CN105312999A - SFP (stress-free polish) equipment and technological cavity thereof - Google Patents
SFP (stress-free polish) equipment and technological cavity thereof Download PDFInfo
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- CN105312999A CN105312999A CN201410366494.5A CN201410366494A CN105312999A CN 105312999 A CN105312999 A CN 105312999A CN 201410366494 A CN201410366494 A CN 201410366494A CN 105312999 A CN105312999 A CN 105312999A
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- pole groove
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Abstract
The invention provides SFP (stress-free polish) equipment and a technological cavity thereof. The technological cavity comprises a positive pole trough and a negative pole trough, wherein a positive pole trough discharge port is formed in the bottom of the positive pole trough, and the bottom surface of the positive pole trough inclines to the positive pole trough discharge port, so that polishing slurry in the positive pole trough can flow to the positive pole trough discharge port under the effect of gravity; a negative pole trough discharge port is formed in the bottom of the negative pole trough, the bottom surface of the negative pole trough inclines to the negative pole trough discharge port, and accordingly, the polishing slurry in the negative pole trough can flow to the negative pole trough discharge port under the effect of gravity. The technological cavity can promote circulation of the polishing slurry, so that no slurry or less slurry is left in the cavity.
Description
Technical field
The present invention relates to a kind of semiconductor processing equipment, particularly relate to a kind of non-stress polishing equipment and process cavity thereof.
Background technology
Non-stress polishing (SFP, StressFreePolish) is a kind of novel polished semiconductor technique, does not use traditional polishing fluid, without the need to using polishing pad, only uses electrochemical polish liquid capable of circulation.Compared with traditional chemically mechanical polishing (CMP), the cost of polish copper declines to a great extent.And the clearance of non-stress polishing affects little by the crystal phase structure of copper, after annealing process can being placed on non-stress polishing technique, greatly reduces the warpage of silicon chip like this, by integrating with CMP, efficiently solve technology and cost bottleneck that CMP exists.
But in non-stress polishing technical process, electrochemical polish liquid needs to recycle, and in prior art, a kind of suitable mode does not promote the circulation of electrochemical polish liquid.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of non-stress polishing equipment and process cavity thereof, can promote the circulation of polishing fluid, make in cavity without liquid storage or liquid storage less.
For solving the problems of the technologies described above, the invention provides a kind of process cavity of non-stress polishing equipment, comprising:
Positive pole groove, the bottom of described positive pole groove has positive pole groove row mouth, and the lower surface of described positive pole groove tilts to described positive pole groove row mouth, flows to described positive pole groove row mouth under gravity to make the polishing fluid in described positive pole groove;
Negative pole groove, the bottom of described negative pole groove has negative pole groove row mouth, and the lower surface of described negative pole groove tilts to described negative pole groove row mouth, flows to described negative pole groove row mouth under gravity to make the polishing fluid in described negative pole groove.
According to one embodiment of present invention, described positive pole trench bottom has the positive pole collector groove of indent, and described positive pole groove row mouth is positioned at described positive pole collector groove; Described negative pole trench bottom has the negative pole collector groove of indent, and described negative pole groove row mouth is positioned at described negative pole collector groove.
According to one embodiment of present invention, described positive pole groove row's mouth and negative pole groove row mouth are positioned at the same side of described semiconductor technology cavity, and the lower surface of described positive pole groove and negative pole groove flushes and the overall lopsidedness arranging mouth and negative pole groove row mouth to described positive pole groove.
According to one embodiment of present invention, described positive pole groove and negative pole groove one-body molded.
According to one embodiment of present invention, the angle of inclination that the lower surface of described positive pole groove arranges mouth to described positive pole groove is 2 degree to 5 degree, and the angle of inclination that the lower surface of described negative pole groove arranges mouth to described negative pole groove is 2 degree to 5 degree.
Present invention also offers a kind of non-stress polishing equipment, comprise the process cavity described in above-mentioned any one.
Compared with prior art, the present invention has the following advantages:
In the process cavity of the non-stress polishing equipment of the embodiment of the present invention, the lower surface of positive pole groove and negative pole groove tilts towards positive pole groove row's mouth and negative pole groove row mouth respectively, to make polishing fluid in groove can under gravity towards positive pole groove and the flowing of negative pole groove row mouth, make in process cavity without liquid storage or liquid storage less.The program is simple and practical, can promote the circulation of polishing fluid with lower cost.
Accompanying drawing explanation
Fig. 1 is the perspective view of the process cavity of the non-stress polishing equipment of the embodiment of the present invention;
Fig. 2 is the top view of the process cavity of the non-stress polishing equipment of the embodiment of the present invention;
Fig. 3 is the profile of the process cavity of the non-stress polishing equipment of the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with specific embodiments and the drawings, the invention will be further described, but should not limit the scope of the invention with this.
Referring to figs. 1 to Fig. 3, the process cavity of the non-stress polishing equipment of the present embodiment comprises positive pole groove 11 and negative pole groove 12, and wherein, the bottom of positive pole groove 11 has positive pole groove row mouth 111, and the bottom of negative pole groove 12 has negative pole groove row mouth 121.Polishing fluid in positive pole groove 11 can be flowed out by positive pole groove row mouth 111, and the polishing fluid in negative pole groove 12 can be flowed out by negative pole groove row mouth 121.
Positive pole groove 11 and negative pole groove 12 can adopt insulating materials to make.More preferably, the material require of positive pole groove 11 and negative pole groove 12 adopts the material of electrochemically resistant optical polishing corrosion, such as plastics.
The lower surface of positive pole groove 11 tilts to positive pole groove row mouth 111, can add flow speed and direction positive pole groove row mouth 111 under gravity to make the polishing fluid in positive pole groove 11.Similarly, the lower surface of negative pole groove 12 tilts to negative pole groove row mouth 121, can add flow speed and direction negative pole groove row mouth 121 under gravity to make the polishing fluid in negative pole groove 12.
The angle of inclination of the lower surface of positive pole groove 11 and negative pole groove 12 can appropriately adjust according to actual conditions, and preferably, the angle of inclination of the lower surface of positive pole groove 11 and negative pole groove 12 is 2 degree to 5 degree.More preferably, the angle of inclination of the lower surface of positive pole groove 11 and negative pole groove 12 is 2 degree.It should be noted that, " angle of inclination " herein refers to whole process cavity when keeping flat, the lower surface of positive pole groove 11 and negative pole groove 12 and the angle of horizontal plane.
As a preferred embodiment, positive pole groove 11 and negative pole groove 12 adopt integrally moulded.Positive pole groove row's mouth 111 and negative pole groove row mouth 121 can be positioned at the same side of whole process cavity.Under these circumstances, lower surface (comprising the lower surface of positive pole groove 11 and the negative pole groove 12) plane integrally of whole process cavity, overall towards the lopsidedness residing for positive pole groove row's mouth 111 and negative pole groove row mouth 121, angle of inclination can be 2 degree to 5 degree.As shown in Figure 3, the lower surface of whole process cavity tilts towards positive pole groove row's mouth 111 and negative pole groove row's mouth 121 (namely along the direction of arrow in Fig. 3).
Still referring to figs. 1 to Fig. 3, as a preferred embodiment, the bottom of positive pole groove 11 can have the positive pole collector groove 13 of indent, and positive pole groove row mouth 111 is positioned at this positive pole collector groove 13, and the polishing fluid in positive pole groove 11 can collect in positive pole collector groove 13.The lower surface of positive pole groove 11 tilts towards positive pole groove row mouth 111, and correspondingly, the bottom of positive pole groove 11 also tilts towards positive pole collector groove 13, makes the polishing fluid in positive pole groove 11 can add flow speed and direction positive pole collector groove 13 and positive pole groove row mouth 111.More at polishing fluid, cannot by positive pole groove row mouth 111 very first time discharge, polishing fluid can temporarily collect in positive pole collector groove 13, and then gradually by positive pole groove arrange mouth 111 discharge.
Similarly, the bottom of negative pole groove 12 also has the negative pole collector groove (not indicating in figure) of indent, and negative pole groove row mouth 121 is positioned at negative pole collector groove, and the polishing fluid in negative pole groove 12 can collect in negative pole collector groove.The lower surface of negative pole groove 12 tilts towards negative pole groove row mouth 121, and correspondingly, the bottom of negative pole groove 12 also tilts towards negative pole collector groove, makes the polishing fluid in negative pole groove 12 can add flow speed and direction negative pole collector groove and negative pole groove row mouth 121.More at polishing fluid, cannot by negative pole groove row mouth 121 very first time discharge, polishing fluid can temporarily collect in negative pole collector groove, and then gradually by negative pole groove arrange mouth 121 discharge.
In a preferred embodiment, positive pole groove 11 and negative pole groove 12 one-body molded, positive pole groove row mouth 111 and negative pole groove row mouth 121 be positioned at the same side, correspondingly, positive pole collector groove 13 and negative pole collector groove are also positioned at the same side.
The present embodiment additionally provides a kind of non-stress polishing equipment, comprises above-mentioned process cavity and other suitable parts, such as positive pole nozzle, negative pole nozzle, liquid feeding pipeline, drain line etc.
Although the present invention with preferred embodiment openly as above; but it is not for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can make possible variation and amendment, the scope that therefore protection scope of the present invention should define with the claims in the present invention is as the criterion.
Claims (6)
1. a process cavity for non-stress polishing equipment, is characterized in that, comprising:
Positive pole groove, the bottom of described positive pole groove has positive pole groove row mouth, and the lower surface of described positive pole groove tilts to described positive pole groove row mouth, flows to described positive pole groove row mouth under gravity to make the polishing fluid in described positive pole groove;
Negative pole groove, the bottom of described negative pole groove has negative pole groove row mouth, and the lower surface of described negative pole groove tilts to described negative pole groove row mouth, flows to described negative pole groove row mouth under gravity to make the polishing fluid in described negative pole groove.
2. process cavity according to claim 1, is characterized in that, described positive pole trench bottom has the positive pole collector groove of indent, and described positive pole groove row mouth is positioned at described positive pole collector groove; Described negative pole trench bottom has the negative pole collector groove of indent, and described negative pole groove row mouth is positioned at described negative pole collector groove.
3. process cavity according to claim 1, it is characterized in that, described positive pole groove row's mouth and negative pole groove row mouth are positioned at the same side of described semiconductor technology cavity, and the lower surface of described positive pole groove and negative pole groove flushes and the overall lopsidedness arranging mouth and negative pole groove row mouth to described positive pole groove.
4. process cavity according to claim 1, is characterized in that, described positive pole groove and negative pole groove one-body molded.
5. process cavity according to claim 1, is characterized in that, the angle of inclination that the lower surface of described positive pole groove arranges mouth to described positive pole groove is 2 degree to 5 degree, and the angle of inclination that the lower surface of described negative pole groove arranges mouth to described negative pole groove is 2 degree to 5 degree.
6. a non-stress polishing equipment, is characterized in that, comprises the process cavity according to any one of claim 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366494.5A CN105312999A (en) | 2014-07-29 | 2014-07-29 | SFP (stress-free polish) equipment and technological cavity thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366494.5A CN105312999A (en) | 2014-07-29 | 2014-07-29 | SFP (stress-free polish) equipment and technological cavity thereof |
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| CN105312999A true CN105312999A (en) | 2016-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410366494.5A Pending CN105312999A (en) | 2014-07-29 | 2014-07-29 | SFP (stress-free polish) equipment and technological cavity thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109465738A (en) * | 2018-12-10 | 2019-03-15 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of polishing pedestal and polissoir |
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| CN1318207A (en) * | 1998-07-09 | 2001-10-17 | Acm研究公司 | Methods and appts. for electropolishing metal intennections on semiconductor devices |
| US6315883B1 (en) * | 1998-10-26 | 2001-11-13 | Novellus Systems, Inc. | Electroplanarization of large and small damascene features using diffusion barriers and electropolishing |
| US6527920B1 (en) * | 2000-05-10 | 2003-03-04 | Novellus Systems, Inc. | Copper electroplating apparatus |
| US20040065543A1 (en) * | 2002-10-02 | 2004-04-08 | Applied Materials, Inc. | Insoluble electrode for electrochemical operations on substrates |
| CN1585835A (en) * | 2001-11-13 | 2005-02-23 | Acm研究公司 | Electropolishing assembly and methods for electropolishing conductive layers |
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Patent Citations (7)
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| US5865984A (en) * | 1997-06-30 | 1999-02-02 | International Business Machines Corporation | Electrochemical etching apparatus and method for spirally etching a workpiece |
| US6103096A (en) * | 1997-11-12 | 2000-08-15 | International Business Machines Corporation | Apparatus and method for the electrochemical etching of a wafer |
| CN1318207A (en) * | 1998-07-09 | 2001-10-17 | Acm研究公司 | Methods and appts. for electropolishing metal intennections on semiconductor devices |
| US6315883B1 (en) * | 1998-10-26 | 2001-11-13 | Novellus Systems, Inc. | Electroplanarization of large and small damascene features using diffusion barriers and electropolishing |
| US6527920B1 (en) * | 2000-05-10 | 2003-03-04 | Novellus Systems, Inc. | Copper electroplating apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109465738A (en) * | 2018-12-10 | 2019-03-15 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of polishing pedestal and polissoir |
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Application publication date: 20160210 |
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