CN105263292A - Electronic equipment framework manufacturing method and electronic equipment - Google Patents
Electronic equipment framework manufacturing method and electronic equipment Download PDFInfo
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- CN105263292A CN105263292A CN201510634247.3A CN201510634247A CN105263292A CN 105263292 A CN105263292 A CN 105263292A CN 201510634247 A CN201510634247 A CN 201510634247A CN 105263292 A CN105263292 A CN 105263292A
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- center
- electronic equipment
- middle frame
- frame support
- outer ring
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Abstract
The invention discloses an electronic equipment framework manufacturing method. The electronic equipment framework manufacturing method comprises steps that, a metal material is processed into a middle frame outer loop, the metal material comprises aluminum or aluminum alloy, a die casting groove is formed at an inner side of the middle frame outer loop through processing, a die casting aluminum alloy embedding member is processed at the die casting groove through die casting to form a middle frame support, and the middle frame support and the middle frame outer loop form the middle frame of the electronic equipment. The invention further provides the corresponding electronic equipment. Through the method and the electronic equipment, problems of appearance requirement and reliability requirement for products can not be both satisfied on the basis of cost control of the electronic equipment are solved.
Description
Technical field
The present invention relates to material processing field, especially a kind of framework preparation method of electronic equipment and electronic equipment.
Background technology
Along with making rapid progress of consumer electronics product, the product competition of various brands is fierce, consumer is also more and more higher for the requirement of consumer electronics product, except the hardware specification (such as processor, screen size and pixel, network formats, camera pixel etc.) of electronic product, consumer also values the appearance design of electronic product very much.For appearance, the aluminium alloy (6061,6063) of fine aluminium or a few kind can reach good appearance by anodic oxidation or other surface treatment methods.
Meanwhile, the aluminium alloy of these kinds, because the intensity of material own is not high, under the requirement meeting structural strength, use nanometer Shooting Technique and high cutting output mechanical processing technique, cause product cost high, be therefore difficult to extensive use.
Summary of the invention
The embodiment of the present invention provides a kind of framework preparation method and electronic equipment of electronic equipment, is difficult on the basis of controlling cost, meet the appearance requirement of product and the problem of reliability requirement in order to solve electronic equipment in prior art simultaneously.
The framework preparation method of a kind of electronic equipment that the embodiment of the present invention provides, comprising:
Be center outer ring by metal material processing, described metal material comprises aluminum or aluminum alloy;
Coined groove is processed in the inner side of described center outer ring;
At described coined groove place, pack alloy inserts is die cast as middle frame support, described middle frame support and described center outer ring form the center of described electronic equipment.
The embodiment of the present invention additionally provides corresponding electronic equipment, comprises center, and this center comprises:
The center outer ring of aluminum or aluminum alloy material and the middle frame support of die-cast aluminum alloy material, be provided with coined groove inside described center outer ring, described middle frame support is fixed on described coined groove.
The framework preparation method of the electronic equipment that the embodiment of the present invention provides, by being center outer ring by metal material processing, described metal material comprises aluminum or aluminum alloy, coined groove is processed in the inner side of described center outer ring, at described coined groove place, pack alloy inserts is die cast as middle frame support, described middle frame support and described center outer ring form the center of described electronic equipment, achieve the metal materials such as the aluminum or aluminum alloy by meeting appearance requirement to combine with the pack alloy meeting requirement of strength, make the center outer ring of electronic rack exposed parts can present abundant appearance by later stage surface treatment, make to be assembled in the structural requirement that inner middle frame support can meet high strength simultaneously, and be beneficial to cost control, be suitable for extensive use.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, to use required in describing embodiment below
accompanying drawingbe briefly described, in the following describes
accompanying drawingonly some embodiments of the present invention
accompanying drawing, for those of ordinary skill in the art, under the prerequisite not paying creative work, can also according to these
accompanying drawingobtain other
accompanying drawing.
fig. 1it is the flow process signal of first embodiment of the framework preparation method of electronic equipment of the present invention
figure;
fig. 2be second embodiment of the framework preparation method of electronic equipment of the present invention at described coined groove place, pack alloy inserts is die cast as middle frame support, described middle frame support and described center outer ring formed the center of described electronic equipment flow process signal
figure;
fig. 3it is the structure of cast die signal of electronic equipment of the present invention
figure;
fig. 4it is the flow process signal of the 3rd embodiment of the framework preparation method of electronic equipment of the present invention
figure;
fig. 5it is the longitudinal profile structural representation of the imitation-shaped knife of electronic equipment of the present invention
figure;
fig. 6be the 3rd embodiment of the framework preparation method of electronic equipment of the present invention using described center as anode be placed in electrolyte solution carry out energising process, utilize electrolysis make described center surface formed anodic oxide coating flow process signal
figure;
fig. 7it is the structural profile signal of electronic rack of the present invention
figure.
Embodiment
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearly understand, below in conjunction with
accompanying drawingand embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Below in conjunction with in the embodiment of the present invention
accompanying drawing, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
See
fig. 1, it is the flow process signal of first embodiment of the framework preparation method of electronic equipment of the present invention
figure.In the present embodiment, the framework preparation method of electronic equipment comprises the following steps:
Step S11, be center outer ring by metal material processing, metal material comprises aluminum or aluminum alloy.
In this step, be center outer ring by metal material processing, when metal material is aluminum or aluminum alloy material, it is squeezed into the outer loop-shaped of center, then cuts into required thickness, so simply polish, stand-by after deburring.
In the embodiment of the present invention, this aluminum alloy materials comprises and can carry out anodised aluminum alloy materials, is preferably fine aluminium, 6061 aluminium alloys, 6063 aluminium alloys.
Step S12, processes coined groove in the inner side of center outer ring.
In this step, the inner side processing the center outer ring obtained in step s 11 processes coined groove.In the embodiment of the present invention, can use machining process, comprise Digit Control Machine Tool processing method etc., along the inner surface processing one circle coined groove of center outer ring, then deburring is stand-by.
In the embodiment of the present invention, coined groove comprises dovetail groove.Traditional I-groove not only handling ease compared by dovetail groove, and is also more easy to filling casting mold as coined groove.
Step S13, at coined groove place, is die cast as middle frame support by pack alloy inserts, and middle frame support and center outer ring form the center of electronic equipment.
In the embodiment of the present invention, die casting develops a kind of few Special Processes of Metal Castings method without cutting faster in metal working process in modern age.It is by motlten metal at high-voltage high-speed retrofilling casting mold, and under high pressure crystallization and freezing forms the process of foundry goods.
The framework preparation method of the electronic equipment that the embodiment of the present invention provides, by being center outer ring by metal material processing, metal material comprises aluminum or aluminum alloy, coined groove is processed in the inner side of center outer ring, at coined groove place, pack alloy inserts is die cast as middle frame support, middle frame support and center outer ring form the center of electronic equipment, achieve the metal materials such as the aluminum or aluminum alloy by meeting appearance requirement to combine with the pack alloy meeting requirement of strength, make the center outer ring of electronic rack exposed parts can present abundant appearance by later stage surface treatment, make to be assembled in the structural requirement that inner middle frame support can meet high strength simultaneously, and be beneficial to cost control, be suitable for extensive use.
Second embodiment of the framework preparation method of electronic equipment of the present invention is the improvement to the first embodiment.See
fig. 2, its be second embodiment of the framework preparation method of electronic equipment of the present invention at coined groove place, pack alloy inserts is die cast as middle frame support, and middle frame support and center outer ring form the flow process signal of the center of electronic equipment
figure.This step is further comprising the steps of:
Step S231, fixing center outer ring is in die casting.
In this step, die casting is fixed in center outer ring.See
fig. 3, it is the structural representation of the die casting of electronic equipment of the present invention
figure.
as Fig. 3shown in, this die casting 5 can comprise cover half 6 and dynamic model 7, and cover half 6 is provided with charging aperture 8.Dynamic model 7 also comprise ejecting mechanism (
in figurenot shown), this ejecting mechanism can be used for foundry goods to release; Cover half 6 be usually connected to cover half mounting panel (
in figurenot shown) on, dynamic model 7 be then connected to dynamic model mounting panel (
in figurenot shown) on.
Step S232, under 600 ~ 800 DEG C of conditions, preferably 670 DEG C, high pressure injects liquid pack alloy in die casting and coined groove.
In this step, by pack alloy under 600 ~ 800 DEG C of conditions, preferably 670 DEG C, be injected in die casting 5 and coined groove by charging aperture 8, make it the middle frame support being formed as being embedded in coined groove.
Step S233, treats that middle frame support solidifies sizing, takes out center.
In this step, after middle frame support coagulation forming, dynamic model 7 separates with cover half 6, is released by whole center by means of the ejecting mechanism be located on dynamic model 7, and this center comprises center outer ring and solidified the middle frame support of sizing.
In the embodiment of the present invention, can stay in dynamic model 7 when opening foundry goods after die casting, now the ejecting mechanism of dynamic model 7 will foundry goods to pushing out, and ejecting mechanism is normally driven by dynamic model mounting panel, the suitable strength of dynamic model mounting panel drives ejecting mechanism, to ensure that foundry goods is not damaged.After foundry goods is pushed out, dynamic model mounting panel regains, all ejecting mechanisms for die casting is ready next time.
The embodiment of the present invention is by fixing center outer ring in die casting, under 600 ~ 800 DEG C of conditions, high pressure injects pack alloy in die casting and coined groove, treat that middle frame support solidifies sizing, take out center, achieve and use extrusion process to improve the intensity of middle frame support, and be convenient to realize mechanization and automation.
See
fig. 4, it is the flow process signal of the 3rd embodiment of the framework preparation method of electronic equipment of the present invention
figure.The framework preparation method of the electronic equipment in the present embodiment comprises the following steps:
Step S31, be center outer ring by metal material processing, metal material comprises aluminum or aluminum alloy.
Step S32, processes coined groove in the inner side of center outer ring.
Step S33, at coined groove place, is die cast as middle frame support by pack alloy inserts, and middle frame support and center outer ring form the center of electronic equipment.
Step S31 to step S33 is identical with the corresponding step of first embodiment of the framework preparation method of electronic equipment of the present invention, repeats no more here.
Step S34, uses imitation-shaped knife processing center.
In this step, center is fixed, by the imitation-shaped knife of customization, process appearance.See
fig. 5, it is the longitudinal profile structural representation of the imitation-shaped knife of electronic equipment of the present invention
figure.
as Fig. 5described, this imitation-shaped knife 9 comprises blade 10, and the top of this imitation-shaped knife 9 is cylindric, and sharp-pointed outstanding blade 10 is formed at bottom, and this imitation-shaped knife 9 has contacted processing by blade 10 with working position by what rotate.In the embodiment of the present invention, this course of processing comprises carries out cut according to the movement locus of model or pattern control imitation-shaped knife 9 or workpiece.
In the embodiment of the present invention, using imitation-shaped knife 9 pairs of centers to process, both can ensure the accuracy of center geomery, is also that follow-up surface treatment is prepared by arranging appearance.
Step S35, by abrasive material high velocity jet in center surface.
In this step, by abrasive material high velocity jet in center surface, not only can remove the flaw on its surface, its surface roughness can also be regulated, for follow-up surface treatment is prepared.
In the embodiment of the present invention, abrasive material comprises at least one in zircon sand, diamond, aluminium oxide, chromium oxide, iron oxide, magnesium oxide, preferably No. 270 zircon sands.The appearance using No. 270 zircon sand process is silver color, and its roughness is suitable for subsequent treatment.When use No. 270 zircon sands are as abrasive material, zircon sand is surperficial in center with 25 pounds of pressure sandblastings, continue 20 seconds.
Step S36, clean center.
In this step, the technique of clean center can comprise ultrasonic cleaning technology, polishing or scratch brushing technique.In the embodiment of the present invention, ultrasonic cleaning technology can remove the attachment on center surface; And process this center further to obtain light, flat surface by polishing or scratch brushing.Wherein, polishing comprises chemical polishing, and chemical polishing can remove the copper component of some alloy surface.
Step S37, is placed in electrolyte solution using center as anode and carries out energising process, utilizes electrolysis to make the surface of center form anodic oxide coating.
In this step, form anodic oxide coating by anodizing on center surface.Wherein, anodic oxide coating obviously can improve the mechanical performance on center surface on the one hand, as corrosion resistance, resistance to wear; On the other hand, the ornamental of center surface can also be significantly improved through adequate colouration.
See
fig. 6, its be the 3rd embodiment of the framework preparation method of electronic equipment of the present invention using center as anode be placed in electrolyte solution carry out energising process, utilize electrolysis make center surface formed anodic oxide coating flow process signal
figure.Wherein, step S37 comprises:
Step S371, utilizes electrolysis, forms anodic oxide coating in center surface.
In this step, electrolysis is utilized to form anodic oxide coating on center surface.In the embodiment of the present invention, anodised power-on voltage comprises 12V, comprises 30 minutes conduction time.
Step S372, deposits dye molecule in the micropore of anodic oxide coating.
In this step, in the micropore of anodic oxide coating, deposit dye molecule, painted to realize.
Step S373, seals micropore, makes dye molecule be fixed in anodic oxide coating;
In this step, seal micropore, dye molecule is fixed in anodic oxide coating to reach colour fixation.In addition, when center outer ring adopts aluminum or aluminum alloy material, alumite is porous membrane, no matter whether has coloring treatment, all will carry out Seal treatment before being taken into use, could improve its corrosion resistance and weatherability like this.In the embodiment of the present invention, the sealing of hole time can be 10 minutes.
Step S374, baking center.
In this step, the center after baking sealing of hole, baking time can be 15 minutes.
The embodiment of the present invention, by arranging and the surface of clean center, then carries out anodized to this center surface, makes center surface produce anodic oxide coating, to realize good mechanical performance and ornamental.
Detailed introduction is done to the embodiment of the framework preparation method of electronic equipment of the present invention above.To be further elaborated corresponding to above-mentioned electronic equipment below.
See
fig. 7, it is the structural profile signal of electronic rack of the present invention
figure.
The electronic equipment of the embodiment of the present invention comprises center, and this center comprises: the center outer ring 1 of aluminum or aluminum alloy material and the middle frame support 3 of die-cast aluminum alloy material, be provided with coined groove 2 inside center outer ring 1, middle frame support 3 is fixed on coined groove 3.Further, this electronic equipment includes but not limited to mobile phone, flat board, navigation, laptop computer.
In the embodiment of the present invention, combine meeting the metal materials such as the aluminum or aluminum alloy of appearance requirement with the pack alloy meeting requirement of strength, make the center outer ring of electronic rack exposed parts can present abundant appearance by later stage surface treatment, make to be assembled in the structural requirement that inner middle frame support can meet high strength simultaneously, and be beneficial to cost control and extensive use.
Preferably, coined groove 2 comprises dovetail groove.Traditional I-groove not only handling ease compared by dovetail groove, and is also more easy to filling casting mold as coined groove.
Preferably, center surface is provided with anodic oxide coating 4.The anodic oxide coating on aluminum or aluminum alloy surface can realize good mechanical performance and ornamental.
The form that the middle frame support that the embodiment of the present invention have employed the center outer ring of aluminum or aluminum alloy and pack alloy combines achieves getting both of appearance and mechanical performance, on the other hand, the anodic oxide coating being arranged at center outer ring then can optimize mechanical performance and the decorative effect on center surface.
In describing the invention, it is to be appreciated that term " longitudinal direction ", " radial direction ", " length ", " width ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", the orientation of the instruction such as " outward " or position relationship be based on
accompanying drawing institutethe orientation shown or position relationship are only for convenience of description originally
inventionand simplified characterization, instead of instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as to this reality invent restriction.In describing the invention, except as otherwise noted, the implication of " multiple " is two or more.
Above disclosedly be only a kind of preferred embodiment of the present invention, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (10)
1. a framework preparation method for electronic equipment, is characterized in that, comprising:
Be center outer ring by metal material processing, described metal material comprises aluminum or aluminum alloy;
Coined groove is processed in the inner side of described center outer ring;
At described coined groove place, pack alloy inserts is die cast as middle frame support, described middle frame support and described center outer ring form the center of described electronic equipment.
2. preparation method according to claim 1, is characterized in that, describedly at described coined groove place, pack alloy inserts is die cast as middle frame support, and described middle frame support and described center outer ring form the step of the center of described electronic equipment, comprising:
Fixing described center outer ring is in die casting;
Under 600 ~ 800 DEG C of conditions, high pressure injects liquid pack alloy in described die casting and described coined groove;
Treat that described middle frame support solidifies sizing, take out described center.
3. preparation method according to claim 1, is characterized in that, describedly at described coined groove place, pack alloy inserts is die cast as middle frame support, and described middle frame support and described center outer ring also comprise after forming the step of the center of described electronic equipment:
Imitation-shaped knife is used to process described center;
By abrasive material high velocity jet in described center surface;
Described center is placed in electrolyte solution as anode and carries out energising process, utilize electrolysis to make the surface of described center form anodic oxide coating.
4. preparation method according to claim 3, is characterized in that, described abrasive material comprises at least one in zircon sand, diamond, aluminium oxide, chromium oxide, iron oxide, magnesium oxide.
5. preparation method according to claim 3, is characterized in that, describedly described center is placed in electrolyte solution as anode carries out energising process, utilizes electrolysis to make the surface of described center form the step of anodic oxide coating, comprising:
Ultrasonic cleaning technology is adopted to clean described center surface;
Adopt center surface described in polishing or scratch brushing PROCESS FOR TREATMENT;
Utilize electrolysis, form anodic oxide coating in described center surface;
Dye molecule is deposited in the micropore of described anodic oxide coating;
Seal described micropore, make described dye molecule be fixed in described anodic oxide coating;
Toast described center.
6. preparation method according to claim 1, is characterized in that, described coined groove comprises dovetail groove.
7. an electronic equipment, comprises center, it is characterized in that, described center comprises: the center outer ring of metal material and the middle frame support of die-cast aluminum alloy material, be provided with coined groove inside described center outer ring, described middle frame support is fixed on described coined groove.
8. electronic equipment according to claim 7, is characterized in that, described coined groove comprises dovetail groove.
9. electronic equipment according to claim 7, is characterized in that, described center surface is provided with anodic oxide coating.
10. the electronic equipment according to any one of claim 7 ~ 9, is characterized in that, described electronic equipment comprises mobile phone, flat board, navigation, laptop computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510634247.3A CN105263292A (en) | 2015-09-28 | 2015-09-28 | Electronic equipment framework manufacturing method and electronic equipment |
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|---|---|---|---|
| CN201510634247.3A CN105263292A (en) | 2015-09-28 | 2015-09-28 | Electronic equipment framework manufacturing method and electronic equipment |
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| CN105263292A true CN105263292A (en) | 2016-01-20 |
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| CN201510634247.3A Pending CN105263292A (en) | 2015-09-28 | 2015-09-28 | Electronic equipment framework manufacturing method and electronic equipment |
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Cited By (6)
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| CN107214315A (en) * | 2017-05-11 | 2017-09-29 | 广东长盈精密技术有限公司 | Center and its manufacture method |
| CN107598137A (en) * | 2017-09-05 | 2018-01-19 | 联想(北京)有限公司 | The pressure casting method and electronic equipment of a kind of metal shell |
| CN107931730A (en) * | 2017-11-20 | 2018-04-20 | 广东欧珀移动通信有限公司 | A kind of processing method of housing, housing and mobile terminal |
| CN108085727A (en) * | 2017-12-27 | 2018-05-29 | 重庆市华阳光学仪器有限公司 | A kind of processing method of metal cage ring for telescope |
| CN108418936A (en) * | 2018-02-09 | 2018-08-17 | 广东欧珀移动通信有限公司 | The production method of shell, electronic device and shell |
| CN112153191A (en) * | 2019-06-29 | 2020-12-29 | 华为机器有限公司 | Structural member of mobile terminal, preparation method of structural member and mobile terminal |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107214315A (en) * | 2017-05-11 | 2017-09-29 | 广东长盈精密技术有限公司 | Center and its manufacture method |
| CN107598137A (en) * | 2017-09-05 | 2018-01-19 | 联想(北京)有限公司 | The pressure casting method and electronic equipment of a kind of metal shell |
| CN107931730A (en) * | 2017-11-20 | 2018-04-20 | 广东欧珀移动通信有限公司 | A kind of processing method of housing, housing and mobile terminal |
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| CN108418936A (en) * | 2018-02-09 | 2018-08-17 | 广东欧珀移动通信有限公司 | The production method of shell, electronic device and shell |
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