CN105218785A - A kind of curing agent composition - Google Patents
A kind of curing agent composition Download PDFInfo
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- CN105218785A CN105218785A CN201510780970.2A CN201510780970A CN105218785A CN 105218785 A CN105218785 A CN 105218785A CN 201510780970 A CN201510780970 A CN 201510780970A CN 105218785 A CN105218785 A CN 105218785A
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Abstract
The invention discloses a kind of curing agent composition, it is composite by two kinds of dissimilar solidifying agent, under the prerequisite that consumption is constant, improves its Tg value.
Description
Technical field
The present invention relates to a kind of curing agent composition.
Background technology
Solidifying agent has another name called stiffening agent, ripening agent or set agent, is that a class is promoted or controls material or the mixture of curing reaction.Resin solidification is through the chemical reactions such as condensation, closed loop, addition or catalysis, makes thermosetting resin that irreversible change procedure occur, and solidification has come by adding solidification (being cross-linked) agent.Solidifying agent is absolutely necessary additive, is to make caking agent, coating, mould material all to need to add solidifying agent, otherwise epoxy resin can not solidify.
Curing reaction belongs to chemical reaction, and affect very large by solidification value, increase in temperature, speed of response is accelerated, and gel time shortens; The logarithmic value of gel time is with solidification value rising linearly downtrending substantially.But solidification value is too high, condensate performance is often made to decline, so there is the upper limit of solidification value; The temperature making curing speed and condensate performance compromise must be selected, as suitable solidification value.Solidifying agent can be divided into four classes by solidification value: low temperature curing agent solidification value is below room temperature; Toughess at room temperature solidification value is room temperature ~ 50 DEG C; Intermediate temperature setting agent is 50 ~ 100 DEG C; High-temperature curing agent solidification value is more than 100 DEG C.The solidifying agent kind belonging to low temperature curing type is little, has poly-coloured glaze alcohol type, polyisocyanic acid ester type etc.; T-31 modified amine, the YH-82 modified amine of domestic development operation all can be solidified below 0 DEG C.The kind belonging to room temperature curing type is a lot: aliphatic polyamine, alicyclic polyamine; Versamid and aromatic amine etc.Belong to some alicyclic polyamine of intermediate temperature setting type, tertiary amine, narrow azole and boron trifluoride complex etc.What belong to high temperature modification solidifying agent has aromatic polyamine, acid anhydrides, resole, aminoresin, Dyhard RU 100 and hydrazides etc.
For hot setting system, solidification value is generally divided into two benches, low-temperature curing is adopted before gel, after reaching gel state or the state slightly higher than gel state, heat carries out after fixing (post-cure) again, and relative leading portion is cured as Procuring (pre-cure).
But existing solidifying agent, most solidification value is not high, or can provide higher solidification value, but cost is high.
Summary of the invention
The object of the invention is to propose a kind of curing agent composition, it is composite by two kinds of dissimilar solidifying agent, under the prerequisite that consumption is constant, improves its Tg value.
For reaching this object, the present invention by the following technical solutions:
A kind of curing agent composition, it comprises following component:
The mass ratio of two kinds of components described in described composition is 3:1-1:3, and preferred 2:1-1:2, has preferred 2:1 further.
Embodiment
The present invention is described pharmaceutical composition of the present invention by following embodiment.
Embodiment 1
I. the synthesis of formula 1 compound
Described in formula 1, compound is known compound, and those skilled in the art can obtain in commercially available purchase, also can synthesize and prepare.Its typical but non-limiting synthesis example is as follows:
First, in reaction vessel, add with the ratio being 1mol maleic anhydride relative to 1.6mol dimethyladamantane or ethyl diamantane, and the internal temperature of reaction vessel is remained on about 160 DEG C.Then, in this reaction vessel, the solution being dissolved in a small amount of dimethyladamantane or ethyl diamantane as the such as ditertiary butyl peroxide 5.5mmol of free radical generating agent is dripped with 3 hours.About 3 hours from dropping end terminate reaction, obtain reaction product.By to the underpressure distillation of gained reaction product, thus obtain corresponding target compound.Wherein, suitably can change the feed ratio, temperature of reaction, the reaction times that illustrate herein uprises to make target compound yield, also can use the free radical generating agent of other kind.
II. the synthesis of formula 2 compound
Described compound is known compound, and those skilled in the art can obtain in commercially available purchase, also can synthesize and prepare.Its typical but non-limiting synthesis example is as follows:
In 1 liter of flask, 100g indoline is added in the sour stock solution that 315ml is made up of 194ml propan-2-ol, 359ml water and the 85ml vitriol oil.At 60 DEG C, the formalin of 36.3g35% is experienced 1 hour and add in the solution of slight haze.This mixture reacts 4 hours further, cooling, and makes to be extracted with ethyl acetate.Through pervaporation, obtain amber powder, filtered, wash with water, then remove brown liquid phase.This product is dissolved in a small amount of IMS, produces white crystal.After filtration and drying, from the first fraction and mother liquor, the white crystal amounting to 54g is obtained.Fusing point is 92-93 DEG C.
By the component I for preparing and II, obtain described anti-curing agent composition according to 2:1 is composite.
At 180 DEG C, use standard cure circulation, by above-mentioned curing agent composition and epoxy resin MY721 (commercially available in Huntsman, UK) stoichiometrically equivalent reaction.Measured the Tg of resulting polymers by DMA, its Tg is 289 DEG C.
Comparative example 1
Component I, not containing component I I, all the other conditions are constant, and its Tg is 146 DEG C.
Comparative example 2
Only containing component I I, not containing component I, all the other conditions are constant, and its Tg is 161 DEG C.
Above-described embodiment and comparative example explanation, curing agent composition of the present invention, it is composite by two kinds of dissimilar activess, under same amount prerequisite, composite Tg effect will be better than far away being used alone of two kinds of components, proves to create synergistic effect between two kinds of solidifying agent that the present invention adopts.
Applicant states, the present invention illustrates curing agent composition of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned special formulation, does not namely mean that the present invention must rely on above-mentioned detailed component and formula could be implemented.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (3)
1. a curing agent composition, it comprises following component:
(1)
(2)
The mass ratio of two kinds of components described in described composition is 3:1-1:3.
2. curing agent composition as claimed in claim 1, it is characterized in that, the mass ratio of described two kinds of components is 2:1-1:2.
3. curing agent composition as claimed in claim 1, it is characterized in that, the mass ratio of described two kinds of components is 2:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510780970.2A CN105218785A (en) | 2015-11-14 | 2015-11-14 | A kind of curing agent composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510780970.2A CN105218785A (en) | 2015-11-14 | 2015-11-14 | A kind of curing agent composition |
Publications (1)
| Publication Number | Publication Date |
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| CN105218785A true CN105218785A (en) | 2016-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510780970.2A Pending CN105218785A (en) | 2015-11-14 | 2015-11-14 | A kind of curing agent composition |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815734A (en) * | 2007-10-05 | 2010-08-25 | 陶氏环球技术公司 | Isocyanate modified epoxy resin and epoxy powder coating composition thereof |
| CN101925627A (en) * | 2008-01-23 | 2010-12-22 | 陶氏环球技术公司 | Epoxy resin hardener composition and contain the composition epoxy resin of such hardener composition |
| CN102226033A (en) * | 2011-05-03 | 2011-10-26 | 广东生益科技股份有限公司 | Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same |
| CN102803334A (en) * | 2009-04-21 | 2012-11-28 | 陶氏环球技术有限责任公司 | Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom |
| CN102884101A (en) * | 2010-03-24 | 2013-01-16 | 赫克塞尔复合材料有限公司 | Novel curing agents |
| CN104755526A (en) * | 2012-11-01 | 2015-07-01 | 三菱瓦斯化学株式会社 | Epoxy resin curing agent |
-
2015
- 2015-11-14 CN CN201510780970.2A patent/CN105218785A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815734A (en) * | 2007-10-05 | 2010-08-25 | 陶氏环球技术公司 | Isocyanate modified epoxy resin and epoxy powder coating composition thereof |
| CN101925627A (en) * | 2008-01-23 | 2010-12-22 | 陶氏环球技术公司 | Epoxy resin hardener composition and contain the composition epoxy resin of such hardener composition |
| CN102803334A (en) * | 2009-04-21 | 2012-11-28 | 陶氏环球技术有限责任公司 | Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom |
| CN102884101A (en) * | 2010-03-24 | 2013-01-16 | 赫克塞尔复合材料有限公司 | Novel curing agents |
| CN102226033A (en) * | 2011-05-03 | 2011-10-26 | 广东生益科技股份有限公司 | Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same |
| CN104755526A (en) * | 2012-11-01 | 2015-07-01 | 三菱瓦斯化学株式会社 | Epoxy resin curing agent |
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Application publication date: 20160106 |
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| RJ01 | Rejection of invention patent application after publication |