CN105295000A - High-viscosity curing agent composition - Google Patents
High-viscosity curing agent composition Download PDFInfo
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- CN105295000A CN105295000A CN201510780984.4A CN201510780984A CN105295000A CN 105295000 A CN105295000 A CN 105295000A CN 201510780984 A CN201510780984 A CN 201510780984A CN 105295000 A CN105295000 A CN 105295000A
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- agent composition
- curing agent
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- viscosity curing
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Abstract
The invention discloses a high-viscosity curing agent composition. Relatively high bonding strength is achieved via combination of a plurality of types of curing agents.
Description
Technical field
The present invention relates to a kind of high viscosity curing agent composition, particularly one and be applicable to the display element high viscosity curing agent compositions such as bonding liquid crystal.
Background technology
Solidifying agent has another name called stiffening agent, ripening agent or set agent, is that a class is promoted or controls material or the mixture of curing reaction.Resin solidification is through the chemical reactions such as condensation, closed loop, addition or catalysis, makes thermosetting resin that irreversible change procedure occur, and solidification has come by adding solidification (being cross-linked) agent.Solidifying agent is absolutely necessary additive, is to make caking agent, coating, mould material all to need to add solidifying agent, otherwise epoxy resin can not solidify.
In recent years, increase, the frame of the display part of adjoint liquid-crystal display are more and more narrow, and the graph thinning of sealing agent is advanced.In addition, as the adhering object of sealing agent, glass is not only by adhering object, also comprising inorganic materials, the alignment films etc. such as ITO electrode, SiN film organic materials etc. also becomes by adhering object, adherend becomes variation, the cementability variation requiring sealing agent to have foreign material can be bonded to each other.
This area faces main, is the requirement of various mobile phone and TV, indicating meter etc. and Rimless narrow to frame, and because its frame is more and more less, the fixing of display element device has just become a difficult problem.For the bonding way that this area is the most frequently used, more and more higher requirement is proposed to bonding strength.
But existing solidifying agent, most cohesive strength is inadequate, or can provide close cohesive strength, but cost is high, loses market-oriented meaning.
Summary of the invention
The object of the invention is to propose a kind of high viscosity curing agent composition, it is composite by dissimilar solidifying agent, provides the higher viscosity met the demands.
For reaching this object, the present invention by the following technical solutions:
A kind of curing agent composition, it comprises following component:
The mass ratio of two kinds of components described in described composition is 3:1-1:3, and preferred 2:1-1:2, has preferred 2:1 further.
Embodiment
The present invention is described high viscosity curing agent composition of the present invention by following embodiment.
Embodiment 1
I. the synthesis of formula 1 compound
Described in formula 1, compound is known compound, and those skilled in the art can obtain in commercially available purchase, also can synthesize and prepare.Its typical but non-limiting synthesis example is as follows:
Prepare in ethanol 150g, be dissolved with 2-isocyanic ester root close the lysate A of ethyl propenoate 14.1g and in ethanol 150g, dissolve the lysate B of hydrazine 5g.Lysate B is controlled stir at 25 DEG C, drip lysate A with the speed of 1.4g/ minute simultaneously.After the dropping of lysate A terminates, utilize Fourier Tranform infrared spectrophotometer assaying reaction liquid, confirm the 2250cm from isocyanate group
-1termination reaction after neighbouring peak disappears.Be that the mode of 1 mole (taking molar ratio computing as 1:1) there occurs reaction according to closing ethyl propenoate 1 mole, hydrazine relative to 2-isocyanic ester root.
After reaction terminating, utilize vaporizer to make ethanol evaporation at 50 DEG C, utilize Fourier Tranform infrared spectrophotometer to measure refining thing, confirm the 3300cm from ethanol
-1neighbouring peak disappears, and produces the compound of formula 1.
II. the synthesis of formula 2 compound
Described compound is known compound, and those skilled in the art can obtain in commercially available purchase, also can synthesize and prepare.Its typical but non-limiting synthesis example is as follows:
In room temperature with in 30 minutes, 1003-nitrobenzoyl chloride is added to containing 15.43 grams of diaminoethanes and 27.2 grams of triethylamines in the stirred vessel in 500 milliliters of chlorobenzenes.Be recorded to the exotherm of 38 DEG C.Be warming up to 50 DEG C, and keep 1 hour.Product is cooled, filters, with acetone and water washing, and dry in a vacuum, obtain 66 grams of lurid powder (72.5%).Get this dinitro compound 65 grams, and with in nitrogen discharged 1 liter of flask, be scattered in 250 milliliters of industrial methylated spirits, add the palladium-gac of 3 gram 10%, and dripped 50 milliliters of hydrazine hydrates in 2 hours, and then reduced.This mixture heat release to 40 DEG C, and dissolve along with nitro-compound and become dark-coloured.Then be warming up to 70 DEG C and keep 90 minutes, then making it cooling.
Filtered by mixture at present containing the target product expected, solid dilute hydrochloric acid, in water, is carried out acidifying, until it dissolves completely by the product pulp retained by strainer.This solution is filtered to remove Pd/C, filtrate ammonia neutralization.Filter to isolate white solid and use distilled water wash.Product vacuum is dry, and obtain 44 grams of powder, account for 81% of theoretical yield, fusing point is 210 DEG C.Described powder is compound shown in formula 2.
By the component I for preparing and II, obtain described curing agent composition according to 2:1 is composite.
Preparation methacrylic acidylate epoxy resin 100 mass parts, spherical silicon dioxide 15 mass parts as inorganic filler, the F-351 as organic filler (Japanese Zeon society manufactures) 15 mass parts, Irgacure907 (BASF manufacture) 3 mass parts as optical free radical initiator, (manufacture of chemical industry society of SHIN-ETSU HANTOTAI) 2 mass parts of the KBM-403 as silane coupling agent and curing agent composition of the present invention 2 mass parts are carried out dispersed, obtain liquid crystal sealing agent composition.
Prepare the square ito glass of thickness 0.5mm, 3.0cm and the square glass of thickness 0.5mm, 2.3cm.In the Central Line of ito glass apart from two ends be 9mm position according to diameter be 1.5 ~ 2.0mm, thickness is that the mode of 6.0 ~ 10.0 μm is coated with above-mentioned liquid crystal sealing agent composition as bonding plane, is alignd in 1 limit of glass square with 2.3cm for ito glass square for 3.0cm and both are fitted, thus produce test film.After UV3000mJ is irradiated to the test film 10 of laminating, heat 60 minutes at 120 DEG C, liquid crystal sealing agent composition is solidified.(society of Shimadzu Seisakusho Ltd. manufactures to utilize Autograph; AGS) to solidification after test film ito glass Central Line on apart from end be that 5mm point carries out punching press, mensuration bonding strength.Its cohesive strength is 29.6N/mm.
Comparative example 1
Only containing component I, not containing component I I, all the other conditions are constant, and its cohesive strength is 18.5N/mm.
Comparative example 2
Only containing component I I, not containing component I, all the other conditions are constant, and its cohesive strength is 14.6N/mm.
Above-described embodiment and comparative example explanation, curing agent composition of the present invention, it is composite by two kinds of dissimilar solidifying agent, under same amount prerequisite, its cohesive strength will be better than far away being used alone of two kinds of components, proves to create synergistic effect between two kinds of solidifying agent that the present invention adopts.
Applicant states, the present invention illustrates curing agent composition of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned special formulation, does not namely mean that the present invention must rely on above-mentioned detailed component and formula could be implemented.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (2)
1. a curing agent composition, it comprises following component:
The mass ratio of two kinds of components described in described composition is 3:1-1:3.
2. curing agent composition as claimed in claim 1, it is characterized in that, the mass ratio of described two kinds of components is 2:1-1:2, preferred 2:1.
Priority Applications (1)
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CN201510780984.4A CN105295000A (en) | 2015-11-14 | 2015-11-14 | High-viscosity curing agent composition |
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CN201510780984.4A CN105295000A (en) | 2015-11-14 | 2015-11-14 | High-viscosity curing agent composition |
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CN105295000A true CN105295000A (en) | 2016-02-03 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1836021A (en) * | 2003-06-23 | 2006-09-20 | 东丽株式会社 | Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same |
CN102695740A (en) * | 2010-01-07 | 2012-09-26 | 赫克塞尔合成有限公司 | Novel resin curing agents |
CN103172832A (en) * | 2013-04-10 | 2013-06-26 | 湖北奥生新材料科技有限公司 | Epoxy resin early-strength curing agent for binding and preparation method thereof |
CN104428339A (en) * | 2012-07-11 | 2015-03-18 | 协立化学产业株式会社 | Curing agent and resin composition using same |
-
2015
- 2015-11-14 CN CN201510780984.4A patent/CN105295000A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1836021A (en) * | 2003-06-23 | 2006-09-20 | 东丽株式会社 | Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same |
CN102695740A (en) * | 2010-01-07 | 2012-09-26 | 赫克塞尔合成有限公司 | Novel resin curing agents |
CN104428339A (en) * | 2012-07-11 | 2015-03-18 | 协立化学产业株式会社 | Curing agent and resin composition using same |
CN103172832A (en) * | 2013-04-10 | 2013-06-26 | 湖北奥生新材料科技有限公司 | Epoxy resin early-strength curing agent for binding and preparation method thereof |
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