CN105312771A - Laser equipment for leveling harmonic oscillator with axisymmetric structure and method adopting laser equipment - Google Patents
Laser equipment for leveling harmonic oscillator with axisymmetric structure and method adopting laser equipment Download PDFInfo
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- CN105312771A CN105312771A CN201510839703.8A CN201510839703A CN105312771A CN 105312771 A CN105312771 A CN 105312771A CN 201510839703 A CN201510839703 A CN 201510839703A CN 105312771 A CN105312771 A CN 105312771A
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- harmonic oscillator
- laser
- leveling
- rotary unit
- laser equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Lasers (AREA)
Abstract
The invention discloses laser equipment for leveling a harmonic oscillator with an axisymmetric structure. The laser equipment comprises an excitation probe, a laser vibration measuring instrument, a rotating unit and a processing control unit, wherein the excitation probe is used for enabling the harmonic oscillator to generate resonant response; the laser vibration measuring instrument is used for acquiring resonant frequency of the harmonic oscillator; the harmonic oscillator is fixed on the rotating unit and is located in the same vertical plane with the excitation probe and the laser vibration measuring instrument; the processing control unit is connected with the excitation probe, the laser vibration measuring instrument and the rotating unit and is used for calculating vibrational frequency data transmitted by the laser vibration measuring instrument and rotating angle information of the rotating unit and acquiring points requiring mass removal on the harmonic oscillator. The laser equipment has the advantages that a principal axis and frequency difference of the harmonic oscillator with the axisymmetric structure can be automatically and accurately measured once, and meanwhile, mass leveling can be performed on the harmonic oscillator with the axisymmetric structure.
Description
Technical field
The present invention relates to sensor finishing technology field, be specifically related to a kind of laser equipment of the harmonic oscillator leveling for axially symmetric structure.
Background technology
The harmonic oscillator of existing axially symmetric structure and gyroscope high for the axial symmetry performance requirement of core harmonic oscillator, general mechanical processing tools is difficult to the performance requirement reaching harmonic oscillator; Also therefore, need that harmonic oscillator is obtained to machining and carry out follow-up fine finishining process, remove excess mass, make harmonic oscillator leveling.
At present for above-mentioned finishing step, the mode mainly taked is manually repeated multiple times measurement, calculating, duplicate removal, and which exists many deficiencies: 1, be difficult to the main shaft accurately obtaining harmonic oscillator; 2, gyro needs not stop dismounting, is difficult to the uniformity and the repeatability that ensure measurement axle; 3, easily there is calculation deviation and human error.
Summary of the invention
The object of the present invention is to provide a kind of laser equipment for the leveling of axially symmetric structure harmonic oscillator and method thereof, it disposable automation can accurately measure axially symmetric structure harmonic oscillator main shaft and frequency difference, carries out quality leveling to it simultaneously.
In order to achieve the above object, the present invention is achieved through the following technical solutions:
For a laser equipment for axially symmetric structure harmonic oscillator leveling, it is characterized in that, comprise:
Incentive probe, for making harmonic oscillator generation resonance response;
Laser vibration measurer, for obtaining the resonant frequency of described harmonic oscillator;
Rotary unit, harmonic oscillator is fixed on this rotary unit, and itself and described incentive probe, laser vibration measurer are in same vertical bit-planes;
Processing and control element (PCE), it connects described incentive probe, laser vibration measurer and rotary unit respectively, and it calculates the vibration frequency data of laser vibration measurer transmission and the rotation angle information of rotary unit and obtains described harmonic oscillator needs the point of removal quality.
The above-mentioned laser equipment for the leveling of axially symmetric structure harmonic oscillator, wherein:
Described rotary unit accurately controls described harmonic oscillator and does small rotation along its central shaft.
The above-mentioned laser equipment for the leveling of axially symmetric structure harmonic oscillator, wherein:
Control by piezoelectric actuator the sidewall that described incentive probe knocks described harmonic oscillator, make harmonic oscillator generation resonance response.
The above-mentioned laser equipment for the leveling of axially symmetric structure harmonic oscillator, wherein, also comprises:
Laser instrument, its connect described in processing and control element (PCE), for removing the local quality of described harmonic oscillator; Itself and described incentive probe, laser vibration measurer focus on a bit, and itself and described incentive probe, laser vibration measurer and rotary unit are in same vertical bit-planes.
A leveling method for the laser equipment of axially symmetric structure harmonic oscillator leveling, is characterized in that, comprise following steps:
S1, rotary unit control harmonic oscillator and rotate to an angle;
S2, incentive probe make harmonic oscillator produce resonance response, and laser vibration measurer obtains the vibration frequency of harmonic oscillator;
S3, processing and control element (PCE) record vibration frequency data and rotation angle information, calculate harmonic oscillator simultaneously and whether turn full one week, if Man Yizhou, and jump procedure S4; If less than one week, jump procedure S1;
S4, processing and control element (PCE) calculate the some frequency difference of harmonic oscillator and harmonic oscillator needing to remove quality.
The leveling method of the laser equipment of above-mentioned axially symmetric structure harmonic oscillator leveling, wherein, also comprises after described step S4:
Whether S5, frequency difference meet the demands, if not, jump procedure S6, if so, leveling terminates;
S6, rotary unit control harmonic oscillator and turn to required angle, and laser instrument accurately removes excess mass, jump procedure S1, exchange reef knot fruit and check.
The present invention compared with prior art has the following advantages: it disposable automation can accurately measure axially symmetric structure harmonic oscillator main shaft and frequency difference, carries out quality leveling to it simultaneously.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram for the laser equipment of axially symmetric structure harmonic oscillator leveling in the present invention;
Fig. 2 is leveling method flow chart in the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, by describing a preferably specific embodiment in detail, the present invention is further elaborated.
As shown in Figure 1, a kind of laser equipment for the leveling of axially symmetric structure harmonic oscillator, it comprises: incentive probe 2, for making harmonic oscillator 1, resonance response occurs; Laser vibration measurer 3, for obtaining the resonant frequency of described harmonic oscillator 1; Rotary unit 5, harmonic oscillator 1 is fixed on this rotary unit, and itself and described incentive probe 2, vibration measurement with laser 3 instrument are in same vertical bit-planes; Processing and control element (PCE) 6, it connects described incentive probe 2, laser vibration measurer 3 and rotary unit 5 respectively, and it calculates the vibration frequency data of laser vibration measurer 3 transmission and the rotation angle information of rotary unit 5 and obtains described harmonic oscillator 1 needs the point of removal quality; Laser instrument 4, its connect described in processing and control element (PCE) 6, it under the prerequisite of not loss harmonic oscillator 1 quality factor, can remove its local quality; Itself and described incentive probe 2, laser vibration measurer 3 focus on a bit, and itself and described incentive probe 2, laser vibration measurer 3 and rotary unit 5 are in same vertical bit-planes.
Described rotary unit 5 accurately controls described harmonic oscillator 1 and does small rotation along its central shaft.
Control by piezoelectric actuator the sidewall that described incentive probe 2 knocks described harmonic oscillator 1, make harmonic oscillator 1 that resonance response occur.
In the present embodiment, described rotary unit 5 is motor, and described processing and control element (PCE) 6 is computer control system.
As shown in Figure 2, present invention also offers the leveling method of the laser equipment of a kind of axially symmetric structure harmonic oscillator leveling, it comprises following steps:
S1, rotary unit 5 control harmonic oscillator 1 and rotate 1 °;
S2, incentive probe 2 make harmonic oscillator 1 produce resonance response, and laser vibration measurer 3 obtains the vibration frequency of harmonic oscillator 1;
S3, processing and control element (PCE) 6 record vibration frequency data and rotation angle information, calculate harmonic oscillator 1 simultaneously and whether turn full one week 360 °, if Man Yizhou, and jump procedure S4; If less than one week, jump procedure S1;
S4, processing and control element (PCE) 6 calculate the some frequency difference of harmonic oscillator 1 and harmonic oscillator 1 needing to remove quality;
Whether S5, frequency difference meet the demands, if not, jump procedure S6, if so, leveling terminates;
S6, rotary unit 5 control harmonic oscillator 1 and turn to required angle, and laser instrument 4 accurately removes excess mass, jump procedure S1, exchange reef knot fruit and check, until frequency difference meets target component.
In sum, the present invention comparatively prior art tool have the following advantages:
1. this equipment can Measurement accuracy, the vibrating spindle calculating axially symmetric structure harmonic oscillator, frequency difference and Mass Distribution situation;
2. this equipment according to the result calculating gained, can accurately remove the excess mass of local;
3. this equipment can the disposable process automatically completing measurement, calculating, duplicate removal, there is not alignment error and repeated problem.
4. there is not artificial participation, improve operating efficiency, avoid human error.
Although content of the present invention has done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple amendment of the present invention and substitute will be all apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (6)
1. for a laser equipment for axially symmetric structure harmonic oscillator leveling, it is characterized in that, comprise:
, there is resonance response for making harmonic oscillator (1) in incentive probe (2);
Laser vibration measurer (3), for obtaining the resonant frequency of described harmonic oscillator (1);
Rotary unit (5), harmonic oscillator (1) is fixed on this rotary unit, and itself and described incentive probe (2), vibration measurement with laser (3) instrument are in same vertical bit-planes;
Processing and control element (PCE) (6), it connects described incentive probe (2), laser vibration measurer (3) and rotary unit (5) respectively, and the rotation angle information of its vibration frequency data transmitted laser vibration measurer (3) and rotary unit (5) calculates and obtains the point that described harmonic oscillator (1) needs remove quality.
2., as claimed in claim 1 for the laser equipment of axially symmetric structure harmonic oscillator leveling, it is characterized in that:
Described rotary unit (5) accurately controls described harmonic oscillator (1) and does small rotation along its central shaft.
3., as claimed in claim 1 for the laser equipment of axially symmetric structure harmonic oscillator leveling, it is characterized in that:
Control by piezoelectric actuator the sidewall that described incentive probe (2) knocks described harmonic oscillator (1), make harmonic oscillator (1) that resonance response occur.
4., as claimed in claim 1 for the laser equipment of axially symmetric structure harmonic oscillator leveling, it is characterized in that, also comprise:
Laser instrument (4), its connect described in processing and control element (PCE) (6), for removing the local quality of described harmonic oscillator (1); Itself and described incentive probe (2), laser vibration measurer (3) focus on a bit, and itself and described incentive probe (2), laser vibration measurer (3) and rotary unit (5) are in same vertical bit-planes.
5. a leveling method for the laser equipment of axially symmetric structure harmonic oscillator leveling, is characterized in that, comprises following steps:
S1, rotary unit (5) control harmonic oscillator (1) and rotate to an angle;
S2, incentive probe (2) make harmonic oscillator (1) produce resonance response, and laser vibration measurer (3) obtains the vibration frequency of harmonic oscillator (1);
S3, processing and control element (PCE) (6) record vibration frequency data and rotation angle information, calculate harmonic oscillator (1) simultaneously and whether turn full one week, if Man Yizhou, and jump procedure S4; If less than one week, jump procedure S1;
S4, processing and control element (PCE) (6) calculate the some frequency difference of harmonic oscillator (1) and harmonic oscillator (1) needing to remove quality.
6. the leveling method of the laser equipment of axially symmetric structure harmonic oscillator leveling as claimed in claim 5, is characterized in that, also comprise after described step S4:
Whether S5, frequency difference meet the demands, if not, jump procedure S6, if so, leveling terminates;
S6, rotary unit (5) control harmonic oscillator (1) and turn to required angle, and laser instrument (4) accurately removes excess mass, jump procedure S1, exchange reef knot fruit and check.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510839703.8A CN105312771B (en) | 2015-11-27 | 2015-11-27 | Laser equipment for leveling harmonic oscillator with axisymmetric structure and method adopting laser equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510839703.8A CN105312771B (en) | 2015-11-27 | 2015-11-27 | Laser equipment for leveling harmonic oscillator with axisymmetric structure and method adopting laser equipment |
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| CN105312771A true CN105312771A (en) | 2016-02-10 |
| CN105312771B CN105312771B (en) | 2017-01-25 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111912398A (en) * | 2020-07-15 | 2020-11-10 | 上海航天控制技术研究所 | Device and method for identifying 1-4 harmonic waves of density of axisymmetric harmonic oscillator under atmosphere |
| CN118049979A (en) * | 2024-04-16 | 2024-05-17 | 四川图林科技有限责任公司 | Harmonic oscillator de-duplication leveling and flatness detection method of hemispherical resonator gyroscope |
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| JP2003048091A (en) * | 2001-07-30 | 2003-02-18 | Matsushita Electric Ind Co Ltd | Laser machining device |
| WO2003014667A1 (en) * | 2001-08-10 | 2003-02-20 | Eads Deutschland Gmbh | Method and device for trimming sensors with oscillating structures |
| CN103365099A (en) * | 2012-03-31 | 2013-10-23 | 上海微电子装备有限公司 | Focusing and leveling signal processing method |
| JP2014133242A (en) * | 2013-01-09 | 2014-07-24 | Lps Works Co Ltd | Laser processing method and laser processing device |
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2015
- 2015-11-27 CN CN201510839703.8A patent/CN105312771B/en active Active
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| JP2003048091A (en) * | 2001-07-30 | 2003-02-18 | Matsushita Electric Ind Co Ltd | Laser machining device |
| WO2003014667A1 (en) * | 2001-08-10 | 2003-02-20 | Eads Deutschland Gmbh | Method and device for trimming sensors with oscillating structures |
| CN103365099A (en) * | 2012-03-31 | 2013-10-23 | 上海微电子装备有限公司 | Focusing and leveling signal processing method |
| JP2014133242A (en) * | 2013-01-09 | 2014-07-24 | Lps Works Co Ltd | Laser processing method and laser processing device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111912398A (en) * | 2020-07-15 | 2020-11-10 | 上海航天控制技术研究所 | Device and method for identifying 1-4 harmonic waves of density of axisymmetric harmonic oscillator under atmosphere |
| CN111912398B (en) * | 2020-07-15 | 2022-09-16 | 上海航天控制技术研究所 | Device and method for identifying 1-4 harmonic waves of density of axisymmetric harmonic oscillator under atmosphere |
| CN118049979A (en) * | 2024-04-16 | 2024-05-17 | 四川图林科技有限责任公司 | Harmonic oscillator de-duplication leveling and flatness detection method of hemispherical resonator gyroscope |
| CN118049979B (en) * | 2024-04-16 | 2024-06-18 | 四川图林科技有限责任公司 | Harmonic oscillator de-duplication leveling and flatness detection method of hemispherical resonator gyroscope |
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| CN105312771B (en) | 2017-01-25 |
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