CN105228368A - Electrothermometer piezo electrical connector automatic welding method and Welding Structure - Google Patents
Electrothermometer piezo electrical connector automatic welding method and Welding Structure Download PDFInfo
- Publication number
- CN105228368A CN105228368A CN201510690185.8A CN201510690185A CN105228368A CN 105228368 A CN105228368 A CN 105228368A CN 201510690185 A CN201510690185 A CN 201510690185A CN 105228368 A CN105228368 A CN 105228368A
- Authority
- CN
- China
- Prior art keywords
- substrate
- electrical connector
- adsorption plate
- welding
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a kind of electrothermometer piezo electrical connector automatic welding method and Welding Structure, first the present invention has made improvement to the structure of electrical connector, the substrate of electrical connector is that a flat board is welded and fixed with wiring board to facilitate, one end of substrate bends and extends adsorption plate for coordinating with Placement head towards hiding the direction of substrate, the free end of adsorption plate upward again decurvation formed and the feeler of piezo electrode contact; Make so again the center of gravity of electrical connector be in the center position of self, electrical connector can be adsorbed with chip mounter and coordinate, and when standing in the circuit board, do not rely on location, little angle also can not topple over; Electrical connector after the present invention makes improvement can coordinate with chip mounter, eliminates the operation of complicated human weld, adopts conputer controlled weld time, has unified the consumption of scolding tin, greatly improved production efficiency, also improve the quality of production simultaneously.
Description
Technical field
The present invention relates to electrothermometer technical field, particularly a kind of electrothermometer piezo electrical connector automatic welding method and Welding Structure.
Background technology
In electrothermometer manufacture process, in piezo assembly process, piezo connects the general mode of human weld that adopts and connects.This connected mode procedure complexity, needs manually to be installed on wiring board, on being welded and fixed by piezo electrical connector.And the consumption of scolding tin and weld time and temperature are often difficult to control in human weld's process, have cause wiring board scrap phenomenon, the quality that have impact on product reduces production efficiency and adds cost.
Specifically, as shown in figures 1-4, existing electrical connector comprises a substrate 1, and one end of substrate 1, towards being bent into a feeler 2 for contacting with piezo electrode obliquely more obliquely away from substrate 1 direction, grows two little angles 3 for locating obliquely at the middle part of substrate 1 both sides; Electrical connector Problems existing when human weld of this structure is:
One, two little angles 3 for locating are grown obliquely at the middle part of substrate 1 both sides, also have two holes in the circuit board accordingly to coordinate with it, on wiring board 4 after brush soldering, substrate 1 is sticked, corresponding two little angles 3 to be inserted in two holes of wiring board 4 for location, avoid that position is inaccurate causes crooked phenomenon; But but offering of this location hole can make when soldering, tin cream likely can flow into circuit back along hole, causes the possibility of waste or short circuit;
Two, not on substrate 1, but on the feeler 2 leaned forward, therefore electrical connector sticks and can rock back and forth as seesaw the center of gravity of the electrical connector of said structure self before welding, just can not ensure that if moved position below when welding;
Three, as improved welding efficiency, need consider to match with automation patch device, but said structure neither one buffer strip between substrate 1 and wiring board 4 when automation patch device paster, directly stick the risk of shock.
Summary of the invention
Instant invention overcomes deficiency existing in above-mentioned prior art, provide a kind of electrothermometer piezo electrical connector automatic welding method and Welding Structure, the present invention improves problems of the prior art, have employed automation chip mounter to weld through row paster, eliminate the operation of human weld, adopt conputer controlled weld time, unified the consumption of scolding tin, greatly improve production efficiency, also improve the quality of production simultaneously.
Technical scheme of the present invention is achieved in that
Electrothermometer piezo electrical connector automatic welding method, comprises the steps:
One, load in chip mounter and need the wiring board of welding and there is flexible electrical connector; Described electrical connector comprises a substrate, substrate is a flat board, one end of substrate bends and extends adsorption plate for coordinating with Placement head towards hiding the direction of substrate, the free end of adsorption plate upward again decurvation formed and the feeler of piezo electrode contact;
Two, wiring board is operated by chip mounter and moves to brush scolding tin step, i.e. brush scolding tin on the pad that wiring board is default;
Three, the wiring board brushing scolding tin is moved to paster region by chip mounter automatically, the adsorption plate of the mounting head absorption electrical connector of chip mounter, and is attached by the pad of the base plate alignment wiring board of electrical connector;
Four, the wiring board installing electrical connector is moved to welding region welding by chip mounter automatically; The wiring board semi-finished product having welded electrical connector take out by chip mounter automatically subsequently, personnel's inspection to be tested.
In order to make electrical connector more stable vertical in the circuit board, as preferably, substrate is roomy compared with adsorption plate.Thus making it place more stably, midstance is more stable, can not topple over easily.
As preferably, the junction of substrate and adsorption plate is arc transition, and substrate, adsorption plate and feeler are formed in one.Three in one is shaping makes processing more easy, and structure is more firm; Adsorption plate and feeler are in surface, the junction of substrate and adsorption plate is that arc transition makes feeler have elasticity and elasticity is larger, carry out at chip mounter also to improve feeler ultimate deformation stroke by reducing friction resistance in the process of installing, make to be cushioned, avoid clashing into.
As preferably, substrate has through hole, when welding, scolding tin is seeped on substrate surface through through hole.Such design makes substrate scolding tin when welding can be seeped on substrate surface through through hole to play the effect strengthening weld bonds intensity.
Electrothermometer piezo electrical connector Welding Structure, comprises wiring board and has flexible electrical connector; Described electrical connector comprises a substrate, substrate is a flat board, one end of substrate bends and extends adsorption plate for coordinating with Placement head towards hiding the direction of substrate, the free end of adsorption plate upward again decurvation formed and the feeler of piezo electrode contact; Be provided with pad in the circuit board, the substrate of electrical connector is welded on pad by scolding tin.
As preferably, substrate is roomy compared with adsorption plate.
As preferably, the both sides of substrate are arc transition, and the width of adsorption plate and feeler is less than the width of substrate.
As preferably, the junction of substrate and adsorption plate is arc transition, and substrate, adsorption plate and feeler are formed in one.
As preferably, substrate has through hole, scolding tin is seeped into substrate surface through through hole.
Have employed the design starting point of the present invention of technique scheme, theory and beneficial effect is:
First the present invention has made improvement to the structure of electrical connector, substrate is that a flat board is welded and fixed with wiring board to facilitate, one end of substrate bends and extends adsorption plate for coordinating with Placement head towards hiding the direction of substrate, the free end of adsorption plate upward again decurvation formed and the feeler of piezo electrode contact; The center of gravity of electrical connector is made so to be again in the center position of self, in other words the plumb line through its center of gravity is crossing with the middle part of substrate, make electrical connector can adsorb with chip mounter like this to coordinate, and when standing in the circuit board, do not rely on location, little angle also can not topple over; Further, the structure of corresponding electrical connector of the present invention, need not offer location hole more in the circuit board, thus has stopped to flow to the same tin cream in the past the generation that waste or short-circuit conditions are caused in the wiring board back side.
Again furtherly, the top that adsorption plate and feeler are in substrate makes to form a buffer strip between both and substrate, makes can produce elastic buffer during paster, avoids that impact is excessive causes damage.
The structure of the present invention to electrical connector has made improvement, makes it can coordinate with chip mounter, eliminates the operation of complicated human weld, adopt conputer controlled weld time, unify the consumption of scolding tin, greatly improved production efficiency, also improve the quality of production simultaneously.
Accompanying drawing explanation
Fig. 1 is the planar structure schematic diagram of electrical connector in prior art;
Fig. 2 is the perspective view of electrical connector in prior art;
Fig. 3 is schematic diagram when electrical connector is welded on wiring board in prior art;
Fig. 4 is the schematic diagram of another angle when electrical connector is welded on wiring board in prior art;
Fig. 5 is the structural representation of electrical connector of the present invention;
Fig. 6 is the A direction view of Fig. 5;
Fig. 7 is the B direction view of Fig. 5;
Fig. 8 is the fractionation structural representation of electrical connector of the present invention and wiring board;
Fig. 9 is the connection status schematic diagram of electrical connector of the present invention and wiring board.
Embodiment
The specific embodiment of the present invention is as follows:
Embodiment: electrothermometer piezo electrical connector automatic welding method, comprises the steps:
One, load in chip mounter (not shown) and need the wiring board 7 of welding and there is flexible electrical connector 10, the model that chip mounter can adopt Sony to produce is the chip mounter of SI-F130WK, and it can mount the multiple electronic devices and components such as resistance, electric capacity, LED chip, processor; As shown in Fig. 5 ~ 7, described electrical connector 10 comprises a substrate 1, substrate 1 is a flat board, one end of substrate 1 bends and extends adsorption plate 2 for coordinating with Placement head towards hiding the direction of substrate 1, the free end of adsorption plate 2 upward again decurvation form the feeler 3 contacted with piezo electrode (not shown); Adsorption plate 2, space between feeler 3 and substrate 1 define buffer strip 4; Substrate 1 is roomy compared with adsorption plate 2, and the both sides of substrate 1 are arc transition, have through hole 6 in the middle part of substrate 1, and adsorption plate 2 is less than the width of substrate 1 with the width of feeler 3; Substrate 1 is arc transition with the junction 5 of adsorption plate 2, and substrate 1, adsorption plate 2 and feeler 3 are formed in one, and adsorption plate 2 is substantially equal with the length of substrate 1 with the entire length of feeler 3;
Two, wiring board 7 is operated by chip mounter and moves to brush scolding tin step, as shown in Figure 8, i.e. and brush scolding tin 9 on the pad 8 that wiring board 7 is default;
Three, the wiring board 7 brushing scolding tin is moved to paster region by chip mounter automatically, the adsorption plate 2 of the mounting head absorption electrical connector 10 of chip mounter, and the pad 8 substrate 1 of electrical connector 10 being aimed at wiring board attaches;
Four, as shown in Figure 9, the wiring board installing electrical connector is moved to welding region welding by chip mounter automatically, and on substrate 1, the existence of through hole 6 makes electrical connector 10 scolding tin when welding can be seeped into effect substrate 1 surface played and strengthens weld bonds intensity through through hole; The wiring board semi-finished product having welded electrical connector take out by chip mounter automatically subsequently, personnel's inspection to be tested.
The structure of the present invention to electrical connector has made optimization, only need debug automation chip mounter program and just automatically can locate fixing automatic welding automatically, saves and manually fixes and the operation of human weld, greatly improve efficiency.
Claims (10)
1. electrothermometer piezo electrical connector automatic welding method, is characterized in that comprising the steps:
One, load in chip mounter and need the wiring board of welding and there is flexible electrical connector; Described electrical connector comprises a substrate, substrate is a flat board, one end of substrate bends and extends adsorption plate for coordinating with Placement head towards hiding the direction of substrate, the free end of adsorption plate upward again decurvation formed and the feeler of piezo electrode contact;
Two, wiring board is operated by chip mounter and moves to brush scolding tin step, i.e. brush scolding tin on the pad that wiring board is default;
Three, the wiring board brushing scolding tin is moved to paster region by chip mounter automatically, the adsorption plate of the mounting head absorption electrical connector of chip mounter, and is attached by the pad of the base plate alignment wiring board of electrical connector;
Four, the wiring board installing electrical connector is moved to welding region welding by chip mounter automatically; The wiring board semi-finished product having welded electrical connector take out by chip mounter automatically subsequently, personnel's inspection to be tested.
2. welding method according to claim 1, is characterized in that: substrate is roomy compared with adsorption plate.
3. welding method according to claim 2, is characterized in that: the both sides of substrate are arc transition, and the width of adsorption plate and feeler is less than the width of substrate.
4. welding method according to claim 1, is characterized in that: the junction of substrate and adsorption plate is arc transition, and substrate, adsorption plate and feeler are formed in one.
5. welding method according to claim 1, is characterized in that: on substrate, have through hole, and when welding, scolding tin is seeped on substrate surface through through hole.
6. electrothermometer piezo electrical connector Welding Structure, is characterized in that: comprise wiring board and have flexible electrical connector; Described electrical connector comprises a substrate, substrate is a flat board, one end of substrate bends and extends adsorption plate for coordinating with Placement head towards hiding the direction of substrate, the free end of adsorption plate upward again decurvation formed and the feeler of piezo electrode contact; Be provided with pad in the circuit board, the substrate of electrical connector is welded on pad by scolding tin.
7. Welding Structure according to claim 6, is characterized in that: substrate is roomy compared with adsorption plate.
8. Welding Structure according to claim 7, is characterized in that: the both sides of substrate are arc transition, and the width of adsorption plate and feeler is less than the width of substrate.
9. Welding Structure according to claim 6, is characterized in that: the junction of substrate and adsorption plate is arc transition, and substrate, adsorption plate and feeler are formed in one.
10. Welding Structure according to claim 6, it is characterized in that: on substrate, have through hole, scolding tin is seeped into substrate surface through through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510690185.8A CN105228368A (en) | 2015-10-17 | 2015-10-17 | Electrothermometer piezo electrical connector automatic welding method and Welding Structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510690185.8A CN105228368A (en) | 2015-10-17 | 2015-10-17 | Electrothermometer piezo electrical connector automatic welding method and Welding Structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105228368A true CN105228368A (en) | 2016-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510690185.8A Pending CN105228368A (en) | 2015-10-17 | 2015-10-17 | Electrothermometer piezo electrical connector automatic welding method and Welding Structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN105228368A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050284656A1 (en) * | 2004-06-23 | 2005-12-29 | Orion Electric Co., Ltd. | Method for manufacturing printed circuit board and printed circuit board with gas venting hole |
| CN202282473U (en) * | 2011-09-06 | 2012-06-20 | 东莞宇龙通信科技有限公司 | Spring leaf structure |
| CN104853540A (en) * | 2015-04-14 | 2015-08-19 | 中山市智牛电子有限公司 | SMT chip packaging process |
-
2015
- 2015-10-17 CN CN201510690185.8A patent/CN105228368A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050284656A1 (en) * | 2004-06-23 | 2005-12-29 | Orion Electric Co., Ltd. | Method for manufacturing printed circuit board and printed circuit board with gas venting hole |
| CN202282473U (en) * | 2011-09-06 | 2012-06-20 | 东莞宇龙通信科技有限公司 | Spring leaf structure |
| CN104853540A (en) * | 2015-04-14 | 2015-08-19 | 中山市智牛电子有限公司 | SMT chip packaging process |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160106 |