CN105345269A - Quartz crystal cutting processing table - Google Patents
Quartz crystal cutting processing table Download PDFInfo
- Publication number
- CN105345269A CN105345269A CN201510701927.2A CN201510701927A CN105345269A CN 105345269 A CN105345269 A CN 105345269A CN 201510701927 A CN201510701927 A CN 201510701927A CN 105345269 A CN105345269 A CN 105345269A
- Authority
- CN
- China
- Prior art keywords
- cutting
- quartz crystal
- raw material
- laser
- draw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The invention discloses a quartz crystal cutting processing table which comprises a workbench, a raw material receiving table, a cutting supporting column, a transverse cutting mechanism and a longitudinal cutting mechanism. The transverse cutting mechanism is arranged on the outer wall of the left side of the cutting supporting column. The longitudinal cutting mechanism is arranged at the bottom of a cutting receiving beam. The quartz crystal cutting processing table is an automatic mechanical cutting processing table, the laser cutting technology is adopted in the table, it can be effectively avoided that quartz crystals crack or are broken in the cutting process due to vibration generated in a traditional cutting processing process. Meanwhile, the processing table can replace manual cutting effectively, the processing speed is increased greatly, and processing efficiency is improved.
Description
Technical field
The present invention relates to quartz crystal processing technique field, be specially a kind of quartz crystal cutting processing platform.
Background technology
Quartz crystal has more than 160 year history, due to the physical property that it is excellent, in national defence, chemical industry, medical treatment, the every field such as machinery play very important effect, due to, quartz crystal is a kind of hard brittle material, easily break under external force, traditional machining mode is difficult to process it efficiently, lack of standardization due to the raw material profile of quartz crystal, need to carry out cutting shaping to it, facilitate follow-up process requirements, because the material of quartz crystal limits, particularly difficult for its cutting processing, high to the technical requirement of staff, not only easily make quartz crystal crack for manually carrying out cutting processing simultaneously, or make it broken, and artificial cutting easily produces deviation for cutting angle, waste is produced to raw material.
Summary of the invention
The object of the present invention is to provide a kind of quartz crystal cutting processing platform, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the invention provides following technical scheme: a kind of quartz crystal cutting processing platform, comprise workbench, raw material adapting table, cutting support column, transverse cutting mechanism and rip cutting mechanism, the intracavity bottom of described workbench is separately installed with main control system and motor supporting table, the top of described motor supporting table is provided with rotary electric machine, the top of described rotary electric machine is provided with rolling disc, the top of described rolling disc is engaged with accepts chassis, the top on described undertaking chassis is fixed with raw material adapting table, the top left of described workbench, right both sides are separately installed with baffle plate and cutting support column, the left side outer wall of described cutting support column is provided with transverse cutting mechanism, the top of described cutting support column is provided with cutting and accepts crossbeam, the top that crossbeam is accepted in described cutting is provided with data analysis processor, the bottom that crossbeam is accepted in described cutting is provided with rip cutting mechanism, described transverse cutting mechanism and rip cutting mechanism include shifting chute, mobile bearing plate, cutter unit accepts draw-in groove, laser adjustment control, cutting raw material calibration probe, laser is polymerized to device, laser cutting head and cutting location-plate, described shifting chute inner chamber arranges mobile bearing plate, described mobile bearing plate inner chamber clamping cutter unit accepts draw-in groove, described cutter unit is accepted bottom draw-in groove and is installed laser adjustment control, bottom described laser adjustment control, laser is installed and is polymerized to device, described laser is polymerized to bottom device and installs laser cutting head and cutting location-plate respectively.
Preferably, the frontal left of described workbench is provided with regulation and control panel.
Preferably, the bottom of described raw material adapting table is provided with overcoat, and its top is also provided with quartz crystal raw material stationary fixture, and the top layer of quartz crystal raw material stationary fixture is provided with rubber pad.
Preferably, described laser adjustment control arranged on left and right sides is all provided with cutting raw material calibration probe.
Preferably, it is clamp connection structure that described shifting chute, mobile bearing plate and cutter unit accept draw-in groove, and its cutter unit undertaking draw-in groove is " work " character form structure.
Compared with prior art, the invention has the beneficial effects as follows: this quartz crystal cutting processing platform, for mechanical automation cutting processing platform, it adopts laser cutting technique, the vibration that the vibration can effectively avoiding traditional cutting processing technique to produce causes quartz crystal to crack in cutting process or fragmentation can effectively avoid traditional cutting processing technique to produce causes quartz crystal to crack in cutting process or fragmentation, this machine table can effectively replace artificial cutting simultaneously, greatly improve process velocity, improve working (machining) efficiency, the cutting raw material calibration that this equipment is installed simultaneously is popped one's head in and cutting location-plate, can effectively cutting raw material be positioned and be calibrated, ensure the accuracy of laser cutting, in addition, the frontal left of workbench is provided with regulation and control panel, staff can be facilitated to regulate and control equipment, the bottom of raw material adapting table is provided with overcoat, prevent laser cutting from damaging workbench, its top is also provided with quartz crystal raw material stationary fixture, make quartz crystal more firmly with stable, and the top layer of quartz crystal raw material stationary fixture is provided with rubber pad, prevent from occurring when fixing quartz crystal damaging, laser adjustment control is left, right both sides are all provided with cutting raw material calibration probe, can effectively calibrate raw material, shifting chute, it is clamp connection structure that mobile bearing plate and cutter unit accept draw-in groove, and its cutter unit undertaking draw-in groove is " work " character form structure, make its shifting chute, connect more stable firm between mobile bearing plate and cutter unit undertaking draw-in groove.
Accompanying drawing explanation
Fig. 1 is Facad structure schematic diagram of the present invention;
Fig. 2 is rip cutting mechanism of the present invention structural representation.
Wherein: 1 workbench, 2 main control systems, 3 regulation and control panels, 4 motor supporting tables, 5 rotary electric machines, 6 rolling discs, 7 accept chassis, 8 raw material adapting tables, 9 baffle plates, 10 cutting support columns, 11 transverse cutting mechanisms, crossbeam is accepted in 12 cuttings, 13 data analysis processor, 14 longitudinal cutting structures, 141 shifting chutes, 142 move bearing plate, 143 cutter units accept draw-in groove, 144 laser adjustment controls, 145 cutting raw material calibration probes, 146 laser are polymerized to device, 147 laser cutting heads, 148 cutting location-plates.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1-2, the invention provides a kind of technical scheme: a kind of quartz crystal cutting processing platform, comprise workbench 1, raw material adapting table 8, cutting support column 10, transverse cutting mechanism 11 and rip cutting mechanism 14, the intracavity bottom of workbench 1 is separately installed with main control system 2 and motor supporting table 4, the frontal left of workbench 1 is provided with regulation and control panel 3, staff can be facilitated to regulate and control equipment, the top of motor supporting table 4 is provided with rotary electric machine 5, the top of rotary electric machine 5 is provided with rolling disc 6, the top of rolling disc 6 is engaged with accepts chassis 7, the top of accepting chassis 7 is fixed with raw material adapting table 8, the bottom of raw material adapting table 8 is provided with overcoat, prevent laser cutting from damaging workbench 1, its top is also provided with quartz crystal raw material stationary fixture, make quartz crystal more firmly with stable, and the top layer of quartz crystal raw material stationary fixture is provided with rubber pad, prevent from occurring when fixing quartz crystal damaging, the top left of workbench 1, right both sides are separately installed with baffle plate 9 and cutting support column 10, the left side outer wall of cutting support column 10 is provided with transverse cutting mechanism 11, the top of cutting support column 10 is provided with cutting and accepts crossbeam 12, the top that crossbeam 12 is accepted in cutting is provided with data analysis processor 13, the bottom that crossbeam 12 is accepted in cutting is provided with rip cutting mechanism 14, transverse cutting mechanism 11 and rip cutting mechanism 14 include shifting chute 141, mobile bearing plate 142, cutter unit accepts draw-in groove 143, laser adjustment control 144, cutting raw material calibration probe 145, laser is polymerized to device 146, laser cutting head 147 and cutting location-plate 148, shifting chute 141 inner chamber arranges mobile bearing plate 142, mobile bearing plate 142 inner chamber clamping cutter unit accepts draw-in groove 143, shifting chute 141, it is clamp connection structure that mobile bearing plate 142 and cutter unit accept draw-in groove 143, and its cutter unit undertaking draw-in groove 143 is " work " character form structure, make its shifting chute 141, connect more stable firm between mobile bearing plate 142 and cutter unit undertaking draw-in groove 143, cutter unit is accepted bottom draw-in groove 143 and is installed laser adjustment control 144, laser adjustment control 144 is left, right both sides are all provided with cutting raw material calibration probe 145, can effectively calibrate raw material, laser is installed bottom laser adjustment control 144 and is polymerized to device 146, laser is polymerized to bottom device 146 and installs laser cutting head 147 and cutting location-plate 148 respectively, this quartz crystal cutting processing platform, for mechanical automation cutting processing platform, it adopts laser cutting technique, the vibration can effectively avoiding traditional cutting processing technique to produce causes quartz crystal to crack in cutting process or fragmentation, this machine table can effectively replace artificial cutting simultaneously, greatly improve process velocity, improve working (machining) efficiency, the cutting raw material that this equipment is installed simultaneously calibrates probe 145 and cutting location-plate 148, can effectively cutting raw material be positioned and be calibrated, ensure the accuracy of laser cutting, during use, quartz crystal raw material is fixed on raw material adapting table 8, .
Although illustrate and describe embodiments of the invention, for the ordinary skill in the art, be appreciated that and can carry out multiple change, amendment, replacement and modification to these embodiments without departing from the principles and spirit of the present invention, scope of the present invention is by claims and equivalents thereof.
Claims (5)
1. a quartz crystal cutting processing platform, comprise workbench (1), raw material adapting table (8), cutting support column (10), transverse cutting mechanism (11) and rip cutting mechanism (14), it is characterized in that: the intracavity bottom of described workbench (1) is separately installed with main control system (2) and motor supporting table (4), the top of described motor supporting table (4) is provided with rotary electric machine (5), the top of described rotary electric machine (5) is provided with rolling disc (6), the top of described rolling disc (6) is engaged with accepts chassis (7), the top of described undertaking chassis (7) is fixed with raw material adapting table (8), the top left of described workbench (1), right both sides are separately installed with baffle plate (9) and cutting support column (10), the left side outer wall of described cutting support column (10) is provided with transverse cutting mechanism (11), the top of described cutting support column (10) is provided with cutting and accepts crossbeam (12), the top that crossbeam (12) is accepted in described cutting is provided with data analysis processor (13), the bottom that crossbeam (12) is accepted in described cutting is provided with rip cutting mechanism (14), described transverse cutting mechanism (11) and rip cutting mechanism (14) include shifting chute (141), mobile bearing plate (142), cutter unit accepts draw-in groove (143), laser adjustment control (144), cutting raw material calibration probe (145), laser is polymerized to device (146), laser cutting head (147) and cutting location-plate (148), described shifting chute (141) inner chamber arranges mobile bearing plate (142), described mobile bearing plate (142) inner chamber clamping cutter unit accepts draw-in groove (143), described cutter unit is accepted draw-in groove (143) bottom and is installed laser adjustment control (144), described laser adjustment control (144) bottom is installed laser and is polymerized to device (146), described laser is polymerized to device (146) bottom and installs laser cutting head (147) and cutting location-plate (148) respectively.
2. a kind of quartz crystal cutting processing platform according to claim 1, is characterized in that: the frontal left of described workbench (1) is provided with regulation and control panel (3).
3. a kind of quartz crystal cutting processing platform according to claim 1, it is characterized in that: the bottom of described raw material adapting table (8) is provided with overcoat, its top is also provided with quartz crystal raw material stationary fixture, and the top layer of quartz crystal raw material stationary fixture is provided with rubber pad.
4. a kind of quartz crystal cutting processing platform according to claim 1, is characterized in that: described laser adjustment control (144) arranged on left and right sides is all provided with cutting raw material calibration probe (145).
5. a kind of quartz crystal cutting processing platform according to claim 1, it is characterized in that: it is clamp connection structure that described shifting chute (141), mobile bearing plate (142) and cutter unit accept draw-in groove (143), and its cutter unit undertaking draw-in groove (143) is " work " character form structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510701927.2A CN105345269A (en) | 2015-10-27 | 2015-10-27 | Quartz crystal cutting processing table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510701927.2A CN105345269A (en) | 2015-10-27 | 2015-10-27 | Quartz crystal cutting processing table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105345269A true CN105345269A (en) | 2016-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510701927.2A Pending CN105345269A (en) | 2015-10-27 | 2015-10-27 | Quartz crystal cutting processing table |
Country Status (1)
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| CN (1) | CN105345269A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834596A (en) * | 2016-06-12 | 2016-08-10 | 佛山市联智新创科技有限公司 | Light guide plate cutting mechanism |
| CN106239311A (en) * | 2016-09-05 | 2016-12-21 | 合肥钰芹信息科技有限公司 | A kind of wafer grinding thinning device |
| CN106769399A (en) * | 2016-11-16 | 2017-05-31 | 河海大学 | The quick location test device in multi-scale rock test specimen axle center and application method |
-
2015
- 2015-10-27 CN CN201510701927.2A patent/CN105345269A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834596A (en) * | 2016-06-12 | 2016-08-10 | 佛山市联智新创科技有限公司 | Light guide plate cutting mechanism |
| CN105834596B (en) * | 2016-06-12 | 2018-03-06 | 武威市锦范工贸有限责任公司 | A kind of light guide plate cutting mechanism |
| CN106239311A (en) * | 2016-09-05 | 2016-12-21 | 合肥钰芹信息科技有限公司 | A kind of wafer grinding thinning device |
| CN106769399A (en) * | 2016-11-16 | 2017-05-31 | 河海大学 | The quick location test device in multi-scale rock test specimen axle center and application method |
| CN106769399B (en) * | 2016-11-16 | 2019-04-30 | 河海大学 | The quick location test device in multi-scale rock test specimen axle center and application method |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160224 |
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| WD01 | Invention patent application deemed withdrawn after publication |