CN105298776A - Self-driven folding grid structure - Google Patents
Self-driven folding grid structure Download PDFInfo
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- CN105298776A CN105298776A CN201510815389.XA CN201510815389A CN105298776A CN 105298776 A CN105298776 A CN 105298776A CN 201510815389 A CN201510815389 A CN 201510815389A CN 105298776 A CN105298776 A CN 105298776A
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- marmem
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- extension member
- end node
- folding
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- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 20
- 238000005057 refrigeration Methods 0.000 claims description 47
- 230000008676 import Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000000956 alloy Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- 101000629937 Homo sapiens Translocon-associated protein subunit alpha Proteins 0.000 description 6
- 101000697347 Homo sapiens Translocon-associated protein subunit gamma Proteins 0.000 description 6
- 102100026231 Translocon-associated protein subunit alpha Human genes 0.000 description 6
- 102100028160 Translocon-associated protein subunit gamma Human genes 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 101000629913 Homo sapiens Translocon-associated protein subunit beta Proteins 0.000 description 3
- 101000629921 Homo sapiens Translocon-associated protein subunit delta Proteins 0.000 description 3
- 102100026229 Translocon-associated protein subunit beta Human genes 0.000 description 3
- 102100026226 Translocon-associated protein subunit delta Human genes 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000007710 freezing Methods 0.000 description 3
- 230000008014 freezing Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004801 process automation Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
The invention discloses a self-driven folding grid structure. The self-driven folding grid structure comprises upper end joints, lower end joints, shear type units and drive units, wherein the shear type units are connected between the upper end joints and the lower end joints, and the drive units drive the shear type units to be folded. Each upper end joint comprises four two-rod connecting pieces, four three-rod connecting pieces and a four-rod connecting piece, and each lower end joint comprises four two-rod connecting pieces, four three-rod connecting pieces and a four-rod connecting piece. Each installing faces of the three shear type units is formed by the corresponding three-rod connecting piece, the corresponding two-rod connecting pieces on the two sides and the corresponding center four-rod connecting piece. The installing face of each shear type unit is provided with a shear type unit. Each drive unit comprises a shape memory alloy telescopic piece and a semiconductor refrigerating piece heating and refrigerating reversing circuit. The beneficial effect that shape memory alloy is large in driving force is involved in the shape memory alloy driving folding grid structure, the defects that during folding and unfolding of the folding grid structure, labor force is consumed, and inconvenience is brought are overcome, and the self-driven folding grid structure can be circularly used many times. A solution is provided for the problem that folding and unfolding are not convenient during application of the folding grid structure.
Description
Technical field
The present invention relates to the folding latticed frame structure that a kind of marmem be made up of niti-shaped memorial alloy spring, scissors unit, two joint element for bar, three joint element for bar, four joint element for bar, semiconductor refrigeration chip heating refrigeration commutating circuit drives, be applicable to the folding of general folding latticed frame structure and expansion process.
Background technique
Folding latticed frame Mechanical Builds is novel, and folding exhibition is convenient, is convenient to transport and storage, reusable.In the modern life, it has purposes widely, as the greenhouse etc. of emergency rescue service tent, tents, temporary booths, Reusability.In aerospace industry, folding latticed frame structure more demonstrates powerful vitality with the performance of its uniqueness, as made the skeleton of space station, radar antenna, the folding wing and chord member etc.General folding latticed frame structure is folding is manual operation with expansion mode, not only waste time and energy, and folding and expanding is not convenient, is unfavorable for transport, weakens to some extent in occasion applicabilities such as disaster areas; Folding latticed frame structure is a Multipoint Drive system, has multiple driver element, as carried out drived control to it, needs one and improve accurate control system during folding and expanding, if the synchronism driven is bad, just there will be and wanders off or draw askew phenomenon.
The marmem that the present invention proposes drives folding latticed frame structure, achieves folding latticed frame structure and folds the automation with expansion process, save manpower, provide condition for folding latticed frame structure is applied to multiple occasion better; And shape memory alloy spring is arranged relative to folding latticed frame symmetrical configuration, each several part is stressed is also symmetrical, therefore can ensure the synchronism of each driver element in deployment lifting process.
Marmem is the alloy having " memory " effect, and why it has recoverable force ability, is because the thermoelastic martensitic transformation that in deformation process, material internal occurs.According to different heating power loading conditions, marmem presents two kinds of performances: shape memory effect, pseudoelasticity, has many application in every field.Utilize the characteristic of marmem, driving effect can be produced, fold and expansion process automation for realizing folding latticed frame structure: when folding latticed frame structure is launched, the Ultimum Ti spring of double process shape-memory effect relies on semiconductor refrigeration chip heating refrigeration commutating circuit to heat up to it, when rising to anti-phase height temperature (80 DEG C) by room temperature (20 DEG C), alloy spring automatically will extend and constantly return to predetermined length, drives scissors unit to launch; When folding latticed frame structure folds, temperature is dropped to room temperature (20 DEG C), alloy spring will shorten to the original length automatically, drives scissors unit to gather.Folding latticed frame structure can be realized accordingly folding and launching freely changing between different conditions.
Semiconductor refrigeration chip heating refrigeration commutating circuit is the commutating circuit formed with four DC solid-state relays, its essence is electronic switch.Export two kinds of signals from control instrument, one is heating signal, and one is cooling signals.When inputting heating signal, DC solid-state relay SSR1 and SSR3 conducting, supply voltage is through OUT+, OUT-of SSR1, and the black end of refrigerating sheet, red end, OUT+, OUT-of SSR3 hold ground, make refrigerating sheet at heated condition.When freezing, DC solid-state relay SSR2 and SSR4 conducting.
On the basis inheriting marmem and folding latticed frame structural advantages, the present invention proposes the folding latticed frame structure that marmem drives, shape memory alloy spring is acted on the scissors unit of folding latticed frame structure, than traditional folding latticed frame structure, the automation of rack deployment lifting process can be realized, and semiconductor refrigeration chip heating refrigeration commutating circuit use semiconductor refrigerating sheet work time do not shake, noise, life-span are long, install easily, be easy to promote, be applicable in general folding latticed frame structure; The folding latticed frame structure that marmem drives can carry out folding and an expansion process at any time, can launch easily, provide open space when needs use, and not needing can fold easily when using, taking up space few, being convenient to transport and storing.
Summary of the invention
Goal of the invention: realize Automatic-expanding and folding process to make folding latticed frame structure, the program can not only reduce the manpower consumption in folding and expanding folding latticed frame configuration process, and semiconductor refrigerating sheet to have working state good, be easy to install, refrigeration and heat-production functions can be realized simultaneously, the advantages such as the cooling and heating time is fast, large-scale folding latticed frame structure is made to be applied to each place better, also combine the advantage of marmem and folding latticed frame structure, evade folding latticed frame folding not convenient with expansion process, not smooth, the shortcoming such as asynchronous, achieve the Collaboration of two kinds of different structures, the road that has been simultaneously the applications expanding of marmem in field of civil engineering.
Technological scheme: for achieving the above object, the technical solution used in the present invention is:
A kind of self-driven folding latticed frame structure, it is characterized in that: comprise end node, lower end node, be connected to the scissors unit between end node and lower end node and drive the driver element of described scissors units folded, described upper end node and lower end node include four two joint element for bar, four three joint element for bar and four joint element for bar, described four two joint element for bar are distributed on foursquare four angles, described three joint element for bar are distributed on the mid point on described foursquare every bar limit, described four joint element for bar are positioned at described foursquare center, two joint element for bar of each three joint element for bar and both sides and four joint element for bar at center form the attachment face of three scissors unit, described scissors unit is 12, the attachment face of described each scissors unit installs a described scissors unit, described driver element comprises marmem extension member and semiconductor refrigeration chip heating refrigeration commutating circuit, described marmem extension member is 24, a described marmem extension member is set respectively between two ends of each scissors unit at upper end node and two ends at lower end node, described semiconductor refrigeration chip heating refrigeration commutating circuit one end is connected to upper end node center and is connected with the 12 marmem extension members being positioned at upper end node for heating or freeze described marmem extension member, the other end of described semiconductor refrigeration chip heating refrigeration commutating circuit is connected to lower end node center and is connected with the 12 marmem extension members being positioned at lower end node for heating or freeze described marmem extension member.
The end of described scissors unit is provided with auricle, the end of described marmem extension member is provided with the collar, the two ends of described marmem extension member are connected to the different auricle places of same scissors unit respectively by bearing pin pin joint.
Described marmem extension member is connected by insulating tape looping with electrit silk side by side by shape memory alloy spring, and described semiconductor refrigeration chip heating refrigeration commutating circuit and electrit silk are connected to form current loop.
In every root marmem extension member of upper end nodal plane, the current loop of electrit silk flows to as from the inside to the outside, in every root marmem extension member of upper end nodal plane, the current loop of electrit silk flows to as from outside to inside, and upper end electric current imports lower current at edge mid-points place with vertical wire.
Semiconductor refrigeration chip heating refrigeration commutating circuit is the commutating circuit formed with four DC solid-state relays, its essence is electronic switch.Export two kinds of signals from control instrument, one is heating signal, and one is cooling signals.When inputting heating signal, DC solid-state relay SSR1 and SSR3 conducting, supply voltage is through OUT+, OUT-of SSR1, and the black end of refrigerating sheet, red end, OUT+, OUT-of SSR3 hold ground, make refrigerating sheet at heated condition.When freezing, DC solid-state relay SSR2 and SSR4 conducting.
Marmem of the present invention drives folding latticed frame structure, by niti-shaped memorial alloy spring, scissors unit, two joint element for bar, three joint element for bar, four joint element for bar, semiconductor refrigeration chip heating refrigeration commutating circuit six part composition, niti-shaped memorial alloy spring in the upper and lower level of scissors unit between two ends, the collar of niti-shaped memorial alloy spring is connected by bearing pin pin joint with the auricle of scissors unit, folding latticed frame structure is by two joint element for bar, three joint element for bar, four joint element for bar are combined into a mechanical structure, semiconductor refrigeration chip heating refrigeration commutating circuit is utilized to be heated up and operation of lowering the temperature to niti-shaped memorial alloy spring by electrit silk, change its length, it is made to produce larger driving force, the relative movement of scissors unit is driven by auricle, macro manifestations is the folding of folding latticed frame structure and expansion process.
Beneficial effect:
The marmem that the present invention proposes drives folding latticed frame structure, by niti-shaped memorial alloy spring action in folding latticed frame structure, the driving force produced when recovering deformation by shape memory alloy spring drives scissors unit, drives the folding of folding latticed frame structure and launches.Realize the automation of rack deployment lifting process, and semiconductor refrigeration chip heating refrigeration commutating circuit use semiconductor refrigerating sheet work time do not shake, noise, life-span are long, install easily, be easy to promote, be applicable in general folding latticed frame structure; The folding latticed frame structure that marmem drives can carry out folding and expansion process at any time, can launch easily, provide open space when needs use, and not needing can fold easily when using, taking up space few, being convenient to transport and storing.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the schematic diagram of semiconductor refrigeration chip heating refrigeration commutating circuit;
Fig. 3 is the schematic diagram of scissors unit;
Fig. 4 is the schematic diagram of niti-shaped memorial alloy spring;
Fig. 5 is the schematic top plan view of folding latticed frame structure top planar current loop;
Fig. 6 is the schematic top plan view of folding latticed frame structure bottom planar current loop;
Fig. 7 is the schematic diagram of shape memory alloy spring and two bar joints;
Fig. 8 is the schematic diagram of shape memory alloy spring and three bar joints;
Fig. 9 is the schematic diagram of shape memory alloy spring and four bar joints;
Figure 10 is the schematic diagram after marmem drives folding latticed frame structure to draw in.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further described.
As shown in Figure 1, marmem drives folding latticed frame structure, is made up of niti-shaped memorial alloy extension member 1, scissors unit 2, two joint element for bar 3, three joint element for bar 4 and four joint element for bar 5.Wherein: niti-shaped memorial alloy extension member 1 is 24, scissors unit 2 is 12, and two joint element for bar 3 are eight, and three joint element for bar 4 are eight, and four joint element for bar 5 are two; Niti-shaped memorial alloy extension member 1 two ends are socketed in the diverse location of same scissors unit 2 respectively, folding latticed frame structure eight corner points are connected the scissors unit 2 in Different Plane by two joint element for bar 3, folding latticed frame structure eight seamed edge midpoint connect three orthogonal scissors unit 2 by three joint element for bar 4, and in folding latticed frame structure, end face is connected four orthogonal scissors unit 2 with the center of bottom surface by four joint element for bar 5.Marmem extension member 1 can realize folding latticed frame structure and fold and expansion process automation: when folding latticed frame structure is launched, the Ultimum Ti extension member 1 of double process shape-memory effect relies on semiconductor refrigeration chip heating refrigeration commutating circuit to be heated up to it by electrit silk, when rising to anti-phase height temperature (80 DEG C) by room temperature (20 DEG C), marmem extension member 1 automatically will extend and constantly return to predetermined length, drives scissors unit 2 to carry out; When folding latticed frame structure folds, temperature is dropped to room temperature (20 DEG C) by semiconductor refrigeration chip heating refrigeration commutating circuit, and alloy extension member 1 will shorten to the original length automatically, drives scissors unit 2 to gather.Folding latticed frame structure can be realized accordingly folding and launching freely changing between different conditions.Fig. 2 is the schematic diagram of semiconductor refrigeration chip heating refrigeration commutating circuit, semiconductor refrigeration chip heating refrigeration commutating circuit 6 is the commutating circuit formed with four DC solid-state relays, when exporting heating signal, DC solid-state relay SSR1 and SSR3 conducting, supply voltage through OUT+, OUT-of SSR1, the black end of refrigerating sheet, red end, OUT+, OUT-of SSR3 hold ground, make refrigerating sheet at heated condition.When freezing, DC solid-state relay SSR2 and SSR4 conducting.Fig. 3 is the schematic diagram of scissors unit 2, and scissors unit four end is furnished with annular auricle 8, for being connected by bearing pin pin joint with the collar 7 in the memory alloy extension member 1 in Fig. 3.Fig. 4 is the schematic diagram of niti-shaped memorial alloy extension member 1, and both ends of the spring respectively has a collar 7, is connected by bearing pin pin joint with the auricle 8 in scissors unit 2.Memory alloy extension member 1 is formed by connecting by insulating tape looping side by side by shape memory alloy spring and electrit silk 9, utilizes the thermal conductivity of electrit silk 9 to affect shape memory alloy spring, and memory alloy spring deformation drives the deformation of electrit silk 9, and the two compatibility of deformation is synchronous.Insulating tape winding will bond closely knit, prevents moisture from invading.Fig. 5 is the schematic diagram of folding latticed frame structure top planar current loop, the current loop of upper layer plane flows to as from the inside to the outside, semiconductor refrigeration chip heating refrigeration commutating circuit flows out the electric current of four branches from centre, folding of turning right after respective arrival length of side mid point arrives the mid point of another side for twice, is more vertically connected to the length of side midpoint of lower floor by wire.Fig. 6 is the schematic diagram of folding latticed frame structure bottom planar current loop, the current loop of lower layer plane flows to as from outside to inside, upper strata electric current is flowed into from lower floor's each limit mid point by wire, transfers twice to the right to underlying layers midpoint, finally flows back to again in semiconductor refrigeration chip heating refrigeration commutating circuit.Fig. 7 is the schematic diagram of shape memory alloy spring and two bar joints, is positioned at the corner point of folding latticed frame structure, is connected to two different scissors unit planes.Fig. 8 is the schematic diagram of shape memory alloy spring and three bar joints, is positioned at the seamed edge midpoint of folding latticed frame structure, is connected to three scissors unit planes.Fig. 9 is the schematic diagram of shape memory alloy spring and four bar joints, is positioned at the center of end face and bottom surface in folding latticed frame structure, is connected to four scissors unit planes.Figure 10 is the schematic diagram after shape memory alloy spring drives folding latticed frame folding structures, and now alloy spring length is the shortest, and folding latticed frame structural volume is minimum, takes up space few, is convenient to transport and stores.
Be noted that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (4)
1. a self-driven folding latticed frame structure, it is characterized in that: comprise end node, lower end node, be connected to the scissors unit between end node and lower end node and drive the driver element of described scissors units folded, described upper end node and lower end node include four two joint element for bar, four three joint element for bar and four joint element for bar, described four two joint element for bar are distributed on foursquare four angles, described three joint element for bar are distributed on the mid point on described foursquare every bar limit, described four joint element for bar are positioned at described foursquare center, two joint element for bar of each three joint element for bar and both sides and four joint element for bar at center form the attachment face of three scissors unit, described scissors unit is 12, the attachment face of described each scissors unit installs a described scissors unit, described driver element comprises marmem extension member and semiconductor refrigeration chip heating refrigeration commutating circuit, described marmem extension member is 24, a described marmem extension member is set respectively between two ends of each scissors unit at upper end node and two ends at lower end node, described semiconductor refrigeration chip heating refrigeration commutating circuit one end is connected to upper end node center and is connected with the 12 marmem extension members being positioned at upper end node for heating or freeze described marmem extension member, the other end of described semiconductor refrigeration chip heating refrigeration commutating circuit is connected to lower end node center and is connected with the 12 marmem extension members being positioned at lower end node for heating or freeze described marmem extension member.
2. a kind of self-driven folding latticed frame structure according to claim 1, it is characterized in that: the end of described scissors unit is provided with auricle, the end of described marmem extension member is provided with the collar, and the two ends of described marmem extension member are connected to the different auricle places of same scissors unit respectively by bearing pin pin joint.
3. a kind of self-driven folding latticed frame structure according to claim 1 and 2, it is characterized in that: described marmem extension member is connected by insulating tape looping with electrit silk side by side by shape memory alloy spring, described semiconductor refrigeration chip heating refrigeration commutating circuit and electrit silk are connected to form current loop.
4. a kind of self-driven folding latticed frame structure according to claim 3, it is characterized in that: in every root marmem extension member of upper end nodal plane, the current loop of electrit silk flows to as from the inside to the outside, in every root marmem extension member of upper end nodal plane, the current loop of electrit silk flows to as from outside to inside, and upper end electric current imports lower current at edge mid-points place with vertical wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510815389.XA CN105298776B (en) | 2015-11-23 | 2015-11-23 | Self-driven folding latticed frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510815389.XA CN105298776B (en) | 2015-11-23 | 2015-11-23 | Self-driven folding latticed frame structure |
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| Publication Number | Publication Date |
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| CN105298776A true CN105298776A (en) | 2016-02-03 |
| CN105298776B CN105298776B (en) | 2018-03-16 |
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| CN201510815389.XA Expired - Fee Related CN105298776B (en) | 2015-11-23 | 2015-11-23 | Self-driven folding latticed frame structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112660363A (en) * | 2020-12-31 | 2021-04-16 | 中国商用飞机有限责任公司 | Aircraft wing flap |
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| US5228258A (en) * | 1989-11-27 | 1993-07-20 | Fuji Jukogyo Kabushiki Kaisha | Collapsible truss structure |
| CN2835392Y (en) * | 2005-07-18 | 2006-11-08 | 倪既民 | Splicing type combined fork frame |
| CN101982657A (en) * | 2010-11-19 | 2011-03-02 | 哈尔滨工业大学 | Square sleeve-type actuator made of shape memory alloy for increasing displacement |
| CN102605892A (en) * | 2012-03-08 | 2012-07-25 | 东南大学 | Movable structure based on folding-rod shearing-type unit |
| JP5165897B2 (en) * | 2007-01-10 | 2013-03-21 | 株式会社越智工業所 | Telescopic frame and structure using the same |
| CN103552696A (en) * | 2013-11-08 | 2014-02-05 | 哈尔滨工业大学 | Frame-type space extensible structure based on shape memory polymer |
| CN104746939A (en) * | 2015-03-25 | 2015-07-01 | 东南大学 | Assembly-needless foldable tent |
-
2015
- 2015-11-23 CN CN201510815389.XA patent/CN105298776B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5228258A (en) * | 1989-11-27 | 1993-07-20 | Fuji Jukogyo Kabushiki Kaisha | Collapsible truss structure |
| CN2835392Y (en) * | 2005-07-18 | 2006-11-08 | 倪既民 | Splicing type combined fork frame |
| JP5165897B2 (en) * | 2007-01-10 | 2013-03-21 | 株式会社越智工業所 | Telescopic frame and structure using the same |
| CN101982657A (en) * | 2010-11-19 | 2011-03-02 | 哈尔滨工业大学 | Square sleeve-type actuator made of shape memory alloy for increasing displacement |
| CN102605892A (en) * | 2012-03-08 | 2012-07-25 | 东南大学 | Movable structure based on folding-rod shearing-type unit |
| CN103552696A (en) * | 2013-11-08 | 2014-02-05 | 哈尔滨工业大学 | Frame-type space extensible structure based on shape memory polymer |
| CN104746939A (en) * | 2015-03-25 | 2015-07-01 | 东南大学 | Assembly-needless foldable tent |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112660363A (en) * | 2020-12-31 | 2021-04-16 | 中国商用飞机有限责任公司 | Aircraft wing flap |
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| CN105298776B (en) | 2018-03-16 |
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Effective date of registration: 20211202 Address after: No. 6, Changjiang River back street, Xuanwu District, Nanjing, Jiangsu Province Patentee after: Nanjing Dongda Modern Prestress Engineering Co.,Ltd. Address before: 210096 No. four archway, 2, Jiangsu, Nanjing Patentee before: SOUTHEAST University |
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Granted publication date: 20180316 |