CN105322097B - Organic light emitting module - Google Patents
Organic light emitting module Download PDFInfo
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- CN105322097B CN105322097B CN201510446017.4A CN201510446017A CN105322097B CN 105322097 B CN105322097 B CN 105322097B CN 201510446017 A CN201510446017 A CN 201510446017A CN 105322097 B CN105322097 B CN 105322097B
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- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses an organic light-emitting module which comprises a light-transmitting substrate, a light extraction structure, a first electrode, an organic light-emitting stack, a second electrode and a transparent carrier plate. The light-transmitting substrate has a refractive index greater than 1.5, and has a first surface and a second surface opposite to the first surface. The light extraction structure is disposed on the first surface. The first electrode is disposed on the second surface of the light-transmitting substrate. The organic light emitting stack is disposed on the first electrode. The second electrode is disposed on the organic light emitting stack. The transparent carrier is connected with the light extraction structure, wherein the minimum distance between the light extraction structure and the transparent carrier is less than or equal to 125 micrometers.
Description
Technical field
The invention belongs to organic light emission technical field, and in particular to a kind of organic light emitting module.
Background technology
Organic Light Emitting Diode (OLED) is a kind of response current and launches the photocell of light, and wherein emission layer is
Organic compound film.This layer of organic semiconductor is between being located at two electrodes.In general, in the two electrodes at least its
In an electrode be transparent.
Organic Light Emitting Diode has been applied in for example mobile electricity of video screen, computer display, portable set
Numerical monitor is produced in the equipment such as words, handheld device and personal digital assistant (PDA).Additionally, white light OLED element is used in admittedly
The application of state illumination develops into a Major research field.
In general, Organic Light Emitting Diode has internal quantum high.However, the light launched from emission layer
In, substantial amounts of light is limited in inside Organic Light Emitting Diode.Because substantial amounts of light be limited in organic material and
Within transparency carrier, the external quantum efficiency of Organic Light Emitting Diode is caused to be about 20%.Therefore, internal quantum effect how is improved
Rate is the important development subject under discussion of Organic Light Emitting Diode.
The content of the invention
The present invention provides a kind of organic light emitting module, with the transparent substrates of high index of refraction, matches the refractive index of first electrode,
So that the waveguide mode in organic light emission stacking and the limitation photon of first electrode is reduced or eliminated.Further, since light is extracted
On the first surface of transparent substrates, transparent substrates can be reduced or eliminated structure setting with the total reflection of Air Interface.Additionally,
The reliable space between sealed transparent support plate and transparent cover plate of connector energy, it is anti-that solution high index of refraction substrate to be faced
Water oxygen scarce capacity problem.
The present invention proposes that a kind of organic light emitting module includes transparent substrates, light extraction structure, first electrode, organic light emission heap
Folded, second electrode and transparent carrier plate.The refractive index of transparent substrates is more than 1.5, and with first surface and relative to the first table
The second surface in face.Light extracts structure, is arranged on first surface.First electrode, is arranged on the second surface of transparent substrates.Have
Machine emissive stacks, are set on the first electrode.Second electrode, is arranged on organic light emission heap stacked on.Transparent carrier plate, connection light extraction
The minimum range that structure, wherein light are extracted between structure and transparent carrier plate is less than or equal to 125 microns.
Brief description of the drawings
Figure 1A is a kind of generalized section of organic light emitting module of one embodiment of the invention；
The generalized section that Figure 1B is stacked for the organic light emission of Figure 1A；
Fig. 1 C are the relative position of transparent substrates, transparent cover plate, the first conductive spacer and second conductive spacer of Figure 1A
The upper schematic diagram of relation；
Fig. 2 is another change knot of transparent substrates, transparent cover plate, the first conductive spacer and second conductive spacer of Fig. 1 C
The upper schematic diagram of the relative position relation of structure；
Fig. 3 is a kind of partial cutaway schematic of organic light emitting module of another embodiment of the present invention；
Fig. 4 is a kind of partial cutaway schematic of organic light emitting module of another embodiment of the present invention；
Fig. 5 is a kind of partial cutaway schematic of organic light emitting module of one more embodiment of the present invention；
Fig. 6 is a kind of generalized section of organic light emitting module of another embodiment of the present invention；
Fig. 7 is a kind of generalized section of organic light emitting module of another embodiment of the present invention；
Fig. 8 is a kind of generalized section of organic light emitting module of one more embodiment of the present invention；
Fig. 9 is a kind of generalized section of organic light emitting module of another embodiment of the present invention；
Figure 10 is a kind of generalized section of organic light emitting module of another embodiment of the present invention；
Figure 11 A are a kind of generalized section of organic light emitting module of one more embodiment of the present invention；
Figure 11 B are the lower regarding schematic diagram of the conductive extension of organic light emitting module in Figure 11 A；
Figure 12 is a kind of generalized section of organic light emitting module of another embodiment of the present invention；
Figure 13 A are a kind of generalized section of organic light emitting module in un-flexed state of another embodiment of the present invention；
Figure 13 B are the generalized section of the organic light emitting module in case of bending of Figure 13 A.
【Description of reference numerals】
100、100b、100c、100d、100e、100f、100g、100h、100i、100j、100k、1001：Organic light emission mould
Block
110、110a：Transparent substrates
112：First surface
114：Second surface
116：Inside contract
120、120d、120e、120f、250：Light extracts structure
122、122d：Surface micro-structure
122e：Scattering particles
124e、124f：Medium
130：First electrode
140：Organic light emission is stacked
142：Hole injection layer
144：Hole transmission layer
145：Emission layer
146：Electron transfer layer
148：Electron injecting layer
150、150k：Second electrode
160：Transparent carrier plate
170：Bonding element
170c、170d、170g：Bonding film
180、1801、180h：Transparent cover plate
182：Recess
184h：First through hole
192、192a、192h：First conductive spacer
194、194a、194h：Second conductive spacer
212、232i：First conductive connection element
214、234i：Second conductive connection element
220、260：Connector
262：Barrier element
264：Flexible member
300：Element
W1、W2：Width
L1、L2、L3：Distance
B：Light
S：Space
I-I：Tangent line
Specific embodiment
To make the object, technical solutions and advantages of the present invention become more apparent, below in conjunction with specific embodiment, and reference
Accompanying drawing, the present invention is described in further detail.
Figure 1A is a kind of generalized section of organic light emitting module of one embodiment of the invention, and Figure 1B is organic for Figure 1A's
The generalized section of emissive stacks, and Fig. 1 C are the transparent substrates of Figure 1A, transparent cover plate, the first conductive spacer and second lead
The upper schematic diagram of the relative position relation of electrical pad piece.Referring to Figure 1A, 1B and 1C, the organic light emitting module of the present embodiment
100 include transparent substrates 110, light extraction structure 120, first electrode 130, organic light emission stacking 140, second electrode 150 and
Transparent carrier plate 160.The refractive index of transparent substrates 110 is more than 1.5.Transparent substrates 110 can be deflection substrate.In the present embodiment
In, transparent substrates 110 be as made by organic material, for example, such as PEN (polyethylene
Naphthalate, PEN), its refractive index is 1.76.However, in other embodiments, transparent substrates 110 can be rigid base
Plate, for example, such as glass substrate.Additionally, in this embodiment, transparent substrates 110 have first surface 112 and relative to the
The second surface 114 on one surface 112.Light extraction structure 120 is arranged on first surface 112.
Light extraction structure 120 includes multiple surface micro-structures 122.In this embodiment, surface micro-structure 122 is multiple rows
Arrange into the lenticule of array.However, in other embodiments, surface micro-structure 122 is multiple microprisms for being arranged in array.
In this embodiment, light extraction structure 120 is out of the ordinary formation with transparent substrates 110.For example, light extraction structure 120 can be with
Form or be fixed on the first surface 112 of transparent substrates 110.In addition, transparent material can be coated on first surface 112 and quilt
Printing forms the shape of surface micro-structure 122.However, in other embodiments, light extraction structure 120 is and transparent substrates 110
Integrally formed.
First electrode 130 is arranged on the second surface 114 of transparent substrates 110.Organic light emission stacking 140, is arranged on the
On one electrode 130, second electrode 150 is arranged in organic light emission stacking 140.Organic light emission stacking 140 is included sequentially from first
Hole injection layer 142, hole transmission layer 144, emission layer 145, electron transfer layer of the electrode 130 to the arrangement of second electrode 150
146th, electron injecting layer 148, but the invention is not restricted to this.In certain embodiments, organic light emission stacking 140 can at least not
One layer therein including hole injection layer 142 and electron injecting layer 148.In this embodiment, first electrode 130 is by transparent
Made by conductive material, e.g. tin indium oxide (indium tin oxide, ITO), and second electrode 150 is made of metal.
However, in other embodiments, first electrode 130 with and second electrode 150 by made by transparent conductive material.
Transparent carrier plate 160 is connected to light extraction structure 120.In this embodiment, transparent carrier plate 160 be by glass or its
Made by his appropriate transparent material.In this embodiment, transparent carrier plate 160 is less than with the light extraction minimum range L1 of structure 120
Equal to 125 microns.For example, the summit of light extraction structure 120 is less than or equal to 125 microns with the distance of transparent carrier plate 160.
In other embodiment, minimum range L1 is less than or equal to 30 microns.For example, minimum range L1 is 25.4 microns.Implement herein
In example, it is in the region of light extraction structure 120 that light extraction structure 120 is connected to the link position of transparent carrier plate 160.Specifically
It, organic light emitting module 100 is also comprising the edge and transparent carrier plate 160 of the bonding connection light extraction structure 120 of element 170.However,
In other embodiments, organic light emitting module 100 is not comprising bonding element 170, the light extraction directly contact transparent carrier plate of structure 120
160, therefore, the rough thickness equal to or less than bonding element 170 of minimum range L1.Because bonding element 170 is soft, if
The bonding too thick hole for causing to be filled with surface micro-structure 122 of element 170, the light extraction efficiency of light extraction structure 120 can be reduced.
This is rough identical with the refractive index of light extraction structure 120 due to binding the refractive index of element 170.Therefore, in this embodiment,
Because bonding element 170 is very thin, therefore light extraction structure 120 is micro- less than or equal to 125 with the minimum range L1 of transparent carrier plate 160
Rice, e.g. 30 microns, consequently, it is possible to preferably light extraction efficiency can be reached.In one embodiment, minimum range L1 can be big
In 250 microns.
In this embodiment, the area ratio of bonding element 170 covering light extraction structure 120 is less than 10%, binds element
170 light transmittance is less than 50%.In other words, bonding element 170 can be made with the clear adhesive material that refractive index is 1 to 2
Into.
In this embodiment, light B is emitted from organic light emission stacking 140 and is sequentially passed through first electrode 130, printing opacity
Substrate 110, light extraction structure 120, transparent carrier plate 160 are to be transmitted into outside.In the organic light emitting module 100 of this embodiment,
The refractive index of its transparent substrates 110 is more than 1.5, matches refractive index (the refractive index citing of tin indium oxide ITO of first electrode 130
For 1.9).So that the waveguide mode in organic light emission stacking 140 and the limitation photon of first electrode 130 is reduced or eliminated.This
Outward, because light extraction structure 120 (having surface micro-structure) is arranged on the first surface 112 of transparent substrates 110, transparent substrates
110 can be reduced or eliminated with the total reflection of Air Interface.Therefore, the brightness of organic light emission module 100 can lift 1.3
Times.Therefore, light emission module 100 can turn into high efficiency illumination module.
In this embodiment, organic light emitting module 100 is also connected to transparent carrier plate 160, transparency cover including transparent cover plate 180
Plate 180 have recess 182, accommodate transparent substrates 110, light extraction structure 120, first electrode 130, organic light emission stacking 140 with
And second electrode 150.In this embodiment, organic light emitting module 100 also includes the first conductive spacer 192 and the second conductive spacer
194.First conductive spacer 192 is arranged on transparent carrier plate 160 and is electrically connected to first electrode 130, and second conductive
Pad 194 is arranged on transparent carrier plate 160 and is electrically connected to second electrode 150.At least the one of organic light emitting module 100
(for example, such as Figure 1A is sections of Fig. 1 C along tangent line I-I), the first conductive spacer 192 and the second conductive pad in individual section
The distance between the side close to each other of piece 194 L2 is less than or equal to the width W1 of recess 182, and the first conductive spacer 192
Width W2 with the distance between the second conductive spacer 194 side away from each other L3 more than or equal to transparent cover plate 180.
In this embodiment, the edge of transparent cover plate 180 is engaged by connector 220 with transparent carrier plate 160, citing and
Speech, connector 220 is solid.
In this embodiment, organic light emitting module 100 is also conductively connected including the first conductive connection element 212 and second
Element 214.First conductive connection element 212 connects the first conductive spacer 192 and first electrode 130, and second is conductively connected
Second conductive spacer of the connection of element 214 214 and second electrode 150.In this embodiment, the first conductive connection element 212 and
Second conductive connection element 214 is bonding wire.Because being less than or equal to width W1 apart from L2, bonding wire can easily connect first
Electrode 130 and second electrode 150.Because being more than or equal to width W2 apart from L3, external circuit is, for example, outer lead, can be with
Easily connect first electrode 130 and second electrode 150.In other embodiments, the first conductive connection element 212 and
Second conductive connection element 214 can be conducting resinl or conductive tape.
Fig. 2 is another change knot of transparent substrates, transparent cover plate, the first conductive spacer and second conductive spacer of Fig. 1 C
The upper schematic diagram of the relative position relation of structure.Refer to Fig. 2, in this embodiment, transparent substrates 110a have inside contract 116,
A part of a part of first conductive spacer 192a and the second conductive spacer 194a are extended into and inside contract 116, to increase by first
Conductive spacer 192a and the second conductive spacer 194a and the first conductive connection element 212 and the second conductive connection element 214
Bonding area.
Fig. 3 is a kind of partial cutaway schematic of organic light emitting module of another embodiment of the present invention.Refer to Fig. 3,
The organic light emitting module 100 of the organic light emitting module 100b and Figure 1A of this embodiment is similar, and both difference is as described below.
In organic light emitting module 100b, light extracts structure 120 and the directly contact of transparent carrier plate 160.Light extracts structure 120 and transparent carrier plate
Bonding force between 160 is Van der Waals force or electrostatic force.
Fig. 4 is a kind of partial cutaway schematic of organic light emitting module of another embodiment of the present invention.Refer to Fig. 4,
The organic light emitting module 100 of the organic light emitting module 100c and Figure 1A of this embodiment is similar, and both difference is as described below.This
The organic light emitting module 100c of embodiment includes the bonding element 170 that bonding film 170c replaces Figure 1A.Bonding film 170c connection light
Extraction structure 120 and transparent carrier plate 160.
In this embodiment, the refractive index of bonding film 170c is between 1 to 2.In one embodiment, bind film 170c's
Refractive index of the refractive index less than transparent substrates 110.Additionally, in this embodiment, bonding film 170c light of the covering more than 90% extracts
Take the area of structure 120.In addition, the area of the area less than or equal to transparent substrates 110 of bonding film 170c.Implement one
In example, bonding film 170c complete covering light extraction structure 120.
Fig. 5 is a kind of partial cutaway schematic of organic light emitting module of one more embodiment of the present invention.Refer to Fig. 5,
The organic light emitting module 100c of the organic light emitting module 100d and Fig. 4 of this embodiment is similar, and both difference is as described below.This
The organic light emitting module 100d of embodiment, the surface micro-structure 122d of light extraction structure 120d is the microprism for being arranged in array,
And bonding film 170d connection light extraction structure 120d and transparent carrier plate 160.
Fig. 6 is a kind of generalized section of organic light emitting module of another embodiment of the present invention.Fig. 6 is refer to, this reality
The organic light emitting module 100 for applying the organic light emitting module 100e and Figure 1A of example is similar, and both difference is as described below.Organic
In light emitting module 100e, light extraction structure 120e is diffusion barrier.Diffusion barrier has medium 124e, and multiple scattering particles 122e
It is distributed in medium 124e.Additionally, the bonding connection transparent carrier plate 160 of element 170 extracts the edge of structure 120e with light.
Fig. 7 is a kind of generalized section of organic light emitting module of another embodiment of the present invention.Fig. 7 is refer to, this reality
The organic light emitting module 100e for applying the organic light emitting module 100f and Fig. 6 of example is similar, and both difference is as described below.Organic
In light emitting module 100f, light extraction structure 120f directly contacts transparent carrier plate 160.Explain, light extraction structure 120f tools
A kind of diffusion barrier in thering is scattering particles 122e to be distributed in medium 124f.Medium 124f is therefore the medium as made by sticky stuff
124f can engage transparent substrates 110 with transparent carrier plate 160.
Fig. 8 is a kind of generalized section of organic light emitting module of one more embodiment of the present invention.Fig. 8 is refer to, this reality
The organic light emitting module 100c for applying the organic light emitting module 100g and Fig. 4 of example is similar, and both difference is as described below.This is implemented
The organic light emitting module 100g of example, structure 120e is identical with the diffusion barrier shown in Fig. 6 for light extraction, and bonding film 170g and Fig. 4
Bonding film 170c it is similar, be used to connect light extraction structure 120e and transparent carrier plate 160.
In this embodiment, the refractive index of bonding film 170g is between 1 to 2.In one embodiment, bind film 170g's
Refractive index of the refractive index less than transparent substrates 110.Additionally, in this embodiment, bonding film 170g light of the covering more than 90% extracts
Take the area of structure 120e.In addition, the area of the area less than or equal to transparent substrates 110 of bonding film 170g.It is real one
Apply in example, bonding film 170g complete covering light extracts structure 120e.
Fig. 9 is a kind of generalized section of organic light emitting module of another embodiment of the present invention.Fig. 9 is refer to, this reality
The organic light emitting module 100 for applying the organic light emitting module 100h and Figure 1A of example is similar, and both difference is as described below.This is implemented
In the organic light emitting module 100h of example, (Fig. 9 lifts a first conductive spacer 192h at least one first conductive spacer 192h
Example) be electrically connected to first electrode 130 and by the first through hole 184h through transparent cover plate 180h (Fig. 9 act one first pass through
As a example by through hole 184h).At least one second conductive spacer 194h (Fig. 9 is lifted as a example by a second conductive spacer 194h) are electrically connected with
To second electrode 150 and by the second through hole 186h, through transparent cover plate 180h, (Fig. 9 lifts a second through hole 186h
Example).Therefore, external circuit is, for example, outer lead, it may be connected to the first conductive spacer 192h and the second conductive spacer 194h.
Figure 10 is a kind of generalized section of organic light emitting module of another embodiment of the present invention.Figure 10 is refer to, this
The organic light emitting module 100h of the organic light emitting module 100i and Fig. 9 of embodiment is similar, and both difference is as described below.This reality
Applying the organic light emitting module 100i of example also includes that (Figure 10 lifts first connecting element at least one first conductive connection element 232i
As a example by 232i) and at least one second conductive connection element 234i (Figure 10 is lifted as a example by a second connecting element 234i).First
Conductive connection element 232i connects the first conductive spacer 192h and first electrode 130, and the second conductive connection element 234i connects
Connect the second conductive spacer 194h and second electrode 150.In this embodiment, the first conductive connection element 232i and second is conductive
Connecting element 234i is conductive projection (being exemplified as the projection of indium projection or other suitable low temperature connection process), or Contraphasic is led
Electrolemma.
Figure 11 A are a kind of generalized section of organic light emitting module of one more embodiment of the present invention.Figure 11 B are Figure 11 A
It is lower regarding schematic diagram that the conduction of middle organic light emitting module extends.Referring to Figure 11 A and Figure 11 B, organic hair of this embodiment
Optical module 100j is similar with the organic light emitting module 100h of Fig. 9, and both difference is as described below.The organic light emission of this embodiment
Module 100j also includes multiple first conductive spacer 192h and multiple second conductive spacer 194h.In this embodiment, conduction is prolonged
242 connection the first conductive spacer 192h are stretched, and conductive extension 244 connects the second conductive spacer 194h.
The first conductive spacer 192h of multiple and multiple second conductive spacer 194h make current organic light emission stack 140 distributions
Obtain more dispersed or more unified.In this embodiment, conductive extension 242 is formed in first electrode 130, and conduction extends 244 and formed
In second electrode 150, therefore the dispersiveness or uniformity of the distribution of organic light emission stacking 140 are more strengthened.In other embodiments,
Conduction extends 242 and is arranged on the external circuit board with conductive extension 244, the first conductive spacer 192h and the second conductive spacer 194h
Distinctly extend 242 with conduction to be engaged with conduction extension 244.
Figure 12 is a kind of generalized section of organic light emitting module of another embodiment of the present invention.Figure 12 is refer to, this
The organic light emitting module 100j of the organic light emitting module 100k and Figure 11 A of embodiment is similar, and both difference is as described below.
In this embodiment, organic light emitting module 100k also includes that another light extraction structure 250 is arranged on second electrode 150k.And
And, second electrode 150k is the e.g. tin indium oxide (indium tin oxide, ITO) as made by transparent conductive material.Cause
This, the light B of a part sequentially penetrates first electrode 130, transparent substrates 110, light extraction structure 120f and transparent carrier plate 160
And outside is delivered to, and the light B of another part sequentially penetrates second electrode 150k, light extraction structure 250 and transparency cover
Plate 180h and be delivered to outside.
Figure 13 A are a kind of generalized section of organic light emitting module in un-flexed state of another embodiment of the present invention.
Figure 13 B are the generalized section of the organic light emitting module in case of bending of Figure 13 A.Referring to Figure 13 A and Figure 13 B, this reality
The organic light emitting module 1001 for applying example is similar with the organic light emitting module 100 of Figure 1A, and both difference is as described below.This is implemented
In the organic light emitting module 1001 of example, recess 182 of the transparent cover plate 1801 without such as Figure 1A.However, in other embodiments, thoroughly
Bright cover plate 1801 has the recess 182 such as Figure 1A.And, in this embodiment, organic light emitting module 1001 also includes multiple company
Fitting 260 connects the edge of transparent carrier plate 160 and transparent cover plate 1801.Element 300 represents transparent substrates 110, light extraction knot
Structure 120 (or 120d, 120e, 120f), first electrode 130, organic light emission stacking 140, second electrode 150 (or also include bonding
Element 170 or bonding film 170c, 170d or 170g).Element 300 be arranged on transparent carrier plate 160 and transparent cover plate 1801 it
Between, space S is between the adjacent connector 260 of each two.Due to there is space S between connector 260, connector 260 has foot
Enough geometric distortions.Therefore, the connector 260 of this embodiment can reliable sealed transparent support plate 160 and transparent cover plate 1801
Space.
In this embodiment, (Figure 13 A and 13B is with more including at least one barrier element 262 for a part of connector 260
As a example by individual barrier element 262), (Figure 13 A and 13B is with more including at least one flexible member 264 for the connector 260 of another part
As a example by individual flexible member 264).Barrier element 262 and flexible member 264 are from the edge of transparent cover plate 1801 towards center replacing
Mode is set.Barrier element 262 can stop water, steam, and air, to reduce the degree of oxidation of flexible member 264.And
And, in this embodiment, transparent carrier plate 160 and transparent cover plate 1801 are deflections, and the elasticity of flexible member 264 can subtract
The fracture of few connecting element 260.Due to there is space S between connector 260, connector 260 has enough geometric distortions.
In sum, in a kind of organic light emitting module of one embodiment of the invention, the printing opacity base with refractive index more than 1.5
Plate, matches the refractive index of first electrode.So that the waveguide mode in organic light emission stacking and the limitation photon of first electrode is subtracted
Less or eliminate.Further, since light extracts structure setting on the first surface of transparent substrates, transparent substrates are complete with Air Interface
Reflection can be reduced or eliminated.Therefore, organic light emission module can turn into high efficiency illumination module.Further, since in connector
Between have space, connector has geometric distortion.Therefore, connector can reliable sky between sealed transparent support plate and transparent cover plate
Between.
Particular embodiments described above, has been carried out further in detail to the purpose of the present invention, technical scheme and beneficial effect
Describe in detail bright, it should be understood that the foregoing is only specific embodiment of the invention, be not intended to limit the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements done etc. should be included in protection of the invention
Within the scope of.
Claims (22)
1. a kind of organic light emitting module, including：
Transparent substrates, with first surface and the second surface relative to the first surface, the wherein refractive index of the transparent substrates
More than 1.5；
Light extracts structure, is arranged on the first surface；
First electrode, is arranged on the second surface of the transparent substrates；
Organic light emission is stacked, and is arranged in the first electrode；
Second electrode, is arranged on the organic light emission heap stacked on；
Transparent carrier plate, connects light extraction structure, and the wherein minimum range between light extraction structure and the transparent carrier plate falls
In the range of 25.4 microns to 125 microns；And
Bonding element, is connected between light extraction structure and the transparent carrier plate.
2. organic light emitting module as claimed in claim 1, it is characterised in that light extraction structure is connected to the connection of the transparent carrier plate
Position is in the region of light extraction structure.
3. organic light emitting module as claimed in claim 1, it is characterised in that light extraction structure includes multiple surface micro-structures.
4. organic light emitting module as claimed in claim 3, it is characterised in that the surface micro-structure is that multiple is arranged in the micro- of array
Mirror or microprism.
5. organic light emitting module as claimed in claim 1, it is characterised in that the light extracts structure and is integrated into the transparent substrates
Shape.
6. organic light emitting module as claimed in claim 1, it is characterised in that the light extracts the minimum between structure and the transparent carrier plate
Distance falls in the range of 25.4 microns to 30 microns.
7. organic light emitting module as claimed in claim 1, it is characterised in that light extraction structure is diffusion barrier.
8. organic light emitting module as claimed in claim 1, it is characterised in that also including transparent cover plate, it is connected to the transparent carrier plate,
The transparent cover plate has recess, and the recess accommodates the transparent substrates, light extraction structure, the first electrode, the organic light emission heap
The folded and second electrode.
9. organic light emitting module as claimed in claim 8, it is characterised in that also include：
At least one first conductive spacer, it is electrically connected to the first electrode, and it is saturating to penetrate this by least one first through hole
Bright cover plate；And
At least one second conductive spacer, it is electrically connected to the second electrode, and it is saturating to penetrate this by least one second through hole
Bright cover plate.
10. organic light emitting module as claimed in claim 9, it is characterised in that also include：
At least one first conductive connection element, it connects at least one first conductive spacer and the first electrode；And
At least one second conductive connection element, it connects at least one second conductive spacer and the second electrode.
11. organic light emitting modules as claimed in claim 8, it is characterised in that also include：
First conductive spacer, it is arranged on the transparent carrier plate and is electrically connected to the first electrode；And
Second conductive spacer, it is arranged on the transparent carrier plate and is electrically connected to the second electrode, wherein in organic hair
In at least one section of optical module, between first conductive spacer and second conductive spacer, two sides close to each other
Distance is less than or equal to the width of the recess, and first conductive spacer and second conductive spacer, two sides away from each other
Width of the distance between the face more than or equal to the transparent cover plate.
12. organic light emitting modules as claimed in claim 1, it is characterised in that the bonding element is bonding film, connect light extraction knot
Structure and the transparent carrier plate.
The organic light emitting module of 13. such as claims 12, it is characterised in that the refractive index of the bonding film is less than the transparent substrates
Refractive index.
14. as claim 12 organic light emitting module, it is characterised in that the refractive index of the bonding film is between 1 to 2.
15. as claim 12 organic light emitting module, it is characterised in that the area covering of the bonding film more than 90% the light
Extract the area of structure.
16. as claim 12 organic light emitting module, it is characterised in that the area of the bonding film be less than or equal to the printing opacity base
The area of plate.
17. organic light emitting modules as claimed in claim 1, it is characterised in that the bonding element connects the edge that the light extracts structure
With the transparent carrier plate.
18. as claim 17 organic light emitting module, it is characterised in that the bonding element covering less than 10% the light extract
The area of structure.
19. as claim 18 organic light emitting module, it is characterised in that the light transmittance of the bonding element be less than 50%.
20. organic light emitting modules as claimed in claim 1, it is characterised in that also include：
Transparent cover plate；And
Multiple connectors, connect the edge of the transparent carrier plate and the edge of the transparent cover plate, wherein those adjacent companies of each two
There is a space, and the wherein transparent substrates, light extraction structure, the first electrode, organic light emission heap between fitting
The folded and second electrode, is arranged between the transparent carrier plate and the transparent cover plate.
21. as claim 20 organic light emitting module, it is characterised in that a part those connectors include at least one stop
Part, those connectors of another part include an at least elastic component, and an at least block piece is saturating from this with an at least elastic component
The edge of bright cover plate is staggered towards the transparent cover plate center.
22. organic light emitting modules as claimed in claim 1, it is characterised in that also including another light extraction structure setting this second
On electrode.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/447,626 US9570712B2 (en) | 2014-07-31 | 2014-07-31 | Organic light-emitting module |
| US14/447,626 | 2014-07-31 | ||
| TW104120511 | 2015-06-25 | ||
| TW104120511A TWI552410B (en) | 2014-07-31 | 2015-06-25 | Organic light-emitting module |
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| Publication Number | Publication Date |
|---|---|
| CN105322097A CN105322097A (en) | 2016-02-10 |
| CN105322097B true CN105322097B (en) | 2017-07-07 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109888127B (en) * | 2019-03-19 | 2021-12-21 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| TWI684801B (en) | 2019-04-26 | 2020-02-11 | 國立清華大學 | Light conversion device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498046A (en) * | 2002-10-01 | 2004-05-19 | ��˹���´﹫˾ | Organic luminescent device with enhanced light extraction efficiency |
| JP2011204364A (en) * | 2010-03-24 | 2011-10-13 | Brother Industries Ltd | El light emitting element |
| CN102714894A (en) * | 2010-01-19 | 2012-10-03 | 松下电器产业株式会社 | Surface light emitting device |
| TW201242414A (en) * | 2011-01-25 | 2012-10-16 | Panasonic Corp | Planate light emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101880184B1 (en) * | 2011-02-14 | 2018-07-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Light-emitting device |
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- 2015-07-27 CN CN201510446017.4A patent/CN105322097B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498046A (en) * | 2002-10-01 | 2004-05-19 | ��˹���´﹫˾ | Organic luminescent device with enhanced light extraction efficiency |
| CN102714894A (en) * | 2010-01-19 | 2012-10-03 | 松下电器产业株式会社 | Surface light emitting device |
| JP2011204364A (en) * | 2010-03-24 | 2011-10-13 | Brother Industries Ltd | El light emitting element |
| TW201242414A (en) * | 2011-01-25 | 2012-10-16 | Panasonic Corp | Planate light emitting device |
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Effective date of registration: 20220401 Address after: 26, 1 song Chi Road, Xinyi District, Taipei, Taiwan, China Patentee after: HANNSTAR DISPLAY Corp. Address before: China Taiwan Hsinchu County town of bamboo East Zhongxing Road 4 paragraph 195 Patentee before: Industrial Technology Research Institute |