CN105319855A - Integrated movement structure of glue head and glue tube - Google Patents
Integrated movement structure of glue head and glue tube Download PDFInfo
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- CN105319855A CN105319855A CN201410294868.7A CN201410294868A CN105319855A CN 105319855 A CN105319855 A CN 105319855A CN 201410294868 A CN201410294868 A CN 201410294868A CN 105319855 A CN105319855 A CN 105319855A
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- glue
- sebific duct
- glue head
- bracket
- topworks
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Abstract
The invention relates to semiconductor production devices and particularly discloses an integrated movement structure of glue heads and glue tubes. The structure is arranged inside a glue-coating unit and includes an executing mechanism, the glue tubes, the glue heads and a tray structure. The executing mechanism is arranged at one side of a glue cup. The tray structure is slidably connected to the executing mechanism. The glue tubes are arranged successively on the tray structure in the movement direction. The glue heads which are respectively corresponding to the glue tubes are also arranged on the tray structure. One end of each glue tube is connected to the tray structure and the other end of each glue tube is connected to each corresponding glue head. The tray structure drives the glue tubes and the glue heads to move parallelly to the arrangement direction of the glue tubes. The structure achieves change of a plurality of the glue heads and prevents mutual interference of the glue tubes, thereby improving equipment stability.
Description
Technical field
The present invention relates to the equipment in semiconductor production, specifically a kind of glue head and sebific duct integrated motion structure.
Background technology
Gel developer in semiconductor crystal wafer is produced is inner, and fixing of gluing glue head and being fixedly separated of sebific duct, normally glue head is placed on the platform of movement, and sebific duct root is fixed on fixing platform.In the process changing glue head; glue head moves; the fixed part of sebific duct does not move, and in this case, sebific duct can be caused to twist; interfere between sebific duct and sebific duct; and then produce friction, cause sebific duct damaged, be both unfavorable for equipment stable operation; also can produce dust granules because of the friction of sebific duct, these particles can cause the yield of semiconductor production to decline.
For solving appeal problem, need the distributed architecture of a kind of novel glue head and sebific duct and a kind of novel mode of motion, the interference between avoiding due to sebific duct and fricative problem.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of glue head and sebific duct integrated motion structure, it is inner that this structure is arranged in semiconductor production coating unit, avoids interfering with each other of sebific duct and rub by such structure.
To achieve these goals, the present invention is by the following technical solutions:
A kind of glue head and sebific duct integrated motion structure, described vibrational power flow is inner in coating unit, comprise topworks, sebific duct, glue head and carrier structure, wherein topworks is arranged at the side of glue cup, described carrier structure is connected in topworks, and pass through the driving moving linearly of topworks, described carrier structure is laid with multiple sebific duct successively along direction of motion, described carrier structure is also provided with the glue head that multiple and each sebific duct is corresponding, one end of each sebific duct is connected with carrier structure, other end glue head corresponding thereto connects, described carrier structure is by the driving of topworks, drive sebific duct and glue first edge to be parallel to sebific duct orientation to move.
Described carrier structure comprises sebific duct bracket, overall bracket and glue head bracket, wherein overall bracket is connected in topworks, described sebific duct bracket and glue head bracket are arranged on overall bracket, and one end of described sebific duct is connected with sebific duct bracket, and described glue head is arranged on glue head bracket.
Described each sebific duct is inverted U-shape structure.The orientation of described glue head is parallel with the direction of motion of carrier structure.Described topworks comprises support body, motor, ball-screw and nut, and wherein motor and ball-screw to be arranged on support body and the output terminal of motor is connected with ball-screw, and described nut is connected with ball-screw, and described carrier structure is connected with nut.
Advantage of the present invention and beneficial effect are:
This structure is that coating unit is inner in gel developer, is a kind of structure that multiple photoresist glue changes first watch, applies this integrated motion structure, can realize multiple glue and change first watch, prevent sebific duct from interfering with each other, improve stabilization of equipment performance.
Accompanying drawing explanation
Fig. 1 is one-piece construction schematic diagram of the present invention;
Fig. 2 is the schematic top plan view of one end of the present invention extreme position;
Fig. 3 is the schematic top plan view of other end extreme position of the present invention.
Wherein: 1 is sebific duct bracket, 2 is overall bracket, and 3 is topworks, and 4 is sebific duct, and 5 is glue head, and 6 is glue head bracket, and 7 is glue cup, and 8 is glue cup central point.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figure 1, the present invention is arranged at coating unit inside, and comprise topworks 3, sebific duct 4, glue head 5 and carrier structure, wherein topworks 3 is arranged at the side of glue cup 7, described carrier structure is connected in topworks 3, and described carrier structure is laid with multiple sebific duct 4 successively along direction of motion.Described carrier structure is also provided with the glue head 5 that multiple and each sebific duct 4 is corresponding, one end of each sebific duct 4 is connected with carrier structure, and other end glue head 5 corresponding thereto connects.Described carrier structure drives sebific duct 4 to move along being parallel to sebific duct 4 orientation together with glue head 5.
Described carrier structure comprises sebific duct bracket 1, overall bracket 2 and glue head bracket 6, and wherein overall bracket 2 is slidably connected in topworks 3, and described sebific duct bracket 1 and glue head bracket 6 are arranged on overall bracket 2.Each sebific duct 4 is inverted U-shape structure, and one end of each sebific duct 4 is connected with sebific duct bracket 1, and sebific duct 4 is connected to outside by sebific duct bracket 1 from sebific duct outlet.The other end of each sebific duct 4 is connected with glue head 5, and described glue head 5 is arranged on glue head bracket 6.The orientation of described glue head 5 is parallel with the direction of motion of carrier structure.Overall bracket 2 drives glue head bracket 6 to move together with the sebific duct 4 on it with sebific duct bracket 1 with the glue head 5 on it under the drive of topworks, and the direction of movement is parallel to the orientation of sebific duct 4.Topworks comprises support body, ball-screw, nut and motor, motor is connected with ball-screw and is installed on support body, described overall bracket 2 is connected with ball-screw by nut, and described carrier structure, under the driving of motor, does rectilinear motion by ball-screw and nut.
The course of work of the present invention is:
In semiconductor production process, when needing different photoresists to carry out the work of even glue, required glue head 5 and sebific duct 4 move to the position of the two line by glue cup 7 center of circle under the drive of topworks.At this time, glue head 5 can carry out gluing work at the glue cup central point 8 of glue cup 7 inside, and now because glue head 5 and sebific duct 4 arrangement in alignment, this straight-line pass glue cup central point 8, so can not interfere with other sebific ducts.Be positioned at the limit of sports record position of the glue head 5 at two ends, as shown in Figure 2 and Figure 3.
In the present invention, glue head 5 and sebific duct 4 are in the process of carrying out gluing, can avoid interfering with each other between different glue head and the different sebific ducts be attached thereto.
Claims (5)
1. a glue head and sebific duct integrated motion structure, it is characterized in that: described vibrational power flow is inner in coating unit, comprise topworks (3), sebific duct (4), glue head (5) and carrier structure, wherein topworks (3) is arranged at the side of glue cup (7), described carrier structure is connected in topworks (3), and pass through the driving moving linearly of topworks (3), described carrier structure is laid with multiple sebific duct (4) successively along direction of motion, described carrier structure is also provided with the glue head (5) that multiple and each sebific duct (4) is corresponding, one end of each sebific duct (4) is connected with carrier structure, other end glue head (5) corresponding thereto connects, described carrier structure is by the driving of topworks (3), sebific duct (4) and glue head (5) is driven to move along being parallel to sebific duct (4) orientation together.
2. by glue head according to claim 1 and sebific duct integrated motion structure, it is characterized in that: described carrier structure comprises sebific duct bracket (1), overall bracket (2) and glue head bracket (6), wherein overall bracket (2) is connected in topworks (3), described sebific duct bracket (1) and glue head bracket (6) are arranged on overall bracket (2), one end of described sebific duct (4) is connected with sebific duct bracket (1), and described glue head (5) is arranged on glue head bracket (6).
3., by the glue head described in claim 1 or 2 and sebific duct integrated motion structure, it is characterized in that: described each sebific duct (4) is inverted U-shape structure.
4., by the glue head described in claim 1 or 2 and sebific duct integrated motion structure, it is characterized in that: the orientation of described glue head (5) is parallel with the direction of motion of carrier structure.
5. by the glue head described in claim 1 or 2 and sebific duct integrated motion structure, it is characterized in that: described topworks (3) comprises support body, motor, ball-screw and nut, wherein motor and ball-screw to be arranged on support body and the output terminal of motor is connected with ball-screw, described nut is connected with ball-screw, and described carrier structure is connected with nut.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410294868.7A CN105319855B (en) | 2014-06-25 | 2014-06-25 | Glue head and rubber tube integrated motion structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410294868.7A CN105319855B (en) | 2014-06-25 | 2014-06-25 | Glue head and rubber tube integrated motion structure |
Publications (2)
Publication Number | Publication Date |
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CN105319855A true CN105319855A (en) | 2016-02-10 |
CN105319855B CN105319855B (en) | 2020-02-07 |
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CN201410294868.7A Active CN105319855B (en) | 2014-06-25 | 2014-06-25 | Glue head and rubber tube integrated motion structure |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1625797A (en) * | 2002-04-26 | 2005-06-08 | 东京毅力科创株式会社 | Substrate treatment apparatus |
CN1754247A (en) * | 2003-02-20 | 2006-03-29 | Asml控股股份有限公司 | Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems |
CN101738867A (en) * | 2008-11-07 | 2010-06-16 | 沈阳芯源微电子设备有限公司 | Photoresist conveying device |
CN201815441U (en) * | 2010-08-16 | 2011-05-04 | 广东常青树化工有限公司 | Multi-feeding point adhesive-feeding machine |
CN102266837A (en) * | 2011-06-23 | 2011-12-07 | 上海泓阳机械有限公司 | Reciprocating UV (ultraviolet) adhesive-dripping coating method and device thereof |
CN203044263U (en) * | 2013-02-25 | 2013-07-10 | 杭州德源科技有限公司 | Glue coating machine |
CN203561823U (en) * | 2013-09-23 | 2014-04-23 | 西安神光安瑞光电科技有限公司 | Gluing machine chamber |
-
2014
- 2014-06-25 CN CN201410294868.7A patent/CN105319855B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1625797A (en) * | 2002-04-26 | 2005-06-08 | 东京毅力科创株式会社 | Substrate treatment apparatus |
CN1754247A (en) * | 2003-02-20 | 2006-03-29 | Asml控股股份有限公司 | Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems |
CN101738867A (en) * | 2008-11-07 | 2010-06-16 | 沈阳芯源微电子设备有限公司 | Photoresist conveying device |
CN201815441U (en) * | 2010-08-16 | 2011-05-04 | 广东常青树化工有限公司 | Multi-feeding point adhesive-feeding machine |
CN102266837A (en) * | 2011-06-23 | 2011-12-07 | 上海泓阳机械有限公司 | Reciprocating UV (ultraviolet) adhesive-dripping coating method and device thereof |
CN203044263U (en) * | 2013-02-25 | 2013-07-10 | 杭州德源科技有限公司 | Glue coating machine |
CN203561823U (en) * | 2013-09-23 | 2014-04-23 | 西安神光安瑞光电科技有限公司 | Gluing machine chamber |
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CN105319855B (en) | 2020-02-07 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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