CN105313230A - Semiconductor cutting pure water spraying control system - Google Patents
Semiconductor cutting pure water spraying control system Download PDFInfo
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- CN105313230A CN105313230A CN201410228769.9A CN201410228769A CN105313230A CN 105313230 A CN105313230 A CN 105313230A CN 201410228769 A CN201410228769 A CN 201410228769A CN 105313230 A CN105313230 A CN 105313230A
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- pure water
- control unit
- control system
- unit
- semiconductor cutting
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Abstract
The invention provides a semiconductor cutting pure water spraying control system. The semiconductor cutting pure water spraying control system comprises a central processing unit, a signal control unit, an electronic flowmeter, a pure water filter, a digital temperature control unit and a spraying unit which are communicated through a pure water pipe, wherein the central processing unit is used for sending control instructions; the signal control unit is further electrically connected with the central processing unit and used for generating working instructions according to the control instructions; the electronic flowmeter is further electrically connected with the signal control unit and supplies water according to preset flowmeter pressure when receiving the working instructions. The pure water filter is used for filtering the supplied water. The digital temperature control unit is used for maintaining the filtered pure water at a preset temperature. The spraying unit is used for spraying the pure water at a preset temperature to perform cutting, the pure water transmission is controlled by utilizing the electronic flowmeter, and the pressure of the flowmeter is stabilized through steps of filtering and constant temperature and the like. The semiconductor cutting pure water spraying control system is simple in structure and convenient to maintain, and faults do not occur easily.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, particularly relate to a kind of semiconductor cutting pure water jet control system.
Background technology
The injection of cutting pure water is closed in on-off action release mainly by magnetic valve in traditional cutting pure water ejection control device, the direction that cutting pure water sprays and pure water can be produced reveal under the impact of solenoid closure and hydraulic pressure, easy water clock is at crystal column surface, the dust having cutting generation in ensuing work remains in crystal column surface, causes surface contamination to product.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of semiconductor to cut pure water jet control system, solves the problem that existing pure water cut-sytle pollination defect causes polluting.
For achieving the above object and other relevant objects, the invention provides a kind of semiconductor cutting pure water jet control system, comprising: by the CPU of pure water cross current, signaling control unit, electronic flowmeter, pure water filter, digital temperature control unit and injection unit; Wherein, described CPU, for sending control instruction; Described signaling control unit, is also electrically connected described CPU, for generating work order according to described control instruction; Described electronic flowmeter, is also electrically connected described signaling control unit, in time receiving described work order, supplies water by preset flow pressure; Described pure water filter, for filtering described water supply; Described digital temperature control unit, for remaining on preset temperature by the pure water after described filtration; Described injection unit, for spraying described preset temperature pure water to cut.
Preferably, described injection unit takes the shape of the letter U.
Preferably, described injection unit has at least two, is located at respectively and upper/lower positions also injection relatively.
Preferably, described two injection units are located on same vertical direction.
Preferably, described pure water water pipe is stainless steel.
As mentioned above, the invention provides a kind of semiconductor cutting pure water jet control system, comprising: by the CPU of pure water cross current, signaling control unit, electronic flowmeter, pure water filter, digital temperature control unit and injection unit; Wherein, described CPU, for sending control instruction; Described signaling control unit, is also electrically connected described CPU, for generating work order according to described control instruction; Described electronic flowmeter, is also electrically connected described signaling control unit, in time receiving described work order, supplies water by preset flow pressure; Described pure water filter, for filtering described water supply; Digital temperature control unit, for remaining on preset temperature by the pure water after described filtration; Injection unit, for spraying described preset temperature pure water to cut, by utilizing electronic flowmeter to control pure water transmission, by steps such as filtration, constant temperature, ensure that stationary flow gauge pressure size; This project organization is simple, and it is convenient to safeguard, and not easily breaks down.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of semiconductor cutting pure water jet control system of the present invention.
Detailed description of the invention
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art the content disclosed by this description can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by detailed description of the invention different in addition, and the every details in this description also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.
Refer to Fig. 1, the invention provides a kind of semiconductor cutting pure water jet control system, comprising: by the CPU 1 of pure water cross current, signaling control unit 2, electronic flowmeter 3, pure water filter 4, digital temperature control unit 5 and injection unit 6.
Described CPU 1, for sending control instruction, such as, completes injection for level signal or current signal etc. to open follow-up equipment work.
Described signaling control unit 2, also be electrically connected described CPU 1, for generating work order according to described control instruction, in the present embodiment, described work order refers to the work of opening whole system, thus realize subsequent need, certainly, described work order can be also such as voltage or current signal, carries out in the mode such as triggered, be only illustration herein, all non-as limit.
Described electronic flowmeter 3, is also electrically connected described signaling control unit 2, in time receiving described work order, supplies water by preset flow pressure.In one embodiment, its Stress control gathers pressure signal to realize by pressure sensor.
Described pure water filter 4, for filtering described water supply; Described filtration is the magazine that brings due to pipeline transportation of filtering mainly, avoids the blocking causing described digital temperature control unit 5 and injection unit 6.
Digital temperature control unit 5, for remaining on preset temperature by the pure water after described filtration; Such as complete heating by modes such as electric heating, and gather pure water temperature to realize temperature control by temperature sensor.
Described injection unit 6, for spraying described preset temperature pure water to cut.In one embodiment, described injection unit 6 takes the shape of the letter U; Preferably, described injection unit 6 has at least two, is located at respectively and upper/lower positions also injection relatively; Preferred further, described two injection units 6 are located on same vertical direction.
In sum, the invention provides a kind of semiconductor cutting pure water jet control system, comprising: by the CPU of pure water cross current, signaling control unit, electronic flowmeter, pure water filter, digital temperature control unit and injection unit; Wherein, described CPU, for sending control instruction; Described signaling control unit, is also electrically connected described CPU, for generating work order according to described control instruction; Described electronic flowmeter, is also electrically connected described signaling control unit, in time receiving described work order, supplies water by preset flow pressure; Described pure water filter, for filtering described water supply; Digital temperature control unit, for remaining on preset temperature by the pure water after described filtration; Injection unit, for spraying described preset temperature pure water to cut, by utilizing electronic flowmeter to control pure water transmission, by steps such as filtration, constant temperature, ensure that stationary flow gauge pressure size; This project organization is simple, and it is convenient to safeguard, and not easily breaks down.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (5)
1. a semiconductor cutting pure water jet control system, is characterized in that, comprising: by the CPU of pure water cross current, signaling control unit, electronic flowmeter, pure water filter, digital temperature control unit and injection unit; Wherein,
Described CPU, for sending control instruction;
Described signaling control unit, is also electrically connected described CPU, for generating work order according to described control instruction;
Described electronic flowmeter, is also electrically connected described signaling control unit, in time receiving described work order, supplies water by preset flow pressure;
Described pure water filter, for filtering described water supply;
Described digital temperature control unit, for remaining on preset temperature by the pure water after described filtration;
Described injection unit, for spraying described preset temperature pure water to cut.
2. semiconductor cutting pure water jet control system according to claim 1, it is characterized in that, described injection unit takes the shape of the letter U.
3. semiconductor cutting pure water jet control system according to claim 1, it is characterized in that, described injection unit has at least two, is located at respectively and upper/lower positions also injection relatively.
4. semiconductor cutting pure water jet control system according to claim 3, it is characterized in that, described two injection units are located on same vertical direction.
5. semiconductor cutting pure water jet control system according to claim 1, it is characterized in that, described pure water water pipe is stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410228769.9A CN105313230A (en) | 2014-05-28 | 2014-05-28 | Semiconductor cutting pure water spraying control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410228769.9A CN105313230A (en) | 2014-05-28 | 2014-05-28 | Semiconductor cutting pure water spraying control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105313230A true CN105313230A (en) | 2016-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410228769.9A Pending CN105313230A (en) | 2014-05-28 | 2014-05-28 | Semiconductor cutting pure water spraying control system |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06155450A (en) * | 1992-11-19 | 1994-06-03 | Sumitomo Metal Ind Ltd | Cutting method with multiple wire saw |
| JPH10180750A (en) * | 1996-12-25 | 1998-07-07 | Nippei Toyama Corp | Slurry temperature control device in wire saw |
| CN101518925A (en) * | 2008-02-28 | 2009-09-02 | 株式会社迪思科 | Process waste liquid treatment apparatus |
| CN102672829A (en) * | 2011-03-17 | 2012-09-19 | 苏州赫瑞特电子专用设备科技有限公司 | Control system for precision multi-thread cutting machine |
-
2014
- 2014-05-28 CN CN201410228769.9A patent/CN105313230A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06155450A (en) * | 1992-11-19 | 1994-06-03 | Sumitomo Metal Ind Ltd | Cutting method with multiple wire saw |
| JPH10180750A (en) * | 1996-12-25 | 1998-07-07 | Nippei Toyama Corp | Slurry temperature control device in wire saw |
| CN101518925A (en) * | 2008-02-28 | 2009-09-02 | 株式会社迪思科 | Process waste liquid treatment apparatus |
| CN102672829A (en) * | 2011-03-17 | 2012-09-19 | 苏州赫瑞特电子专用设备科技有限公司 | Control system for precision multi-thread cutting machine |
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Application publication date: 20160210 |