CN105296976A - Chemical-copper solution and chemical copper plating method - Google Patents
Chemical-copper solution and chemical copper plating method Download PDFInfo
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Abstract
The invention relates to the technical field of nonmetallic surface chemical plating treatment, in particular to a chemical-copper solution. The chemical-copper solution comprises a pre-plating copper solution and a thick copper plating solution. The pre-plating copper solution comprises copper salt, formaldehyde, a first complexing agent, a stabilizing agent, a surface active agent, an accelerant and a pH adjusting agent. The thick copper plating solution comprises copper salt, formaldehyde, a second complexing agent, a stabilizing agent, a surface active agent, an accelerant and a pH adjusting agent. The first complexing agent is a mixture of ethylene diamine tetraacetic acid and tetrahydroxypropyl ethylenediamine. The second complexing agent is a mixture of tartrate and triethanolamine. The chemical-copper solution is stable in performance, convenient to maintain, safe and environmentally friendly; the pre-plating copper solution is high in activity and the thick copper plating solution is good in stability, the pre-plating copper solution and the thick copper plating solution are applied to different stages of the chemical copper plating method respectively, the chemical plating work efficiency is high, obtained plating layers are combined reliably, the yield of copper plating pieces is high, and large-scale industrial production is facilitated.
Description
Technical field
The present invention relates to nonmetallic surface electroless plating processing technology field, particularly relate to a kind of chemical bronze plating liquid and the method to nonmetallic surface electroless copper.
Background technology
Electroless plating makes metal ion under the self-catalysis of metallic surface, reduce the metal deposition process carried out by reductive agent suitable in solution, and electroless plating only just can be carried out on the surface with catalytic activity.Traditional non-metallic surface activation method adopts colloidal palladium, but colloidal stability is poor, and palladium is expensive, causes activating cost higher.Thus, low palladium and engendering without palladium technique; A kind of no-palladium activating technique common at present is directly entrained in nonmetal basal body by organometallics, utilize laser ablation action breaks down valence link wherein thus obtain catalytic type metallic particles, as laser direct structuring technique (LaserDirectStructuring, LDS) chemical plating technology in, namely electroless plating is wherein for template with the conductive pattern of radium-shine machine-shaping, simultaneously due to the metal on radium-shine processing activated plastic basis material, be convenient to be coated with conducting wire on plastic components.Although the radium-shine processing in LDS technology makes non-metallic surface activation cost greatly reduce, but no-palladium activating brings challenge to follow-up electroless plating, conventional chemical plating fluid and change electroplating method are difficult to the matrix after this kind of activation realize metallization, for electroless copper.
Chemical copper plating solution is mainly made up of mantoquita, reductive agent, complexing agent, stablizer, pH value regulator and other additives.Most of commercial chemistry copper plating solution adopts formaldehyde as reductive agent, there are two basic chemical reactions in reaction process, and namely cupric ion obtains electronics and becomes copper simple substance, and formaldehyde and hydroxide ion react to be produced hydrogen G&W and Carboxylic Acid Ions and provides electronics, except cupric ion carries out effective redox reaction at catalytic surface, be reduced into outside metallic copper by formaldehyde, also there is many side reactions, mainly comprise Kang Niluocha reaction and non-catalytic reaction, in above-mentioned on-catalytic type reaction, the particulate of Red copper oxide is reduced out, after this, Red copper oxide may be reduced into particulate copper through further reacting again, above-mentioned side reaction not only consumes the effective constituent in particulate, and the Red copper oxide produced, copper and imperceptible powder suspension are in the plating solution, very difficult filter method is gone out, plating solution is easily caused to decompose, if Red copper oxide and copper codeposition, final unplated piece surface is put into copper deposits and is loosened coarse, and then make copper deposits, namely copper plate and unplated piece basal body binding force poor, the increase of copper powder simultaneously can cause the further destruction of copper plating bath.
The copper plate less stable that the nonmetallic surface of conventional change copper plating bath after no-palladium activating is formed, can not thick copper facing, and if stabilizing agent dosage simply in raisingizations copper plating bath, just easily impact is plated fast; In general, plating speed is higher, the more difficult control of stability, and stability is better, the more difficult lifting of plating speed.Therefore, the how stability of coordinating copper plating bath and this contradiction of plating speed, obtain the chemical bronze plating liquid and change electroplating method with certain plating speed and high stability, be the research direction in electroless copper field always.
Summary of the invention
For above-mentioned the deficiencies in the prior art, an object of the present invention is to provide that a kind of use properties is stable, solution composition is simple, easy to maintenance, safety and environmental protection, coating is in conjunction with reliable chemical copper plating solution.
Two of object of the present invention there are provided a kind of method to nonmetallic surface electroless copper of simple to operate, safety and environmental protection.
To achieve these goals, technical scheme of the present invention is as follows:
A kind of chemical copper plating solution, comprise copper pre-plating liquid and thick copper plating bath, described copper pre-plating liquid comprises mantoquita, formaldehyde, the first complexing agent, stablizer, tensio-active agent, promotor, pH adjusting agent; Described thick copper plating bath comprises mantoquita, formaldehyde, the second complexing agent, stablizer, tensio-active agent, promotor, pH adjusting agent; Wherein said first complexing agent is the mixture of disodium ethylene diamine tetraacetate and tetrahydroxypropyl ethylenediamine, wherein the mass ratio of disodium ethylene diamine tetraacetate and four hydroxypropyl diamines is (3-5): 1, and described second complexing agent is the mixture of tartrate and trolamine.
Compared to prior art, the present invention is provided with the copper pre-plating liquid and thick copper plating bath of selecting different complexing agent, the effect of complexing agent forms stable complex compound with cupric ion, prevent cupric ion raw copper hydroxide precipitation in the basic conditions, wherein copper pre-plating liquid adopts the mixture of disodium ethylene diamine tetraacetate and tetrahydroxypropyl ethylenediamine as complexing agent, works, make plating solution have high reactivity with stablizer one, improve sedimentation rate, the copper film of one deck densification can be formed fast on pre-plating piece; Thickness copper liquid adopts the mixture of tartrate and trolamine as complexing agent, and its stability is better, can form fine and close thick copper film in order lentamente.And the stable performance of above-mentioned copper plating solution, solution composition are simple, easy to maintenance, safety and environmental protection.
Particularly, in described copper pre-plating liquid, the concentration of mantoquita is 7-11g/L, the concentration of formaldehyde is 11-20g/L, the concentration of the first complexing agent is 40-150g/L, and the concentration of stablizer is 30-100mg/L, and the content of pH adjusting agent is 5.0-20g/L, the concentration of tensio-active agent is 1-100mg/L, and the concentration of promotor is 1-100mg/L; The pH of described copper pre-plating liquid is 11-13.
Particularly, in described thick copper plating bath, the concentration of mantoquita is 11-15g/L, the concentration of formaldehyde is 18-25g/L, and the concentration of the second complexing agent is 50-200g/L, and the concentration of stablizer is 30-100mg/L, the content of pH adjusting agent is 11-13g/L, the concentration of tensio-active agent is 1-100mg/L, and the concentration of promotor is 0.01-10g/L, and the pH of described thick copper plating bath is 12.5-13.5.
Preferably, described mantoquita is one or both in copper sulfate, cupric chloride or cupric nitrate, preferably sulfuric acid copper; Described pH adjusting agent, for providing the alkaline environment of copper plating bath, improves the continuous stability of reaction, and can improve Deposit appearance, it is one or both in sodium hydroxide, sodium carbonate, salt of wormwood, boric acid, the mixture of preferred sodium hydroxide and sodium carbonate simultaneously.
Preferably, described stablizer is the mixture of methyl alcohol and 2,2-dipyridyl, and wherein the concentration of methyl alcohol is 1-100mg/L, can suppress the disproportionation reaction of formaldehyde, stablize the concentration of reductive agent, improves bath stability, improves the outward appearance of coating; The content of described 2,2-dipyridyls is 1-25mg/L, is conducive to the marshalling degree improving copper crystal grain, reduces being mingled with of Red copper oxide particle, promotes speed and the persistence of copper deposition.
Preferably, stablizer in described copper pre-plating liquid also comprises butylthiomethyl imidazoles, it has the ability of stable plating solution, with methyl alcohol and 2,2-dipyridyl composite, the object significantly improving chemical stability can be reached, also can improve plating speed simultaneously, acceleration effect is good, and has the effect of crystal grain thinning, can reduce coating particle size.
Preferably, described promotor is the mixture of nickel salt and VITAMIN B4, VITAMIN B4 is conducive to the toughness controlling coating, increase the cold-hot impact test piece of coating, itself and nickel salt can control the grown junction crystal type of copper plate by Synergistic stabilizer, reduce the residual ratio of cupric oxide at coating, thus improve the purity of coating
Preferably, described tensio-active agent can improve the compactness of copper plate, one or more in optional alkylphenol polyoxyethylene (OP-10), polyoxyethylene glycol, tween, n-octyl sodium sulfate, polyoxyethylene surfactant.
To a method for nonmetallic surface electroless copper, comprise the following steps:
First laser activation, forms line pattern with laser on the surface of described nonmetal parts, produces metal core to make this pattern area;
Then copper pre-plating, is placed in copper pre-plating liquid as above and soaks 5-30min, to produce copper film on described line pattern by the nonmetal parts being formed with line pattern;
Thick copper facing subsequently, puts into thick copper liquid as above and soaks 50-120min, to produce thick copper film on described line pattern by the nonmetal parts after copper pre-plating.
Preferably, the temperature of described copper pre-plating is 40-50 DEG C, and described thick copper-plated temperature is 55-65 DEG C.
Compared to prior art, in the present invention, copper plating bath comprises copper pre-plating liquid and the thickness copper liquid of different composition respectively, the activity of copper pre-plating liquid is higher, and the stability of thick copper plating bath is relatively better, adopt different plating solutions to process plating piece in the different stages like this, the coating obtained combines reliable, and the copper facing part good article rate obtained improves, the working efficiency simultaneously changing plating improves, and is conducive to large-scale industrial production.
Embodiment
Below the specific embodiment of the present invention is described in further detail.
Embodiment 1
A method for nonmetallic surface electroless copper, comprises the following steps:
First laser activation, forms line pattern with laser on the surface of described nonmetal parts, produces metal core to make this pattern area;
Then copper pre-plating, the copper pre-plating liquid nonmetal parts being formed with line pattern being placed in 45 DEG C soaks 10min, to produce copper film on described line pattern; Wherein, the component that copper pre-plating solution comprises and content are distinguished as follows: copper sulfate 10g/L, formaldehyde 20g/L, disodium ethylene diamine tetraacetate 60g/L, tetrahydroxypropyl ethylenediamine 20g/L, methyl alcohol 30mg/L, 2,2-dipyridyl 12mg/L, butylthiomethyl imidazoles 5mg/L, sodium hydroxide 5g/L, polyoxyethylene glycol 10mg/L, VITAMIN B4 15mg/L, nickel salt 15mg/L, the pH of copper pre-plating liquid is 11.5;
Thick copper facing subsequently, the thick copper liquid nonmetal parts after copper pre-plating being put into 55 DEG C soaks 60min, to produce thick copper film on described line pattern; Wherein, the component that thick copper plating solution comprises and content are distinguished as follows: copper sulfate 12g/L, formaldehyde 20g/L, sodium tartrate 40g/L, trolamine 20g/L, methyl alcohol 20mg/L, 2,2-dipyridyl 20mg/L, sodium hydroxide 8g/L, sodium carbonate 5g/L, polyoxyethylene glycol 10mg/L, VITAMIN B4 5mg/L, nickel salt 35mg/L, the pH of thick copper plating bath is 12.5;
Copper pre-plating liquid after plating and thick copper plating bath, in 80 DEG C of water-baths, steady time is greater than 2h respectively, nonmetal parts surface resulting copper layer light, and copper particle alignment is fine and close, is combined closely with nonmetallic surface; And layers of copper resistivity is lower, its tack is stronger.
Embodiment 2
A method for nonmetallic surface electroless copper, comprises the following steps:
First laser activation, forms line pattern with laser on the surface of described nonmetal parts, produces metal core to make this pattern area;
Then copper pre-plating, the copper pre-plating liquid nonmetal parts being formed with line pattern being placed in 45 DEG C soaks 15min, to produce copper film on described line pattern; Wherein, the component that copper pre-plating solution comprises and content are distinguished as follows: copper sulfate 8g/L, formaldehyde 11g/L, disodium ethylene diamine tetraacetate 50g/L, tetrahydroxypropyl ethylenediamine 10g/L, methyl alcohol 60mg/L, 2,2-dipyridyl 20mg/L, butylthiomethyl imidazoles 8mg/L, sodium hydroxide 20g/L, OP-1020mg/L, VITAMIN B4 20mg/L, nickel salt 20mg/L, the pH of copper pre-plating liquid is 12;
Thick copper facing subsequently, puts into thick copper liquid and soaks 100min, to produce thick copper film on described line pattern by the nonmetal parts after copper pre-plating; Wherein, the component that thick copper plating solution comprises and content are distinguished as follows: copper sulfate 15g/L, formaldehyde 25g/L, sodium tartrate 80g/L, trolamine 60g/L, methyl alcohol 50mg/L, 2,2-dipyridyl 20mg/L, sodium hydroxide 5g/L, sodium carbonate 5g/L, OP-1010mg/L, VITAMIN B4 25mg/L, nickel salt 35mg/L, the pH of thick copper plating bath is 12.5;
Copper pre-plating liquid after plating and thick copper plating bath, in 80 DEG C of water-baths, steady time is greater than 2h respectively, nonmetal parts surface resulting copper layer light, and copper particle alignment is fine and close, is combined closely with nonmetallic surface; And layers of copper resistivity is lower, its tack is stronger.
Embodiment 3
A method for nonmetallic surface electroless copper, comprises the following steps:
First laser activation, forms line pattern with laser on the surface of described nonmetal parts, produces metal core to make this pattern area;
Then copper pre-plating, the copper pre-plating liquid nonmetal parts being formed with line pattern being placed in 45 DEG C soaks 10min, to produce copper film on described line pattern; Wherein, the component that copper pre-plating solution comprises and content are distinguished as follows: copper sulfate 11g/L, formaldehyde 16g/L, disodium ethylene diamine tetraacetate 60g/L, tetrahydroxypropyl ethylenediamine 60g/L, methyl alcohol 80mg/L, 2,2-dipyridyl 2mg/L, butylthiomethyl imidazoles 5mg/L, sodium hydroxide 5g/L, polyoxyethylene glycol 10mg/L, VITAMIN B4 15mg/L, nickel salt 15mg/L, the pH of copper pre-plating liquid is 11.5;
Thick copper facing subsequently, the thick copper liquid nonmetal parts after copper pre-plating being put into 55 DEG C soaks 60min, to produce thick copper film on described line pattern; Wherein, the component that thick copper plating solution comprises and content are distinguished as follows: copper sulfate 11g/L, formaldehyde 20g/L, sodium tartrate 40g/L, trolamine 60g/L, methyl alcohol 50mg/L, 2,2-dipyridyl 20mg/L, sodium hydroxide 8g/L, sodium carbonate 5g/L, polyoxyethylene glycol 10mg/L, VITAMIN B4 5mg/L, nickel salt 35mg/L, the pH of thick copper plating bath is 12.5;
Copper pre-plating liquid after plating and thick copper plating bath, in 80 DEG C of water-baths, steady time is greater than 2h respectively, nonmetal parts surface resulting copper layer light, and copper particle alignment is fine and close, is combined closely with nonmetallic surface; And layers of copper resistivity is lower, its tack is stronger.
Above-described embodiment, just preferred embodiment of the present invention, is not used for limiting the scope of the present invention, therefore all equivalences done with the structure described in the claims in the present invention, feature and principle change or modify, and all should be included within the claims in the present invention scope.
Claims (10)
1. chemical copper plating solution, is characterized in that: comprise copper pre-plating liquid and thick copper plating bath, and described copper pre-plating liquid comprises mantoquita, formaldehyde, the first complexing agent, stablizer, tensio-active agent, promotor, pH adjusting agent; Described thick copper plating bath comprises mantoquita, formaldehyde, the second complexing agent, stablizer, tensio-active agent, promotor, pH adjusting agent; Wherein said first complexing agent is the mixture of disodium ethylene diamine tetraacetate and tetrahydroxypropyl ethylenediamine, and described second complexing agent is the mixture of tartrate and trolamine.
2. chemical copper plating solution according to claim 1, it is characterized in that: in described copper pre-plating liquid, the concentration of mantoquita is 7-11g/L, the concentration of formaldehyde is 11-20g/L, the concentration of the first complexing agent is 40-150g/L, and the concentration of stablizer is 30-100mg/L, and the content of pH adjusting agent is 5.0-20g/L, the concentration of tensio-active agent is 1-100mg/L, and the concentration of promotor is 0.01-10g/L; The pH of described copper pre-plating liquid is 11-13.
3. chemical copper plating solution according to claim 1, it is characterized in that: in described thick copper plating bath, the concentration of mantoquita is 11-15g/L, the concentration of formaldehyde is 18-25g/L, and the concentration of the second complexing agent is 50-200g/L, and the concentration of stablizer is 30-100mg/L, the content of pH adjusting agent is 11-13g/L, the concentration of tensio-active agent is 1-100mg/L, and the concentration of promotor is 0.01-10g/L, and the pH of described thick copper plating bath is 12.5-13.5.
4. chemical copper plating solution according to claim 1, is characterized in that: described mantoquita is one or both in copper sulfate, cupric chloride or cupric nitrate, and described pH adjusting agent is one or both in sodium hydroxide, sodium carbonate, salt of wormwood, boric acid.
5. chemical copper plating solution according to claim 1, is characterized in that: described stablizer is the mixture of methyl alcohol and 2,2-dipyridyl, and the content of wherein said 2,2-dipyridyls is 1-25mg/L.
6. chemical copper plating solution according to claim 1, is characterized in that: also comprise butylthiomethyl imidazoles in described stablizer.
7. chemical copper plating solution according to claim 1, is characterized in that: described promotor is the mixture of nickel salt and VITAMIN B4.
8. chemical copper plating solution according to claim 1, is characterized in that: described tensio-active agent is one or more in alkylphenol polyoxyethylene (OP-10), polyoxyethylene glycol, tween, n-octyl sodium sulfate, polyoxyethylene surfactant.
9. to a method for nonmetallic surface electroless copper, it is characterized in that, comprise the following steps:
First laser activation, forms line pattern with laser on the surface of described nonmetal parts, produces metal core to make this pattern area;
Then copper pre-plating, the copper pre-plating liquid be placed in by the nonmetal parts being formed with line pattern as described in any one of claim 1-8 soaks 5-30min, to produce copper film on described line pattern;
Thick copper facing subsequently, the thick copper liquid put into by the nonmetal parts after copper pre-plating as described in any one of claim 1-8 soaks 50-120min, to produce thick copper film on described line pattern.
10. the method to nonmetallic surface electroless copper according to claim 9, is characterized in that: the temperature of described copper pre-plating is 40-50 DEG C, and described thick copper-plated temperature is 55 DEG C.
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105779980A (en) * | 2016-03-09 | 2016-07-20 | 昆山艾森半导体材料有限公司 | Chemical copper plating agent and preparation method thereof |
| CN107523813A (en) * | 2016-06-20 | 2017-12-29 | 浙江保利电梯导轨制造有限公司 | The copper electroplating method of copper-clad cage guide |
| CN107955876A (en) * | 2017-11-28 | 2018-04-24 | 江苏胜达科技有限公司 | The method that laser-impact combines processing steel wire surface with chemical plating stannum bronze |
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| CN113774368A (en) * | 2021-10-12 | 2021-12-10 | 上海天承化学有限公司 | Chemical copper plating solution and preparation method and application thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047419A (en) * | 1989-05-16 | 1990-11-28 | 四川大学 | The production technology of electrode of piezoelectric ceramic device |
| CN1142252A (en) * | 1994-12-27 | 1997-02-05 | 揖斐电株式会社 | Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| US20130214278A1 (en) * | 2011-08-19 | 2013-08-22 | Seung-hee Nam | Array substrate for display device and method of manufacturing the same |
| CN103476199A (en) * | 2013-09-27 | 2013-12-25 | 电子科技大学 | Printed circuit addition manufacturing method based on copper autocatalysis and chemical copper plating |
| CN104561956A (en) * | 2014-12-27 | 2015-04-29 | 广东致卓精密金属科技有限公司 | High-activity chemical copper plating solution and chemical copper plating method |
| CN104651814A (en) * | 2014-11-28 | 2015-05-27 | 广东致卓精密金属科技有限公司 | Chemical copper plating solution and chemical copper plating method |
-
2015
- 2015-10-21 CN CN201510689432.2A patent/CN105296976A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047419A (en) * | 1989-05-16 | 1990-11-28 | 四川大学 | The production technology of electrode of piezoelectric ceramic device |
| CN1142252A (en) * | 1994-12-27 | 1997-02-05 | 揖斐电株式会社 | Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| US20130214278A1 (en) * | 2011-08-19 | 2013-08-22 | Seung-hee Nam | Array substrate for display device and method of manufacturing the same |
| CN103476199A (en) * | 2013-09-27 | 2013-12-25 | 电子科技大学 | Printed circuit addition manufacturing method based on copper autocatalysis and chemical copper plating |
| CN104651814A (en) * | 2014-11-28 | 2015-05-27 | 广东致卓精密金属科技有限公司 | Chemical copper plating solution and chemical copper plating method |
| CN104561956A (en) * | 2014-12-27 | 2015-04-29 | 广东致卓精密金属科技有限公司 | High-activity chemical copper plating solution and chemical copper plating method |
Non-Patent Citations (5)
| Title |
|---|
| 上岗就业百分百系列丛书编委会: "《电镀工上岗就业百分百》", 31 July 2011 * |
| 徐滨士 等: "《表面工程技术手册 上》", 31 July 2009 * |
| 曹权根 等: "四羟丙基乙二胺-乙二胺四乙酸二钠体系快速化学镀铜", 《电镀与涂饰》 * |
| 李异等: "《电镀前处理与后处理》", 31 January 2009 * |
| 邹宗柏: "《1000个实用精细化工产品制造技术及应用》", 31 May 1996 * |
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| CN113774368B (en) * | 2021-10-12 | 2024-02-13 | 上海天承化学有限公司 | Electroless copper plating solution and preparation method and application thereof |
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| CN114045476A (en) * | 2021-11-11 | 2022-02-15 | 重庆大学 | Copper-magnesium composite material and preparation method and application thereof |
| CN114045476B (en) * | 2021-11-11 | 2023-10-20 | 重庆大学 | Copper-magnesium composite material and preparation method and application thereof |
| CN114411130A (en) * | 2021-12-29 | 2022-04-29 | 广东利尔化学有限公司 | Thick electroless copper plating solution with good ductility |
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Application publication date: 20160203 |