CN105345989A - Integral molding method of three-dimensional touch module - Google Patents
Integral molding method of three-dimensional touch module Download PDFInfo
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- CN105345989A CN105345989A CN201510808076.1A CN201510808076A CN105345989A CN 105345989 A CN105345989 A CN 105345989A CN 201510808076 A CN201510808076 A CN 201510808076A CN 105345989 A CN105345989 A CN 105345989A
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- layer
- control sensor
- touch control
- mold
- curved surface
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides an integral molding method of a three-dimensional touch module. The integral molding method comprises the following steps: an anti-scraping hardening mold layer on a touch sensor is removed; adhesive is coated on the anti-scraping hardening mold layer for bonding with a three-dimensional curved surface plastic layer (Plastic cover-3D); and the integral molding of the three-dimensional touch module is achieved through connection of a plastic film layer, the anti-scraping hardening mold layer, and the touch sensor The method can solve the problems of increment of manufacturing cost and difficult yield control due to the use of curved surface bonding equipment caused by weak adhesion between the three-dimensional curved surface plastic layer and the anti-scraping hardening mold layer of the touch sensor when the three-dimensional curved surface plastic layer is used in an in-mold forming (IMF) technology.
Description
Technical field
The present invention, about a kind of three-dimensional touch module integral formation method, refers to a kind of by the touch module of three-dimensional (IMF) integrated method in in-molded processing procedure especially.
Background technology
Known in-mold transfer printing (In-MoldRollerorIn-MoldRelease, IMR) film, and in-molded (In-MoldForming, IMF) film, be make required figure with half tone or drum-type embossing plate, and implement release layer with printing machine platform or coating machine platform, protection wearing layer, ink pattern layer, metal pattern layer, the printing coating of adhesion layer and other figures, because its printing machine platform or coating machine platform, and half tone or drum-type embossing plate are open space, be difficult to reach free from environmental pollution and the process requirements of air in printing process, and easily manufacture waste water, waste gas and garbage waste material, cause in the process of above three kinds of discarded objects very loaded down with trivial details.
Refer to shown in Fig. 1, it is known three-dimensional touch module bonding structure schematic diagram.The transfer printing engineering method of known in-molded (IMF), be first by film itself via steps such as softening, vacuum formings, complete three-dimensional (3D) shaping after carry out surface treatment again.Three-dimensionally shaped inserting in mould with surface-treated film will be completed and carry out ejection formation again.While ejection formation, utilize the temperature of plastics to make ink transfer cylinder on working of plastics, die sinking ejects plastic and namely completes step that is one-body molded and pattern transfer printing.The plastic possessing corner angle due to in-molded (IMF) carries out surface treatment, and can create three-dimensional surface sense of touch, and its intensity of variation is better than in-mold transfer thin membrane (IMR).For automobile-used touch module, automobile-used touch module generally comprises: function film layer 1, three-dimension curved surface plastic layer (Plasticcover_3D) 2, optical cement layer 31 and touch control sensor (4,32,5), through this optical cement layer 31 by this three-dimension curved surface plastic layer 2 and this touch control sensor (4,32,5) be connected, then through in-molded fabrication techniques touch module.But, when automobile-used touch module carries out in-molded (IMF) processing procedure, because automobile-used touch cover must consider resistance to impact, firmer material such as Merlon (Polycarbonate, PC) plastics must be selected, simultaneously, consider the associativity of film and plastics, film also must select polycarbonate plastic material, and frame Printing Zone (BlackMatrix, BM) then must increase one deck is knotted layer to increase the associativity of frame Printing Zone and PC plastics.And, because automobile-used touch module has three-dimension curved surface plastic layer, collocation module application of a surface technology is needed when IMF processing procedure, except must application of a surface equipment be invested, and have one laminating expenses of labour to cause outside cost of manufacture raising, during application of a surface processing procedure, three-dimension curved surface plastic layer must be fitted with touch module contraposition, and laminating qualification rate is wayward, if long when the laminating time, the moisture absorption of PC plastics may be caused to cause laminating sensor fail-safe analysis (ReliabilityAnalysis, RA) produce degassed bubble (outgas) afterwards, need to be improved.
Summary of the invention
Shortcoming existing when mentioning three-dimensional touch module group procedure because above-mentioned, inventor adheres to excelsior kindhearted motivation, proposes a kind of touch module (IMF) integrated method in in-molded processing procedure of three-dimensional.
In order to achieve the above object, system of the present invention takes following technological means to be reached, wherein, the three-dimensional touch module integral formation method of the present invention, comprise the following steps: an in-molded jetting mold, a function film layer, three-dimension curved surface plastic layer (Plasticcover_3D) and a touch control sensor are provided, wherein this touch control sensor has a scratch resistant sclerosis mold layer, and this touch control sensor comprises a tin indium oxide (ITO) conductive film; Remove this scratch resistant sclerosis mold layer on this touch control sensor; And utilize this in-molded jetting mold by one-body molded to this function film layer, this three-dimension curved surface plastic layer and this touch control sensor.
In present pre-ferred embodiments, this touch control sensor comprises: one first sensed layer and one second sensed layer, this first sensed layer is connected with this second sensed layer through a bonding coat, and wherein this bonding coat is optical cement (OpticalClearAdhesive, OCA).
In present pre-ferred embodiments, this tin indium oxide conductive film has Merlon (Polycarbonate, PC).
In addition, the present invention also proposes a kind of three-dimensional touch module integral formation method, comprise the following steps: an in-molded jetting mold, a function film layer, a three-dimension curved surface plastic layer and a touch control sensor are provided, wherein this touch control sensor has a scratch resistant sclerosis mold layer, and this touch control sensor comprises a tin indium oxide conductive film; Coating one then glue in this scratch resistant sclerosis mold layer; Through this then glue this scratch resistant sclerosis mold layer is connected with this three-dimension curved surface plastic layer; And utilize this in-molded jetting mold by one-body molded to this function film layer, this three-dimension curved surface plastic layer and this touch control sensor.
In present pre-ferred embodiments, this tin indium oxide conductive film is without Merlon.
And, the present invention also proposes a kind of three-dimensional touch module integral formation method, comprise the following steps: an in-molded jetting mold, a function film layer, a three-dimension curved surface plastic layer, a touch control sensor and a plastic film layers are provided, wherein this touch control sensor has a scratch resistant sclerosis mold layer, and this touch control sensor comprises a tin indium oxide conductive film; A bonding coat is utilized scratch resistant to this plastic film layers and this sclerosis mold layer to be connected; Utilize this in-molded jetting mold by one-body molded to this function film layer, this three-dimension curved surface plastic layer, this touch control sensor and this plastic film layers.
In present pre-ferred embodiments, this tin indium oxide conductive film is without Merlon.
Accompanying drawing explanation
Fig. 1 is known techniques three-dimensional touch module bonding structure schematic diagram;
Fig. 2 is three-dimensional touch module integral formation method first embodiment bonding structure schematic diagram of the present invention;
Fig. 3 is three-dimensional touch module integral formation method second embodiment bonding structure schematic diagram of the present invention;
Fig. 4 is three-dimensional touch module integral formation method the 3rd embodiment bonding structure schematic diagram of the present invention.
Drawing reference numeral illustrates:
1 function film layer
2 three-dimension curved surface plastic layers
3,31,32 optical cement layer
4 first sensed layer
41 scratch resistant sclerosis mold layer
5 second sensed layer
6 then glue
7 plastic film layers
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Detailed description of the invention
For reaching above-mentioned purpose and effect, the technological means that the present invention adopted and structure, with regard to present pre-ferred embodiments, hereby drawing illustrates that its features and functions is as follows in detail, understand completely in order to do profit, but it is noted that, these contents do not form restriction of the present invention.
Refer to shown in Fig. 2, it is three-dimensional touch module integral formation method first embodiment bonding structure schematic diagram of the present invention.Three-dimensional touch module integral formation method comprises the following steps:
One in-molded jetting mold (not shown), a function film layer 1, three-dimension curved surface plastic layer (Plasticcover_3D) 2 and a touch control sensor (4,32,5) are provided.This touch control sensor (4,32,5) one first sensed layer 4 and one second sensed layer 5 is comprised, this first sensed layer 4 and this second sensed layer 5 comprise a tin indium oxide (ITO) conductive film, and this tin indium oxide conductive film has Merlon (Polycarbonate, PC).This first sensed layer 4 is connected with this second sensed layer 5 through a bonding coat 3, and this bonding coat 3 can be an optical cement (OpticalClearAdhesive, OCA).Because tin indium oxide conductive film is when film-plating process, surface can have a scratch resistant sclerosis mold layer 41 and avoid damaging during plated film, makes this touch control sensor (4,32,5) have this scratch resistant sclerosis mold layer 41.
Remove this scratch resistant sclerosis mold layer 41 that this touch control sensor (4,32,5) is upper.Because this scratch resistant sclerosis mold layer 41 can cause the meeting of this three-dimension curved surface plastic layer 2 and this touch control sensor (4,32,5) Merlon is then not good, therefore this touch control sensor (4 is removed, 32,5) this upper scratch resistant sclerosis mold layer 41, makes this touch control sensor (4,32,5) can directly and this three-dimension curved surface plastic layer 2 recline and combine.
Utilize this in-molded jetting mold by one-body molded to this function film layer 1, this three-dimension curved surface plastic layer 2 and this touch control sensor (4,32,5).After removing this scratch resistant sclerosis mold layer 41, this function film layer 1, this three-dimension curved surface plastic layer 2 and this touch control sensor (4,32,5) can be imbedded this in-molded jetting mold and carry out one-body molded burying and penetrate.
Refer to shown in Fig. 3, it is three-dimensional touch module integral formation method second embodiment bonding structure schematic diagram of the present invention.Three-dimensional touch module integral formation method comprises the following steps:
One in-molded jetting mold (not shown), a function film layer 1, three-dimension curved surface plastic layer (Plasticcover_3D) 2 and a touch control sensor (4,32,5) are provided.This touch control sensor (4,32,5) comprises one first sensed layer 4 and one second sensed layer 5, and this first sensed layer 4 and this second sensed layer 5 comprise a tin indium oxide (ITO) conductive film.This first sensed layer 4 is connected with this second sensed layer 5 through a bonding coat 3, and this bonding coat 3 can be an optical cement (OpticalClearAdhesive, OCA).Because tin indium oxide conductive film is when film-plating process, surface can have a scratch resistant sclerosis mold layer 41 and avoid damaging during plated film, makes this touch control sensor (4,32,5) have this scratch resistant sclerosis mold layer 41.
Coating one then glue 6 in this scratch resistant sclerosis mold layer 41.
Through this then glue 6 this scratch resistant sclerosis mold layer 41 is connected with this three-dimension curved surface plastic layer 2.
Utilize this in-molded jetting mold by one-body molded to this function film layer 1, this three-dimension curved surface plastic layer 2 and this touch control sensor (4,32,5).After this scratch resistant sclerosis mold layer 41 is connected with this three-dimension curved surface plastic layer 2, this function film layer 1, this three-dimension curved surface plastic layer 2 and this touch control sensor (4,32,5) can be imbedded this in-molded jetting mold and carry out one-body molded burying and penetrate.It is worth mentioning that, now the tin indium oxide conductive film of this first sensed layer 4 and this second sensed layer 5 can select material without Merlon as PET (polyethyleneterephthalate, or cyclic olefin polymer (CycloOlefinPolymer PET), etc., but be not limited thereto COP).
Refer to shown in Fig. 4, it is three-dimensional touch module integral formation method the 3rd embodiment bonding structure schematic diagram of the present invention.Three-dimensional touch module integral formation method comprises the following steps:
One in-molded jetting mold (not shown), function film layer 1, three-dimension curved surface plastic layer (Plasticcover_3D) 2, touch control sensor (4,32,5) and a plastic film layers 7 are provided.This touch control sensor (4,32,5) comprises one first sensed layer 4 and one second sensed layer 5, and this first sensed layer 4 and this second sensed layer 5 comprise a tin indium oxide (ITO) conductive film.This first sensed layer 4 is connected with this second sensed layer 5 through a bonding coat 32, and this bonding coat 32 can be an optical cement (OpticalClearAdhesive, OCA).Because tin indium oxide conductive film is when film-plating process, surface can have a scratch resistant sclerosis mold layer 41 and avoid damaging during plated film, makes this touch control sensor (4,32,5) have this scratch resistant sclerosis mold layer 41.
A bonding coat 31 is utilized scratch resistant to this plastic film layers 7 and this sclerosis mold layer 41 to be connected.On this touch control sensor (4,32,5), paste this plastic film layers 7, to recline the medium of combination as with this three-dimension curved surface plastic layer 2.
Utilize this in-molded jetting mold by one-body molded to this function film layer 1, this three-dimension curved surface plastic layer 2, this touch control sensor (4,32,5) and this plastic film layers 7.After this plastic film layers 7 can recline and combines with this three-dimension curved surface plastic layer 2, can by this function film layer 1, this three-dimension curved surface plastic layer 2, this touch control sensor (4,32,5) and this plastic film layers 7 imbed this in-molded jetting mold and carry out one-body molded burying and penetrate.It is worth mentioning that, now the tin indium oxide conductive film of this first sensed layer 4 and this second sensed layer 5 can select material without Merlon as PET (polyethyleneterephthalate, or cyclic olefin polymer (CycloOlefinPolymer PET), etc., but be not limited thereto COP).
Comprehensively above-mentioned, the three-dimensional touch module integral formation method of the present invention's proposition, can for known in-molded (IMF) processing procedure, cannot be one-body molded during use three-dimension curved surface plastic layer (Plasticcover_3D), processing procedure must be increased and improve cost of manufacture and the laminating shortcomings such as qualification rate is wayward are improved, a three-dimensional touch module integral formation method is provided.
Through above-mentioned detailed description, fully showing the progressive that the present invention has enforcement, and be new invention not seen before, meet patent of invention important document completely, files an application in whence in accordance with the law.Only the foregoing is only preferred embodiment of the present invention, when can not in order to limit scope of the invention process, that is the equalization change done according to the scope of the claims of the present invention with modify, all should belong in scope that patent of the present invention contains.
Claims (9)
1. a three-dimensional touch module integral formation method, is characterized in that, comprises the following steps:
There is provided an in-molded jetting mold, a function film layer, a three-dimension curved surface plastic layer and a touch control sensor, wherein this touch control sensor has a scratch resistant sclerosis mold layer, and this touch control sensor comprises a tin indium oxide conductive film;
Remove this scratch resistant sclerosis mold layer on this touch control sensor; And
Utilize this in-molded jetting mold by one-body molded to this function film layer, this three-dimension curved surface plastic layer and this touch control sensor.
2. three-dimensional touch module integral formation method as claimed in claim 1, it is characterized in that, this touch control sensor comprises: one first sensed layer and one second sensed layer, and this first sensed layer is connected with this second sensed layer through a bonding coat, and wherein this bonding coat is optical cement.
3. three-dimensional touch module integral formation method as claimed in claim 1, it is characterized in that, this tin indium oxide conductive film has Merlon.
4. a three-dimensional touch module integral formation method, is characterized in that, comprises the following steps:
There is provided an in-molded jetting mold, a function film layer, a three-dimension curved surface plastic layer and a touch control sensor, wherein this touch control sensor has a scratch resistant sclerosis mold layer, and this touch control sensor comprises a tin indium oxide conductive film;
Coating one then glue in this scratch resistant sclerosis mold layer;
Through this then glue this scratch resistant sclerosis mold layer is connected with this three-dimension curved surface plastic layer; And
Utilize this in-molded jetting mold by one-body molded to this function film layer, this three-dimension curved surface plastic layer and this touch control sensor.
5. three-dimensional touch module integral formation method as claimed in claim 4, it is characterized in that, this touch control sensor comprises: one first sensed layer and one second sensed layer, and this first sensed layer is connected with this second sensed layer through a bonding coat, and wherein this bonding coat is optical cement.
6. three-dimensional touch module integral formation method as claimed in claim 4, it is characterized in that, this tin indium oxide conductive film is without Merlon.
7. a three-dimensional touch module integral formation method, is characterized in that, comprises the following steps:
There is provided an in-molded jetting mold, a function film layer, a three-dimension curved surface plastic layer, a touch control sensor and a plastic film layers, wherein this touch control sensor has a scratch resistant sclerosis mold layer, and this touch control sensor comprises a tin indium oxide conductive film;
A bonding coat is utilized scratch resistant to this plastic film layers and this sclerosis mold layer to be connected;
Utilize this in-molded jetting mold by one-body molded to this function film layer, this three-dimension curved surface plastic layer, this touch control sensor and this plastic film layers.
8. three-dimensional touch module integral formation method as claimed in claim 7, it is characterized in that, this touch control sensor comprises: one first sensed layer and one second sensed layer, and this first sensed layer is connected with this second sensed layer through this bonding coat, and wherein this bonding coat is optical cement.
9. the three-dimensional touch module integral formation method as described in claim 7 or 8, is characterized in that, this tin indium oxide conductive film is without Merlon.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510808076.1A CN105345989A (en) | 2015-11-19 | 2015-11-19 | Integral molding method of three-dimensional touch module |
| TW104143923A TWI546718B (en) | 2015-11-19 | 2015-12-25 | Three - dimensional touch module integrated molding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510808076.1A CN105345989A (en) | 2015-11-19 | 2015-11-19 | Integral molding method of three-dimensional touch module |
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| CN105345989A true CN105345989A (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510808076.1A Pending CN105345989A (en) | 2015-11-19 | 2015-11-19 | Integral molding method of three-dimensional touch module |
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| TW (1) | TWI546718B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106738624A (en) * | 2017-01-16 | 2017-05-31 | 业成科技（成都）有限公司 | The structure of low stress line workpiece and its it is integrally formed preparation method |
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| TW201413512A (en) * | 2012-09-19 | 2014-04-01 | Dongguan Masstop Liquid Crystal Display Co Ltd | Touch display device and touch panel |
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2015
- 2015-11-19 CN CN201510808076.1A patent/CN105345989A/en active Pending
- 2015-12-25 TW TW104143923A patent/TWI546718B/en active
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| CN101414235A (en) * | 2007-10-19 | 2009-04-22 | 宸鸿光电科技股份有限公司 | In-mold moulding touch control module group and producing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106738624A (en) * | 2017-01-16 | 2017-05-31 | 业成科技（成都）有限公司 | The structure of low stress line workpiece and its it is integrally formed preparation method |
| CN106738624B (en) * | 2017-01-16 | 2019-04-09 | 业成科技（成都）有限公司 | The structure and its integrated molding production method of low stress line workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201719353A (en) | 2017-06-01 |
| TWI546718B (en) | 2016-08-21 |
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