CN105304469A - Polyimide substrate, preparation method of polyimide substrate and flexible displayer - Google Patents

Polyimide substrate, preparation method of polyimide substrate and flexible displayer Download PDF

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Publication number
CN105304469A
CN105304469A CN201510621996.2A CN201510621996A CN105304469A CN 105304469 A CN105304469 A CN 105304469A CN 201510621996 A CN201510621996 A CN 201510621996A CN 105304469 A CN105304469 A CN 105304469A
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polyimide substrate
lignin
polyimide
substrate
preparation
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CN201510621996.2A
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CN105304469B (en
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黄华
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to US15/131,469 priority patent/US10344182B2/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/34—Component parts, details or accessories; Auxiliary operations
    • B29C41/50—Shaping under special conditions, e.g. vacuum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D197/00—Coating compositions based on lignin-containing materials
    • C09D197/005—Lignin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
    • B29K2105/0044—Stabilisers, e.g. against oxydation, light or heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0058—Liquid or visquous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07G—COMPOUNDS OF UNKNOWN CONSTITUTION
    • C07G1/00—Lignin; Lignin derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08H—DERIVATIVES OF NATURAL MACROMOLECULAR COMPOUNDS
    • C08H6/00—Macromolecular compounds derived from lignin, e.g. tannins, humic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/24—Homopolymers or copolymers of amides or imides

Abstract

The invention relates to the field of displayers, and provides a polyimide substrate prepared by lignin, polyimide and a radical initiator through reaction. The lignin contains multiple types of active groups, such as hydroxyl, carboxyl and aromatic bases, etc. The lignin is introduced to a polyimide polymer structure, and the maximum absorption peak of the polymer is enabled to red shift to be less than or equal to 380nm from being less than or equal to 280nm so as to have certain absorption and shielding effect on optical wave in the subsequent laser stripping process, damage to the substrate and liquid crystal in the process of glass substrate laser stripping can be prevented, and display quality of a flexible displayer can be ensured. Besides, the polyimide substrate also has high transparency and excellent thermal stability.

Description

A kind of polyimide substrate, its preparation method and flexible display
Technical field
The present invention relates to field of display, particularly a kind of polyimide substrate, its preparation method and flexible display.
Background technology
Flexible display, is called bendable display or flexible display.It is made up of the material of softness, and primary structure comprises flexible base, board, middle display medium and encapsulation.
Flexible base, board is the important component part of whole flexible display, and its performance all has important impact for the quality of flexible display and life-span.At present, the material that can be used as flexible base, board comprises ultra-thin glass, metal forming or thin polymer film.Thin polymer film can be that poly terephthalic acid is with diol ester, PEN, Merlon, cyclic polyolefin, polyether sulfone and polyimides etc.Wherein, polyimide substrate receives much concern with its excellent high-temperature stability, good mechanical property and excellent chemical-resistant stability.
Polyimide substrate take glass as substrate, polyimide solution or its presoma polyamic acid solution are applied on a glass substrate, then polyimide film is obtained through overcuring, then the assembling of display medium, water barrier to oxygen and encapsulated layer is carried out on polyimide film surface, finally the device of preparation is removed glass substrate through laser lift-off (LLO), thus obtain taking polyimide film as the display of flexible base, board.
But because polyimide substrate does not shield the effect of laser, sealing and curing or employing laser lift-off are removed in the process at the bottom of peeling liner, and the laser easily direct liquid crystal to display floater inside has an impact, the quality of impact display.
Summary of the invention
The invention provides a kind of polyimide substrate, its preparation method and flexible display, described polyimide substrate can absorb≤light of 380nm, effectively prevent the injury for substrate and panel itself liquid crystal in laser lift-off process, guarantee the quality of flexible display.
The invention discloses a kind of preparation method of polyimide substrate, comprise the following steps:
Lignin, polyimides and radical polymerization initiator are dissolved in organic solvent;
The organic solvent obtained after dissolving is coated on glass substrate, in nitrogen atmosphere, is obtained by reacting polyimide substrate.
Preferably, the mass ratio of described lignin, polyimides and radical polymerization initiator is 100:300 ~ 1000:2.
Preferably, described organic solvent is 1-METHYLPYRROLIDONE (NMP), oxolane or toluene.
Preferably, described radical polymerization initiator is benzoyl peroxide, the benzoyl peroxide tert-butyl ester or methyl ethyl ketone peroxide.
Preferably, the temperature of described reaction is 200 ~ 400 DEG C.
Preferably, the time of described reaction is 6 ~ 24 hours.
The invention discloses a kind of polyimide substrate, reacted by lignin, polyimides and radical initiator and make.
Preferably, the mass ratio of described lignin, polyimides and radical polymerization initiator is 100:300 ~ 1000:2.
The invention also discloses a kind of flexible display, comprise the polyimide substrate that described in polyimide substrate described in technique scheme or technique scheme prepared by method.
Compared with prior art, polyimide substrate of the present invention is made up of lignin, polyimides and radical initiator.Because lignin contains various active group, as hydroxyl, carboxyl, aromatic radical etc., be introduced in polyimide polymer structure, make polymer maximum absorption band from being less than or equal to 280 nanometer red shifts to being less than or equal to 380 nanometers, thus for the light wave in post laser stripping process, there is certain absorption and shielding action, prevent the injury for substrate and liquid crystal in laser lift-off glass substrate process, guarantee the display quality of flexible display.In addition, polyimide substrate of the present invention also has high transparent and excellent thermal stability.
Accompanying drawing explanation
Fig. 1 is the flexible display of unstripped glass substrate; Wherein, 1 is glass substrate, and 2 is polyimide substrate;
Fig. 2 is the light transmission figure of polyimide substrate of the present invention.
Embodiment
In order to understand the present invention further, below in conjunction with embodiment, the preferred embodiment of the invention is described, but should be appreciated that these describe just for further illustrating the features and advantages of the present invention, instead of limiting to the claimed invention.
The embodiment of the invention discloses a kind of preparation method of polyimide substrate, comprise the following steps:
Lignin, polyimides and radical polymerization initiator are dissolved in organic solvent, are coated on glass substrate, in nitrogen atmosphere, be obtained by reacting polyimide substrate.
Containing a large amount of active groups in lignin, as hydroxyl, carboxyl, carbonyl, aromatic radical etc., these groups can affect lignin for ultraviolet absorption.After the lignin with these groups is introduced polyimides by the present invention, the maximum absorption band of the polymer of formation is by being less than or equal to 280nm red shift to being less than or equal to 380nm.
In the process preparing flexible display, the wavelength of sealing and curing is about 360nm, and the wavelength in laser lift-off process is about 308nm.The maximum absorption band of the polyimide substrate after the present invention introduces lignin can reach 380nm, can absorb the light wave in sealing and curing or laser lift-off process completely, thus avoids it for the injury of substrate and liquid crystal.
According to the present invention, lignin, polyimides and radical polymerization initiator are dissolved in organic solvent, are coated on glass substrate, in nitrogen atmosphere, be obtained by reacting polyimide substrate.The mass ratio of described lignin, polyimides and radical polymerization initiator is preferably 100:300 ~ 1000:2, is more preferably 100:400 ~ 900:2, and override is 100:450 ~ 650:2.
Described organic solvent is preferably NMP, oxolane or toluene.Described radical polymerization initiator is preferably benzoyl peroxide, the benzoyl peroxide tert-butyl ester or methyl ethyl ketone peroxide.
The temperature of described reaction is preferably 200 ~ 400 DEG C, is more preferably 200 ~ 250 DEG C.
The time of described reaction is preferably 6 ~ 24 hours, is more preferably 6 ~ 8 hours.
The invention also discloses a kind of polyimide substrate, reacted by lignin, polyimides and radical initiator and make.The mass ratio of described lignin, polyimides and radical polymerization initiator is preferably 100:300 ~ 1000:2, is more preferably 100:400 ~ 900:2, and override is 100:450 ~ 650:2.The temperature of described reaction is preferably 200 ~ 400 DEG C, is more preferably 200 ~ 250 DEG C.The time of described reaction is preferably 6 ~ 24 hours, is more preferably 6 ~ 8 hours.
The invention also discloses a kind of flexible display, comprise the polyimide substrate that described in polyimide substrate described in technique scheme or technique scheme prepared by method.The present invention is not particularly limited for substantially preparing by polyimides the method forming flexible display, prepares according to method well known to those skilled in the art.
In order to understand the present invention further, be described in detail to polyimide substrate provided by the invention, its preparation method and flexible display device below in conjunction with embodiment, protection scope of the present invention is not limited by the following examples.
The lignin of use of the present invention is commercially available prod.
Embodiment 1
100 grams of lignin, 450 grams of polyimides and 2 grams of peroxidating formyls are dissolved in NMP, after uniform solution to be formed, by coating equipment by described solution coating on a glass substrate, pass into nitrogen in equipment simultaneously and remove oxygen, 200 DEG C of reactions 6 hours, obtain polyimide substrate.
Test the absorbing properties of the polyimide substrate obtained and the transparency, result is see Fig. 2.Fig. 2 is the light transmission figure of polyimide substrate of the present invention.As shown in Figure 2, the polyimide substrate after the present invention's lignin modification than the common maximum absorption band of polyimide substrate without any doping from being less than or equal to 280 nanometer red shifts to being less than or equal to 380 nanometers.And there is high transparent, in visible-range, transmitance reaches more than 85%.
Embodiment 2
100 grams of lignin, 500 grams of polyimides and 2 grams of peroxidating formyls are dissolved in oxolane, after uniform solution to be formed, by coating equipment by described solution coating on a glass substrate, pass into nitrogen in equipment simultaneously and remove oxygen, 250 DEG C of reactions 8 hours, obtain polyimide substrate.
Embodiment 3
100 grams of lignin, 800 grams of polyimides and 2 grams of peroxidating formyls are dissolved in toluene, after uniform solution to be formed, by coating equipment by described solution coating on a glass substrate, pass into nitrogen in equipment simultaneously and remove oxygen, 300 DEG C of reactions 24 hours, obtain polyimide substrate.
The explanation of above embodiment just understands method of the present invention and core concept thereof for helping.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improve and modify and also fall in the protection range of the claims in the present invention.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims (9)

1. a preparation method for polyimide substrate, is characterized in that, comprises the following steps:
Lignin, polyimides and radical polymerization initiator are dissolved in organic solvent,
The organic solvent obtained after dissolving is coated on glass substrate, in nitrogen atmosphere, is obtained by reacting polyimide substrate.
2. preparation method according to claim 1, is characterized in that, the mass ratio of described lignin, polyimides and radical polymerization initiator is 100:300 ~ 1000:2.
3. preparation method according to claim 2, is characterized in that, described organic solvent is 1-METHYLPYRROLIDONE, oxolane or toluene.
4. preparation method according to claim 3, is characterized in that, described radical polymerization initiator is benzoyl peroxide, the benzoyl peroxide tert-butyl ester or methyl ethyl ketone peroxide.
5. the preparation method according to Claims 1 to 4 any one, is characterized in that, the temperature of described reaction is 200 ~ 400 DEG C.
6. the preparation method according to Claims 1 to 4 any one, is characterized in that, the time of described reaction is 6 ~ 24 hours.
7. a polyimide substrate, is characterized in that, described polyimide substrate is reacted by lignin, polyimides and radical initiator to be made.
8. polyimide substrate according to claim 7, is characterized in that, the mass ratio of described lignin, polyimides and radical polymerization initiator is 100:300 ~ 1000:2.
9. a flexible display, comprises the polyimide substrate that described in polyimide substrate described in claim 7 or 8 or claim 1 ~ 6 any one prepared by method.
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US15/131,469 US10344182B2 (en) 2015-09-25 2016-04-18 Polyimide substrate and method for preparing the same, and flexible display

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Cited By (3)

* Cited by examiner, † Cited by third party
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CN108957955A (en) * 2018-08-13 2018-12-07 深圳市华星光电半导体显示技术有限公司 W color blocking and preparation method thereof, array substrate
CN111344130A (en) * 2017-06-08 2020-06-26 日产化学株式会社 Method for manufacturing substrate for flexible device
CN115011315A (en) * 2022-06-14 2022-09-06 华南理工大学 Preparation and application of flexible electronic biomass/polyimide-based heat-dissipation material film

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