CN105355408B - A kind of manufacture method of embossing surface attachment inductance - Google Patents
A kind of manufacture method of embossing surface attachment inductance Download PDFInfo
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- CN105355408B CN105355408B CN201510793803.1A CN201510793803A CN105355408B CN 105355408 B CN105355408 B CN 105355408B CN 201510793803 A CN201510793803 A CN 201510793803A CN 105355408 B CN105355408 B CN 105355408B
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Abstract
The invention discloses a kind of manufacture method of embossing surface attachment inductance, this method prepares air core coil and base first, and base includes pedestal and is arranged on N number of boss on pedestal and into array spacings arrangement or N number of groove, and N is the integer more than or equal to 2；Then N number of air core coil is corresponded to be enclosed on N number of outside the boss or correspond N number of air core coil and be placed within N number of groove, obtain the assembly of N number of coil and base, now the assembly of N number of coil and base is placed within the die cavity of mould again and carries out cold pressing and hot-forming successively, then is cut to obtain after inductance body at inductance body both ends using end silver process formation termination electrode by the array that inductance parent blank is lined up according to N number of air core coil；Advantage is to be molded more inductor combinations together, and die size increases exponentially, and can reduce mould difficulty of processing, and extends the mold use life-span and improve the manufacture efficiency of inductor product, and percent defective is relatively low, and production cost is relatively low.
Description
Technical field
The present invention relates to a kind of manufacture method of surface mount inductance, and inductance is mounted more particularly, to a kind of embossing surface
Manufacture method.
Background technology
Inductance is one of three big passive device of electronic circuit, primarily serves filtering, vibration, delay, trap, sieve in circuit
Signal is selected, cross noise filtering, stabling current and suppresses the effect such as Electromagnetic Interference.With the fast development of electronics technology, it is particularly
The quick popularization of mobile class consumer electronics terminal, inductance component is to miniaturization, lightening, high frequency, high current, high efficiency, low
The directions such as EMI are developed.At present, inductance component is divided into three classes according to its manufacturing process difference：Wire-wound inductor, laminated inductance and molding
Inductance.Wire-wound inductor first manufactures magnetic core because needing, then the coiling on magnetic core, has certain process limitation, existing
Technology under hardly consistent with small light and thin requirement, and its magnetic core material is ferrite, and saturation induction density Bs only has 0.7 special
Si La, inductance are easily saturated, and are not suitable for high current.Laminated inductance is by being printed on coil inside magnetic core, then burning in advance
Knot forms, and can meet the requirement of small-sized light thinning, but because the coil line footpath of printing is limited, does not fit through high current, and
Its magnetic core material is also ferrite, and its saturation induction density Bs is limited, and inductance has the defects of being easily saturated.It is first to be molded inductance
Prefabricated coil, then coil is placed in compressing in Magnaglo and forms magnetic core, thus coil is directly embedded to inside magnetic core, is fitted
Miniaturization is closed, and magnetic core is internally formed closed magnetic circuit, Magnetic Shielding Effectiveness is outstanding, and Magnaglo generally selects carbonyl iron dust and iron silicon
The high Bs materials such as chromium, inductance are not easy saturation, therefore are molded the main trend that inductance is the development of power-type inductance.
Patent No. CN202183292U Chinese invention patent discloses a kind of manufacture method for being molded inductance, the manufacture
Method is to be molded the general manufacture method of inductance at present, in the manufacture method, is first welded on prefabricated coil and binding post
Together, then by the prefabricated coil after welding and binding post it is placed in mould, inserts magnetic and be pressed into inductance under a certain pressure
Green compact, finally again through Overheating Treatment, cut the process such as pin and whole pin formed finished product inductance.The manufacture method manufacture of above-mentioned molding inductance
Size has certain advantage, but because the presence for having binding post causes its miniaturization difficult in 2520 specification above inductance
Degree increase, particularly when coil and binding post size all very littles, it welds positioning precision and welding difficulty is very big, at present only
2016 specifications can be accomplished.This problem is minimized in order to solve inductance, and patentee is Japanese Dong Kwang Co., Ltd, Publication No.
The manufacture method of another molding inductance is disclosed in CN103295754A Chinese patent, this method eliminates binding post,
Prefabricated coil is directly installed on prefabricated magnetic core, then fills out powder compacting, form inductance green compact, then through Overheating Treatment and electrode
The process shaping finished product inductance such as shaping.Although the above method solves the problems, such as inductance miniaturization well, in preformed core
On meet difficulty, when inductor size very little (specification is below 2016), the size of preformed core also very little is right in assembling
Seriously affect production efficiency in the arrangement arrangement of magnetic core, and magnetic core intensity is very low, is easily broken, thus cause percent defective compared with
Height, production cost are significantly increased.
The content of the invention
It is high that the technical problems to be solved by the invention are to provide a kind of production efficiency, and percent defective is relatively low, production cost compared with
The manufacture method of low embossing surface attachment inductance.
Technical scheme is used by the present invention solves above-mentioned technical problem：A kind of manufacturer of embossing surface attachment inductance
Method, comprise the following steps：
1. according to design specification, the enamel-covered wire with self-adhesive layer is coiled into air core coil of the both ends with lead；
2. using magnetic manufacture base, described base includes pedestal and is arranged on described pedestal and into array spacings
The N number of boss or N number of groove of arrangement, N are the integer more than or equal to 2；
3. assemble air core coil and base：N number of air core coil is corresponded and is enclosed on N number of outside the boss or will be N number of hollow
Coil is corresponded and is placed within N number of groove, obtains the assembly of N number of air core coil and base, N number of air core coil and base
N number of air core coil also arranges into array-like in assembly, has a segment distance between two neighboring air core coil；
4. the assembly of N number of air core coil and base is placed within the die cavity of cold stamping die, magnetic is inserted into die cavity
After carry out cold pressing treatment, obtain inductance parent just base；
Hot-pressing processing and pressurize processing are carried out successively 5. base at the beginning of inductance parent is transferred in hot pressing die, obtain inductance mother
Body green compact；
6. inductance parent green compact are heat-treated, inductance parent blank is obtained；
7. the array that inductance parent blank is lined up according to N number of air core coil is cut, N number of built-in air core coil is obtained
Inductance body, the lead at air core coil both ends is exposed in each inductance body；
8. termination electrode, termination electrode and the inductance body at inductance body both ends are formed using end silver process at inductance body both ends
The exposed lead in both ends corresponds conducting；
9. in the uniform application anti-corrosive insulation layer in other positions of inductance body in addition to position where termination electrode.
The particle diameter of described magnetic is 65~250 microns, and described magnetic is soft between 1 micron~50 microns by particle diameter
Magnetic material powder is prepared, and described soft magnetic powder is carbonyl iron powder, pure iron powder, iron Si powder, iron silicochromium powder
End, iron nickel by powder, iron nickel molybdenum powder, iron sial powder, iron-based amorphous powder and one kind in iron based nano crystal powder or at least
Two kinds of mixture.
The preparation process of described magnetic is：
A. soft magnetic powder is weighed, the quality of soft magnetic powder is designated as M, unit is gram；
B. the chemical pure phosphoric acid that quality is (0.1%~2.5%) * M gram and quality is (2%~20%) * M gram third is weighed
Ketone, chemical pure phosphoric acid and acetone are mixed and stirred for uniformly, obtaining to the mixture of chemical pure phosphoric acid and acetone；
C. the mixture of chemical pure phosphoric acid and acetone is added into stirring in soft magnetic powder and, to drying, obtains the first powder
Mixture；
D. the epoxy resin that quality is (0.5%~5%) * M gram and quality is (2%~20%) * M gram third is weighed again
Ketone, epoxy resin and acetone are mixed and stirred for uniformly, obtaining to the mixture of epoxy resin and acetone；
E. the mixture of epoxy resin and acetone is added in the first mixture of powders and stirred, obtained the second powder and mix
Compound；
F. the second mixture of powders is granulated using Granulation Equipments, obtains the magnetic half that particle diameter is 65~250 microns
Finished product；
G. magnetic semi-finished product are subjected to drying and processing, drying and processing temperature is 80 DEG C~120 DEG C, and the time is 1 hour；
H. it is (0.5%~3.0%) * M gram to weigh quality, zinc stearate powder of the particle diameter below 5 microns, by stearic acid
Stirred 1 hour in the magnetic semi-finished product that zinc powder is added after drying, obtain magnetic finished product.In this method, magnetic has saturation magnetic
The features such as sense is big, magnetic conductivity is high, insulation effect is good and mobility is good, the molding inductance prepared using it as raw material have using frequency
Rate is high, operating current is big, caloric value and the low advantage of loss.
Described air core coil is formed using Alpha's mode coiling, and the inner ring of described air core coil is circular or oval
Shape, the lead at described air core coil both ends and its angle drawn between end face are 15 °~135 °.It is hollow in this method
Two leads of coil are drawn on the outside of coil, on the premise of the same number of turn of coiling, can reduce coil height, and then drop
The height of low molding inductance, and when coil lead and when to draw the angle that is formed between end face be acute angle or obtuse angle, after cutting its
Sectional area will increase, and then increase the contact area of lead and follow-up termination electrode, so as to reduce the D.C. resistance of molding inductance.
When the inner ring of described air core coil is circle, described base include pedestal and be arranged on described pedestal and
Into array spacings arrangement N number of boss when, described boss is that cross section is circular cylinder, and the height of described boss is
0.2 times of described air core coil axial height~1.2 times, the internal diameter of a diameter of described air core coil of described boss
0.6~0.95 times；When the inner ring of described air core coil is ellipse, described base includes pedestal and is arranged on described base
On seat and into array spacings arrangement N number of boss when, described boss be cross section be ellipse cylindricality, described boss
It is highly 0.2 times~1.2 times of described air core coil axial height, a diameter of described air core coil of length of described boss
0.6~0.95 times of long internal diameter, the 0.6~0.95 of the short internal diameter of short a diameter of described air core coil of described boss
Times；When the inner ring of described air core coil is circle, described base includes pedestal and is arranged on described pedestal and Cheng Zhen
When arranging spaced N number of groove, described groove is that cross section is circular cylinder shape groove, described groove it is a diameter of
1.05~1.5 times of the external diameter of described air core coil；When the inner ring of described air core coil is oval, described base bag
Include pedestal and be arranged on described pedestal and into array spacings arrangement N number of groove when, described groove is that cross section is ellipse
Circular cylindrical groove, it is 1.05~1.5 times of the long external diameter of a diameter of described air core coil of length of described groove, described
1.05~1.5 times of the short external diameter of short a diameter of described air core coil of groove.In this method, by advance comprising boss,
The density of increase molding inductance coil internal core rod, improve the inductance value of molding inductance；Elliptical coil increases coil inside plug
Area, improve molding inductance inductance value.
The sticking temperature of the self-adhesive layer of described enamel-covered wire is 80 DEG C~220 DEG C, and the temperature resistant grade of described enamel-covered wire is
155 DEG C~255 DEG C.
The temperature of described cold pressing treatment is not higher than 50 DEG C, and the temperature of described hot-pressing processing is 80 DEG C~250 DEG C, described
Pressurize processing time be 10 seconds~300 seconds, the temperature of described heat treatment is 150 DEG C~250 DEG C, described heat treatment time
For 30 minutes~300 minutes.In this method, magnetic has certain mobility and good compressibility at 80~250 DEG C, then
Green density can be increased by applying certain pressure, and then is played the adhesion of magnet in enhancing molding inductance and improved molding electricity
The effect of the inductance value of sense.
Described cutting mode is wire cutting mode or blade cutting mode, air core coil both ends in each inductance body
Lead directly make its exposed by cutting mode or make its exposed by lapping mode after dicing.Which can improve
Inductance manufacture efficiency and product qualification rate are molded, reduces manufacturing cost.
Compared with prior art, the advantage of the invention is that preparing air core coil first and using magnetic manufacture base, bottom
Seat includes pedestal and is arranged on N number of boss on pedestal and into array spacings arrangement or N number of groove, and N is whole more than or equal to 2
Number；Then N number of air core coil is corresponded to be enclosed on N number of outside the boss or correspond N number of air core coil and is placed in N number of groove
Within, the assembly of N number of air core coil and base is obtained, the assembly of N number of air core coil and base is now placed in mould again
Die cavity within carry out successively cold pressing and it is hot-forming, thus in base at the beginning of inductance parent and inductance parent green compact forming process,
More inductor combinations are molded together, now mould cavity size increases exponentially, and product is in shaping, die cavity and upper low punch
Size will increase exponentially, mould difficulty of processing can be reduced, and extend the mold use life-span and improve inductor product system
Efficiency is made, and percent defective is relatively low, production cost is relatively low.
Brief description of the drawings
Fig. 1 is the structure chart for the air core coil that the embossing surface of the present invention mounts the manufacture method of inductance；
Fig. 2 is the structure chart for the base that the embossing surface of the present invention mounts the manufacture method of inductance；
Fig. 3 is the structure that the embossing surface of the present invention mounts the air core coil of the manufacture method of inductance and the assembly of base
Figure；
Fig. 4 is that the assembly loading of air core coil and base that the embossing surface of the present invention mounts the manufacture method of inductance is cold
Sectional view in compression mould；
Fig. 5 is sectional views of the Fig. 4 along A-A directions；
Fig. 6 is that the assembly loading of air core coil and base that the embossing surface of the present invention mounts the manufacture method of inductance is cold
The state diagram of magnetic is inserted after in compression mould；
Fig. 7 is that the embossing surface of the present invention mounts the schematic diagram that inductance parent green compact are prepared in the manufacture method of inductance；
Fig. 8 is cutting technique schematic diagram in the manufacture method of the embossing surface attachment inductance of the present invention；
Fig. 9 be the present invention embossing surface mount inductance manufacture method in inductance body structure chart；
Figure 10 mounts the structure chart of inductance for embossing surface in the manufacture method of the embossing surface attachment inductance of the present invention.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing embodiment.
Embodiment one：As illustrated, a kind of manufacture method of embossing surface attachment inductance, comprises the following steps：
1. according to design specification, the enamel-covered wire with self-adhesive layer is coiled into air core coil 1 of the both ends with lead 11；Enamel-cover
The sticking temperature of the self-adhesive layer of line is 80 DEG C~220 DEG C, and the temperature resistant grade of enamel-covered wire is 155 DEG C~255 DEG C.
2. using magnetic manufacture base, base includes pedestal 2 and setting on the base 2 and arranged into array spacings N number of
Boss 3 or N number of groove, N are the integer more than or equal to 2；
3. assemble air core coil 1 and base：N number of air core coil 1 is corresponded and is enclosed on the outside of N number of boss 3 or by N number of sky
Wire-core coil 1 is corresponded and is placed within N number of groove, obtains the assembly of N number of air core coil 1 and base, N number of air core coil 1 and
N number of air core coil 1 also arranges into array-like in the assembly of base, has a segment distance between two neighboring air core coil 1；
4. the assembly of N number of air core coil 1 and base is placed within the die cavity 4 of cold stamping die, magnetic is inserted into die cavity
Cold pressing treatment is carried out after powder 5, obtains inductance parent just base, the temperature of cold pressing treatment is not higher than 50 DEG C；
Hot-pressing processing and pressurize processing are carried out successively 5. base at the beginning of inductance parent is transferred in hot pressing die, obtain inductance mother
Body green compact, the temperature of hot-pressing processing is 80 DEG C~250 DEG C, and pressurize processing time is 10 seconds~300 seconds；
6. inductance parent green compact are heat-treated, inductance parent blank 6 is obtained, the temperature of heat treatment is 150 DEG C~250
DEG C, heat treatment time is 30 minutes~300 minutes.
7. the array that inductance parent blank 6 is lined up according to N number of air core coil 1 is cut, N number of built-in tubular wire is obtained
The inductance body 7 of circle 1, the lead 11 at the both ends of air core coil 1 is exposed in each inductance body 7, and cutting mode is wire cutting mode
Or blade cutting mode, the lead 11 at the both ends of air core coil 1 directly makes its exposed by cutting mode in each inductance body 7
Or make its exposed by lapping mode after dicing；
8. termination electrode 8, the termination electrode 8 and inductance at the both ends of inductance body 7 are formed using end silver process at the both ends of inductance body 7
The exposed lead 11 in the both ends of body 7 corresponds conducting；
9. in other positions uniform application anti-corrosive insulation layer of the inductance body 7 in addition to the place position of termination electrode 8, mould is obtained
Press surface mount inductance.
Embodiment two：As illustrated, a kind of manufacture method of embossing surface attachment inductance, comprises the following steps：
1. according to design specification, the enamel-covered wire with self-adhesive layer is coiled into air core coil 1 of the both ends with lead 11；Enamel-cover
The sticking temperature of the self-adhesive layer of line is 80 DEG C~220 DEG C, and the temperature resistant grade of enamel-covered wire is 155 DEG C~255 DEG C.
2. using magnetic manufacture base, base includes pedestal 2 and setting on the base 2 and arranged into array spacings N number of
Boss 3 or N number of groove, N are the integer more than or equal to 2；
3. assemble air core coil 1 and base：N number of air core coil 1 is corresponded and is enclosed on the outside of N number of boss 3 or by N number of sky
Wire-core coil 1 is corresponded and is placed within N number of groove, obtains the assembly of N number of air core coil 1 and base, N number of air core coil 1 and
N number of air core coil 1 also arranges into array-like in the assembly of base, has a segment distance between two neighboring air core coil 1；
4. the assembly of N number of air core coil 1 and base is placed within the die cavity 4 of cold stamping die, magnetic is inserted into die cavity
Cold pressing treatment is carried out after powder 5, obtains inductance parent just base, the temperature of cold pressing treatment is not higher than 50 DEG C；
Hot-pressing processing and pressurize processing are carried out successively 5. base at the beginning of inductance parent is transferred in hot pressing die, obtain inductance mother
Body green compact, the temperature of hot-pressing processing is 80 DEG C~250 DEG C, and pressurize processing time is 10 seconds~300 seconds；
6. inductance parent green compact are heat-treated, inductance parent blank 6 is obtained, the temperature of heat treatment is 150 DEG C~250
DEG C, heat treatment time is 30 minutes~300 minutes.
7. the array that inductance parent blank 6 is lined up according to N number of air core coil 1 is cut, N number of built-in tubular wire is obtained
The inductance body 7 of circle 1, the lead 11 at the both ends of air core coil 1 is exposed in each inductance body 7, and cutting mode is wire cutting mode
Or blade cutting mode, the lead 11 at the both ends of air core coil 1 directly makes its exposed by cutting mode in each inductance body 7
Or make its exposed by lapping mode after dicing；
8. termination electrode 8, the termination electrode 8 and inductance at the both ends of inductance body 7 are formed using end silver process at the both ends of inductance body 7
The exposed lead 11 in the both ends of body 7 corresponds conducting；
9. in other positions uniform application anti-corrosive insulation layer of the inductance body 7 in addition to the place position of termination electrode 8, mould is obtained
Press surface mount inductance.
In the present embodiment, the particle diameter of magnetic is 65~250 microns, and magnetic is soft between 1 micron~50 microns by particle diameter
Magnetic material powder is prepared, and soft magnetic powder is carbonyl iron powder, pure iron powder, iron Si powder, iron silicochromium powder, iron nickel
Powder, iron nickel molybdenum powder, iron sial powder, iron-based amorphous powder and one kind in iron based nano crystal powder or at least two it is mixed
Compound.
Embodiment three：As illustrated, a kind of manufacture method of embossing surface attachment inductance, comprises the following steps：
1. according to design specification, the enamel-covered wire with self-adhesive layer is coiled into air core coil 1 of the both ends with lead 11；Enamel-cover
The sticking temperature of the self-adhesive layer of line is 80 DEG C~220 DEG C, and the temperature resistant grade of enamel-covered wire is 155 DEG C~255 DEG C.
2. using magnetic manufacture base, base includes pedestal 2 and setting on the base 2 and arranged into array spacings N number of
Boss 3 or N number of groove, N are the integer more than or equal to 2；
3. assemble air core coil 1 and base：N number of air core coil 1 is corresponded and is enclosed on the outside of N number of boss 3 or by N number of sky
Wire-core coil 1 is corresponded and is placed within N number of groove, obtains the assembly of N number of air core coil 1 and base, N number of air core coil 1 and
N number of air core coil 1 also arranges into array-like in the assembly of base, has a segment distance between two neighboring air core coil 1；
4. the assembly of N number of air core coil 1 and base is placed within the die cavity 4 of cold stamping die, magnetic is inserted into die cavity
Cold pressing treatment is carried out after powder 5, obtains inductance parent just base, the temperature of cold pressing treatment is not higher than 50 DEG C；
Hot-pressing processing and pressurize processing are carried out successively 5. base at the beginning of inductance parent is transferred in hot pressing die, obtain inductance mother
Body green compact, the temperature of hot-pressing processing is 80 DEG C~250 DEG C, and pressurize processing time is 10 seconds~300 seconds；
6. inductance parent green compact are heat-treated, inductance parent blank 6 is obtained, the temperature of heat treatment is 150 DEG C~250
DEG C, heat treatment time is 30 minutes~300 minutes.
7. the array that inductance parent blank 6 is lined up according to N number of air core coil 1 is cut, N number of built-in tubular wire is obtained
The inductance body 7 of circle 1, the lead 11 at the both ends of air core coil 1 is exposed in each inductance body 7, and cutting mode is wire cutting mode
Or blade cutting mode, the lead 11 at the both ends of air core coil 1 directly makes its exposed by cutting mode in each inductance body 7
Or make its exposed by lapping mode after dicing；
8. termination electrode 8, the termination electrode 8 and inductance at the both ends of inductance body 7 are formed using end silver process at the both ends of inductance body 7
The exposed lead 11 in the both ends of body 7 corresponds conducting；
9. in other positions uniform application anti-corrosive insulation layer of the inductance body 7 in addition to the place position of termination electrode 8, mould is obtained
Press surface mount inductance.
In the present embodiment, the particle diameter of magnetic is 65~250 microns, and magnetic is soft between 1 micron~50 microns by particle diameter
Magnetic material powder is prepared, and soft magnetic powder is carbonyl iron powder, pure iron powder, iron Si powder, iron silicochromium powder, iron nickel
Powder, iron nickel molybdenum powder, iron sial powder, iron-based amorphous powder and one kind in iron based nano crystal powder or at least two it is mixed
Compound.
In the present embodiment, the preparation process of magnetic is：
A. soft magnetic powder is weighed, the quality of soft magnetic powder is designated as M, unit is gram；
B. the chemical pure phosphoric acid that quality is (0.1%~2.5%) * M gram and quality is (2%~20%) * M gram third is weighed
Ketone, chemical pure phosphoric acid and acetone are mixed and stirred for uniformly, obtaining to the mixture of chemical pure phosphoric acid and acetone；
C. the mixture of chemical pure phosphoric acid and acetone is added into stirring in soft magnetic powder and, to drying, obtains the first powder
Mixture；
D. the epoxy resin that quality is (0.5%~5%) * M gram and quality is (2%~20%) * M gram third is weighed again
Ketone, epoxy resin and acetone are mixed and stirred for uniformly, obtaining to the mixture of epoxy resin and acetone；
E. the mixture of epoxy resin and acetone is added in the first mixture of powders and stirred, obtained the second powder and mix
Compound；
F. the second mixture of powders is granulated using Granulation Equipments, obtains the magnetic half that particle diameter is 65~250 microns
Finished product；
G. magnetic semi-finished product are subjected to drying and processing, drying and processing temperature is 80 DEG C~120 DEG C, and the time is 1 hour；
H. it is (0.5%~3.0%) * M gram to weigh quality, zinc stearate powder of the particle diameter below 5 microns, by stearic acid
Stirred 1 hour in the magnetic semi-finished product that zinc powder is added after drying, obtain magnetic finished product.
Example IV：As illustrated, a kind of manufacture method of embossing surface attachment inductance, comprises the following steps：
1. according to design specification, the enamel-covered wire with self-adhesive layer is coiled into air core coil 1 of the both ends with lead 11；Enamel-cover
The sticking temperature of the self-adhesive layer of line is 80 DEG C~220 DEG C, and the temperature resistant grade of enamel-covered wire is 155 DEG C~255 DEG C.
2. using magnetic manufacture base, base includes pedestal 2 and setting on the base 2 and arranged into array spacings N number of
Boss 3 or N number of groove, N are the integer more than or equal to 2；
3. assemble air core coil 1 and base：N number of air core coil 1 is corresponded and is enclosed on the outside of N number of boss 3 or by N number of sky
Wire-core coil 1 is corresponded and is placed within N number of groove, obtains the assembly of N number of air core coil 1 and base, N number of air core coil 1 and
N number of air core coil 1 also arranges into array-like in the assembly of base, has a segment distance between two neighboring air core coil 1；
4. the assembly of N number of air core coil 1 and base is placed within the die cavity 4 of cold stamping die, magnetic is inserted into die cavity
Cold pressing treatment is carried out after powder 5, obtains inductance parent just base, the temperature of cold pressing treatment is not higher than 50 DEG C；
Hot-pressing processing and pressurize processing are carried out successively 5. base at the beginning of inductance parent is transferred in hot pressing die, obtain inductance mother
Body green compact, the temperature of hot-pressing processing is 80 DEG C~250 DEG C, and pressurize processing time is 10 seconds~300 seconds；
6. inductance parent green compact are heat-treated, inductance parent blank 6 is obtained, the temperature of heat treatment is 150 DEG C~250
DEG C, heat treatment time is 30 minutes~300 minutes.
7. the array that inductance parent blank 6 is lined up according to N number of air core coil 1 is cut, N number of built-in tubular wire is obtained
The inductance body 7 of circle 1, the lead 11 at the both ends of air core coil 1 is exposed in each inductance body 7, and cutting mode is wire cutting mode
Or blade cutting mode, the lead 11 at the both ends of air core coil 1 directly makes its exposed by cutting mode in each inductance body 7
Or make its exposed by lapping mode after dicing；
8. termination electrode 8, the termination electrode 8 and inductance at the both ends of inductance body 7 are formed using end silver process at the both ends of inductance body 7
The exposed lead 11 in the both ends of body 7 corresponds conducting；
9. in other positions uniform application anti-corrosive insulation layer of the inductance body 7 in addition to the place position of termination electrode 8, mould is obtained
Press surface mount inductance.
In the present embodiment, air core coil 1 is formed using Alpha's mode coiling, and the inner ring of air core coil 1 is circular or ellipse
Circle, the lead 11 at the both ends of air core coil 1 and its angle drawn between end face are 15 °~135 °.
Embodiment five：As illustrated, a kind of manufacture method of embossing surface attachment inductance, comprises the following steps：
1. according to design specification, the enamel-covered wire with self-adhesive layer is coiled into air core coil 1 of the both ends with lead 11；Enamel-cover
The sticking temperature of the self-adhesive layer of line is 80 DEG C~220 DEG C, and the temperature resistant grade of enamel-covered wire is 155 DEG C~255 DEG C.
2. using magnetic manufacture base, base includes pedestal 2 and setting on the base 2 and arranged into array spacings N number of
Boss 3 or N number of groove, N are the integer more than or equal to 2；
3. assemble air core coil 1 and base：N number of air core coil 1 is corresponded and is enclosed on the outside of N number of boss 3 or by N number of sky
Wire-core coil 1 is corresponded and is placed within N number of groove, obtains the assembly of N number of air core coil 1 and base, N number of air core coil 1 and
N number of air core coil 1 also arranges into array-like in the assembly of base, has a segment distance between two neighboring air core coil 1；
4. the assembly of N number of air core coil 1 and base is placed within the die cavity 4 of cold stamping die, magnetic is inserted into die cavity
Cold pressing treatment is carried out after powder 5, obtains inductance parent just base, the temperature of cold pressing treatment is not higher than 50 DEG C；
Hot-pressing processing and pressurize processing are carried out successively 5. base at the beginning of inductance parent is transferred in hot pressing die, obtain inductance mother
Body green compact, the temperature of hot-pressing processing is 80 DEG C~250 DEG C, and pressurize processing time is 10 seconds~300 seconds；
6. inductance parent green compact are heat-treated, inductance parent blank 6 is obtained, the temperature of heat treatment is 150 DEG C~250
DEG C, heat treatment time is 30 minutes~300 minutes.
7. the array that inductance parent blank 6 is lined up according to N number of air core coil 1 is cut, N number of built-in tubular wire is obtained
The inductance body 7 of circle 1, the lead 11 at the both ends of air core coil 1 is exposed in each inductance body 7, and cutting mode is wire cutting mode
Or blade cutting mode, the lead 11 at the both ends of air core coil 1 directly makes its exposed by cutting mode in each inductance body 7
Or make its exposed by lapping mode after dicing；
8. termination electrode 8, the termination electrode 8 and inductance at the both ends of inductance body 7 are formed using end silver process at the both ends of inductance body 7
The exposed lead 11 in the both ends of body 7 corresponds conducting；
9. in other positions uniform application anti-corrosive insulation layer of the inductance body 7 in addition to the place position of termination electrode 8, mould is obtained
Press surface mount inductance.
In the present embodiment, air core coil 1 is formed using Alpha's mode coiling, and the inner ring of air core coil 1 is circular or ellipse
Circle, the lead 11 at the both ends of air core coil 1 and its angle drawn between end face are 15 °~135 °.
In the present embodiment, when the inner ring of air core coil 1 is circle, base includes pedestal 2 and setting on the base 2 and Cheng Zhen
When arranging spaced N number of boss 3, boss 3 is that cross section is circular cylinder, and the height of boss 3 is the axial direction of air core coil 1
0.2 times of height~1.2 times, 0.6~0.95 times of the internal diameter of a diameter of air core coil 1 of boss 3；When in air core coil 1
Enclose as ellipse, base include pedestal 2 and set on the base 2 and into array spacings arrangement N number of boss 3 when, boss 3 is horizontal stroke
Section is the cylindricality of ellipse, and the height of boss 3 is 0.2 times~1.2 times of the axial height of air core coil 1, the long diameter of boss 3
For 0.6~0.95 times of the long internal diameter of air core coil 1, the 0.6~0.95 of the short internal diameter of short a diameter of air core coil 1 of boss 3
Times；When the inner ring of air core coil 1 is circle, base includes pedestal 2 and setting on the base 2 and arranged into array spacings N number of
During groove, groove is that cross section is circular cylinder shape groove, the 1.05~1.5 of the external diameter of a diameter of air core coil 1 of groove
Times；When the inner ring of air core coil 1 is ellipse, base includes the N that pedestal 2 and setting arrange on the base 2 and into array spacings
During individual groove, groove be cross section be ellipse cylindrical groove, the 1.05 of the long external diameter of a diameter of air core coil 1 of length of groove
~1.5 times, 1.05~1.5 times of the short external diameter of short a diameter of air core coil 1 of groove.
Claims (6)
1. a kind of manufacture method of embossing surface attachment inductance, it is characterised in that including comprising the following steps：
1. according to design specification, the enamel-covered wire with self-adhesive layer is coiled into air core coil of the both ends with lead；
2. using magnetic manufacture base, described base includes pedestal and is arranged on described pedestal and is arranged into array spacings
N number of boss or N number of groove, N be integer more than or equal to 2；
3. assemble air core coil and base：N number of air core coil is corresponded and is enclosed on N number of outside the boss or by N number of air core coil
One-to-one corresponding is placed within N number of groove, obtains the assembly of N number of air core coil and base, the assembling of N number of air core coil and base
N number of air core coil also arranges into array-like in body, has a segment distance between two neighboring air core coil；
4. the assembly of N number of air core coil and base is placed within the die cavity of cold stamping die, it is laggard that magnetic is inserted into die cavity
Row cold pressing treatment, obtain inductance parent just base；
Hot-pressing processing and pressurize processing are carried out successively 5. base at the beginning of inductance parent is transferred in hot pressing die, obtain the life of inductance parent
Base；
6. inductance parent green compact are heat-treated, inductance parent blank is obtained；
7. the array that inductance parent blank is lined up according to N number of air core coil is cut, the electricity of N number of built-in air core coil is obtained
Feel body, the lead at air core coil both ends is exposed in each inductance body；
8. termination electrode, termination electrode and the inductance body both ends at inductance body both ends are formed using end silver process at inductance body both ends
Exposed lead corresponds conducting；
9. in the uniform application anti-corrosive insulation layer in other positions of inductance body in addition to position where termination electrode, embossing surface is obtained
Mount inductance；
Described air core coil is formed using Alpha's mode coiling, and the inner ring of described air core coil is circular or ellipse,
The lead at described air core coil both ends and its angle drawn between end face are 15 °~135 °；
When the inner ring of described air core coil is circle, described base includes pedestal and is arranged on described pedestal and Cheng Zhen
When arranging spaced N number of boss, described boss is that cross section is circular cylinder, and the height of described boss is described
0.2 times~1.2 times of air core coil axial height, the 0.6 of the internal diameter of a diameter of described air core coil of described boss
~0.95 times；
When the inner ring of described air core coil is ellipse, described base include pedestal and be arranged on described pedestal and into
During N number of boss of array spacings arrangement, described boss is the cylindricality that cross section is ellipse, and the height of described boss is institute
0.2 times of the air core coil axial height stated~1.2 times, the long internal diameter of a diameter of described air core coil of length of described boss
0.6~0.95 times, 0.6~0.95 times of the short internal diameter of short a diameter of described air core coil of described boss；
When the inner ring of described air core coil is circle, described base includes pedestal and is arranged on described pedestal and Cheng Zhen
When arranging spaced N number of groove, described groove is that cross section is circular cylinder shape groove, described groove it is a diameter of
1.05~1.5 times of the external diameter of described air core coil；
When the inner ring of described air core coil is ellipse, described base include pedestal and be arranged on described pedestal and into
During N number of groove of array spacings arrangement, described groove is the cylindrical groove that cross section is ellipse, and the length of described groove is straight
Footpath is 1.05~1.5 times of the long external diameter of described air core coil, short a diameter of described air core coil of described groove
1.05~1.5 times of short external diameter.
A kind of 2. manufacture method of embossing surface attachment inductance according to claim 1, it is characterised in that described magnetic
Particle diameter be 65~250 microns, described magnetic prepared by soft magnetic powder of the particle diameter between 1 micron~50 microns and
Into described soft magnetic powder is carbonyl iron powder, pure iron powder, iron Si powder, iron silicochromium powder, iron nickel by powder, iron nickel
Molybdenum powder, iron sial powder, iron-based amorphous powder and one kind or at least two mixture in iron based nano crystal powder.
A kind of 3. manufacture method of embossing surface attachment inductance according to claim 2, it is characterised in that described magnetic
Preparation process be：
A. soft magnetic powder is weighed, the quality of soft magnetic powder is designated as M, unit is gram；
B. the chemical pure phosphoric acid that quality is (0.1%~2.5%) * M gram and the acetone that quality is (2%~20%) * M gram are weighed,
Chemical pure phosphoric acid and acetone are mixed and stirred for uniformly, obtaining to the mixture of chemical pure phosphoric acid and acetone；
C. the mixture of chemical pure phosphoric acid and acetone is added into stirring in soft magnetic powder and, to drying, obtains the mixing of the first powder
Thing；
D. the epoxy resin that quality is (0.5%~5%) * M gram and the acetone that quality is (2%~20%) * M gram are weighed again, will
Epoxy resin and acetone are mixed and stirred for uniformly, obtaining the mixture of epoxy resin and acetone；
E. the mixture of epoxy resin and acetone is added in the first mixture of powders and stirred, obtain the mixing of the second powder
Thing；
F. the second mixture of powders is granulated using Granulation Equipments, obtains the magnetic semi-finished product that particle diameter is 65~250 microns；
G. magnetic semi-finished product are subjected to drying and processing, drying and processing temperature is 80 DEG C~120 DEG C, and the time is 1 hour；
H. it is (0.5%~3.0%) * M gram to weigh quality, zinc stearate powder of the particle diameter below 5 microns, by Zinc stearate powder
Stirred 1 hour in the magnetic semi-finished product that end is added after drying, obtain magnetic finished product.
A kind of 4. manufacture method of embossing surface attachment inductance according to claim 1, it is characterised in that described enamel-cover
The sticking temperature of the self-adhesive layer of line is 80 DEG C~220 DEG C, and the temperature resistant grade of described enamel-covered wire is 155 DEG C~255 DEG C.
A kind of 5. manufacture method of embossing surface attachment inductance according to claim 1, it is characterised in that described cold pressing
The temperature of processing is not higher than 50 DEG C, and the temperature of described hot-pressing processing is 80 DEG C~250 DEG C, and described pressurize processing time is 10
Second~300 seconds, the temperature of described heat treatment is 150 DEG C~250 DEG C, and described heat treatment time is 30 minutes~300 minutes.
A kind of 6. manufacture method of embossing surface attachment inductance according to claim 1, it is characterised in that described cutting
Mode is wire cutting mode or blade cutting mode, and the lead at air core coil both ends passes through cutting mode in each inductance body
Directly make its exposed or make its exposed by lapping mode after dicing.
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| CN105845423B (en) * | 2016-06-17 | 2018-01-19 | 深圳市固电电子有限公司 | Integrated inductor obtained by the preparation method and use the method for integrated inductor |
| CN106252056A (en) * | 2016-08-31 | 2016-12-21 | 和瑞电子(中山)有限公司 | A kind of integrated inductor manufacture method |
| CN107749340A (en) * | 2017-10-17 | 2018-03-02 | 深圳顺络电子股份有限公司 | A kind of high reliability high current molding inductance and manufacture method |
| CN110323052A (en) * | 2018-03-28 | 2019-10-11 | 昆山磁通新材料科技有限公司 | A kind of preparation method and its inductance of the high-effect molding inductance of high magnetic permeability |
| CN109166717B (en) * | 2018-09-03 | 2020-03-20 | 横店集团东磁股份有限公司 | Integrally-formed inductor forming method |
| CN109360731A (en) * | 2018-12-03 | 2019-02-19 | 东莞市高东电子科技有限公司 | A kind of integrated inductance production method and the inductance using this method production |
| CN110517859B (en) * | 2019-07-25 | 2020-10-13 | 深圳顺络汽车电子有限公司 | Inductance component and preparation method thereof |
| CN111370214A (en) * | 2019-11-20 | 2020-07-03 | 横店集团东磁股份有限公司 | Method for preparing magnetic powder core from alloy composite powder |
| CN114334428B (en) * | 2020-10-30 | 2022-10-14 | 宁波磁性材料应用技术创新中心有限公司 | Manufacturing method of integrally-formed molded inductor |
| WO2021043343A2 (en) * | 2020-11-17 | 2021-03-11 | 深圳顺络电子股份有限公司 | Integrally formed inductor and manufacturing method therefor |
| CN114050036A (en) * | 2021-11-24 | 2022-02-15 | 横店集团东磁股份有限公司 | Integrally-formed cup-core inductor and preparation method thereof |
| CN116487143A (en) * | 2022-01-13 | 2023-07-25 | 宁波磁性材料应用技术创新中心有限公司 | Manufacturing method of integrated inductor and inductor manufactured by using same |
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| JPH09129468A (en) * | 1995-10-27 | 1997-05-16 | Toko Inc | Manufacture of high-frequency inductor |
| JP3399366B2 (en) * | 1998-06-05 | 2003-04-21 | 株式会社村田製作所 | Manufacturing method of inductor |
| US6768409B2 (en) * | 2001-08-29 | 2004-07-27 | Matsushita Electric Industrial Co., Ltd. | Magnetic device, method for manufacturing the same, and power supply module equipped with the same |
| CN102867614A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Wafer inductor with preformed shell and manufacturing method of wafer inductor |
| CN103050224A (en) * | 2012-12-26 | 2013-04-17 | 王向群 | Power inductor and manufacturing method thereof |
| CN104425121B (en) * | 2013-08-27 | 2017-11-21 | 三积瑞科技（苏州）有限公司 | Inlay the manufacture method of buried alloy inductance |
| CN103915236A (en) * | 2014-04-01 | 2014-07-09 | 黄伟嫦 | Novel inductor and manufacturing method thereof |
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