of important technology crystal, has been widely used in many fields of science and technology, national defence and civilian industry.
In existing sapphire cutting technique, be difficult to the precision controlling cutting, cutting efficiency is low, cuts not meticulous.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of sapphire fine cut instrument, can adopt the matching model of laser marking and high-pressure water cutting, laser grooving and scribing is meticulous, and lines can reach millimeter to micron dimension, high-efficiency environment friendly is pollution-free, improves sapphire cutting accuracy.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of sapphire fine cut instrument, it is characterized in that, comprise: processing platform, laser marker, cutter head, high-pressure water pipe, water under high pressure generator, a supporting traverse has been horizontally disposed with directly over described processing platform, described laser marker is connected on supporting traverse, described cutter head is connected in described high-pressure water pipe, high-pressure water pipe is connected on described supporting traverse, be arranged in parallel with described laser marker, described water under high pressure generator is connected with described cutter head by high-pressure water pipe, wherein, water under high pressure generator is connected with processing platform numerical control servo, laser marker is connected with computer.
In a preferred embodiment of the present invention, described cutter head is the conical structure that diamond material is made.
In a preferred embodiment of the present invention, the nozzle diameter of described cutter head is 0.05mm.
In a preferred embodiment of the present invention, described cutter head is provided with a control valve.
In a preferred embodiment of the present invention, described water under high pressure generator is connected to water tank.
The invention has the beneficial effects as follows: sapphire fine cut instrument provided by the invention adopts the matching model of laser marking and high-pressure water cutting, laser grooving and scribing is meticulous, lines can reach millimeter to micron dimension, high-efficiency environment friendly is pollution-free, improve sapphire cutting accuracy, computer and Automated condtrol, process efficiency is high, and product qualified rate is high.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a kind of sapphire fine cut instrument one of the present invention preferred embodiment;
In accompanying drawing, the mark of each parts is as follows: 1-processing platform, 2-laser marker, 3-cutter head, 4-high-pressure water pipe, 5-water under high pressure generator, 6-supporting traverse, 7-computer, 8-control valve.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of sapphire fine cut instrument, it is characterized in that, comprise: processing platform 1, laser marker 2, cutter head 3, high-pressure water pipe 4, water under high pressure generator 5, a supporting traverse 6 has been horizontally disposed with directly over described processing platform 1, described laser marker 2 is connected on supporting traverse 6, described cutter head 3 is connected in described high-pressure water pipe 4, high-pressure water pipe 4 is connected on described supporting traverse 6, be arranged in parallel with described laser marker 2, described water under high pressure generator 5 is connected with described cutter head 3 by high-pressure water pipe 4, wherein, described laser marker 2 is connected with computer 7.
Laser marker 2 can get the various marks that computer 7 can identify, lines are precisely meticulous, and lines can reach millimeter to micron dimension, ensure that precision during cutting.
The conical structure that described cutter head 3 is made for diamond material, can bear high pressure.
The nozzle diameter of described cutter head 3 is 0.05mm, can bear the pressure of 1700 MPas.
Described cutter head 3 is provided with a control valve 8, the keying being carried out control valve 8 by digital control servo system is controlled, and improves control efficiency.
Described water under high pressure generator 5 is connected to water tank.
Sapphire fine cut instrument provided by the invention adopts the matching model of laser marking and high-pressure water cutting, laser grooving and scribing is meticulous, lines can reach millimeter to micron dimension, high-efficiency environment friendly is pollution-free, improve sapphire cutting accuracy, computer and Automated condtrol, process efficiency is high, and product qualified rate is high.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. a sapphire fine cut instrument, it is characterized in that, comprise: processing platform, laser marker, cutter head, high-pressure water pipe, water under high pressure generator, a supporting traverse has been horizontally disposed with directly over described processing platform, described laser marker is connected on supporting traverse, described cutter head is connected in described high-pressure water pipe, high-pressure water pipe is connected on described supporting traverse, be arranged in parallel with described laser marker, described water under high pressure generator is connected with described cutter head by high-pressure water pipe, wherein, water under high pressure generator is connected with processing platform numerical control servo, laser marker is connected with computer.
2. sapphire fine cut instrument according to claim 1, is characterized in that, described cutter head is the conical structure that diamond material is made.
3. sapphire fine cut instrument according to claim 1, is characterized in that, the nozzle diameter of described cutter head is 0.05mm.
4. sapphire fine cut instrument according to claim 1, is characterized in that, described cutter head is provided with a control valve.
5. sapphire fine cut instrument according to claim 1, is characterized in that, described water under high pressure generator is connected to water tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510792689.0A CN105365061A (en) | 2015-11-18 | 2015-11-18 | Precise cutting instrument for sapphires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510792689.0A CN105365061A (en) | 2015-11-18 | 2015-11-18 | Precise cutting instrument for sapphires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105365061A true CN105365061A (en) | 2016-03-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510792689.0A Pending CN105365061A (en) | 2015-11-18 | 2015-11-18 | Precise cutting instrument for sapphires |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105365061A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195332A (en) * | 2018-10-13 | 2019-01-11 | 芜湖市传世信息技术有限公司 | A kind of electronic product productive power road plate cutter device |
| CN114179239A (en) * | 2021-12-20 | 2022-03-15 | 浙江瑞度新材料科技有限公司 | Machining device for special cutting line for sapphire |
| CN114227260A (en) * | 2022-01-14 | 2022-03-25 | 金当量能源科技(山东)有限公司 | Laser high-pressure water-rocket crusher and working method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
| JP2006043713A (en) * | 2004-07-30 | 2006-02-16 | Hamamatsu Photonics Kk | Laser beam machining method |
| CN101104239A (en) * | 2007-07-30 | 2008-01-16 | 国营武昌造船厂 | Numerically controlled cutting control device and numerically controlled cutting control method |
| CN101134265A (en) * | 2000-09-13 | 2008-03-05 | 浜松光子学株式会社 | Laser processing method and method of cutting semiconductor material substrate |
| CN104552639A (en) * | 2014-12-18 | 2015-04-29 | 无锡科诺达电子有限公司 | Dust removal device of sapphire processing system |
| CN204414388U (en) * | 2014-12-18 | 2015-06-24 | 无锡科诺达电子有限公司 | Sapphire cutter sweep |
| CN205255298U (en) * | 2015-11-18 | 2016-05-25 | 无锡科诺达电子有限公司 | Meticulous cutting appearance of sapphire |
-
2015
- 2015-11-18 CN CN201510792689.0A patent/CN105365061A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
| CN101134265A (en) * | 2000-09-13 | 2008-03-05 | 浜松光子学株式会社 | Laser processing method and method of cutting semiconductor material substrate |
| JP2006043713A (en) * | 2004-07-30 | 2006-02-16 | Hamamatsu Photonics Kk | Laser beam machining method |
| CN101104239A (en) * | 2007-07-30 | 2008-01-16 | 国营武昌造船厂 | Numerically controlled cutting control device and numerically controlled cutting control method |
| CN104552639A (en) * | 2014-12-18 | 2015-04-29 | 无锡科诺达电子有限公司 | Dust removal device of sapphire processing system |
| CN204414388U (en) * | 2014-12-18 | 2015-06-24 | 无锡科诺达电子有限公司 | Sapphire cutter sweep |
| CN205255298U (en) * | 2015-11-18 | 2016-05-25 | 无锡科诺达电子有限公司 | Meticulous cutting appearance of sapphire |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195332A (en) * | 2018-10-13 | 2019-01-11 | 芜湖市传世信息技术有限公司 | A kind of electronic product productive power road plate cutter device |
| CN114179239A (en) * | 2021-12-20 | 2022-03-15 | 浙江瑞度新材料科技有限公司 | Machining device for special cutting line for sapphire |
| CN114227260A (en) * | 2022-01-14 | 2022-03-25 | 金当量能源科技(山东)有限公司 | Laser high-pressure water-rocket crusher and working method thereof |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160302 |
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| WD01 | Invention patent application deemed withdrawn after publication |