CN105278249A - Stereo-lithography rapid-prototyping cationic polysiloxane photosensitive resin composition and preparation method and application thereof - Google Patents
Stereo-lithography rapid-prototyping cationic polysiloxane photosensitive resin composition and preparation method and application thereof Download PDFInfo
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- CN105278249A CN105278249A CN201410264129.3A CN201410264129A CN105278249A CN 105278249 A CN105278249 A CN 105278249A CN 201410264129 A CN201410264129 A CN 201410264129A CN 105278249 A CN105278249 A CN 105278249A
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- polysiloxane
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- -1 polysiloxane Polymers 0.000 title claims abstract description 82
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 45
- 125000002091 cationic group Chemical group 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000011342 resin composition Substances 0.000 title claims abstract description 14
- 238000001459 lithography Methods 0.000 title abstract 6
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 125000003700 epoxy group Chemical group 0.000 claims abstract 9
- 239000004593 Epoxy Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 8
- 239000012749 thinning agent Substances 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000005864 Sulphur Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 3
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- RZTDESRVPFKCBH-UHFFFAOYSA-N 1-methyl-4-(4-methylphenyl)benzene Chemical group C1=CC(C)=CC=C1C1=CC=C(C)C=C1 RZTDESRVPFKCBH-UHFFFAOYSA-N 0.000 claims description 2
- XHIKSLHIZYVEQI-UHFFFAOYSA-N CC1=C(C(=O)[PH2]=O)C(=CC(=C1)C)C Chemical compound CC1=C(C(=O)[PH2]=O)C(=CC(=C1)C)C XHIKSLHIZYVEQI-UHFFFAOYSA-N 0.000 claims description 2
- QNJVYPYNVCLCBU-UHFFFAOYSA-N CCOP(=O)C(=O)c1c(C)cc(C)cc1C Chemical compound CCOP(=O)C(=O)c1c(C)cc(C)cc1C QNJVYPYNVCLCBU-UHFFFAOYSA-N 0.000 claims description 2
- 229910052740 iodine Inorganic materials 0.000 claims description 2
- 239000011630 iodine Substances 0.000 claims description 2
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 claims description 2
- HITZGLBEZMKWBW-UHFFFAOYSA-N ac1n8rtr Chemical group C1CC2OC2CC1CC[Si](O1)(O2)O[Si](O3)(C4CCCC4)O[Si](O4)(C5CCCC5)O[Si]1(C1CCCC1)O[Si](O1)(C5CCCC5)O[Si]2(C2CCCC2)O[Si]3(C2CCCC2)O[Si]41C1CCCC1 HITZGLBEZMKWBW-UHFFFAOYSA-N 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 claims 1
- 239000002994 raw material Substances 0.000 abstract 3
- 239000003085 diluting agent Substances 0.000 abstract 1
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000002118 epoxides Chemical group 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- OQBZXAHYFBVSIH-UHFFFAOYSA-N 2,2,4,4,6-pentamethyl-6-[3-(oxiran-2-ylmethoxy)propyl]-1,3,5,2,4,6-trioxatrisilinane Chemical compound C[Si]1(O[Si](O[Si](O1)(C)CCCOCC2CO2)(C)C)C OQBZXAHYFBVSIH-UHFFFAOYSA-N 0.000 description 2
- HDVVTZNLJGUDSK-UHFFFAOYSA-N C(C1CO1)O[SiH](O[Si](C)(C)C)C Chemical compound C(C1CO1)O[SiH](O[Si](C)(C)C)C HDVVTZNLJGUDSK-UHFFFAOYSA-N 0.000 description 2
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- HOCOIDRZLNGZMV-UHFFFAOYSA-N ethoxy(oxido)phosphanium Chemical compound CCO[PH2]=O HOCOIDRZLNGZMV-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 2
- IPXMMBFOSWEGRL-UHFFFAOYSA-N 2,2,4,4,6,6,8-heptamethyl-8-[3-(oxiran-2-ylmethoxy)propyl]-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound O1[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si]1(C)CCCOCC1OC1 IPXMMBFOSWEGRL-UHFFFAOYSA-N 0.000 description 1
- FBEAVZZRKBTLDU-UHFFFAOYSA-N C[Si]1(O[Si](O[Si](O1)(C)COCC2CO2)(C)C)C Chemical compound C[Si]1(O[Si](O[Si](O1)(C)COCC2CO2)(C)C)C FBEAVZZRKBTLDU-UHFFFAOYSA-N 0.000 description 1
- QNLHGCHRJUEVIT-UHFFFAOYSA-N C[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)COCC2CO2)(C)C)C Chemical compound C[Si]1(O[Si](O[Si](O[Si](O1)(C)C)(C)COCC2CO2)(C)C)C QNLHGCHRJUEVIT-UHFFFAOYSA-N 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003651 drinking water Substances 0.000 description 1
- 235000020188 drinking water Nutrition 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
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- Epoxy Resins (AREA)
Abstract
The invention relates to a stereo-lithography rapid-prototyping cationic polysiloxane photosensitive resin composition and its preparation method and application. The stereo-lithography rapid-prototyping cationic polysiloxane photosensitive resin composition mainly comprises the following raw materials (by weight): 10-85% of double-side polysiloxane containing an epoxide group, 3-21% of polyepoxy polysiloxane, 10-60% of a polysiloxane diluents containing an epoxy group and 1.0-4.0% of a cationic initiator. The raw materials are mixed according to the above ratio and the mixed raw materials are stirred and heated to obtain a transparent liquid, namely the stereo-lithography rapid-prototyping polysiloxane photosensitive resin. After stereo-lithography prototyping, the stereo-lithography rapid-prototyping polysiloxane photosensitive resin has rapid-prototyping characteristic of photosensitive resin and also has polysiloxane characteristic of high and low temperature resistance. A component molded by the use of the photosensitive resin has advantages of low shrinkage, high product precision, good heat resistance and the like.
Description
Technical field
The invention belongs to 3D and print Fast Forming Technique field, be specifically related to cationic polysiloxane group photosensitive resin composition of stereolithography rapid prototyping and preparation method thereof.
Background technology
It is exactly computer design 3D figure that 3D prints Fast Forming Technique, based on discrete-accumulation principle, according to three-dimensional computer digital model, adopt the method formation of parts successively piled up, be suitable for the parts manufactures such as personalization, short run, complex-shaped, hollow, technique has without model's point, has unrivaled advantage in the short run advanced development of new product development.
Stereolithography rapid prototyping technology adopts the light of specific wavelength and intensity to focus on photo-curing material surface, make it, by putting to line, by line to face consecutive solidification, to complete the drawing performance of an aspect, then lifting table moves the height of a synusia in the vertical direction, then solidifies another aspect.The formation that is layering like this 3D solid.
Print as 3D of new generation, use liquid photosensitive resin molded part, be cured with ultraviolet light, do not need expensive laser system, therefore equipment price is cheap, and operation and maintenance cost is also very low, can work at lower temperature (minimum reach 50 DEG C); And, also have simple to operate, forming speed is fast, forming process is pollution-free, the precision of drip molding is high, can in advantages such as office environment uses, therefore, application prospect is very good.
The photosensitive resin being applicable to stereolithography rapid prototyping requires that the viscosity of glue system is low, good fluidity, and solidification rate is fast, and cure shrinkage is low, and goods are bent without sled, the requirements such as excellent heat resistance.At present, the domestic preparation method for high precision, high-fire resistance stereolithography rapid prototyping material reports less.Report is had no specific to the cationic polysiloxane group photosensitive resin of stereolithography rapid prototyping and preparation thereof.Polysiloxane has Heat stability is good, glass temperature is low, gas penetration potential is high, dielectricity is excellent, with plurality of advantages and the special surface property such as good biocompatibility.
Summary of the invention
The object of the present invention is to provide a kind of high precision, high-fire resistance stereolithography rapid prototyping cationic
polysiloxane group photosensitive resin.The light-sensitive emulsion glassware for drinking water adopting this technology to prepare has system viscosity low, the advantage of good fluidity, under UV-irradiation, have glue curing speed fast, cure shrinkage is low, and goods are without the characteristic of sled song, due to the agent structure of its polysiloxane, give the high-low temperature resistant characteristic of the rear goods excellence of solidification.The parts utilizing this polysiloxane group photosensitive resin to be shaped, have precision high, good heat resistance, low temperature performance excellent, the advantages such as toughness enhancing.
The present invention also aims to the manufacture method that the cationic polysiloxane group photosensitive resin of stereolithography rapid prototyping is provided.
The present invention is achieved through the following technical solutions:
The cationic photosensitive resin of a kind of stereolithography rapid prototyping, comprises the material component of following quality proportioning:
Both-end is containing the polysiloxane 10 ~ 85% of epoxide group;
Polyepoxy polysiloxane 3-21%;
Containing epoxy radicals polysiloxane thinning agent 10 ~ 60%;
Thinning agent 10-80%
Cationic initiator 1.0 ~ 4.0%.
Preferably, described both-end is polysiloxane backbone containing the polysiloxane of epoxide group, and the polyorganosiloxane resin of epoxide group is contained at two ends, and molecular weight is between 2000-50000, uses the polymer mixed of one or more molecular weight to use respectively.
Preferably, described polyepoxy polysiloxane is the polysiloxane that side base and (or) end group contain epoxide group, and molecular weight is between 2000-50000, uses the polymer mixed of one or more molecular weight to use respectively.
Preferably, described is the polysiloxane that side base and (or) end group contain epoxide group containing epoxy radicals polysiloxane thinning agent, between molecular weight 300-2000;
More preferably, so-called is two (epoxypropoxy) tetramethyl disiloxane containing epoxy radicals polysiloxane thinning agent, two (epoxypropoxy) hexam ethylcyclotrisiloxane, two (epoxypropoxy) octamethylcyclotetrasiloxane, two (epoxypropoxy) decamethyl five siloxane, four (epoxypropoxy) tetramethyl-ring tetrasiloxane, four (epoxypropoxy) tetramethyl-ring tetrasiloxane, two (epoxy radicals hexyl propyl group) tetramethyl disiloxane, two (epoxy radicals hexyl propyl group) hexam ethylcyclotrisiloxane, two (epoxy radicals hexyl propyl group) octamethylcyclotetrasiloxane, two (epoxy radicals hexyl propyl group) decamethyl five siloxane, four (epoxypropoxy) tetramethyl-ring tetrasiloxane, four (epoxy radicals hexyl propyl group) tetramethyl-ring tetrasiloxane, two (glycidoxyethyl) tetramethyl disiloxane, two (glycidoxyethyl) hexam ethylcyclotrisiloxane, two (glycidoxyethyl) octamethylcyclotetrasiloxane, two (glycidoxyethyl) decamethyl five siloxane, four (glycidoxyethyl) tetramethyl-ring tetrasiloxane, four (glycidoxyethyl) tetramethyl-ring tetrasiloxane, two (epoxy radicals hexyl ethyl) tetramethyl disiloxane, two (epoxy radicals hexyl ethyl) hexam ethylcyclotrisiloxane, two (epoxy radicals hexyl ethyl) octamethylcyclotetrasiloxane, two (epoxy radicals hexyl ethyl) decamethyl five siloxane, four (glycidoxyethyl) tetramethyl-ring tetrasiloxane, the potpourri of four (epoxy radicals hexyl ethyl) tetramethyl-ring tetrasiloxane or more material.
Described thinning agent is the organic compound containing epoxide group, and more preferably, thinning agent is alkyl glycidyl ether, neodecanoic acid diglycidyl fat, trihydroxymethylpropanyltri diglycidyl ether, toluene glycidol ether, castor oil polyglycidyl ether.
Preferably, so-called cationic initiator is the initiating agent causing epoxy reaction.
More preferably, so-called cationic initiators is two 2, the luxuriant titanium of 6-bis-fluoro-3-pyrroles phenyl two, triaryl hexafluorophosphoric acid sulfosalt, 4, 4 '-dimethyl diphenyl iodine hexafluorophosphate, 10-(4-xenyl)-ITX hexafluorophosphate, the reaction product of the same 10-of polyvalent alcohol [4-(2-carboxymethoxyl)-biphenyl]-2-isopropyl-9 oxygen-9H-thioxanthones-10-sulphur hexafluorophosphate, phenyl two (2, 4, 6-trimethylbenzoyl) phosphine oxide, 2, 4, 6-trimethylbenzoy-dipheny phosphine oxide, 2, 4, 6-trimethylbenzoyl phosphinic acid ethyl ester or potpourris two or more in them.Or two or more potpourri in them.
Present invention also offers a kind of preparation method of above-mentioned stereolithography rapid prototyping photosensitive resin, the method is mixed by described quality proportioning by described material component, mixture is heated, stir till becoming transparent uniform liquid, the product of acquisition is stereolithography rapid prototyping photosensitive resin.
Above-mentioned stereolithography rapid prototyping photosensitive resin is applied to stereolithography rapid prototyping technical field as photo-curing material, and its curing light source preferably adopts wavelength to be the ultraviolet light of 345nm ~ 385nmnm.
Embodiment
Below in conjunction with embodiment, the present invention is done and describes in detail further, but implementation of the present invention is not limited thereto.
Embodiment 1
In the glass there-necked flask of 5000 milliliters that stirrer and condenser pipe are housed, add both-end epoxypropoxy polysiloxane (molecular weight is 50000) 2210.0g, multi-epoxy third oxygen propyl group polysiloxane (molecular weight is 2000) 546.0g, two (epoxypropoxy) tetramethyl disiloxane 380.0g, neodecanoic acid diglycidyl fat 450.g, triaryl hexafluorophosphoric acid sulfosalt 46.0g.Heating, stir until become transparent faint yellow uniform liquid, this liquid is a kind of photosensitive resin of preparation.With this photosensitive resin prepared as material, utilize ultraviolet light 3D printer can make 3D and print works.
Embodiment 2
In the glass there-necked flask of 5000 milliliters that stirrer and condenser pipe are housed, add both-end epoxypropoxy polysiloxane (molecular weight is 2000) 400.0g, multi-epoxy third oxygen propyl group polysiloxane (molecular weight is 50000) 120.0g, four (epoxypropoxy) tetramethyl-ring tetrasiloxane 2100.0g, toluene glycidol ether 560.0g, 10-(4-xenyl)-ITX hexafluorophosphate 40.0 grams.Heating, stirs until become transparent faint yellow uniform liquid, is a kind of photosensitive resin of preparation.
Embodiment 3
In the glass there-necked flask of 5000 milliliters that stirrer and condenser pipe are housed, add both-end epoxypropoxy polysiloxane (molecular weight is 20000) 1500.0g, multi-epoxy third oxygen propyl group polysiloxane (molecular weight is 25000) 310.0g, two (glycidoxyethyl) hexam ethylcyclotrisiloxane 930.0g, trihydroxymethylpropanyltri diglycidyl ether 450.0g, the luxuriant titanium 60.0g of two 2,6-bis-fluoro-3-pyrroles's phenyl two.Heating, stirs until become transparent faint yellow uniform liquid, is a kind of photosensitive resin of preparation.
Embodiment 4
In the glass there-necked flask of 5000 milliliters that stirrer and condenser pipe are housed, add both-end epoxyhexyl propyl group polysiloxane (molecular weight is 50000) 1275g, multi-epoxy hexyl propyl group polysiloxane (molecular weight is 2000) 330.0g, two (epoxyhexyl propyl group) hexam ethylcyclotrisiloxane 450.0g, castor oil polyglycidyl ether 1980.0g, 10-(4-xenyl)-ITX hexafluorophosphate 46g.Heating, stir until become transparent faint yellow uniform liquid, this liquid is a kind of photosensitive resin of preparation.With this photosensitive resin prepared as material, utilize ultraviolet light 3D printer can make 3D and print works.
Embodiment 5
In the glass there-necked flask of 5000 milliliters that stirrer and condenser pipe are housed, add both-end epoxyhexyl propyl group polysiloxane (molecular weight is 2000) 1000g, multi-epoxy hexyl propyl group polysiloxane (molecular weight is 50000) 300g, four (epoxyhexyl propyl group) tetramethyl-ring tetrasiloxane 600g, neodecanoic acid diglycidyl fat 1450.0g, 10-(4-xenyl)-ITX hexafluorophosphate 40 grams.Heating, stirs until become transparent faint yellow uniform liquid, is a kind of photosensitive resin of preparation.
Embodiment 6
In the glass there-necked flask of 5000 milliliters that stirrer and condenser pipe are housed, add both-end epoxyhexyl propyl group polysiloxane (molecular weight is 20000) 1500g, multi-epoxy hexyl propyl group polysiloxane (molecular weight is 25000) 320g, two (epoxyhexyl ethyl) octamethylcyclotetrasiloxane 1050.0g, the reaction product 56 grams of alkyl glycidyl ether 1050.0g, the same 10-of polyvalent alcohol [4-(2-carboxymethoxyl)-biphenyl]-2-isopropyl-9 oxygen-9H-thioxanthones-10-sulphur hexafluorophosphate.Heating, stirs until become transparent faint yellow uniform liquid, is a kind of photosensitive resin of preparation.
Embodiment 7
In the glass there-necked flask of 5000 milliliters that stirrer and condenser pipe are housed; add both-end epoxyhexyl propyl group polysiloxane (molecular weight is 20000) 1000g; oneself the third oxygen propyl group polysiloxane (molecular weight is 25000) 210.0g of multi-epoxy; four (epoxy radicals hexyl ethyl) tetramethyl-ring tetrasiloxane 610g; trihydroxymethylpropanyltri diglycidyl ether 1420.0g; 2; 4; 6-trimethylbenzoy-dipheny phosphine oxide 30.0g; 2; 4,6-trimethylbenzoyl phosphinic acid ethyl ester 20.0g.Heating, stirs until become transparent faint yellow uniform liquid, is a kind of photosensitive resin of preparation.
Embodiment 8
In the glass there-necked flask of 5000 milliliters that stirrer and condenser pipe are housed; add both-end epoxyhexyl propyl group polysiloxane (molecular weight is 20000) 1500g; oneself the third oxygen propyl group polysiloxane (molecular weight is 25000) 360.0g of multi-epoxy; four (epoxy radicals hexyl propyl group) tetramethyl-ring tetrasiloxane 450.0g; trihydroxy methyl ice alkane triglycidyl ether 450.0g; 2; 4; 6-trimethylbenzoy-dipheny phosphine oxide 45.0g; 2; 4,6-trimethylbenzoyl phosphinic acid ethyl ester 30.0g.Heating, stirs until become transparent faint yellow uniform liquid, is a kind of photosensitive resin of preparation.
Claims (9)
1. the cationic polysiloxane group photosensitive resin composition of stereolithography rapid prototyping, is characterized in that: the material component comprising following quality proportioning:
Both-end is containing the polysiloxane 10 ~ 85% of epoxide group;
Polyepoxy polysiloxane 3-21%;
Containing epoxy radicals polysiloxane thinning agent 10 ~ 60%;
Cationic initiator 1.0 ~ 4.0%.
2. the cationic polysiloxane group photosensitive resin composition of a kind of stereolithography rapid prototyping according to claim 1, it is characterized in that: described both-end is polysiloxane backbone containing the polysiloxane of epoxide group, the polyorganosiloxane resin of epoxide group is contained at two ends, and molecular weight is between 2000-50000.
3. the cationic polysiloxane group photosensitive resin composition of a kind of stereolithography rapid prototyping according to claim 1, it is characterized in that: described polyepoxy polysiloxane is the polysiloxane that side base and (or) end group contain epoxide group, molecular weight is between 2000-50000.
4. the cationic polysiloxane group photosensitive resin composition of a kind of stereolithography rapid prototyping according to claim 1, it is characterized in that: described is the polysiloxane that side base and (or) end group contain epoxide group containing epoxy radicals polysiloxane thinning agent, between molecular weight 300-2000.
5. the cationic polysiloxane group photosensitive resin composition of a kind of stereolithography rapid prototyping according to Claims 1-4, is characterized in that: the structure of described epoxide group is epoxypropoxy, glycidoxyethyl, epoxy cyclohexylethyl, expoxycyclohexyl propyl group.
6. the cationic polysiloxane group photosensitive resin composition of a kind of stereolithography rapid prototyping according to claim 1-5, it is characterized in that: the structure of described polysiloxane is except epoxide group, can also be made up of other organo-functional group, such as, be made up of methyl, phenyl and trifluoro propyl.
7. the cationic polysiloxane group photosensitive resin composition of a kind of stereolithography rapid prototyping according to claim 1, it is characterized in that: described cationic initiators is two 2, the luxuriant titanium of 6-bis-fluoro-3-pyrroles phenyl two, triaryl hexafluorophosphoric acid sulfosalt, 4, 4 '-dimethyl diphenyl iodine hexafluorophosphate, 10-(4-xenyl)-ITX hexafluorophosphate, the reaction product of the same 10-of polyvalent alcohol [4-(2-carboxymethoxyl)-biphenyl]-2-isopropyl-9 oxygen-9H-thioxanthones-10-sulphur hexafluorophosphate, phenyl two (2, 4, 6-trimethylbenzoyl) phosphine oxide, 2, 4, 6-trimethylbenzoy-dipheny phosphine oxide, 2, 4, 6-trimethylbenzoyl phosphinic acid ethyl ester or potpourris two or more in them.
8. the preparation method of the cationic polysiloxane group photosensitive resin composition of a kind of stereolithography rapid prototyping according to claim 1-7, it is characterized in that: described material component is mixed by described quality proportioning, stir lower heating, until become transparent uniform liquid.
9. the application of the cationic polysiloxane group photosensitive resin composition of a kind of stereolithography rapid prototyping described in claim 1-8, is characterized in that: curing light source adopts wavelength to be the ultraviolet light of 355nm ~ 385nmnm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410264129.3A CN105278249B (en) | 2014-05-30 | 2014-05-30 | A kind of stereolithography rapid prototyping cationic polysiloxane group photosensitive resin composition and its preparation method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410264129.3A CN105278249B (en) | 2014-05-30 | 2014-05-30 | A kind of stereolithography rapid prototyping cationic polysiloxane group photosensitive resin composition and its preparation method and application |
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| CN107357136A (en) * | 2017-08-23 | 2017-11-17 | 广西众昌树脂有限公司 | Photosensitive liquid resin |
| KR20180097318A (en) * | 2017-02-23 | 2018-08-31 | 동우 화인켐 주식회사 | A method of silicon compound, colored photosensitive resin composition, color filter and image display device comprising using the same |
| JP2019117325A (en) * | 2017-12-27 | 2019-07-18 | 信越化学工業株式会社 | Photosensitive resin composition, pattern forming method and method for manufacturing optical semiconductor element |
| WO2020073822A1 (en) * | 2018-10-09 | 2020-04-16 | 常州强力先端电子材料有限公司 | Triphenylphosphonium salt compound, and uses thereof |
| CN111018764A (en) * | 2018-10-09 | 2020-04-17 | 常州强力先端电子材料有限公司 | Triphenylsulfonium salt compound and application thereof |
| CN113754441A (en) * | 2021-03-15 | 2021-12-07 | 山东理工大学 | Photosensitive resin and preparation method and application thereof |
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| CN113754441B (en) * | 2021-03-15 | 2023-02-17 | 山东理工大学 | Photosensitive resin and preparation method and application thereof |
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