CN105346194A - Copper-clad plate hydroforming device - Google Patents
Copper-clad plate hydroforming device Download PDFInfo
- Publication number
- CN105346194A CN105346194A CN201510785328.3A CN201510785328A CN105346194A CN 105346194 A CN105346194 A CN 105346194A CN 201510785328 A CN201510785328 A CN 201510785328A CN 105346194 A CN105346194 A CN 105346194A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- forming device
- pressing
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
Abstract
The invention provides a copper-clad plate hydroforming device. The device comprises a pressure vessel and a control device which is arranged on the outer wall of the pressure vessel and is used for controlling a pressure vessel lamination process. A vacuum bag is arranged in the main body of the pressure vessel. Multiple copper-clad plates to be subjected to lamination molding are arranged in the vacuum bag. The bottom of the main body of the pressure vessel is provided with a heating device. The inner wall of the main body of the pressure vessel is provided with multiple temperature sensors. The heating device and the temperature sensor are electrically connected to the control device. The pressure vessel is filled with a liquid medium, forms a sealed space and applies uniform pressure for the vacuum bag. The control device controls the heating device to heat the liquid medium so that a lamination process is finished. The copper-clad plates are laminated in the liquid medium in the sealed container so that the surface of the sample to be subjected to lamination is subjected to uniform pressing. The pressed product has a small warping degree and a less plate resin solidification amount and does not easily produce white spots, cracks, layer bubbles, gaps and pits.
Description
Technical field
The present invention relates to copper-clad plate preparing technical field, particularly relate to a kind of hydraulic forming device of copper-clad plate.
Background technology
Copper-clad plate (CopperCladLaminates) is the baseplate material for the manufacture of printed wiring board (PCB), is usually formed by base material, dielectric adhering layer and the hot pressing of Copper Foil three kinds of medium compounds in prior art.Because hot pressing completes in air or vacuum, briquetting pressure is larger, and the lamination on copper-clad plate surface is stressed is not uniform, so just causes that the product angularity of suppressing out is high, lack of homogeneity.
Therefore, for the above-mentioned defect existed in currently available technology, be necessary to study in fact, to provide a kind of scheme, solve the defect existed in prior art.
Summary of the invention
In order to solve prior art Problems existing, the object of the present invention is to provide a kind of hydraulic forming device utilizing the character of the even transmission of pressure of liquid medium to realize the copper-clad plate surface copper-clad plate of uniform pressurization everywhere.
In order to overcome the defect of prior art, technical scheme of the present invention is:
A kind of hydraulic forming device of copper-clad plate, comprise pressing container and be arranged on this pressing container outer wall for controlling the control device of described pressing container complete layer press operation, described pressing container comprises pressing vessel and container cover, and described pressing vessel and container cover have the deadend structure cooperatively interacted makes described pressing container form confined space; Be provided with vacuum bag in described pressing vessel, described vacuum bag is used for the shaping copper-clad plate to be laminated of in-built multi-disc; Be provided with a heater in the bottom of described pressing vessel, be provided with multiple temperature sensor at the inwall of described pressing vessel, described heater and described temperature sensor and described control device are electrically connected; Described pressing container filled with fluid medium to described vacuum bag uniform pressurization after forming confined space, described control device controls described heater to liquid medium heating complete layer press operation.
Preferably, described control device comprises control module, input module and display module further, wherein,
Described input module is used for the parameter information of input layer press operation;
Described display module is for showing the duty of pressing container;
Described control module is connected with described display module with described temperature sensor, described heater, described input module, controls the duty of described heater for the temperature information measured by the parameter information of described input module and described temperature sensor.
Preferably, described control module adopts Mitsubishi FX3U series of programmable logic controller.
Preferably, also comprise vavuum pump, described vavuum pump is used for carrying out vacuum pumping to described vacuum bag and making described vacuum bag be in vacuum state.
Preferably, described vacuum bag is silica gel bag.
Preferably, described pressing vessel and described container cover is pressed to be made up of cast steel material.
Preferably, described heater adopts elema heater.
Preferably, the power of described elema heater is not less than 50KW.
Preferably, described temperature sensor adopts resistance temperature detector.
Preferably, described resistance temperature detector is PT100.
Relative to prior art, adopt technical scheme of the present invention, because copper-clad plate lamination process completes in the liquid medium of airtight container, utilize the character of the incompressible character of liquid and even transmission of pressure, thus making laminate samples surface uniform pressurization everywhere, the angularity of compacting product is out little, and in plate, resin solidification amount can reduce, not easily there is hickie, crackle, the bubble in layer, space and pit etc.
Accompanying drawing explanation
The structural representation of the hydraulic forming device of a kind of copper-clad plate that Fig. 1 provides for the embodiment of the present invention.
The principle schematic of control device in the hydraulic forming device of a kind of copper-clad plate that Fig. 2 provides for the embodiment of the present invention.
Detailed description of the invention
Be below specific embodiments of the invention and by reference to the accompanying drawings, technical scheme of the present invention is further described, but the present invention be not limited to these embodiments.
In order to overcome the defect that prior art exists, refer to Fig. 1 and Fig. 2, be depicted as the structural representation of the hydraulic forming device of a kind of copper-clad plate that the embodiment of the present invention provides, comprise pressing container 1 and be arranged on this pressing container outer wall for controlling the control device 2 (in Fig. 1 and not shown) of pressing container complete layer press operation, pressing container comprises by firm, wear-resisting, the pressing vessel 11 that corrosion resistant cast steel material is made and container cover 12, pressing vessel 11 and container cover 12 have the deadend structure cooperatively interacted, container cover 12 forms confined space after closing, can ensure that in laminating operation pressing container is in air-tight state, be provided with vacuum bag 13 in pressing vessel 11, vacuum bag 13 is for the shaping copper-clad plate 14 to be laminated of in-built multi-disc, and usual vacuum bag 13 selects silica gel bag.During non-lamination, not yet solidify although the substrate of copper-clad plate 14, Copper Foil and the bonding glue-line close bed for adhesive base plate and Copper Foil are combined, lamination solidification need be carried out by the pressure of liquid medium and temperature to it.By vavuum pump vacuum pumping carried out to vacuum bag 13 and make vacuum bag 13 be in vacuum state, ensureing the impact of copper-clad plate 14 at lamination process not liquid body medium.Be provided with a heater 15 in the bottom of pressing vessel 11, be provided with multiple temperature sensor 16 at the inwall of pressing vessel 11, heater 15 and temperature sensor 16 are electrically connected with control device 2; Pressing container filled with fluid medium to vacuum bag 13 uniform pressurization after forming confined space, control device controls heater 15 pairs of liquid mediums heating complete layer press operations.In reality, according to the parameter such as thawing, solidification of bonding glue-line, control device controls heating and the cooling procedure of heater 15, due to effect of expanding with heat and contract with cold, in confined space, the inevitable adjoint pressure process of heating process, when force value is no more than the maximum pressure that pressing container 1 can bear, choose suitable heating curves and constant temperature time, to reach optimum lamination solidification effect.
Adopt technique scheme, because copper-clad plate lamination process completes in the liquid medium of airtight container, utilize the character of the incompressible character of liquid and even transmission of pressure, thus make laminate samples surface uniform pressurization everywhere, the angularity of compacting product is out little, in plate, resin solidification amount can reduce, and not easily occurs hickie, crackle, the bubble in layer, space and pit etc.
In a preferred embodiment, control device 2 comprises control module 21, input module 22 and display module 23 further, wherein,
Input module 22 is for the parameter information of input layer press operation;
Display module 23 is for showing the duty of pressing container;
Control module 21 is connected with display module 23 with temperature sensor 16, heater 15, input module 22, controls the duty of heater 15 for the temperature information measured by the parameter information of input module 22 and temperature sensor 16.
In a preferred embodiment, control module adopts Mitsubishi FX3U series of programmable logic controller.
In a preferred embodiment, vavuum pump (in Fig. 1 and not shown) is also comprised, for carrying out vacuum pumping to silica gel bag.
In a preferred embodiment, heater 15 adopts elema heater, and the power of elema heater is not less than 50KW, selects the elema heater of 100KW in practice.
In a preferred embodiment, temperature sensor 16 adopts resistance temperature detector.
In a preferred embodiment, resistance temperature detector 16 is PT100.PT100 has the advantages such as reaction speed is fast, precision is high, antijamming capability is strong in the interval of-50-600 DEG C.
The explanation of above embodiment just understands method of the present invention and core concept thereof for helping.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improve and modify and also fall in the protection domain of the claims in the present invention.Be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can realize without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. the hydraulic forming device of a copper-clad plate, it is characterized in that, comprise pressing container and be arranged on this pressing container outer wall for controlling the control device of described pressing container complete layer press operation, described pressing container comprises pressing vessel and container cover, and described pressing vessel and container cover have the deadend structure cooperatively interacted makes described pressing container form confined space; Be provided with vacuum bag in described pressing vessel, described vacuum bag is used for the shaping copper-clad plate to be laminated of in-built multi-disc; Be provided with a heater in the bottom of described pressing vessel, be provided with multiple temperature sensor at the inwall of described pressing vessel, described heater and described temperature sensor and described control device are electrically connected; Described pressing container filled with fluid medium to described vacuum bag uniform pressurization after forming confined space, described control device controls described heater to liquid medium heating complete layer press operation.
2. the hydraulic forming device of copper-clad plate as claimed in claim 1, it is characterized in that, described control device comprises control module, input module and display module further, wherein,
Described input module is used for the parameter information of input layer press operation;
Described display module is for showing the duty of pressing container;
Described control module is connected with described display module with described temperature sensor, described heater, described input module, controls the duty of described heater for the temperature information measured by the parameter information of described input module and described temperature sensor.
3. the hydraulic forming device of copper-clad plate as claimed in claim 2, is characterized in that, described control module adopts Mitsubishi FX3U series of programmable logic controller.
4. the hydraulic forming device of copper-clad plate as claimed in claim 1 or 2, is characterized in that, also comprise vavuum pump, and described vavuum pump is used for carrying out vacuum pumping to described vacuum bag and making described vacuum bag be in vacuum state.
5. the hydraulic forming device of copper-clad plate as claimed in claim 4, it is characterized in that, described vacuum bag is silica gel bag.
6. the hydraulic forming device of copper-clad plate as claimed in claim 1, is characterized in that, press described pressing vessel and described container cover to be made up of cast steel material.
7. the hydraulic forming device of copper-clad plate as claimed in claim 1, is characterized in that, described heater adopts elema heater.
8. the hydraulic forming device of copper-clad plate as claimed in claim 8, it is characterized in that, the power of described elema heater is not less than 50KW.
9. the hydraulic forming device of copper-clad plate as claimed in claim 1, is characterized in that, described temperature sensor adopts resistance temperature detector.
10. the hydraulic forming device of copper-clad plate as claimed in claim 9, it is characterized in that, described resistance temperature detector is PT100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510785328.3A CN105346194A (en) | 2015-11-16 | 2015-11-16 | Copper-clad plate hydroforming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510785328.3A CN105346194A (en) | 2015-11-16 | 2015-11-16 | Copper-clad plate hydroforming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105346194A true CN105346194A (en) | 2016-02-24 |
Family
ID=55322328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510785328.3A Pending CN105346194A (en) | 2015-11-16 | 2015-11-16 | Copper-clad plate hydroforming device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105346194A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124589A (en) * | 1977-04-07 | 1978-10-31 | Toyobo Co Ltd | Manufacture of unsaturated polyester resin copper clad laminate |
| US20030102077A1 (en) * | 2001-12-03 | 2003-06-05 | Pioneer Technology Engineering Co., Ltd., | Method for manufacturing a copper-clad laminate |
| CN102529292A (en) * | 2012-01-04 | 2012-07-04 | 秦会斌 | Isostatic pressing laminating method and device |
| CN205291835U (en) * | 2015-11-16 | 2016-06-08 | 嘉兴市上村电子有限公司 | Hydraulic molding device of copper -clad plate |
-
2015
- 2015-11-16 CN CN201510785328.3A patent/CN105346194A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124589A (en) * | 1977-04-07 | 1978-10-31 | Toyobo Co Ltd | Manufacture of unsaturated polyester resin copper clad laminate |
| US20030102077A1 (en) * | 2001-12-03 | 2003-06-05 | Pioneer Technology Engineering Co., Ltd., | Method for manufacturing a copper-clad laminate |
| CN102529292A (en) * | 2012-01-04 | 2012-07-04 | 秦会斌 | Isostatic pressing laminating method and device |
| CN205291835U (en) * | 2015-11-16 | 2016-06-08 | 嘉兴市上村电子有限公司 | Hydraulic molding device of copper -clad plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102627017A (en) | Laminate press device, curing processing device, carrier plate, laminating system, and laminating method | |
| CN105246271B (en) | A kind of manufacturing method for the rigid-flex combined board for having an isolated island formula hardboard | |
| CN102529292A (en) | Isostatic pressing laminating method and device | |
| CN205291835U (en) | Hydraulic molding device of copper -clad plate | |
| CN105101658B (en) | The hot ultrasonic cryogenic sintering method and device of a kind of nano silver conductive ink | |
| CN102343704A (en) | Extrusion apparatus and method for removing air between panels | |
| CN205196102U (en) | Energy storage circulation hydraulic molding device of copper -clad plate | |
| CN105346194A (en) | Copper-clad plate hydroforming device | |
| CN205232582U (en) | Hydraulic loading forming device of copper -clad plate | |
| CN205291834U (en) | Circulation hydraulic molding device of copper -clad plate | |
| CN201426216Y (en) | PCB stacking structure | |
| CN205291827U (en) | Energy storage circulation hydraulic loading forming device of copper -clad plate | |
| CN205291836U (en) | Energy storage hydraulic molding device of copper -clad plate | |
| CN105346191A (en) | Copper-clad plate circulation hydraulic pressure forming device | |
| CN205232577U (en) | Energy storage hydraulic loading forming device of copper -clad plate | |
| CN105346187A (en) | Copper-clad plate energy storage circulation hydraulic pressure forming device | |
| CN205291833U (en) | Multistage energy storage circulation hydraulic molding device of copper -clad plate | |
| CN205291828U (en) | Circulation hydraulic loading forming device of copper -clad plate | |
| CN101961893B (en) | Composite material mold and manufacturing method thereof | |
| CN105346192A (en) | Copper-clad plate energy storage hydraulic pressure forming device | |
| CN105357879A (en) | Copper clad laminate hydraulic pressurization forming device | |
| CN105357878A (en) | Copper clad laminate energy storage cyclic hydraulic forming device | |
| CN205291837U (en) | Multistage energy storage circulation hydraulic loading forming device of copper -clad plate | |
| CN105357877A (en) | Copper clad laminate energy storage hydraulic pressurization forming device | |
| CN105246260B (en) | A kind of manufacture method of aluminum-based circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160224 |