CN105256976A - Geothermal solid wood composite floor and manufacturing method thereof - Google Patents
Geothermal solid wood composite floor and manufacturing method thereof Download PDFInfo
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- CN105256976A CN105256976A CN201510745390.XA CN201510745390A CN105256976A CN 105256976 A CN105256976 A CN 105256976A CN 201510745390 A CN201510745390 A CN 201510745390A CN 105256976 A CN105256976 A CN 105256976A
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Abstract
The invention relates to a geothermal solid wood composite floor and a manufacturing method thereof. A layer of metal film is arranged between a base material of the solid wood composite floor and a paint layer, and by using excellent heat-conducting property of metal, heat energy of the ground is conducted to the upper surface of the floor by the metal film, so that the heat-conducting property of the wood floor is effectively improved; wood has properties such as humidity absorption, desorption and air shrinkage and humidity expansion, and the metal film is arranged between the base material of the solid wood composite floor and the paint layer; contact between the base material of the solid wood composite floor and air and water molecules is effectively isolated, and water content in the base material of the solid wood composite floor is kept constant; deformation caused by water content of the solid wood floor is effectively solved; the geothermal floor uses the solid wood composite floor as the base material, and the metal film can reduce formaldehyde emission; the thickness of the metal film is set to be 30 nanometers to 50 micrometers; poor heat-conducting property and size stability of the geothermal floor are improved and wood textures are not influenced.
Description
Technical field
The invention belongs to man-made board technology field, particularly relate to a kind of underground heat solid wooden compound floor and manufacture method thereof.
Background technology
Heating floor is " by floor panel heating, interior temperature is even, and temperature is upwards radiation from ground, from bottom to top successively decreases ".Floor panel heating will become following main heating system.Domestic ground heating finishing rises from the nineties middle and later periods in last century, has also had 10 years till now, has obtained and develop fast.As the main product wood geothermal floor of heating floor, the subject matter existed at present is the low and poor dimensional stability of thermal conductivity.
Timber is a kind of natural porous macromolecular material, poor thermal conductivity, and ground heat is delivered to surface by floor, and heat waste is serious; The environment for use of heating floor is complicated, especially at northern area, various moisture will be born in non-heating season ground, and when heating, surface temperature raises again suddenly, often because the change of moisture content causes the problems such as floor cracking, distortion, the promotion and application of wood geothermal floor are had a strong impact on.
Summary of the invention
The object of the invention is to improve the deficiency in existing technology, a kind of manufacture method of underground heat solid wooden compound floor is provided, the technical barrier of the low and poor dimensional stability of current wood geothermal floor heat transfer efficiency can be efficiently solved.
For achieving the above object, the present invention takes following process technology scheme:
The invention provides a kind of manufacture method of underground heat solid wooden compound floor, comprise following workshop section:
(1) floor base material processing, the processing of (two) metal film, (three) paint process, is characterized in that:
(1) floor base material processing
Timber is processed into solid wooden compound floor base material;
(2) metal film processing
By described for step () wooden floor substrate surface plating layer of metal film, the thickness of described metal film is 30 nanometer-50 microns;
(3) paint process
In the surface of step (two) described metal film paint, comprise some roads priming paint and some roads finish paint.
Nano-cellulose is adopted to carry out graft modification process in the described metallic film surface of step (2).
In the one that step (two) described metal film is copper film, aluminium film and nickel film.
Described metal film adopts chemical plating or ion sputtering process to be plated in wooden floor base material or solid wooden compound floor substrate surface.
Present invention also offers a kind of underground heat solid wooden compound floor, it comprises solid wooden compound floor base material, skin of paint and metal film, between solid wooden compound floor base material and skin of paint, arrange layer of metal film, and the thickness of described metal film is between 30 nanometer-50 microns.
Described metallic film surface is through nano-cellulose graft modification process.
Described metal film is the one of copper film, aluminium film and nickel film.
The thickness of described metal film is between 30 nanometer-50 microns.
The present invention relates to a kind of underground heat solid wooden compound floor and manufacture method thereof, layer of metal film is provided with between solid wooden compound floor base material and skin of paint, utilize the heat conductivility that metal is excellent, by the heat energy on ground, be transmitted to floor upper surface by metal film, effectively can improve the heat conductivility of wood flooring; Timber has the wet performance such as to rise of moisture absorption, desorb and drying shrinkage, layer of metal film is provided with between solid wooden compound floor base material and skin of paint, effectively completely cut off the contact of solid wooden compound floor base material and air water molecule, make the water tariff collection in solid wooden compound floor base material constant, the distortion that heating floor causes because of moisture content can be efficiently solved; Using solid wooden compound floor as the heating floor of base material, metal film can also reduce burst size of methanal; The thickness of metal film is set to 30 nanometer-50 microns, namely can reach and improve heating floor heat conductivility difference and dimensional stability, not affect the grain of wood again.
Below in conjunction with the drawings and specific embodiments, the invention will be further described, not limitation of the present invention, and the equivalent replacement of every any this area of carrying out according to the disclosure of invention, all belongs to protection scope of the present invention.
Accompanying drawing explanation
Fig. 1 underground heat solid wooden compound floor schematic diagram
In figure: 1 is solid wooden compound floor base material; 2 is metallic diaphragm; 3 is skin of paint
Detailed description of the invention
Embodiment 1: underground heat solid wooden compound floor
The underground heat solid wooden compound floor of exemplary embodiments of the present invention, it comprises wooden floor base material (1), skin of paint (3) and copper film layer (2), between solid wooden compound floor base material (1) and skin of paint (3), arrange the copper film layer (2) that a layer thickness is 50 microns, nano-cellulose graft modification process has been carried out on copper film layer (2) surface.
The typical implementation step of composite geothermal floor wooden floor manufacture method of the present invention is as follows:
1, timber is processed into wooden floor base material, belongs to prior art;
2, wooden floor base material in step 1 is immersed in copper plating bath, dip time is 15min, copper plating bath temperature is 50 degree, copper plating bath is the mixed liquor of copper sulphate, edetate, polyethylene glycol, pyridine and water, the pH value of electroplate liquid is 12.0, by the control of copper plating solution concentration, dip time and copper plating bath temperature, is the copper film layer of 30 nanometers in wood floor base material plated surface a layer thickness;
3, nano-cellulose is dissolved in methacrylic acid solution, nano-cellulose is grafted to the base material of wooden floor described in step 2 copper film surface by methacrylate;
4, carry out paint process in step 3 engrafted nanometer cellulose and copper film floor base material, form 8 road priming paint and 4 to the underground heat solid wooden compound floor of finish paint.
Claims (8)
1. a manufacture method for underground heat solid wooden compound floor, comprises following workshop section: the processing of (one) floor base material, the processing of (two) metal film, (three) paint process, is characterized in that:
(1) floor base material processing
Timber is processed into solid wooden compound floor base material;
(2) metal film processing
By described for step () wooden floor substrate surface plating layer of metal film, the thickness of described metal film is 30 nanometer-50 microns;
(3) paint process
In the surface of step (two) described metal film paint, comprise some roads priming paint and some roads finish paint.
2. the manufacture method of underground heat solid wooden compound floor according to claim 1, is characterized in that: adopt nano-cellulose to carry out graft modification process in the described metallic film surface of step (2).
3. the manufacture method of underground heat solid wooden compound floor according to claim 1, is characterized in that: the one in step (two) described metal film being copper film, aluminium film and nickel film.
4. the manufacture method of underground heat solid wooden compound floor according to claim 1, is characterized in that: described metal film adopts chemical plating or ion sputtering process to be plated in wooden floor base material or solid wooden compound floor substrate surface.
5. a underground heat solid wooden compound floor, it comprises solid wooden compound floor base material, skin of paint and metal film, it is characterized in that: between solid wooden compound floor base material and skin of paint, arrange layer of metal film, and the thickness of described metal film is between 30 nanometer-50 microns.
6. underground heat solid wooden compound floor according to claim 5, is characterized in that: described metallic film surface is through nano-cellulose graft modification process.
7. underground heat solid wooden compound floor according to claim 5, is characterized in that: described metal film is the one of copper film, aluminium film and nickel film.
8. underground heat solid wooden compound floor according to claim 5, is characterized in that: the thickness of described metal film is between 30 nanometer-50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510745390.XA CN105256976B (en) | 2015-11-06 | 2015-11-06 | A kind of underground heat solid wooden compound floor and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510745390.XA CN105256976B (en) | 2015-11-06 | 2015-11-06 | A kind of underground heat solid wooden compound floor and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105256976A true CN105256976A (en) | 2016-01-20 |
| CN105256976B CN105256976B (en) | 2018-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510745390.XA Active CN105256976B (en) | 2015-11-06 | 2015-11-06 | A kind of underground heat solid wooden compound floor and its manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106894610A (en) * | 2017-02-14 | 2017-06-27 | 书香门地(上海)新材料科技有限公司 | A kind of copper skill floor and its production method |
| CN108115798A (en) * | 2017-12-04 | 2018-06-05 | 杨舜轲 | A kind of process equipment and processing method of floor heating multi-layer solid wood composite floor |
| CN109594742A (en) * | 2019-01-21 | 2019-04-09 | 上海淼道环境科技有限公司 | A kind of novel radiation changes in temperature floor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2515357Y (en) * | 2002-01-18 | 2002-10-09 | 关利峰 | Floor with goldleaf layer |
| JP2003221914A (en) * | 2003-01-14 | 2003-08-08 | Maizuru:Kk | Metal floor post |
| WO2005045155A1 (en) * | 2003-11-10 | 2005-05-19 | Heng Xu | An enhanced damp-proof and fire-proof floor board |
| CN200940332Y (en) * | 2006-08-23 | 2007-08-29 | 浙江方圆木业有限公司 | Aluminium film floor-radiation type floorings |
| CN201531104U (en) * | 2009-10-30 | 2010-07-21 | 河南省天地建筑防水工程有限公司 | Waterproof damp-proof wood floorboard |
| CN102644367A (en) * | 2012-03-31 | 2012-08-22 | 麦道地板（苏州）有限公司 | Ground heating floor capable of rapidly heating |
-
2015
- 2015-11-06 CN CN201510745390.XA patent/CN105256976B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2515357Y (en) * | 2002-01-18 | 2002-10-09 | 关利峰 | Floor with goldleaf layer |
| JP2003221914A (en) * | 2003-01-14 | 2003-08-08 | Maizuru:Kk | Metal floor post |
| WO2005045155A1 (en) * | 2003-11-10 | 2005-05-19 | Heng Xu | An enhanced damp-proof and fire-proof floor board |
| CN200940332Y (en) * | 2006-08-23 | 2007-08-29 | 浙江方圆木业有限公司 | Aluminium film floor-radiation type floorings |
| CN201531104U (en) * | 2009-10-30 | 2010-07-21 | 河南省天地建筑防水工程有限公司 | Waterproof damp-proof wood floorboard |
| CN102644367A (en) * | 2012-03-31 | 2012-08-22 | 麦道地板（苏州）有限公司 | Ground heating floor capable of rapidly heating |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106894610A (en) * | 2017-02-14 | 2017-06-27 | 书香门地(上海)新材料科技有限公司 | A kind of copper skill floor and its production method |
| CN108115798A (en) * | 2017-12-04 | 2018-06-05 | 杨舜轲 | A kind of process equipment and processing method of floor heating multi-layer solid wood composite floor |
| CN109594742A (en) * | 2019-01-21 | 2019-04-09 | 上海淼道环境科技有限公司 | A kind of novel radiation changes in temperature floor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105256976B (en) | 2018-10-16 |
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