CN105338726A

CN105338726A - Circuit board

Info

Publication number: CN105338726A
Application number: CN201410381821.4A
Authority: CN
Inventors: 博仁嵩; 叶喜扬
Original assignee: Mitac Computer Kunshan Co Ltd; Mitac Technology Corp
Current assignee: Mitac Computer Kunshan Co Ltd; Getac Technology Corp
Priority date: 2014-08-06
Filing date: 2014-08-06
Publication date: 2016-02-17

Abstract

The invention discloses a circuit board. The circuit board comprises a substrate and at least one fixed component; at least one positioning hole is formed in the substrate; the positioning hole is provided with two parallel long edges and two semicircles; the fixed component is arranged on the substrate; the fixed component comprises a locking column and a fixed column; the fixed column is arranged in a protruding manner at one end of the locking column, and the fixed column penetrates through the positioning hole of the substrate correspondingly; the fixed column can be formed by punching and cutting the opposite two sides of a cylinder; and the two side faces of the formed cylinder by punching and cutting are parallel to each other and are correspondingly clamped in the two parallel long edges. The positioning hole and the fixed column can be clamped and fixed correspondingly; through the fixation by the parallel long edges, the rotation of the fixed component relative to the substrate does not occur, so that screws fixedly locked to the locking column can be detached or locked more easily.

Description

Circuit board

[technical field]

The present invention about a kind of circuit board, espespecially a kind of circuit board comprising fixation kit.

[background technology]

When fixing circuit board, gap assembly (standoff) often can be used to carry out the locking of auxiliary circuit board.Height of column because of gap assembly can be used to frame height circuit board, and the electronic building brick on circuit board can not directly be contacted with housing or other circuit boards.And if adopt metal gap assembly, can use as earth point, also can as the circuit of cabling, be used for making to produce between each circuit board to be electrically connected.

Existing gap assembly mostly is cylindric, and forms a cylindric projection in one end of gap assembly, and at the recessed screw part of the other end of gap assembly.When group is established, be the cylindric projection of gap assembly is worn and is fastened on base plate (circuit board or casing), after fixing, go up tin again with fixed interval (FI) assembly.And circuit board is positioned over after on the assembly of gap, utilize screw to pass circuit board and secure in the screw part of gap assembly, whereby with fixing circuit board.

But how columned projection, after permanent use, can produce the phenomenon of detin, that is cannot be engaged mutually with base plate.When user takes off circuit board for screwing off screw, gap assembly and screw is often caused together to rotate, and cannot by screw and gap components apart.Now, need other use instrument to fix gap assembly, gap assembly and screw just can be avoided together to rotate, therefore cause maintenance not easily.Moreover, after gap assembly cannot be engaged mutually with base plate, also likely make gap assembly to be fixed on base plate, and the problem got loose.

[summary of the invention]

In view of this, the object of the invention is to propose a kind of circuit board, convenient during to reach maintenance.

For reaching above-mentioned purpose, the invention provides a kind of circuit board, it comprises: a substrate and at least one fixation kit.Substrate has at least one location hole, and location hole has two parallel long limits and two semi arches, and two ends on two parallel long limits connect semi arch respectively.Fixation kit is arranged on substrate, and fixation kit comprises; One sealed post and a fixed leg.Fixed leg is convexly equipped in one end of sealed post, and correspondence is arranged in the location hole of substrate.Wherein, fixed leg can be cut relative two sides of cylinder by a cylinder through punching and be formed, and the two side faces of the cylinder that punching is whittled into is parallel to each other and correspondence is sticked in two parallel long limits respectively.

By said structure, because the location hole on substrate can mutually correspondingly fix with the fixed leg of fixation kit, and fixing by parallel long limit, fixation kit opposing substrate can not be caused to produce and to rotate.User for pull down another circuit board securing to circuit board carry out replacing or keeping in repair time, can under fast rotary the sealed screw to sealed post to dismantle circuit board.Also due to fixation kit can not and substrate between produce relative rotary motion and the fixed leg of the fixation kit that weares and teares, therefore each fixation kit is also reusable, reduces the manufacture of assembly and waste.Moreover, utilize the punching mode of cutting to make the dual side-edge of the fixed leg of fixation kit form parallel long limit, comparatively simple and easy in manufacture, and be applicable to the processing procedure of the fixation kit of any size.And owing to not needing the die sinking manufacture again in response to the fixation kit of different size, manufacturing cost can be saved in a large number.

For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate institute's accompanying drawings to be described in detail below.

[accompanying drawing explanation]

Fig. 1 is the schematic diagram of first embodiment of the invention circuit board.

Fig. 2 is the upward view of first embodiment of the invention fixation kit.

Fig. 3 is the schematic diagram of first embodiment of the invention substrate processing.

Fig. 4 is the vertical view of first embodiment of the invention location hole.

[embodiment]

Refer to Fig. 1, it is the schematic diagram of first embodiment of the invention circuit board.The circuit board of the present embodiment comprises substrate 10 and a fixation kit 20.Having a location hole 11 on the substrate 10, is for illustrating in the present embodiment, therefore only indicates a location hole 11.In other aspects, also on the substrate 10 according to required quantity and position, multiple location hole 11 can be set.As seen from the figure, two ends that location hole 11 has two parallel long limits 111 and two semi arch 112, two parallel long limits 111 connect a semi arch 112 respectively.

Please refer to the upward view that Fig. 1 and Fig. 2, Fig. 2 are the present embodiment fixation kit.Correspondence is arranged on substrate 10 by fixation kit 20, and fixation kit 20 comprises sealed post 21 and a fixed leg 22.Sealed post 21 is provided with a locking part 211, and locking part 211 can be screw part or grab joint portion etc., optionally secures to the lock-in component in sealed post and determines.The structure that sealed post 21 can be one of the forming with fixed leg 22, if meaning i.e. fixation kit 20 utilizes metal material to make, then can at one end form sealed post 21 one end with a metal cylinder and form fixed leg 22.

Fixed leg 22 to cut relative two sides of a cylinder 221 by cylinder 221 through punching and to be formed.Refer to Fig. 2, for convenience of description, draw cylinder 221 with dashed lines in fig. 2 and rushed the part reamed.Be the cylinder 221 being less than sealed post 21 at one end projection diameter of sealed post 21 in the present embodiment, and the mode utilizing punching to cut rushes relative two sides of cutting cylinder 221, and form the fixed leg 22 with parallel dual side-edge.Certainly, the cutting of cylinder 221 also can use CNC processing procedure, or even die sinking makes, but considers the situation when volume production, and the punching mode of cutting can significantly save manufacturing cost and time.

In addition, for convenience of calculating and the formation of location hole 11 size, can define at this size rushing the fixed leg 22 after cutting further.As shown in Figure 2, if the diameter of fixed leg 22 is Φ 1, and the vertical range between the parallel dual side-edge formed after cutting is d1, then Φ 1 is 4:3 with the length ratio of d1, i.e. Φ 1:d1=4:3.

Then be the schematic diagram of the present embodiment substrate processing please refer to Fig. 1 and Fig. 3, Fig. 3.The processing mode of the location hole 11 on the present embodiment substrate 10 is formed by utilizing bore mode.Namely after using a circular bite 30 to pass perpendicularly through substrate 10, more vertically leave substrate 10 again after moving certain predetermined distance d 2, namely form required location hole 11.For making fixed leg 22 can be matched with location hole 11, the diameter of therefore selected drill bit 30 is that Φ 2, Φ 2 approximates d1.For example, when if desired making fixed leg 22 and location hole 11 close-fitting, Φ 2 can be made to be slightly less than or to equal d1.Now, the vertical range between two parallel long limits 111 of the location hole 11 formed is Φ 2, and the vertical range between the parallel dual side-edge of fixed leg 22 is d1, because Φ 2 approximates d1, so fixed leg 22 can be arranged in location hole 11.

In addition, the predetermined distance d 2 of tapered end 30 movement is the center of circle to drill bit 30 when being positioned at starting point from drill bit 30 center of circle when moving to terminal, the distance between two centre points.Please refer to Fig. 4, it is the vertical view of the present embodiment location hole.As seen from Figure 4, the length on two parallel long limits 111 of location hole 11 is predetermined distance d 2.Similarly, for making fixed leg 22 can be arranged in location hole 11, the predetermined distance d 2 of the required movement of tapered end 30 is the half for Φ 2, i.e. 0.5* Φ 2.Distance between longest edge two end points of thus formed location hole 11 is 1.5* Φ 2.And as shown in Figure 2, the distance between longest edge two end points of fixed leg 22 is Φ 1.Due to Φ 1:d1=4:3, and Φ 2=d1, so 1.5* Φ 2 can be greater than Φ 1, namely make fixed leg 22 can wear in location hole 11, but the ratio of above distance is only for explanation use, not as limit.Also or in another embodiment, Φ 1 equals 3 to 2 with the ratio of d1 is rough, and Φ 2=d1, so 1.5* Φ 2 can slightly equal Φ 1, fixed leg 22 can be worn to location hole 11 and fit completely.

When fixation kit 20 is fixedly held to after on substrate 10 by user, the fixed leg 22 by fixation kit 20 is arranged at after in location hole 11, for strengthening the gap between fixing also recycling scolding tin filling fixed leg 22 and location hole 11.Fixation kit 20 can be fixedly arranged on upper surface or the lower surface of substrate 10, to make to form gap between substrate 10 and other assemblies (as casing or other circuit boards), avoids substrate 10 directly tactile with other attached components.Such as, when substrate 10 will be fixed on casing, fixation kit 20 can be arranged at the lower surface of substrate 10, avoid substrate 10 directly to touch casing with frame height substrate 10.

In addition, refer to Fig. 1, can comprise an electronic building brick 40 at circuit board, electronic building brick 40 is arranged at the upper surface of substrate 10.The sealed post 21 of fixation kit 20 is the homonymies being positioned at electronic building brick 40, and the height of sealed post 21 can be equal to or greater than the height of electronic building brick 40.Because fixation kit 20 is in order to another circuit board or the housing of just locking again on the substrate 10, think and avoid another circuit board or housing directly to touch electronic building brick 40 on substrate 10, namely the height of sealed post 21 needs the height being equal to or greater than electronic building brick 40, to form safe spacing.

By said structure, because the location hole 11 on substrate 10 can mutually correspondingly fix with the fixed leg 22 of fixation kit 20, and fixing by parallel long limit 111, fixation kit 20 opposing substrate 10 can not be caused to produce and to rotate.User for pull down circuit board carry out replacing or keeping in repair time, the screw of sealed post 21 can be secured to dismantle circuit board under fast rotary.Also due to fixation kit 20 can not and substrate 10 between produce relative rotary motion and the fixed leg 22 of the fixation kit 20 that weares and teares.Therefore each fixation kit 20 is also reusable, reduces manufacture and the waste of assembly.Moreover, utilize the punching mode of cutting to make the dual side-edge of the fixed leg 22 of fixation kit 20 form parallel long limit, comparatively simple and easy in manufacture, and be applicable to the processing procedure of the fixation kit of any size.And owing to not needing the die sinking manufacture again in response to the fixation kit of different size, manufacturing cost can be saved in a large number.

Claims

1. a circuit board, is characterized in that, it comprises:

One substrate, has at least one location hole, and this location hole has two parallel long limits and two semi arches, and two ends on this two parallel long limit connect this semi arch respectively; And

At least one fixation kit, be arranged on this substrate, this fixation kit comprises;

One sealed post; And

One fixed leg, this fixed leg is convexly equipped in one end of this sealed post, and correspondence is arranged in this location hole of this substrate, wherein this fixed leg is cut relative two sides of this cylinder by a cylinder through punching and is formed, and the two side faces of this cylinder that punching is whittled into is parallel to each other and correspondence is sticked in this two parallel long limit respectively.

2. circuit board as claimed in claim 1, it is characterized in that, the vertical range between this two side faces is 1.5 times of this cylindrical radius.

3. circuit board as claimed in claim 1, it is characterized in that, the shaft of this fixed leg is matched with this location hole.

4. circuit board as claimed in claim 1, it is characterized in that, the length on these parallel long limits is equal with the radius of this semi arch.

5. circuit board as claimed in claim 1, it is characterized in that, the diameter of this semi arch is equal with the vertical range between this two side faces.

6. circuit board as claimed in claim 1, it is characterized in that, this sealed post of this fixation kit and this fixed leg are one of the forming.

7. circuit board as claimed in claim 1, it is characterized in that, this fixation kit is fixedly arranged on this substrate by a scolding tin.

8. circuit board as claimed in claim 1, it is characterized in that, also comprise at least one electronic building brick and be arranged at this substrate surface, and be positioned at the same side with this sealed post, and the height of this sealed post is equal to or greater than the height of this electronic building brick.