CN105348749A - Embedded microprocessor radiating packaging material - Google Patents
Embedded microprocessor radiating packaging material Download PDFInfo
- Publication number
- CN105348749A CN105348749A CN201510929652.8A CN201510929652A CN105348749A CN 105348749 A CN105348749 A CN 105348749A CN 201510929652 A CN201510929652 A CN 201510929652A CN 105348749 A CN105348749 A CN 105348749A
- Authority
- CN
- China
- Prior art keywords
- parts
- powder
- embedded microprocessor
- silicon nitride
- gained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to an embedded microprocessor radiating packaging material, which is prepared from following raw materials in parts by weight: 18-20 parts of carbon fiber, 8-12 parts of epoxy acrylate, 3-5 parts of alpha-aluminium oxide, 2-4 parts of blanc fixe, 4-8 parts of beryllia, 10-14 parts of benzophenonetetracarboxylic dianhydride, 4-8 parts of sodium bichromate, 2-6 parts of coal ash, 2-4 parts of sepiolite powder, 2-6 parts of silicon nitride powder, 2-3 parts of amino resin and 4-5 parts of auxiliaries. The auxiliaries are prepared from following raw materials in parts by weight: 3-6 parts of castor oil, 12-14 parts of silicon nitride micropowder, 3-7 parts of aluminite powder, 2-4 parts of n-butyl acetate, 6-10 parts of iron powder, 4-8 parts of carbon nanotube and 2-6 parts of epoxy resin. The embedded microprocessor radiating packaging material is firm and tough, is not easy to rust and durable, and has well heat conduction and radiating capacity, and the surface is not easy to wear.
Description
Technical field
The invention belongs to field of computer technology, be specifically related to a kind of embedded microprocessor cooling encapsulation material.
Background technology
Embedded microprocessor is developed by the CPU in multi-purpose computer and comes.Its feature has the treater of more than 32, and have higher performance, its price is also corresponding higher certainly.But with computer processor unlike, in actual Embedded Application, only retain and functional hardware that Embedded Application is closely related, remove other redundancy function part, so just realize the particular requirement of Embedded Application with minimum power consumption and resource.Compare with industrial control computer, embedded microprocessor has the advantage that volume is little, lightweight, cost is low, reliability is high.The core of embedded system hardware layer is embedded microprocessor, maximum different of embedded microprocessor and universal cpu are in the system that embedded microprocessor is operated in mostly as particular group institute special designs, many for universal cpu being completed by board of tasks are integrated in chip internal by it, thus be conducive to embedded system design time be tending towards miniaturization, also there is very high efficiency and reliability simultaneously.Embedded microprocessor in actual use, needs to adopt suitable mode to be dispelled the heat, to improve result of use better.
Summary of the invention
The object of the present invention is to provide a kind of embedded microprocessor cooling encapsulation material, to improve embedded microprocessor packaged material heat dispersion better, improve its work-ing life.
To achieve these goals, technical scheme of the present invention is as follows.
A kind of embedded microprocessor cooling encapsulation material, is made up of the raw material of following mass fraction: 18 ~ 20 parts, carbon fiber, epoxy acrylic resin 8 ~ 12 parts, 3 ~ 5 parts, ɑ-aluminum oxide, ground barium sulfate 2 ~ 4 parts, beryllium oxide 4 ~ 8 parts, benzophenone tetracarboxylic dianhydride 10 ~ 14 parts, sodium dichromate 4 ~ 8 parts, 2 ~ 6 parts, flyash, sepiolite powder 2 ~ 4 parts, alpha-silicon nitride powders 2 ~ 6 parts, 2 ~ 3 parts, aminoresin, auxiliary agent 4 ~ 5 parts.
Described auxiliary agent is made up of the raw material of following mass parts: Viscotrol C 3 ~ 6 parts, silicon nitride powder 12 ~ 14 parts, aluminium powder 3 ~ 7 parts, N-BUTYL ACETATE 2 ~ 4 parts, iron powder 6 ~ 10 parts, carbon nanotube 4 ~ 8 parts, epoxy resin 2 ~ 6 parts, the preparation method of this auxiliary agent is: be first dissolved in by N-BUTYL ACETATE in appropriate water, be mixed with the aqueous solution that concentration is 3 ~ 8%, and silicon nitride powder is dropped in solution, dispersed with stirring is filtered after evenly soaking 8 ~ 14h, dry, gained material mixes with other remaining component, and be heated to 30 ~ 40 DEG C, room temperature is cooled to after constant temperature dispersed with stirring 1 ~ 3h, material is ground to form 500 ~ 600 order fine powders again, obtain.
Above-mentioned embedded microprocessor cooling encapsulation material, its preparation method comprises following steps:
(1) first sepiolite powder, alpha-silicon nitride powders, aminoresin are dissolved in 10 ~ 16 times in the water of its total mass number, drop into benzophenone tetracarboxylic dianhydride subsequently, cryodrying after immersion 8 ~ 10h, by for subsequent use after gained material and flyash mixed grinding 4 ~ 5h;
(2), after step (1) gained material and other remaining component being uniformly mixed 1 ~ 2h, dropping into ball-milling processing in ball mill, make square hole sieve surplus≤0.1% of gained material;
(3) material of step (2) gained is sent into compression moulding in mould, with after the temperature of 600 ~ 200 DEG C sintering 4 ~ 6h under nitrogen or argon atmosphere, through naturally cooling to room temperature and get final product.
This beneficial effect of the invention is: the present invention combines the advantage of the compositions such as carbon fiber, epoxy acrylic resin, beryllium oxide, ɑ-aluminum oxide, there is good heat conduction, heat-sinking capability, auxiliary agent can improve the sintering character of mixing material, prevents material Thermal cracking, can improve the sintering character of mixing material, compact structure after mixing material is sintered, material of the present invention is firm tough, and surface is not easy to wear, not easily corrosion, durable in use, possess good heat conduction, heat-sinking capability.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is described, better to understand the present invention.
Embodiment 1
In the present embodiment embedded microprocessor cooling encapsulation material, be made up of the raw material of following mass fraction: 18 parts, carbon fiber, epoxy acrylic resin 8 parts, 3 parts, ɑ-aluminum oxide, ground barium sulfate 2 parts, beryllium oxide 4 parts, benzophenone tetracarboxylic dianhydride 10 parts, sodium dichromate 4 parts, 2 parts, flyash, sepiolite powder 2 parts, alpha-silicon nitride powders 2 parts, 2 parts, aminoresin, auxiliary agent 4 parts.
Described auxiliary agent is made up of the raw material of following mass parts: Viscotrol C 3 parts, silicon nitride powder 12 parts, aluminium powder 3 parts, N-BUTYL ACETATE 2 parts, iron powder 6 parts, carbon nanotube 4 parts, epoxy resin 2 parts, the preparation method of this auxiliary agent is: be first dissolved in by N-BUTYL ACETATE in appropriate water, be mixed with the aqueous solution that concentration is 3%, and silicon nitride powder is dropped in solution, dispersed with stirring is filtered after evenly soaking 8h, dry, gained material mixes with other remaining component, and be heated to 30 DEG C, room temperature is cooled to after constant temperature dispersed with stirring 1h, material is ground to form 500 order fine powders again, obtain.
Above-mentioned embedded microprocessor cooling encapsulation material, its preparation method comprises following steps:
(1) first sepiolite powder, alpha-silicon nitride powders, aminoresin are dissolved in 10 times in the water of its total mass number, drop into benzophenone tetracarboxylic dianhydride subsequently, cryodrying after immersion 8h, by for subsequent use after gained material and flyash mixed grinding 4h;
(2), after step (1) gained material and other remaining component being uniformly mixed 1h, dropping into ball-milling processing in ball mill, make square hole sieve surplus≤0.1% of gained material;
(3) material of step (2) gained is sent into compression moulding in mould, with after the temperature of 600 DEG C sintering 6h under nitrogen or argon atmosphere, through naturally cooling to room temperature and get final product.
Embodiment 2
Embedded microprocessor cooling encapsulation material in the present embodiment, is made up of the raw material of following mass fraction: 19 parts, carbon fiber, epoxy acrylic resin 10 parts, 4 parts, ɑ-aluminum oxide, ground barium sulfate 3 parts, beryllium oxide 6 parts, benzophenone tetracarboxylic dianhydride 12 parts, sodium dichromate 6 parts, 4 parts, flyash, sepiolite powder 3 parts, alpha-silicon nitride powders 4 parts, 2 parts, aminoresin, auxiliary agent 4 parts.
Described auxiliary agent is made up of the raw material of following mass parts: Viscotrol C 5 parts, silicon nitride powder 13 parts, aluminium powder 5 parts, N-BUTYL ACETATE 3 parts, iron powder 8 parts, carbon nanotube 6 parts, epoxy resin 4 parts, the preparation method of this auxiliary agent is: be first dissolved in by N-BUTYL ACETATE in appropriate water, be mixed with the aqueous solution that concentration is 5%, and silicon nitride powder is dropped in solution, dispersed with stirring is filtered after evenly soaking 11h, dry, gained material mixes with other remaining component, and be heated to 35 DEG C, room temperature is cooled to after constant temperature dispersed with stirring 5h, material is ground to form 500 ~ 600 order fine powders again, obtain.
Above-mentioned embedded microprocessor cooling encapsulation material, its preparation method comprises following steps:
(1) first sepiolite powder, alpha-silicon nitride powders, aminoresin are dissolved in 13 times in the water of its total mass number, drop into benzophenone tetracarboxylic dianhydride subsequently, cryodrying after immersion 9h, by for subsequent use after gained material and flyash mixed grinding 4.5h;
(2), after step (1) gained material and other remaining component being uniformly mixed 1.5h, dropping into ball-milling processing in ball mill, make square hole sieve surplus≤0.1% of gained material;
(3) material of step (2) gained is sent into compression moulding in mould, with after the temperature of 650 DEG C sintering 5h under nitrogen or argon atmosphere, through naturally cooling to room temperature and get final product.
Embodiment 3
Embedded microprocessor cooling encapsulation material in the present embodiment, is made up of the raw material of following mass fraction: 20 parts, carbon fiber, epoxy acrylic resin 12 parts, 5 parts, ɑ-aluminum oxide, ground barium sulfate 4 parts, beryllium oxide 8 parts, benzophenone tetracarboxylic dianhydride 14 parts, sodium dichromate 8 parts, 6 parts, flyash, sepiolite powder 4 parts, alpha-silicon nitride powders 6 parts, 3 parts, aminoresin, auxiliary agent 5 parts.
Described auxiliary agent is made up of the raw material of following mass parts: Viscotrol C 6 parts, silicon nitride powder 14 parts, aluminium powder 7 parts, N-BUTYL ACETATE 4 parts, iron powder 10 parts, carbon nanotube 8 parts, epoxy resin 6 parts, the preparation method of this auxiliary agent is: be first dissolved in by N-BUTYL ACETATE in appropriate water, be mixed with the aqueous solution that concentration is 8%, and silicon nitride powder is dropped in solution, dispersed with stirring is filtered after evenly soaking 8h, dry, gained material mixes with other remaining component, and be heated to 40 DEG C, room temperature is cooled to after constant temperature dispersed with stirring 3h, material is ground to form 600 order fine powders again, obtain.
Above-mentioned embedded microprocessor cooling encapsulation material, its preparation method comprises following steps:
(1) first sepiolite powder, alpha-silicon nitride powders, aminoresin are dissolved in 16 times in the water of its total mass number, drop into benzophenone tetracarboxylic dianhydride subsequently, cryodrying after immersion 10h, by for subsequent use after gained material and flyash mixed grinding 5h;
(2), after step (1) gained material and other remaining component being uniformly mixed 2h, dropping into ball-milling processing in ball mill, make square hole sieve surplus≤0.1% of gained material;
(3) material of step (2) gained is sent into compression moulding in mould, with after the temperature of 200 DEG C sintering 6h under nitrogen or argon atmosphere, through naturally cooling to room temperature and get final product.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (3)
1. an embedded microprocessor cooling encapsulation material, is characterized in that: be made up of the raw material of following mass fraction: 18 ~ 20 parts, carbon fiber, epoxy acrylic resin 8 ~ 12 parts, 3 ~ 5 parts, ɑ-aluminum oxide, ground barium sulfate 2 ~ 4 parts, beryllium oxide 4 ~ 8 parts, benzophenone tetracarboxylic dianhydride 10 ~ 14 parts, sodium dichromate 4 ~ 8 parts, 2 ~ 6 parts, flyash, sepiolite powder 2 ~ 4 parts, alpha-silicon nitride powders 2 ~ 6 parts, 2 ~ 3 parts, aminoresin, auxiliary agent 4 ~ 5 parts.
2. embedded microprocessor cooling encapsulation material according to claim 1, it is characterized in that: described auxiliary agent is made up of the raw material of following mass parts: Viscotrol C 3 ~ 6 parts, silicon nitride powder 12 ~ 14 parts, aluminium powder 3 ~ 7 parts, N-BUTYL ACETATE 2 ~ 4 parts, iron powder 6 ~ 10 parts, carbon nanotube 4 ~ 8 parts, epoxy resin 2 ~ 6 parts, the preparation method of this auxiliary agent is: be first dissolved in by N-BUTYL ACETATE in appropriate water, be mixed with the aqueous solution that concentration is 3 ~ 8%, and silicon nitride powder is dropped in solution, dispersed with stirring is filtered after evenly soaking 8 ~ 14h, dry, gained material mixes with other remaining component, and be heated to 30 ~ 40 DEG C, room temperature is cooled to after constant temperature dispersed with stirring 1 ~ 3h, material is ground to form 500 ~ 600 order fine powders again, obtain.
3. embedded microprocessor cooling encapsulation material according to claim 1, is characterized in that: described embedded microprocessor cooling encapsulation material, and its preparation method comprises following steps:
(1) first sepiolite powder, alpha-silicon nitride powders, aminoresin are dissolved in 10 ~ 16 times in the water of its total mass number, drop into benzophenone tetracarboxylic dianhydride subsequently, cryodrying after immersion 8 ~ 10h, by for subsequent use after gained material and flyash mixed grinding 4 ~ 5h;
(2), after step (1) gained material and other remaining component being uniformly mixed 1 ~ 2h, dropping into ball-milling processing in ball mill, make square hole sieve surplus≤0.1% of gained material;
(3) material of step (2) gained is sent into compression moulding in mould, with after the temperature of 600 ~ 200 DEG C sintering 4 ~ 6h under nitrogen or argon atmosphere, through naturally cooling to room temperature and get final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510929652.8A CN105348749A (en) | 2015-12-15 | 2015-12-15 | Embedded microprocessor radiating packaging material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510929652.8A CN105348749A (en) | 2015-12-15 | 2015-12-15 | Embedded microprocessor radiating packaging material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105348749A true CN105348749A (en) | 2016-02-24 |
Family
ID=55324820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510929652.8A Pending CN105348749A (en) | 2015-12-15 | 2015-12-15 | Embedded microprocessor radiating packaging material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105348749A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109485953A (en) * | 2018-10-10 | 2019-03-19 | 安徽科比电子科技有限公司 | A kind of aluminum-housed resistor inner filling material improving heat dissipation performance |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102086364A (en) * | 2010-12-16 | 2011-06-08 | 广东风华高新科技股份有限公司 | Conductive silver paste for microelectronic packaging and preparation method thereof |
| JP2011148877A (en) * | 2010-01-20 | 2011-08-04 | Ishida Co Ltd | Method for producing polyethylene terephthalate film |
-
2015
- 2015-12-15 CN CN201510929652.8A patent/CN105348749A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011148877A (en) * | 2010-01-20 | 2011-08-04 | Ishida Co Ltd | Method for producing polyethylene terephthalate film |
| CN102086364A (en) * | 2010-12-16 | 2011-06-08 | 广东风华高新科技股份有限公司 | Conductive silver paste for microelectronic packaging and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 周文英，等: "《导热填料》", 30 April 2014, 国防工业出版社 * |
| 舒友等: "《涂料配方设计与制备》", 31 August 2014, 西南交通大学出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109485953A (en) * | 2018-10-10 | 2019-03-19 | 安徽科比电子科技有限公司 | A kind of aluminum-housed resistor inner filling material improving heat dissipation performance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101538162B (en) | Preparation method for high reliability large-scale silicon nitride ceramic material | |
| CN103641370B (en) | Composite cement enhanced grinding aid containing amide polyamine polycarboxylic acids and preparation method therefor | |
| CN106409461B (en) | Preparation method of low-loss FeSi6.5 soft magnetic composite powder core | |
| EP2578551A1 (en) | Composition used for high strength and watertight concrete | |
| CN104789823A (en) | Aluminum-based composite heat dissipation material for LED | |
| CN104628388A (en) | High thermal conductivity silicon carbide ceramic material and preparation method thereof | |
| CN103464738B (en) | Add corrupt split slide plate and the production method thereof of titanium | |
| CN110357435B (en) | High-strength high-modulus magnesium-aluminum-silicon microcrystalline glass material and preparation method thereof | |
| CN110451936A (en) | A kind of complex phase ceramic and its preparation method and application | |
| CN100375654C (en) | Sustained-release grinding aid for hard micro-powder | |
| CN113012886B (en) | High-resistance direct-current-superposition low-power-consumption integrally-formed inductance material and preparation method thereof | |
| CN102199008A (en) | Preparation method of superfine slag micro powder | |
| CN104030686B (en) | A kind of high tenacity silicon carbide ceramics and preparation method thereof | |
| CN106064946A (en) | Mechanical seal SiC/ graphite diphase ceramic material and preparation method thereof | |
| CN105198389A (en) | Composition for alumina ceramic, alumina ceramic and preparation method thereof | |
| CN105348749A (en) | Embedded microprocessor radiating packaging material | |
| CN113512408A (en) | Composite heat storage material based on steel slag-coal gangue and preparation method thereof | |
| CN104164596A (en) | LED aluminum-based composite heat-dissipating material containing modified fly ash | |
| CN104387042A (en) | Wear-resistant and heat-resistant ceramic material for nozzle and preparation method of wear-resistant and heat-resistant ceramic material | |
| CN104195375A (en) | A modified bamboo fiber-containing aluminum-base composite heat dispersing material for an LED | |
| CN108530964A (en) | A kind of heat radiation coating and preparation method thereof for electronic equipment casing | |
| CN102560321A (en) | Yttrium silicate hot-spray composite powder and preparation method thereof | |
| CN102628099B (en) | Method for forming balls by cooling and solidifying mineral powder by using water glass as bonding agent | |
| CN104087794A (en) | Reinforced active aluminum-based composite heat dissipation material for LED (light emitting diode) | |
| CN104073694A (en) | High-heat conductivity temperature-resistant aluminum-based composite radiating material for LED (Light-Emitting Diode) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160224 |