CN105223228A - A kind of thermal conductivity coefficient measurement instrument - Google Patents
A kind of thermal conductivity coefficient measurement instrument Download PDFInfo
- Publication number
- CN105223228A CN105223228A CN201410298146.9A CN201410298146A CN105223228A CN 105223228 A CN105223228 A CN 105223228A CN 201410298146 A CN201410298146 A CN 201410298146A CN 105223228 A CN105223228 A CN 105223228A
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- CN
- China
- Prior art keywords
- chip microcomputer
- metal sleeve
- thermal probe
- measurement instrument
- conductivity coefficient
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The present invention relates to a kind of thermal conductivity coefficient measurement instrument, comprise stabilized voltage supply, single-chip microcomputer and thermal probe, described single-chip microcomputer is connected with stabilized voltage supply by power lead respectively with thermal probe, and single-chip microcomputer is connected by signal wire with thermal probe.The present invention is easy to carry, simple to operate, reads data convenient, can be applicable to various soft material.
Description
Technical field
The invention belongs to field of measuring technique, be specifically related to a kind of thermal conductivity coefficient measurement instrument.
Background technology
The measuring method of coefficient of heat conductivity has a variety of, wherein heat-pole method is the best method of testing of generally acknowledging in international coefficient of heat conductivity research field, but existing heat-pole method instrument measurement range is narrower, can only the single material such as mensurated gas composition or liquid, complicated operation, measuring accuracy also can not be guaranteed.Thermoprobe method based on heat-pole method principle solves the narrow problem of measurement range, and is easy to operation, and accuracy is high, saves Measuring Time.But when measuring by thermoprobe method, need stabilized voltage supply and data acquisition unit, general data acquisition unit is relatively large, and directly can not read result, carries more inconvenient.
summary of the invention
The present invention overcomes the deficiencies in the prior art, proposes a kind of thermal conductivity coefficient measurement instrument, and described measuring instrument is easy to carry, can be used for measuring various soft material coefficient of heat conductivity, directly reads result by single-chip microcomputer display screen.
technical scheme of the present invention is: a kind of thermal conductivity coefficient measurement instrument, comprises stabilized voltage supply, single-chip microcomputer and thermal probe, and described single-chip microcomputer is connected with stabilized voltage supply by power lead respectively with thermal probe, and single-chip microcomputer is connected by signal wire with thermal probe.
Described thermal probe comprises metal sleeve and heating unit, metal sleeve is cylindrical, and the height of metal sleeve and the ratio range of external diameter are 40-42, and described heating unit is positioned at metal sleeve, be provided with insulation end socket in one end of metal sleeve, scribble epoxide-resin glue at the outside surface of its other end.
Heat-conducting silicone grease is provided with in the inside of heating unit.
Described single-chip microcomputer is provided with display.Heating copper wire is provided with in heating unit.
the present invention has following beneficial effect:
1) the present invention replaces data acquisition system (DAS) with the single-chip microcomputer of calculation procedure, simple to operate, reads data convenient;
2) the present invention is applicable to various soft material, is not limited to a certain special soft material;
3) measurement mechanism of the present invention is simple, convenient and swift, is easy to carry.
Accompanying drawing explanation
Fig. 1 is principle schematic of the present invention;
Fig. 2 is the sectional median plane figure of thermal probe of the present invention;
Fig. 3 is the connection diagram of the present invention when working.
In figure: 1, stabilized voltage supply; 2, single-chip microcomputer; 3, metal sleeve; 4, heating unit; 5, go between; 6, epoxide-resin glue; 7, heat-conducting silicone grease; 8, insulate end socket; 9, soft material.
embodiment:
See shown in Fig. 1 to Fig. 3, the present invention includes stabilized voltage supply 1, single-chip microcomputer 2 and thermal probe, described single-chip microcomputer 2 is connected with stabilized voltage supply 1 by power lead respectively with thermal probe, and single-chip microcomputer 2 is connected by signal wire with thermal probe.Described thermal probe comprises metal sleeve 3 and heating unit 4, and described heating unit 4 is positioned at metal sleeve 3, is provided with insulation end socket 8, scribbles epoxide-resin glue 6 at the outside surface of its other end in one end of metal sleeve 3.Described power lead is connected with heating unit 4 by insulation end socket 8.Heat-conducting silicone grease 7 is provided with in the inside of heating unit 4.Described single-chip microcomputer 2 is provided with display.Heating copper wire is provided with in heating unit 4 shown in Fig. 1.Stabilized voltage supply 1 provides constant voltage to heating copper wire, ensures that the heating power of thermal probe unit length remains unchanged.Thermal probe Main Function thrusts soft material 9, transmits temperature signal, and will heat copper wire and load in metal sleeve 3, its gap heat-conducting silicone grease 7 fills up.When a measurement is taken, temperature signal is sent to connected single-chip microcomputer 2 by thermal probe, and single-chip microcomputer 2 accepts this signal and undertaken calculating and demonstrating result by inner program of having compiled and edit.Metal sleeve is cylindrical, and the height of metal sleeve and the ratio range of external diameter are the height that 40-42, Fig. 2 choose the metal sleeve 3 of thermal probe is 30mm, and external diameter is 0.7mm, and internal diameter is 0.3mm, and length-diameter ratio is 42, greatly reduces axial hot-fluid; During making, heating copper wire employing diameter is the enamel-cover copper wire of 0.05mm, and heat-conducting silicone grease 7 smeared by heating copper wire, and insert after coiling 20 circle in metal sleeve 3, its gap heat-conducting silicone grease 7 fills up.Two the end of a thread electric welding of heating copper wire are welded with lead-in wire 5, thus ensure good electric conductivity.With epoxide-resin glue 6 two ends of thermal probe fixed after welding and be encapsulated in the insulation end socket 8 of thermal probe, preventing lead-in wire from fractureing.
Fig. 3 is connection diagram, connects circuit according to connection diagram, thermal probe is thrust soft material 9 inner, after having crossed 20 ± 5s, from the display screen of single-chip microcomputer 2, reads result.If continue to measure, thermal probe need be extracted, cooling about 3min (naturally cooling) is carried out the next one again and is measured.
Claims (2)
1. a thermal conductivity coefficient measurement instrument, is characterized in that: comprise stabilized voltage supply, single-chip microcomputer and thermal probe, and described single-chip microcomputer is connected with stabilized voltage supply by power lead respectively with thermal probe, and single-chip microcomputer is connected by signal wire with thermal probe.
2. thermal conductivity coefficient measurement instrument according to claim 1, it is characterized in that: described thermal probe comprises metal sleeve and heating unit, metal sleeve is cylindrical, the height of metal sleeve and the ratio range of external diameter are 40-42, described heating unit is positioned at metal sleeve, be provided with insulation end socket in one end of metal sleeve, scribble epoxide-resin glue at the outside surface of its other end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410298146.9A CN105223228A (en) | 2014-06-28 | 2014-06-28 | A kind of thermal conductivity coefficient measurement instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410298146.9A CN105223228A (en) | 2014-06-28 | 2014-06-28 | A kind of thermal conductivity coefficient measurement instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105223228A true CN105223228A (en) | 2016-01-06 |
Family
ID=54992301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410298146.9A Pending CN105223228A (en) | 2014-06-28 | 2014-06-28 | A kind of thermal conductivity coefficient measurement instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105223228A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725021A (en) * | 2019-03-05 | 2019-05-07 | 太原理工大学 | A kind of thermal conductivity measurement method based on data screening |
| CN111982960A (en) * | 2020-08-13 | 2020-11-24 | 中国科学院合肥物质科学研究院 | High-temperature-resistant heat probe device for online measurement of heat conductivity coefficient based on hot wire method |
| CN114034733A (en) * | 2021-11-29 | 2022-02-11 | 吉林大学 | Multifunctional unsaturated soil in-situ matrix suction measuring instrument |
-
2014
- 2014-06-28 CN CN201410298146.9A patent/CN105223228A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725021A (en) * | 2019-03-05 | 2019-05-07 | 太原理工大学 | A kind of thermal conductivity measurement method based on data screening |
| CN111982960A (en) * | 2020-08-13 | 2020-11-24 | 中国科学院合肥物质科学研究院 | High-temperature-resistant heat probe device for online measurement of heat conductivity coefficient based on hot wire method |
| CN114034733A (en) * | 2021-11-29 | 2022-02-11 | 吉林大学 | Multifunctional unsaturated soil in-situ matrix suction measuring instrument |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160106 |
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| WD01 | Invention patent application deemed withdrawn after publication |