CN105261409A - Polyimide powder mica tape wound copper flat wire - Google Patents
Polyimide powder mica tape wound copper flat wire Download PDFInfo
- Publication number
- CN105261409A CN105261409A CN201510665035.1A CN201510665035A CN105261409A CN 105261409 A CN105261409 A CN 105261409A CN 201510665035 A CN201510665035 A CN 201510665035A CN 105261409 A CN105261409 A CN 105261409A
- Authority
- CN
- China
- Prior art keywords
- mica paper
- polyimide film
- flat wire
- copper flat
- mica tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Insulating Bodies (AREA)
Abstract
The invention discloses a polyimide powder mica tape wound copper flat wire which comprises a copper flat wire. A polyimide powder mica tape is wound on the copper flat wire. The polyimide powder mica tape comprises a mica paper layer, a polyimide film and electrical alkali-free glass cloth, wherein the polyimide film and the electrical alkali-free glass cloth are respectively arranged at two sides of the mica paper layer. Furthermore the polyimide film contacts with the copper flat wire. The polyimide film is sealed in an adhesive manner through high-frequency heating fusion. The polyimide powder mica tape wound copper flat wire has advantages of high moisture-proof performance and higher reliability in use.
Description
Technical field
The present invention relates to a kind of polyimides mica paper tape to be wrapped copper strap wire.
Background technology
Wind power generation electromagnetic wire used is one of key technology of wind power generation, and current electromagnetic wire humidity resistance is not good.
Summary of the invention
A kind of polyimides mica paper tape that the object of the present invention is to provide a kind of humidity resistance good is wrapped copper strap wire.
The present invention is achieved through the following technical solutions: a kind of polyimides mica paper tape is wrapped copper strap wire, comprise copper strap wire, described copper strap wire is wrapped polyimides mica paper tape, described polyimides mica paper tape comprises mica paper layer, and lay respectively at polyimide film and the electrician alkali-free glass cloth of mica paper layer both sides, and what contact with copper strap wire is polyimide film; Described polyimide film is the polyimide film of high-frequency heating melting seal.
As present invention further optimization scheme, described mica paper layer, between polyimide film and electrician alkali-free glass cloth by organic pressure-sensitive gel adhesion.
Compared with prior art, the present invention has following beneficial effect:
A kind of polyimides mica paper tape of the present invention is wrapped copper strap wire, and humidity resistance is good, uses more reliable.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
As shown in Figure 1, a kind of polyimides mica paper tape is wrapped copper strap wire, comprise copper strap wire 1, described copper strap wire 1 is wrapped polyimides mica paper tape, described polyimides mica paper tape comprises mica paper layer 3, and lay respectively at polyimide film 2 and the electrician alkali-free glass cloth 4 of mica paper layer 3 both sides, and what contact with copper strap wire 1 is polyimide film 2; Described polyimide film 2 is the polyimide film of high-frequency heating melting seal.Described mica paper layer 3, between polyimide film 2 and electrician alkali-free glass cloth 4 by organic pressure-sensitive gel adhesion.
Claims (2)
1. a polyimides mica paper tape is wrapped copper strap wire, comprise copper strap wire (1), it is characterized in that: described copper strap wire (1) is wrapped polyimides mica paper tape, described polyimides mica paper tape comprises mica paper layer (3), and lay respectively at polyimide film (2) and the two-layer electrician alkali-free glass cloth (4) of mica paper layer (3) both sides, and what contact with copper strap wire (1) is polyimide film (2); The polyimide film that described polyimide film (2) is high-frequency heating melting seal.
2. a kind of polyimides mica paper tape according to claim 1 is wrapped copper strap wire, it is characterized in that: described mica paper layer (3), between polyimide film (2) and electrician alkali-free glass cloth (4) by organic pressure-sensitive gel adhesion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510665035.1A CN105261409A (en) | 2015-10-15 | 2015-10-15 | Polyimide powder mica tape wound copper flat wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510665035.1A CN105261409A (en) | 2015-10-15 | 2015-10-15 | Polyimide powder mica tape wound copper flat wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105261409A true CN105261409A (en) | 2016-01-20 |
Family
ID=55101057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510665035.1A Pending CN105261409A (en) | 2015-10-15 | 2015-10-15 | Polyimide powder mica tape wound copper flat wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105261409A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107332382A (en) * | 2017-07-28 | 2017-11-07 | 安徽威能电机有限公司 | The insulation system of wound rotor coil |
-
2015
- 2015-10-15 CN CN201510665035.1A patent/CN105261409A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107332382A (en) * | 2017-07-28 | 2017-11-07 | 安徽威能电机有限公司 | The insulation system of wound rotor coil |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160120 |
|
| WD01 | Invention patent application deemed withdrawn after publication |