CN105283265A - Method and device for removing brittle-hard material which is transparent to laser radiation, by means of laser radiation - Google Patents
Method and device for removing brittle-hard material which is transparent to laser radiation, by means of laser radiation Download PDFInfo
- Publication number
- CN105283265A CN105283265A CN201480030335.6A CN201480030335A CN105283265A CN 105283265 A CN105283265 A CN 105283265A CN 201480030335 A CN201480030335 A CN 201480030335A CN 105283265 A CN105283265 A CN 105283265A
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- Prior art keywords
- laser emission
- laser radiation
- crisp
- threshold
- primary
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
Abstract
The invention relates to a method for removing brittle-hard material (1) having a spatial volume of a given thickness between a top side (4) and an underside (2) by means of laser radiation, and the material (1) has a defined optical penetration depth which is greater than or equal to the thickness of said material. The laser radiation is incident at a defined angle of incidence (10) with respect to the surface normal of the top side; said laser radiation is designated as primary laser radiation (12). The primary laser radiation (12) is at least partly reflected at the underside (2) of the material (1), such that secondary laser radiation (13) is generated in the volume of the material as a result of the reflection. For the processing of the brittle-hard material (1), the underside (2) of the latter is backed by a further material (2) in an interlocking manner. The invention also relates to a corresponding device.
Description
Technical field
The present invention relates to for divesting by means of laser emission, such as hole, cutting, carve the method and device of scraping the transparent crisp and hard material of laser emission, wherein this material has the spatial volume of given thickness between the upside and downside of material, and this material has the optics depth of invasion defined of the thickness being more than or equal to this material, wherein laser emission is with the incident angles defined between the axle of laser emission and the face normal of upside, and the laser emission incided on the upside of material is called as primary laser radiation, wherein primary laser radiation is reflected at least partly at the downside place of material, make to generate secondary laser emission by reflection in the volume of material, coherent superposition wherein by absorbing primary and secondary laser emission generates electron density in the volume of material, described electron density has at least two grades material to not same-action of electron density, distribute the specific threshold value of material of the intensity of primary laser radiation wherein to these grades of electron density, its mode is, reaching of the first threshold of the intensity of primary laser radiation is characterized by the change of material behavior and/or the mechanical damage of crack form, and characterize reaching of Second Threshold by divesting with the machinery peeling off and/or divest form of material.
Background technology
Such method is especially applied to display technology, wherein must process thin glass substrate, a kind of crisp hard material.Lucky industrial display technology captures the increasing market space, and tends to the more and more lighter equipment with sensitive touch-screen, and therefore also tends to thinner glass plate for such as smart phone and tablet PC.
Thin glass substrate is can realize the advantage compared with just providing when the durability of heavy sheet glass and mechanical stability for display.Described thin glass plate is almost used in whole flat-panel monitor (FDP).
Conventional is carry out milling with the blade defined for processing the method for such thin glass plate, or it is based on the mechanism (quarter scrapes and fractures) of the cracking initiation introduced targetedly in material or material.Use the multiple known method modification in laser emission situation same based on be, utilize the mechanism of carving the principle of scraping and then fracture, its mode is, replace scrape quarter, and material/material is fractureed after the effect of laser emission with the effect of laser emission.Conventional mechanical processing (cutting, boring) for thin glass plate the material thickness of Yan Yu great compare significantly more difficult.That is, introduce microcrack when machinery is carved and scraped or even split out fraction, so-called chip (Chip), make polishing or etching become needs as subsequent machining technology.
Realize large strip rate to such requirement for the method and device that divest crisp and hard material described as beginning, and there is not damage in the material, make to be divested by this so after processing not by otherwise utilize the additional stress that may occur according to the method for prior art or additional crack to be incorporated in material.
The present inventor has been found that these crack performances are at least three kinds of different forms of expression:
First kind crack: damage, cracking initiation/chip appear at the dorsal part of material.First kind crack is in front side, and---the incident part of laser emission---just occurs when damage also not occurring and yet divests.
Equations of The Second Kind crack: crack or damage---also known as sharp shaped material---are with incident edge for starting point, and this incident edge is the transition part divested from the unaltered part on the surface of workpiece to the formed side direction divesting depression sidewall.
Crack or the damage of Equations of The Second Kind---compared with the 3rd class crack---the large degree of depth are extending in the volume of material.These with the material that incident edge is starting point change/damage also can become visible in volume or produce (so it is also referred to as " filament "; Physical cause is Kerr effect and self-focusing) or even arrive the dorsal part of workpiece or the surface of laser emission dorsad.If from being arrived workpiece or the downside of material or the surface of laser emission dorsad by the Equations of The Second Kind crack on surface divested, then it---in careless analysis---is usually no longer distinguished with first kind crack mutually.
3rd class crack: the formation in the meticulous crack so deeply do not invaded is additional to Equations of The Second Kind crack or Equations of The Second Kind damage---along by the surface (cut edge) divested---occurs; It is not limited to the region close to incident edge, and appear at laser emission divest in depression incide by divest surface (divesting sidewall), namely divest part on sidewall.3rd class crack from by the surface extension that divests to material.3rd class crack invades in material with the less degree of depth compared with first kind crack.The rough surface divesting depression has the roughness having more small curvature radius compared with incident edge.The focussing force divesting the rough surface of depression is significantly stronger compared with the focussing force at incident edge.That is, the local roughness of rough surface can be assigned to significantly less compared with the focal length of the larger radius of curvature by contrast at incident edge with the focal length of small curvature radius.
JP2005230863A describes for the method and apparatus by means of laser emission processing transparent material.Time in the material that laser emission incidence will be processed, should avoid reflection, whole workpiece should be dipped in liquid for this reason.
The method and apparatus for dividing glass sheets is described in WO2006045130A1.Deposit (hinterlegen) to the material use reflecting glass plate form fit of cutting, to realize or to strengthen reflection.Produce air gap due to the glass that will cut and the different surface roughness of the downside of solid panel that uses, make however still to occur significant reflection.
Summary of the invention
The present invention based on task be, a kind of method and a kind of device are provided, utilize described method and described device to avoid such as the cutting of the transparent crisp and hard material of laser emission, carve damage, the cracking initiation on back side damage, i.e. the material dorsal part scraping and hole and so on and/or play bits, that is first kind crack as the aforementioned.
This task utilizes method according to claim 1 and device according to claim 6 to solve.
Importantly, in order to process crisp and hard material, this crisp and hard material is deposited by other material in downside form fit.At this, downside is the face relative with the surface that laser emission is incided of the stores or supplies that will process.
Measures first mentioned is particularly suited for utilizing the so-called crisp hard thin material of ultra-short pulse laser RADIATION PROCESSING, such as glass, and this material is also known as " broad-band gap " material." broad-band gap " material is characterized by the band gap be greater than between the valence band of 1eV and conduction band.Ultra-short pulse laser radiation refers to have and is less than 500ps(psec) laser emission of pulse duration in scope.The absorption transparent the having of laser emission being more than or equal to the material of the optics depth of invasion defined of material thickness has two the physically different regions relevant from the intensity of laser emission, and described region term " linear absorption " and " non-linear absorption " represent.The intensity of the laser emission particularly importantly locally existed in material is in order to reach the threshold value behavior of non-linear absorption in material, wherein this material is that transparent or for laser emission absorption has little value to little intensity, and the larger value of intensity for laser emission---higher than change/crack and at least two threshold values of peeling off/divesting---and become high absorption.
In addition verified, time pulse shape strongly affects reaching of threshold value and therefore strongly affects the absorption in material.The discovery of right times pulse shape is theme instead of the prior art of research.For gaussian-shape time pulse shape special circumstances and for 10ps pulse duration (pulse duration is greater than 10ps(based on intensity)) for, reaching of threshold value is characterized by the value of the intensity of laser emission.For the pulse duration (based on fluence) being less than 10ps, reaching of threshold value is characterized by the value of the fluence of laser emission (relating to the energy term of area).Verified, utilize the back side damage avoiding institute's rapidoprint according to measure of the present invention as follows, namely the crisp hard material will processed or material are deposited ordinatedly by other material shape, namely on the side relative with the side being used for laser emission to incide in the material that will process.In contrast, when crisp and hard material is when dorsal part is by air entanglement, such back side damage can be observed.These results can be explained by following: by suitable other material, do not reflect at the dorsal part place of material.When refractive index and the value of the optical characteristics of absorptivity are consistent with the value of the optical characteristics of the crisp and hard material that will divest, then material is suitable for avoiding back side damage.By comparison, such as at air as the reflection that laser emission occurs when dorsal part material.By absorb directly incident primary laser radiation and at dorsal part place by the coherent superposition of secondary laser emission reflected, in the volume of material, generate electron density.
Advantageously, the optical characteristics of this other material can be adjusted by the interface spatially between structuring crisp and hard material and this other material.Such structuring such as can be carried out in the following way: on the dorsal part of material, generate grid periodic structure, makes not occur by the radiation of reflecting and only occurs the radiation that diffraction goes out from material.In this case, dorsal part material should be regarded as lower area: there is structurized amplitude in this region, and dorsal part material should be regarded as the periodic transformation of material and environment (such as air).Although the structuring of the dorsal part of the material processed can not affect the optical characteristics in the volume of the material that will process, but the degree of reflection---a kind of characteristic on surface---not only depends on the optical characteristics of the material in volume, and depends on the character (namely also depending on its geometry) on surface itself; Degree of reflection this dependence to the shape at interface not only demonstrates Fresnel law but also demonstrate diffraction theory.
As other material, both preferably can use liquid, can solid panel be used again.
If use liquid---this is particularly preferred---, then in order to process, crisp and hard material can be inserted in respective liquid pond, make downside and liquid comes into contact.As liquid be applicable to especially as such as in immersion microscope the immersion oil that uses.If as other materials'use solid panel, then should use by extensiblely maybe can hardening-the plate made of extensible materials, wherein for obtained refractive index, material type depends on the result of the such as manufacture process of sclerosis and so on of this material.
If use liquid, then the composition of liquid should be adjusted to, make refractive index and the value of the optical characteristics of absorptivity and the value of the optical characteristics of the crisp and hard material that will divest just consistent, make according to whether should avoiding damage or divest and be no more than first (damage) or second (divesting) intensity threshold.
Meanwhile, solid panel can have the aforementioned structure in the face of fitting with the downside of the crisp and hard material that will process as other material.In any case, should be noted that the required form fit between material and solid panel.
According to the present invention, optical interface is minimized in the effect of the reflection of laser emission at it, makes to avoid exceeding the first threshold of intensity and therefore avoids the damage of downside (dorsal part).It should be noted that the light refractive index physically and also ideally mated under not attainable limiting case technically between the material that will process with the material that will deposit can eliminate the optical effect at this interface.The perfection of refractive index or the coupling of near perfect especially draw when being no more than first and second threshold value of intensity of laser emission, and wherein first threshold is assigned to the appearance of damage, and Second Threshold is assigned to the appearance divested.The feature of the disappearance that (dorsal part) on downside damages is to have adjusted liquid composition according to the present invention.So little mismatch causes exceeding the first threshold occurring damage (such as crack).So mismatch ofer poor quality causes the divesting with the form of peeling off on downside (dorsal part).
According to the present invention ,/the reflection of material dorsal part should to be avoided on material dorsal part.
If liquid is used to deposit the material that will process, it should be noted that the dorsal part of only material is soaked by liquid.
Accompanying drawing explanation
Other details of the present invention and feature are from drawing the description of embodiment with reference to the accompanying drawings below.In the accompanying drawings:
Fig. 1 schematically shows the structure according to device of the present invention;
Fig. 2 shows according to another device of the present invention;
Fig. 3 shows the schematic diagram for being set forth in the generation principle of carrying out adding the back side damage of thin crisp and hard material in man-hour by means of laser emission; And
Fig. 4 shows two schematic diagrames, and wherein the figure A on the left side shows the dorsal part of the glass processed when not deposited by other material, and the figure B on the right shows the dorsal part when being deposited by other material.
Detailed description of the invention
Fig. 1 and 2 shows two devices, laser emission can be utilized to process the transparent material represented with Reference numeral 1 of laser emission, to realize according to following effect of the present invention by described two devices: especially avoid or suppress on material dorsal part owing to processing the first kind crack of causing.
According to the present invention, according to the device of Fig. 1, the crisp and hard material 1 that process is deposited by other material 3 in its dorsal part 2 form fit, and this other material 3 is such as solid panel.In order to divest by means of laser emission or hole, crisp and hard material is scraped or cutting surfaces to carve thus, and laser emission is incided on sheet-like material from 4s, upside.Therefore importantly, material 1 with primary laser incident to relative downside 2, upside 4 on---therefore laser emission be stored to form fit through the part that is mapped to after material thickness-smooth.
The difference of the device according to device as shown in Figure 2 of the present invention and Fig. 1 is, crisp and hard material is not deposited by solid panel on 2 on the downside of it, but is immersed in liquid cell 5, and downside 2 is covered by liquid.Liquid 5 is such as filled in bathtub 6; Material 1 is supported by two supports 8 in the bottom 7 of bathtub 6.
Figure 3 illustrates the generation principle of back side damage, described back side damage utilizes just to be avoided according to the device of Fig. 1 and 2 and measure.Transparent material 1 and downside 2 thereof represent with Reference numeral identical in fig 1 and 2.The medium, the in the current situation such as air Reference numeral 9 that surround the downside 2 of material 1 represent.Incidenting laser radiation 6 is in order to clearly illustrate with large incidence angle 10.What the simulation illustrate the intensity near dorsal part 2 causes the periodicity of damage/crack/" playing bits " (peeling off) too high, and it shows with region 11.
Fig. 3 simulates crisp and hard material 1 and has thickness d and the situation on this material 1 is incided in primary laser radiation 12.Material 1 has the optics depth of invasion (d of the thickness d being more than or equal to crisp and hard material 1 for the wavelength of primary laser radiation 12
opt>=d).
The region 11 that the periodicity of radiation intensity improves produces in the following way: in the volume of crisp and hard material 1, produce secondary radiation 13 by the reflection of primary radiation 12 at downside place.By absorbing laser radiation, the electron density in crisp and hard material 1 increases with at least two grades, distributes the threshold value of the intensity of laser emission wherein to these grades.Reaching of first threshold is characterized by the change of material behavior, and reaching of Second Threshold is characterized by mechanical damage, and wherein mechanical damage occurs with a crack/bits or the form that divests.
According to the present invention, by as shown in figs. 1 and 2 the second material being positioned at downside 2 place of crisp and hard material 1, the optical characteristics at the interface between crisp and hard material and the second material is adjusted to, make the radiation intensity in the volume of crisp and hard material 1 and in the environment of downside 2 due to incident primary radiation 12 and the threshold value being reached the intensity of the second grade by the interference between the secondary radiation 13 that reflects, and therefore avoid the damage of downside 2.This other material on the downside 2 of crisp and hard material 1 can be solid body 3(Fig. 1) or liquid 5(Fig. 2).
The foregoing advantages at the downside place of crisp and hard material 1 also can strengthen in the following way: the optical characteristics being adjusted the interface between crisp and hard material 1 and this other material by periodic structure, and making does not have reflection (diffraction progression) to be directed in the volume of the first material 1.
Fig. 4 shows the contrast for explaining effect of the present invention with two schematic diagrames.The figure A on the left side shows the dorsal part of the glass plate processed when not deposited by other material, and schemes B and show and utilize other material under the same conditions deposit and carry out dorsal part when processing.Damage schematically shows with line or line segment form.It is clear that the damage of much less can be recognized compared with the glass plate of figure A according to the glass plate of figure B.
Claims (6)
1. for divesting the method to the transparent crisp and hard material of laser emission by means of laser emission, wherein said material has the spatial volume of given thickness between the upside and downside of material, and described material has the optics depth of invasion defined being more than or equal to material thickness, wherein laser emission is with the incident angles defined between the axle of laser emission and the face normal of upside, and the laser emission incided on the upside of material is called as primary laser radiation, wherein primary laser radiation is reflected at least partly at the downside place of material, make to generate secondary laser emission by reflection in the volume of material, coherent superposition wherein by absorbing primary and secondary laser emission generates electron density in the volume of material, described electron density has at least two grades material to not same-action of electron density, distribute the specific threshold value of material of the intensity of primary laser radiation wherein to these grades of electron density, its mode is, change by material behavior and/or the mechanical damage with crack form characterize reaching of the first threshold of the intensity of primary laser radiation, and characterize reaching of Second Threshold by divesting with the machinery peeling off and/or divest form of material, it is characterized in that, in order to process crisp and hard material, described crisp and hard material is deposited by other material in downside form fit.
2. method according to claim 1, is characterized in that, is adjusted the optical characteristics of described other material by the interface spatially between structuring crisp and hard material and described other material.
3. method according to claim 1 and 2, is characterized in that, as other materials'use liquid.
4. method according to claim 3, it is characterized in that, the composition of liquid is adjusted to, make refractive index consistent with the value of the optical characteristics of the crisp and hard material that will divest with the value of the optical characteristics of absorptivity, make first threshold and the Second Threshold of the intensity being no more than laser emission, wherein first threshold is assigned to the appearance of damage, and Second Threshold is assigned to the appearance divested.
5. method according to claim 1 and 2, is characterized in that, as other materials'use solid panel.
6. for divesting the device to the transparent crisp and hard material of laser emission by means of laser emission, wherein said material has the spatial volume of given thickness between the upside and downside of material, and described material has the optics depth of invasion defined being more than or equal to material thickness, wherein laser emission is with the incident angles defined between the axle of laser emission and the face normal of upside, and the laser emission incided on the upside of material is called as primary laser radiation, wherein primary laser radiation is reflected at least partly at the downside place of material, make to generate secondary laser emission by reflection in the volume of material, coherent superposition wherein by absorbing primary and secondary laser emission generates electron density in the volume of material, described electron density has at least two grades material to not same-action of electron density, distribute the specific threshold value of material of the intensity of primary laser radiation wherein to these grades of electron density, its mode is, change by material behavior and/or the mechanical damage with crack form characterize reaching of the first threshold of the intensity of primary laser radiation, and characterize reaching of Second Threshold by divesting with the machinery peeling off and/or divest form of material, it is characterized in that, in order to process crisp and hard material, described crisp and hard material is deposited by other material in downside form fit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013005135.5A DE102013005135A1 (en) | 2013-03-26 | 2013-03-26 | Method and device for removing brittle-hard, transparent to laser radiation material by means of laser radiation |
| DE102013005135.5 | 2013-03-26 | ||
| PCT/EP2014/000788 WO2014154345A2 (en) | 2013-03-26 | 2014-03-24 | Method and device for removing brittle-hard material which is transparent to laser radiation, by means of laser radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105283265A true CN105283265A (en) | 2016-01-27 |
Family
ID=50678136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480030335.6A Pending CN105283265A (en) | 2013-03-26 | 2014-03-24 | Method and device for removing brittle-hard material which is transparent to laser radiation, by means of laser radiation |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2978558A2 (en) |
| KR (1) | KR20150135381A (en) |
| CN (1) | CN105283265A (en) |
| DE (1) | DE102013005135A1 (en) |
| WO (1) | WO2014154345A2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107026984A (en) * | 2016-02-01 | 2017-08-08 | 波音公司 | System and method for protecting high-radiation flux light based on the flight time |
| CN113560714A (en) * | 2021-08-05 | 2021-10-29 | 深圳市恩德斯科技有限公司 | Laser selective processing method, forming process and device for transparent material surface coating |
| CN114799539A (en) * | 2022-06-27 | 2022-07-29 | 中国华能集团清洁能源技术研究院有限公司 | Laser scribing method |
| TWI797311B (en) * | 2018-04-19 | 2023-04-01 | 美商康寧公司 | Methods for forming holes in substrates |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102138964B1 (en) | 2014-11-19 | 2020-07-28 | 트룸프 레이저-운트 시스템테크닉 게엠베하 | System for asymmetric optical beam shaping |
| DE102014116958B9 (en) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optical system for beam shaping of a laser beam, laser processing system, method for material processing and use of a common elongated focus zone for laser material processing |
| DE102014116957A1 (en) | 2014-11-19 | 2016-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Optical system for beam shaping |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005230863A (en) | 2004-02-19 | 2005-09-02 | Institute Of Physical & Chemical Research | Method and device for processing inside transparent material |
| DE102004020737A1 (en) * | 2004-04-27 | 2005-11-24 | Lzh Laserzentrum Hannover E.V. | Device for cutting components from brittle materials with stress-free component mounting |
| AT501000B1 (en) | 2004-10-25 | 2006-10-15 | Lisec Maschb Gmbh | METHOD AND ARRANGEMENT FOR SHARING GLASS, PARTICULARLY FLAT GLASS |
| DE102005055174B8 (en) * | 2005-11-18 | 2007-07-26 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Process for removing translucent materials with laser radiation and apparatus therefor |
-
2013
- 2013-03-26 DE DE102013005135.5A patent/DE102013005135A1/en active Pending
-
2014
- 2014-03-24 WO PCT/EP2014/000788 patent/WO2014154345A2/en active Application Filing
- 2014-03-24 CN CN201480030335.6A patent/CN105283265A/en active Pending
- 2014-03-24 KR KR1020157030101A patent/KR20150135381A/en not_active Application Discontinuation
- 2014-03-24 EP EP14721752.5A patent/EP2978558A2/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107026984A (en) * | 2016-02-01 | 2017-08-08 | 波音公司 | System and method for protecting high-radiation flux light based on the flight time |
| CN107026984B (en) * | 2016-02-01 | 2021-01-26 | 波音公司 | System and method for time-of-flight based protection of high radiant flux light |
| TWI797311B (en) * | 2018-04-19 | 2023-04-01 | 美商康寧公司 | Methods for forming holes in substrates |
| CN113560714A (en) * | 2021-08-05 | 2021-10-29 | 深圳市恩德斯科技有限公司 | Laser selective processing method, forming process and device for transparent material surface coating |
| CN114799539A (en) * | 2022-06-27 | 2022-07-29 | 中国华能集团清洁能源技术研究院有限公司 | Laser scribing method |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2978558A2 (en) | 2016-02-03 |
| WO2014154345A3 (en) | 2014-12-31 |
| KR20150135381A (en) | 2015-12-02 |
| DE102013005135A1 (en) | 2014-10-02 |
| WO2014154345A2 (en) | 2014-10-02 |
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Application publication date: 20160127 |