CN105210136A - Method for producing transparent surface material having adhesive layer - Google Patents
Method for producing transparent surface material having adhesive layer Download PDFInfo
- Publication number
- CN105210136A CN105210136A CN201480028226.0A CN201480028226A CN105210136A CN 105210136 A CN105210136 A CN 105210136A CN 201480028226 A CN201480028226 A CN 201480028226A CN 105210136 A CN105210136 A CN 105210136A
- Authority
- CN
- China
- Prior art keywords
- bonding coat
- resin bed
- semi
- fender
- solid preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Provided is a method for producing a transparent surface material having an adhesive layer, by which the film thickness deviation at an edge part of a resin applied by a die coating method is reduced and adhesiveness with a display panel is excellent. The method for producing a transparent surface material having an adhesive layer comprises a step for forming a semi-cured resin layer by applying a curable resin composition to one surface of a transparent surface material using a die coater and semi-curing at least a portion of the applied resin composition, and a step for obtaining an adhesive layer by curing the resin layer. In the step for forming the resin layer, the semi-curing is started while the resin composition is being applied.
Description
Technical field
The present invention relates to the manufacture method of the transparent facestock of band bonding coat.
Background technology
In order to protect liquid crystal display (LiquidCrystalDisplay; and touch-screen, organic electroluminescent (ElectroLuminescence LCD); EL) display panel of the display device such as display, knownly will comprise the transparent facestock with fusible curable resin layer and fit in the technical scheme (such as patent documentation 1) of display panel.In patent documentation 1, form the method with the resin of fusible curable resin layer as coating, have employed divider mode.
Prior art document
Patent documentation
Patent documentation 1: Jap.P. No. 5138820 publication
Summary of the invention
Invent technical matters to be solved
On the other hand, as coating process better than divider mode in productivity etc., known mould is coated with mode.It is spued from the slit of die head by the applied things such as resin combination that mould is coated with mode, and makes die head and substrate relative movement, thus on real estate, form the method for film, can form the thicker coated film of specific thickness with good productivity on real estate.But adopt mould to be coated with in the coating of the resin combination of mode, the end infiltration spread of the resin combination be coated with, end shape easily changes.Therefore there are the following problems: after coating, the thickness deviation with the end of fusible curable resin layer (bonding coat) increases, when transparent facestock and display panel are fitted, the end of transparent facestock is not easily bonding with display panel, the bonding instability of transparent facestock and display panel.
The invention that the present invention is problem in view of above-mentioned prior art and completes, provides a kind of reduction to be coated with the thickness deviation of the end of the resin combination that mode is coated with, the manufacture method with the transparent facestock of the band bonding coat excellent in adhesion of display panel with mould.
The technical scheme that technical solution problem adopts
The feature of the manufacture method of the transparent facestock of band bonding coat of the present invention is, comprise: in the one side of transparent facestock, utilize mould coating device to be coated with the resin combination with curability, make the semi-solid preparation at least partially in be coated with described resin combination, form the operation of the resin bed of semi-solid preparation; The solidification of described resin bed is made to make the operation (following, " operation making bonding coat " will to be somebody's turn to do in this manual also referred to as " bonding coat formation process ") of bonding coat; In the operation forming described resin bed, start to carry out described semi-solid preparation in the process of the described resin combination of coating.
In the operation forming described resin bed, be coated with described resin combination whole semi-solid preparation can be made.
In the operation forming described resin bed, a part of semi-solid preparation of the circumference of be coated with described resin combination can be made.
In the operation forming described resin bed, the circumference of be coated with described resin combination can be made with frame-shaped semi-solid preparation.
The operation making described resin bed planarization can be comprised before the operation making described bonding coat.
In the operation making described resin bed planarization, can heat described resin bed.
The operation making described bonding coat can comprise the operation making part semi-solid preparation uncured in be coated with described resin combination.
The operation making described bonding coat can comprise: the operation of bonding protective film on described resin bed; Make the operation that the described resin bed being pasted with described diaphragm formally solidifies.
In the operation forming described resin bed, described resin combination semi-solid preparation can be made by irradiating light.
The effect of invention
By the manufacture method of the transparent facestock of band bonding coat of the present invention, can obtain and be coated with the thickness deviation reduction of the end of the resin that mode is coated with, the transparent facestock with the band bonding coat excellent in adhesion of display panel with mould.
Accompanying drawing explanation
Fig. 1 is the figure of the fender of the band bonding coat representing the first embodiment, and (a) is vertical view, and (b) is the A-A cut-open view in (a).
Fig. 2 is the process flow diagram of the manufacture method of the fender of the band bonding coat representing the first embodiment.
Fig. 3 is the figure of the step representing resin bed formation process S11; a () is the stereographic map of resin bed forming apparatus; b () is the B-B cut-open view in (a), (c) be represent resin bed formation process S11 terminate after the cut-open view of fender of tape tree lipid layer in stage.
Fig. 4 is the cut-open view of the change of the end shape representing resin bed.
Fig. 5 is the process flow diagram of the manufacture method of the fender of the band bonding coat representing the second embodiment.
Fig. 6 is the figure of the step of the resin bed formation process S21 represented in resin bed forming apparatus, a () is the stereographic map of the resin bed forming apparatus processing stage of representing the first semi-solid preparation, (b) is the stereographic map of the resin bed forming apparatus processing stage of representing the second semi-solid preparation.
Fig. 7 is the figure of the step representing resin bed formation process S21, (a) be represent resin bed formation process S21 terminate after the vertical view of fender of tape tree lipid layer in stage, (b) is the C-C cut-open view in (a).
Fig. 8 is the figure of the step of resin bed formation process in the manufacture method of the fender of the band bonding coat representing the 3rd embodiment, is the stereographic map of the resin bed forming apparatus processing stage of representing the first semi-solid preparation.
Fig. 9 is the figure of the step of resin bed formation process in the manufacture method of the fender of the band bonding coat representing the 3rd embodiment; (a) be represent resin bed formation process S21 terminate after the vertical view of fender of tape tree lipid layer in stage, (b) is the D-D cut-open view in (a).
Figure 10 is the figure of the result representing embodiment.
Embodiment
Below, accompanying drawing is utilized to be described embodiments of the present invention.
In addition, scope of the present invention is not limited to following embodiment, can change arbitrarily in the scope of technological thought of the present invention.In addition, in the following drawings, for the ease of understanding each formation, the differences such as engineer's scale in actual structure and each structure and numerical value are sometimes made.
" transparent " in this instructions refer to by the display surface of plane materiel and display panel across bonding coat tight fit after, the image that shows all or in part of display panel can observe through plane materiel and not be subject to the form of warp.Therefore, even if the part being incident to the light of plane materiel from display panel is absorbed by plane materiel or reflects, or due to optical phase change etc. and cause the transmission of visible light of plane materiel low, as long as can the display image of display panel be observed through plane materiel and not have warp, just can be called " transparent ".
" (methyl) acrylate " in this instructions refers to acrylate or methacrylate.
" thickness " in this instructions refers to the thickness by using the assay method of thickness gauge (Japanese: マ イ Network ロ ゲ ー ジ) or laser displacement gauge etc. to record.
In following embodiment, be described using the situation of transparent facestock as the fender of the display surface of protection display panel.Below, this formation on fender with bonding coat is called that the fender of band bonding coat is described.
< first embodiment >
(fender of band bonding coat)
First, be described with reference to Fig. 1 (a), (b) fender (being namely equivalent to be with the transparent facestock of bonding coat) 1 to the band bonding coat that the manufacture method by present embodiment manufactures.
Fig. 1 (a) is the vertical view of the fender 1 of the band bonding coat representing present embodiment, and Fig. 1 (b) is the A-A cut-open view in Fig. 1 (a).
The fender 1 of the band bonding coat of present embodiment, as shown in Fig. 1 (a), (b), comprises fender (i.e. transparent facestock) 10, shading Printing Department 11, bonding coat 12, diaphragm 13.
[fender]
Fender 10 is transparent flat boards.Shape during the overlooking of fender 10 is not particularly limited, and the shape that maybe can will arrange the display device of display panel etc. according to the display panel will pasting fender 10 suitably sets.Shape during the overlooking of fender 10 in Fig. 1 (a) for rectangular-shaped.
Fender 10 is arranged on the picture display face side of display panel, protection display panel.As the material of fender 10, glass plate or transparent resin plate can be exemplified.Except to from except the emergent light of display panel or the transparency height of reflected light, from have photostability, low birefringence, high plane precision, resistance to surface damage, high mechanical properties angle consider, the material of fender 10 also preferably glass plate.Consider from the angle of the following abundant transmission of the light making Photocurable resin composition solidify, also preferred glass plate.
As the material of glass plate, can the glass materials such as soda-lime glass being exemplified, being more preferably the less high transmission glass of less, the blue degree of ferrous components (as being commonly called as, also referred to as ultrawhite sheet glass).In order to improve security, tempered glass also can be used as positive plane materiel.When using glass plate thin especially, preferably use and implemented chemical enhanced glass plate.As the material of transparent resin plate, the resin material (such as polycarbonate, polymethylmethacrylate etc.) that the transparency is high can be exemplified.
For fender 10, in order to improve the interface binding force with bonding coat 12, also surface treatment can be implemented.As surface-treated method, the method on the surface with silane coupling agent process fender 10 can be exemplified, utilize the oxidizing flame produced by flame burner to form the method etc. of silicon oxide film.
For fender 10, in order to improve the contrast of display image, also anti-reflection layer can be set at the lower surface 10b of the side contrary with upper surface (simultaneously) 10a being formed with bonding coat 12 side.In addition; also can carry out painted to a part for fender 10 or entirety according to object; or the upper surface 10a of fender 10 and/or a part of lower surface 10b or entirety are made ground glass shape and are made light scattering, or the upper surface 10a of fender 10 and/or a part of lower surface 10b or overall formed trickle concavo-convex etc. and make transmitted light that refraction or reflection occur.In addition, also coloring film, light-diffusing films, light refracting films, optical reflection film etc. can be pasted on the upper surface 10a of fender 10 and/or a part of lower surface 10b or entirety.
Consider from the angle of physical strength, the transparency, during for glass plate, the thickness of fender 10 is preferably 0.5mm ~ 25mm.In the purposes such as television receiver, PC display of indoor use, considering from the light-weighted angle of display device, be preferably 1mm ~ 6mm, being arranged in outdoor public display purposes, being preferably 3mm ~ 20mm.When using chemically reinforced glass, consider from the angle of intensity, the thickness of glass plate is preferably about 0.5mm ~ 1.5mm.When for transparent resin plate, preferred 2mm ~ 10mm.
[shading Printing Department]
Shading Printing Department 11 be formed with frame-shaped at the periphery of fender 10 band Printing Department.The Wiring member etc. be connected with display panel is sheltered by shading Printing Department 11, thus make cannot part beyond the image display area of identification display panel from fender 10 side (lower surface 10b side).Shading Printing Department 11 can be formed at the upper surface 10a of side, the i.e. fender 10 being formed with bonding coat 12, or is formed at the lower surface 10b (being upper surface 10a side in Fig. 1 (b)) of its opposition side, i.e. fender 10.Considering from the angle of the parallax reducing shading Printing Department 11 and image display area, is better the upper surface 10a being formed at the side, the i.e. fender 10 that are formed with bonding coat 12.When fender 10 is glass plate, if adopt the ceramic printing comprising black pigment to shading Printing Department 11, then light-proofness is good, therefore preferably.
[bonding coat]
Bonding coat 12 is formed on the upper surface 10a of fender 10.
In this instructions; so-called bonding coat 12, described in the manufacture method of the fender of band bonding coat described as follows, in the one side of fender (transparent facestock), coating has the resin combination of curability; make be coated with described resin composition, the layer of gained is called bonding coat.
The shear elasticity of bonding coat 12 at 35 DEG C is preferably 10
2pa ~ 10
7pa, is more preferably 10
3pa ~ 10
6pa.And then in order to make space when fitting with display panel disappear in shorter time, the shear elasticity of bonding coat 12 at 35 DEG C is particularly preferably 10
3pa ~ 10
5pa.If the shear elasticity of bonding coat 12 is 10
2more than Pa, then can maintain the shape of bonding coat 12, in addition; even if when the thickness h 1 of bonding coat 12 is thicker; bonding coat 12 entirety also can maintain thickness h 1 equably, when being fitted with display panel by the fender 1 of band bonding coat, the interface of display panel and bonding coat 12 not easily produces space.In addition, if the shear elasticity of bonding coat 12 is 10
3more than Pa, then easily suppress the distortion of bonding coat 12 when being peeled off by diaphragm 13.
If the shear elasticity of bonding coat 12 is 10
7below Pa, then, when fitting with display panel, bonding coat 12 can give play to good adaptation.In addition; because the transport properties of molecules forming the resin material of bonding coat 12 is higher; so after display panel and the fender 1 of band bonding coat being fitted under reduced atmosphere; when being returned under atmospheric pressure atmosphere; pressure (remain the pressure of decompression state) in space and put on bonding coat 12 pressure (i.e. atmospheric pressure) pressure differential effect under, the volume in space easily reduces.Further, the gas in the space after volume reduction is easily dissolved in bonding coat 12 and is absorbed.
The shear elasticity of bonding coat 12 at 35 DEG C mensuration as described below.
Use flow graph (Anton Paar (Antonpaar) Inc., modularization flow graph PhysicaMCR-301), mensuration rotor is set to the thickness h 1 of bonding coat 12 identical with the gap of light transmission fixed head, the material (following uncured hardening resin composition 30) forming bonding coat 12 is set in the gap.Then, the light and heat needed for solidification are applied to uncured hardening resin composition 30, while measure the shear elasticity of solidification process, using the shear elasticity of the measured value under the condition of cure of regulation as bonding coat 12.
The thickness h 1 of bonding coat 12 is preferably 0.03mm ~ 2mm, is more preferably 0.1mm ~ 0.8mm.If the thickness h of bonding coat 12 1 is more than 0.03mm, then bonding coat 12 can cushion the impact etc. that the external force from fender 10 side (i.e. lower surface 10b side) causes effectively, can protect display panel.In addition, even if be mixed into the foreign matter of the thickness h 1 being no more than bonding coat 12 between display panel and the fender 1 of band bonding coat, the thickness h 1 of bonding coat 12 also can not significantly change, little on the impact of optical transmittance property.If the thickness h of bonding coat 12 1 is below 2mm, then not easily residual clearance between fender 10 and bonding coat 12, the integral thickness of display device can not unnecessarily thicken.
[diaphragm]
The surface of bonding coat 12 protected by diaphragm 13, the shape maintaining bonding coat 12 until face the fender 1 of band bonding coat is fitted with display panel before till.
When the fender 1 of band bonding coat is fitted with display panel, diaphragm 13 is peeled off from bonding coat 12.By this, the bonding coat 12 that protected film 13 covers exposes, and by making bonding coat 12 abut with display panel, the fender 1 of band bonding coat can be fitted with display panel.Size during the overlooking of the size of diaphragm 13 and fender 10 is roughly equal.
Diaphragm 13 requires not closely sealed securely with bonding coat 12.Therefore, as diaphragm 13, preferably lower with the adaptation of the bonding coat 12 be made up of tygon, polypropylene, fluorine-type resin etc. base material film.The suitable thickness of diaphragm 13 is different with the kind of used resin, when the film using tygon, polypropylene etc. more soft, is preferably 0.04mm ~ 0.2mm, is more preferably 0.06mm ~ 0.1mm.If the thickness of diaphragm 13 is more than 0.04mm, then, when being peeled off from bonding coat 12 by diaphragm 13, the excessive deformation of diaphragm 13 can be suppressed.If the thickness of diaphragm 13 is below 0.2mm, then when peeling off, diaphragm 13 easily bends, and easily peels off.
(manufacture method of the fender of band bonding coat)
Then, the manufacture method of the fender 1 of the band bonding coat of present embodiment is described.
Fig. 2 is the process flow diagram of the manufacture method of the fender 1 of the band bonding coat representing present embodiment.
The manufacture method of the fender 1 of the band bonding coat of present embodiment as shown in Figure 2, comprises resin bed formation process S11, bonding coat formation process S12.
First, resin bed formation process S11 is coated with mode with mould on fender 10, to be coated with hardening resin composition, to form the operation of resin bed.
Fig. 3 (a) is the figure of the step representing resin bed formation process S11; it is the used stereographic map with the resin bed forming apparatus 2 of mould coating device 20; Fig. 3 (b) is the B-B cut-open view in Fig. 3 (a), Fig. 3 (c) be represent resin bed formation process S11 terminate after the cut-open view of fender of tape tree lipid layer in stage.
In addition, in explanation, set XYZ coordinate system, be described with reference to this XYZ coordinate system position relationship to each component.Now, take vertical as Z-direction, with the long side direction of fender 10 for X-direction, with the direction (short side direction of fender 10) orthogonal with X-direction and this both direction of Z-direction for Y direction.
In addition, in below illustrating, short side direction refers to the short side direction (Y direction) of fender 10, and long side direction refers to the long side direction (X-direction) of fender 10.
As shown in Fig. 3 (a), (b), (c), form the resin bed 32 of semi-solid preparation by resin bed forming apparatus 2.
Resin bed forming apparatus 2 comprises mobile device 33, mould coating device 20, solidification equipment 21.
[mobile device]
Mobile device 33 makes fender 10 towards the device of the opposition side (-X-direction side) movement in the direction of coating hardening resin composition 30.As mobile device 33, be not particularly limited in the scope of removable fender 10.In present embodiment, the situation that mobile device 33 is belt conveyor is described.
In addition, in below illustrating, with the side, direction (-X-direction) of fender 10 movement under the effect of mobile device 33 for downstream, with the opposition side in the direction of movement (+X-direction side) for upstream side.
Illustrated example is the mechanism making fender movement, as long as but substantially can make following mould coating device and fender relative movement, also can be the mechanism making the movement of mould coating device.
[mould coating device]
Mould coating device is spued to transparent facestock (fender), the device forming the film layer of hardening resin composition at transparent area face from the slit portion of die head by hardening resin composition substantially.On the upside of the vertical that mould coating device 20 is arranged at fender 10 (+Z-direction side).Mould coating device 20 is as shown in Fig. 3 (b), and cross section view is roughly in pentagon shape.The center of the long side direction (X-direction) of mould coating device 20 is provided with slit portion 20a.
Slit portion 20a is in the upper extension of the short side direction (Y direction) of mould coating device 20.Uncured hardening resin composition 30 spues from slit portion 20a.
Be not particularly limited in the scope that can be coated with mode with mould and be coated with hardening resin composition 30 as mould coating device 20, also can use arbitrary known mould coating device.
[hardening resin composition]
The viscosity of hardening resin composition 30 is preferably 0.05Pas ~ 50Pas, is more preferably 1Pas ~ 20Pas.If viscosity is more than 0.05Pas, then can reduce the ratio of following monomer (B), suppress the physical property of bonding coat 12 to reduce.In addition, if viscosity is below 50Pas, then bonding coat 12 not easily residual clearance.
As hardening resin composition 30, from can low-temperature setting and the fast angle of curing rate consider, preferably comprise the Photocurable resin composition of curability compound and Photoepolymerizationinitiater initiater (C).
In present embodiment, the situation that hardening resin composition 30 is Photocurable resin compositions is described.
As hardening resin composition 30, consider from easy angle viscosity being adjusted to above-mentioned scope, above-mentioned curability compound preferably comprise more than a kind there is curability group and number-average molecular weight be 1000 ~ 100000 oligomer (A) and more than a kind there is curability group and molecular weight be 125 ~ 600 monomer (B), the ratio of monomer (B) is 40 ~ 80 quality % in the total (100 quality %) of oligomer (A) and monomer (B).
As the curability group of oligomer (A), the unsaturated group (acryloxy, methacryloxy etc.) of addition polymerization or the combination etc. of unsaturated group and sulfydryl can be exemplified; Angle that is fast from curing rate and that can obtain the high bonding coat 12 of the transparency is considered, is preferably selected from the group of acryloxy and methacryloxy.
As the curability group of monomer (B), the unsaturated group (acryloxy, methacryloxy etc.) of addition polymerization or the combination etc. of unsaturated group and sulfydryl can be exemplified; Angle that is fast from curing rate and that can obtain the high bonding coat 12 of the transparency is considered, is preferably selected from the group of acryloxy and methacryloxy.
As monomer (B), consider from the angle of the mechanical property of the curability of hardening resin composition 30, bonding coat 12, preferably every 1 molecule has the monomer of 1 ~ 3 curability group.
As Photoepolymerizationinitiater initiater (C), the Photoepolymerizationinitiater initiater such as acetophenone class, ketal class, benzoin or benzoin ethers, phosphinoxides, Benzophenones, thioxanthene ketone, quinones can be exemplified.
Non-curable oligomer (D) can also be added in resin combination.Non-curable oligomer (D) is not with the curability compound generation curing reaction in composition and every 1 molecule has the oligomer of 0.8 ~ 3 hydroxyl when the solidification of resin bed formation Photocurable resin composition.More preferably the hydroxyl in every 1 molecule is 2 ~ 3.In addition, the number-average molecular weight (Mn) that every 1 hydroxyl of non-curable oligomer (D) is corresponding is better 400 ~ 8000.Non-curable oligomer (D) can be used alone a kind, also can two or more also use.
[solidification equipment]
Solidification equipment 21 be arranged at be in fender 10 vertical on the upside of (+Z-direction side) and relative to the position of mould coating device 20 side (-X-direction side) farther downstream.
Solidification equipment 21 is as shown in Fig. 3 (a), and the bearing of trend (Y direction) along the slit portion 20a of mould coating device 20 extends.The bearing of trend length (Y direction length) of solidification equipment 21 is set as with the bearing of trend length of slit portion 20a roughly equal, or is greater than the bearing of trend length of slit portion 20a.
Solidification equipment 21 has multiple light source (not shown) along bearing of trend, on the upper surface 10a of fender 10, irradiate light.Multiple light source is can the line source of light of the roughly homogeneous wire of exposure intensity.As each light source, such as, can select uviol lamp, high-pressure sodium lamp, UV-LED etc.From the visible ray that the light of each light source irradiation is such as ultraviolet or short wavelength.
The distance of position on long side direction (X-direction distance) w1 of the light source in the position of the application place of mould coating device 20, i.e. slit portion 20a and the light irradiation position of solidification equipment 21, i.e. solidification equipment 21 is as shown in Fig. 3 (c), shorter than long side direction length (X-direction length) w2 of the forming region of the resin bed 32 after semi-solid preparation.In other words, distance w1 is set as the semi-solid preparation starting to carry out be coated with hardening resin composition 30 in the coating process of hardening resin composition 30 by solidification equipment 21.
Fender 10 is arranged on mobile device 33, makes fender 10 side (-X-direction side) movement towards downstream.While mobile fender 10, hardening resin composition 30 is spued from the slit portion 20a of mould coating device 20, fender 10 is coated with hardening resin composition 30.Hardening resin composition 30 is coated into and makes the outer rim 32a of the resin bed 32 of semi-solid preparation be positioned at the position (with reference to Fig. 3 (c)) more more outward than the inner edge 11a of shading Printing Department 11.
Then; at mobile fender 10 and while being coated with hardening resin composition 30 by mould coating device 20; from each light source injection light of solidification equipment 21, to by mould coating device 20, the hardening resin composition 30 be coated on fender 10 irradiates the light of wire successively.The shoot mode of light be luminous energy is shone be positioned at the light source of solidification equipment 21 vertical on the downside of the whole short side direction (Y direction) (with reference to Fig. 3 (a)) of hardening resin composition 30 of (-Z-direction side).In addition, the intensity settings of the light penetrated from the light source of solidification equipment 21 is for making hardening resin composition 30 semi-solid preparation.
Hardening resin composition 30 penetrates the hardening resin composition 31 becoming semi-solid preparation by illumination.In this first embodiment, the described resin combination be coated with whole semi-solid preparation.From the coating time of hardening resin composition 30 to hardening resin composition 30 semi-solid preparation by distance w1, the speed of the mobile device 33 of fender 10 movement is decided.Be better the infiltration spread being adjusted to the end that can suppress the hardening resin composition 30 be coated with from the coating time of hardening resin composition 30 to hardening resin composition 30 semi-solid preparation, and reduce the thickness deviation of the resin bed 32 of semi-solid preparation simultaneously.
By this operation, as Suo Shi Fig. 3 (c), form the resin bed 32 of whole semi-solid preparation.
Here, when " semi-solid preparation " refers to the degree of polymerization of the bonding coat 12 had by the fender 1 of the band bonding coat shown in Fig. 1 as targeted degree of polymerization, just stop solidification process when being polymerized and not yet proceeding to targeted degree of polymerization.In other words, " semi-solid preparation " although refer to and make hardening resin composition 30 be polymerized (solidification), the degree of polymerization of the bonding coat 12 that the fender 1 that polymerization (solidification) does not proceed to band bonding coat has.
If the polymerization of the degree of polymerization (targeted degree of polymerization) reaching bonding coat 12 is called " formally solidifying ", then can be called the state of " semi-solid preparation " the midway stage of polymerization, the resin bed of semi-solid preparation represents that polymerization does not proceed to the layer of the degree of polymerization of bonding coat 12.
Then, bonding coat formation process S12 comprises diaphragm adhering processes S12a and formal curing process S12b.
Diaphragm adhering processes S12a is the operation be pasted onto by diaphragm 13 on the resin bed 32 of semi-solid preparation.
The method of attaching of diaphragm 13 is not particularly limited.Such as, can select by mobile device 33, fender 10 to be moved, the diaphragm 13 being rolled into roll is pasted onto the method on the resin bed 32 of semi-solid preparation.
By this operation, diaphragm 13 is secured on the resin bed 32 of semi-solid preparation, the state (with reference to Fig. 1 (a), (b)) that the protected film 13 of resin bed 32 forming semi-solid preparation covers.
Formal curing process S12b is the operation (namely, making the resin bed 32 of semi-solid preparation formally solidify the operation making bonding coat 12) making the resin bed 32 of semi-solid preparation formally solidify to form bonding coat 12.
As the method for the formal solidification of the resin bed 32 making semi-solid preparation, such as can in the same manner as resin bed formation process S11 the method for choice for use solidification equipment 21.The intensity of light penetrated from solidification equipment 21 and irradiation time are set as that the resin bed 32 making semi-solid preparation formally solidifies.
By this operation, the resin bed 32 of semi-solid preparation formally solidifies.
By the formal curing process of above resin bed 32, bonding coat formation process S12 terminates, and the resin bed 32 of formal solidification is formed as bonding coat 12.
By above resin bed formation process S11 and bonding coat formation process S12, make the fender 1 (with reference to Fig. 1 (a), (b)) of the band bonding coat of present embodiment.
The manufacture method of the fender of band bonding coat according to the present embodiment; fender 10 is coated with (namely in coating process) in the process of hardening resin composition 30; namely; before the coating of hardening resin composition 30 terminates, start the semi-solid preparation carrying out be coated with hardening resin composition 30.Therefore, before the end infiltration spread of hardening resin composition 30, hardening resin composition 30 just semi-solid preparation, can reduce the thickness deviation of the end of the resin bed 32 of semi-solid preparation.Consequently, by making the resin bed 32 of semi-solid preparation formally solidify, the bonding coat 12 that thickness deviation reduces can be obtained.Therefore, the fender 1 of band bonding coat excellent in adhesion can be obtained.Accompanying drawing is below used to be described.
Fig. 4 (a), (b) are the cut-open views of the change of the end shape representing be coated with hardening resin composition 30, to be the figure after representing just coating hardening resin composition 30, Fig. 4 (b) be Fig. 4 (a) represents figure after coating after the stipulated time.
As shown in Fig. 4 (a), just by after mould coating device 20 (being coated with mode with mould) coating, the end shape of hardening resin composition 30 is in the shape substantially vertical relative to the upper surface 10a of fender 10.
On the other hand, as shown in Fig. 4 (b), after the stipulated time, due to hardening resin composition 30 infiltration spread, the end shape of hardening resin composition 30 is the shape that thickness reduces gradually from Inside To Outside.If the end of hardening resin composition 30 is this shape, then consequently the end shape of bonding coat 12 is also same shape.Therefore, when fender 10 and display panel being fitted, the end of fender 10 is not easily bonding with display panel, the bonding instability of fender 10 and display panel.
In contrast, according to the present embodiment, just after coating hardening resin composition 30, irradiated light by solidification equipment 21 pairs of hardening resin compositions 30, made hardening resin composition 30 become the hardening resin composition 31 of semi-solid preparation.Therefore, the infiltration spread of hardening resin composition 30 can be suppressed before the end shape of hardening resin composition 30 becomes the shape that thickness reduces gradually from Inside To Outside.Consequently, the bonding coat 12 that the thickness deviation that can obtain end reduces.
In addition, according to the present embodiment, the coating of hardening resin composition 30 and semi-solid preparation carry out in a procedure, therefore can save the artificial of manufacturing process.
In addition, according to the present embodiment, also following method can be adopted.
Hardening resin composition 30 also can be hot curing resin composition.Now, solidification equipment 21 adopts the formation that can apply heat to the hardening resin composition 30 be coated on fender 10.
In resin bed formation process S11, also the illuminate condition of light can be set as by regulating the translational speed of mobile device 33, regulating the time to hardening resin composition 30 irradiates light to make hardening resin composition 30 semi-solid preparation.
In resin bed formation process S11, also fender 10 can not be moved by mobile device 33, the substitute is and mould coating device 20 and solidification equipment 21 are moved.Now, mould coating device 20 and solidification equipment 21 is made to move towards the direction (+X-direction) of coating hardening resin composition 30.
In resin bed formation process S11, fender 10 and mould coating device 20 and solidification equipment 21 both sides also can be made to move.
< second embodiment >
Then, the manufacture method of the fender of the band bonding coat of the second embodiment is described.Second embodiment compared with the first embodiment, formed resin bed operation in resin bed a part of semi-solid preparation this point on different.In more detail, in the second embodiment, in the operation forming resin bed, the circumference of resin bed is with frame-shaped semi-solid preparation.
In addition, about the inscape same with above-mentioned embodiment, be marked with the symbol same with above-mentioned embodiment, illustrated and suitably simplify or omit.
Fig. 5 is the process flow diagram of the manufacture method of the fender of the band bonding coat representing present embodiment.
The manufacture method of the fender of the band bonding coat of present embodiment as shown in Figure 5, comprises resin bed formation process S21, planarization process S22, bonding coat formation process S23.
First, resin bed formation process S21 is the operation forming resin bed 40 by resin bed forming apparatus 2.
Fig. 6 (a), b () is the figure of the step representing resin bed formation process S21, Fig. 6 (a) represents the stereographic map end of downstream side (X-direction side end) of hardening resin composition 30 being carried out to the resin bed forming apparatus 2 of the state of semi-solid preparation process, Fig. 6 (b) is the stereographic map representing the resin bed forming apparatus 2 of both ends, downstream at the X-direction both ends of hardening resin composition 30 being carried out to the state of semi-solid preparation process, Fig. 7 (a), b () is the figure of the step representing resin bed formation process S21, Fig. 7 (a) be represent resin bed formation process S21 terminate after the vertical view of fender of tape tree lipid layer in stage, Fig. 7 (b) is the C-C cut-open view in Fig. 7 (a).
In addition, the XYZ coordinate system that in explanation, setting is same with above-mentioned Fig. 3 (a), (b), is described with reference to this XYZ coordinate system position relationship to each component.
As shown in Fig. 6 (a), (b); same with the resin bed formation process S11 of the first embodiment; on fender 10, hardening resin composition 30 is coated with by mould coating device 20; under the effect of solidification equipment 21, be coated on hardening resin composition 30 semi-solid preparation in coating process on fender 10.In the resin bed formation process S21 of present embodiment, as described below, only make a part of semi-solid preparation of hardening resin composition 30.
First, as shown in Fig. 6 (a), in the end of downstream side (-X-direction side end) of be coated with hardening resin composition 30, penetrate the light of wire from the whole bearing of trend (Y direction) of solidification equipment 21.By this, whole short side direction (Y direction) semi-solid preparation of the hardening resin composition 30 of (-Z-direction side) on the downside of the vertical of the light source being positioned at solidification equipment 21 is made.Consequently, the end of downstream side of hardening resin composition 30 becomes the hardening resin composition 31 of semi-solid preparation.
Then, in the inside portion of the long side direction (X-direction) of be coated with hardening resin composition 30, the injection from the light of the light source of the center side of solidification equipment 21 is stopped, only from the both ends injection light of the bearing of trend (Y direction) of solidification equipment 21 as Suo Shi Fig. 6 (b).By this, the both ends semi-solid preparation of the short side direction (Y direction) of be coated with hardening resin composition 30 is only made.Consequently, the both ends of the short side direction of the inside portion of hardening resin composition 30 (Y direction) are only had to become the hardening resin composition 31 of semi-solid preparation.
Then, in the upstream-side-end (+X-direction side end) of hardening resin composition 30, whole bearing of trend from solidification equipment 21 in the same manner as the end of downstream side of hardening resin composition 30 penetrates light, makes hardening resin composition 30 semi-solid preparation.Consequently, the upstream-side-end of hardening resin composition 30 becomes the hardening resin composition 31 of semi-solid preparation.
By this operation; resin bed 40 is formed as shown in Fig. 7 (a), (b); this resin bed 40 comprises semi-solid preparation portion 40a that be formed at the circumference of fender 10 with frame-shaped, that be made up of the hardening resin composition 31 of semi-solid preparation, and surrounded by semi-solid preparation portion 40a, the uncured portion 40b that is made up of uncured hardening resin composition 30.
Then, planarization process S22 is the operation of the thickness planarization being made resin bed 40 by heated resin layer 40.In addition, this planarization process is preferably applied to the situation that hardening resin composition 30 is Photocurable resin compositions.
Stipulated time is heated to resin bed 40, the viscosity of the uncured portion 40b of resin bed 40 is reduced.By this operation, by the inside that semi-solid preparation portion 40a surrounds the uncured portion 40b planarization of receiving, the thickness of resin bed 40 is roughly homogeneous.
Then, bonding coat formation process S23 comprises semi-solid preparation operation S23a, diaphragm adhering processes S23b, formal curing process S23c.
Semi-solid preparation operation S23a is the operation of the uncured portion 40b semi-solid preparation making resin bed 40.
Irradiate light, make the uncured portion 40b semi-solid preparation of non-semi-solid preparation in resin bed formation process S21.The method of irradiating light is not particularly limited, such as, can use solidification equipment 21 in the same manner as resin bed formation process S21.By this operation, the overall semi-solid preparation of resin bed 40.
Diaphragm adhering processes S23b is same with the diaphragm adhering processes S12a in the first embodiment.By this operation, bonding protective film 13 on the resin bed of semi-solid preparation.
Formal curing process S23c is same with the formal curing process S12b in the first embodiment.By this operation, the resin bed of semi-solid preparation formally solidifies.
By above operation, bonding coat formation process S23 terminates, and forms bonding coat 12.
By above from resin bed formation process S21 to the operation of bonding coat formation process S23, make the fender 1 (with reference to Fig. 1) of band bonding coat.
The manufacture method of the fender of band bonding coat according to the present embodiment; coating hardening resin composition 30, makes the both ends of circumference, the i.e. long side direction (X-direction) of be coated with hardening resin composition 30 and the both ends semi-solid preparation successively of short side direction (Y direction).By this, circumference is formed with the resin bed 40 of frame-shaped semi-solid preparation by a procedure.The circumference (end) of resin bed 40 semi-solid preparation immediately after coating, therefore infiltration spread is suppressed.In addition, the infiltration spread of the central portion of resin bed 40 is tackled by the circumference of the resin bed 40 of semi-solid preparation, thus suppressed.Consequently, by making resin bed 40 formally solidify, the bonding coat 12 that the thickness deviation that can form end reduces.Therefore, the fender 1 of band bonding coat excellent in adhesion can be obtained.
In addition, according to the present embodiment, the central portion of resin bed 40 is the uncured portion 40b be made up of uncured hardening resin composition 30, therefore reduces viscosity by heating.Because viscosity reduces, hardening resin composition 30 is infiltration spread easily, the thickness roughly homogenization of uncured portion 40b.
On the other hand, the surrounding of uncured portion 40b is surrounded by the semi-solid preparation portion 40a be made up of the hardening resin composition 31 of semi-solid preparation, and therefore the infiltration spread of the end of uncured portion 40b is suppressed, can suppress the increase of the thickness deviation of the end of resin bed 40.
By this, even if when the thickness deviation of be coated with hardening resin composition 30 is large, thickness bonding coat roughly homogeneous on the whole 12 also can be formed.
In addition, in present embodiment, also can adopt following method.
In planarization process S22, also can not heat resin bed 40.Such as, resin bed 40 planarization can being made for physically by carrying out smooth mode with roller etc., also can make resin bed 40 planarization naturally by placing the stipulated time.Now, hardening resin composition 30 also can have Thermocurable.
In addition, planarization engineering S22 also can omit.
< the 3rd embodiment >
Then, the 3rd embodiment is described.3rd embodiment, compared with the second embodiment, only makes in the end semi-solid preparation this point in resin bed direction different in resin bed formation process.In other words, in resin bed formation process, make the circumference of resin bed with frame-shaped semi-solid preparation in this second embodiment, and only make a part of semi-solid preparation of the circumference of resin bed in the third embodiment.
In addition, about the inscape same with above-mentioned embodiment, be marked with the symbol same with above-mentioned embodiment, illustrated and suitably simplify or omit.
Fig. 8 is the figure of the step of the resin bed formation process represented in present embodiment; represent the stereographic map end (X-direction side end) in a direction of hardening resin composition 30 being carried out to the resin bed forming apparatus 2 of the state of semi-solid preparation process; Fig. 9 (a), (b) are the figure of the step of the resin bed formation process represented in present embodiment; Fig. 9 (a) is the vertical view of the fender of the tape tree lipid layer in stage after representing resin bed formation process, and Fig. 9 (b) is the D-D cut-open view in Fig. 9 (a).
In addition, the XYZ coordinate system that in explanation, setting is same with above-mentioned Fig. 3 (a), (b), is described with reference to this XYZ coordinate system position relationship to each component.
The manufacture method of the fender of the band bonding coat of present embodiment comprises resin bed formation process and bonding coat formation process.
First, resin bed formation process is the operation forming resin bed 60 with resin bed forming apparatus 2A.
Resin bed forming apparatus 2A as shown in Figure 8, comprises mobile device 33, mould coating device 20, solidification equipment 50.
Solidification equipment 50 be arranged at respectively be in fender 10 vertical on the upside of the both ends of short side direction (Y direction) of (+Z-direction side).Solidification equipment 50 is arranged at the position relative to mould coating device 20 side (-X-direction side) farther downstream.Solidification equipment 50 has light source (not shown) in the same manner as solidification equipment 21.
In the same manner as the resin bed formation process S11 in the first embodiment, fender 10 is arranged on mobile device 33, makes fender 10 side (-X-direction side) movement towards downstream.While mobile fender 10, hardening resin composition 30 is spued from mould coating device 20, fender 10 is coated with hardening resin composition 30.Then, by solidification equipment 50, successively light is irradiated to be coated with hardening resin composition 30, make the both ends semi-solid preparation of the short side direction (Y direction) of hardening resin composition 30.
By this operation, resin bed 60 is formed as shown in Fig. 9 (a), (b), this resin bed 60 comprises semi-solid preparation portion 60a that be formed at the both ends of short side direction (Y direction), that be made up of the hardening resin composition 31 of semi-solid preparation, and clamped by semi-solid preparation portion 60a, the uncured portion 60b that is made up of uncured hardening resin composition 30.
Then, bonding coat formation process is same with the bonding coat formation process S23 in the second embodiment, comprises semi-solid preparation operation, diaphragm adhering processes, formal curing process.In addition, semi-solid preparation operation, diaphragm adhering processes and formal curing process are also same with semi-solid preparation operation S23a, the diaphragm adhering processes S23b of the bonding coat formation process S23 in the second embodiment and formal curing process S23c.
By above operation, make the fender 1 (with reference to Fig. 1) of band bonding coat.
The manufacture method of the fender of band bonding coat according to the present embodiment, the both ends of the short side direction of resin bed 60 start semi-solid preparation in coating process, and therefore infiltration spread is suppressed.Consequently, by making resin bed 60 formally solidify, the bonding coat 12 that the thickness deviation that can form the both ends of short side direction reduces.By this, the fender 1 of band bonding coat excellent in adhesion can be obtained.
In addition, according to the present embodiment, the light penetrated from the light source of solidification equipment 50 is without the need to switching according to irradiated site, therefore easy.
In addition, in present embodiment, also can adopt following method.
In resin bed formation process, solidification equipment 21 used in first, second embodiment also can be used to make hardening resin composition 30 semi-solid preparation.Now, only light is irradiated from the both ends of the bearing of trend (Y direction) of solidification equipment 21.
In addition, when using solidification equipment 21 in resin bed formation process, also only can irradiate light in the end of downstream side (-X-direction side end) of hardening resin composition 30 and the upstream-side-end (+X-direction side end) of hardening resin composition 30 from the whole bearing of trend of solidification equipment 21, and not irradiate light completely in the inside portion of the long side direction of hardening resin composition 30.Now, the resin bed of the both ends semi-solid preparation only having long side direction (X-direction) can be formed.
< embodiment >
Then, as embodiment, the manufacture method of the fender of the band bonding coat of the first embodiment and the fender of band bonding coat that manufactured by this manufacture method are described.Measure the image of the end shape of the bonding coat of the fender of the band bonding coat of the present embodiment and the end shape as the bonding coat of the fender of the existing band bonding coat of comparative example with microscope, compare.As the hardening resin composition forming bonding coat, use Photocurable resin composition.
(Photocurable resin composition)
The Photocurable resin composition used in the present embodiment acquisition as described below.
By molecular end with ethylene-oxide-modified 2 officials can polypropylene glycol (number-average molecular weight according to hydroxyl value calculates: 4000) and hexamethylene diisocyanate with 6 to 7 mixed in molar ratio, then (Osaka Organic Chemical Industry Co., Ltd. (Osaka You Machine chemical industry society) makes to use isobornyl acrylate, IBXA) after dilution, under the existence of the catalyzer of tin compound, make it react in 70 DEG C, in the prepolymer of gained, add 2-Hydroxy ethyl acrylate with the mol ratio of roughly 1 to 2 makes it react in 70 DEG C, thus the urethane acrylate oligomer with isobornyl acrylate dilution obtaining 30 quality % is (following, be designated as UC-1) solution.The curability group number of UC-1 is 2, and number-average molecular weight is about 55000.The viscosity of UC-1 solution at 60 DEG C is about 580Pas.
By acrylic acid-4-hydroxybutyl (Osaka organic chemistry Co., Ltd. system, the 4-HBA) Homogeneous phase mixing of the UC-1 solution of 50 mass parts and 50 mass parts, obtain potpourri.By this potpourri of 100 mass parts, the molecular end of 75 mass parts with 2 ethylene-oxide-modified officials can the polypropylene glycol (number-average molecular weight according to hydroxyl value calculates: 4000), the molecular end of 75 mass parts with 3 ethylene-oxide-modified officials can the polypropylene glycol (number-average molecular weight according to hydroxyl value calculates: 6200), the 1-hydroxy-cyclohexyl-phenyl-one (Photoepolymerizationinitiater initiater of 3 mass parts, Ciba Specialty Chemicals (チ バ ス ペ シ ャ Le テ ィ ケ ミ カ Le ズ society) makes, IRGACURE184), 2 of 0.08 mass parts, 5-di-tert-butyl hydroquinone (polymerization inhibitor, Tokyo changes into Co., Ltd. (East capital and changes into society) system), and 0.5 mass parts antioxidant (BASF AG (BASF) make, IRGANOX1010) Homogeneous phase mixing, obtain Photocurable resin composition.
Fender is moved with the speed of 33mm/s relative to mould coating device and solidification equipment, the Photocurable resin composition of gained is coated on fender.Solidification equipment in the present embodiment has the ultraviolet light source of injection, is configured to be coated with on fender after hardening resin composition 4.2s to hardening resin composition irradiation ultraviolet radiation.In addition, the ultraviolet intensity of irradiation is 0.396W/cm
2.
Figure 10 is the figure of the measurement result representing the present embodiment.Transverse axis represents the distance from bonding coat leading section, and the longitudinal axis represents the thickness of bonding coat.
As shown in Figure 10, in the fender of the band bonding coat of comparative example, after formation resin bed; namely; after being coated with on fender by hardening resin composition, in another procedure, make resin bed semi-solid preparation, resin bed infiltration spread in the process therefore to semi-solid preparation.Consequently, known thickness reduces gradually towards leading section from the position of distance bonding coat leading section about 7mm.
In contrast, in the fender of the band bonding coat of the present embodiment, the position that the thickness of the end of known bonding coat starts to reduce is the position of distance leading section about 3mm.
Can confirm thus, by the present embodiment, the infiltration spread of hardening resin composition is suppressed, can reduce the thickness deviation of the end of bonding coat.
Industry utilizes possibility
By the manufacture method of the transparent facestock of band bonding coat of the present invention; can obtain and be coated with the thickness deviation reduction of the end of the resin that mode is coated with, the transparent facestock with the band bonding coat excellent in adhesion of display panel with mould, this transparent facestock can be used for the protection purposes of the display panel of liquid crystal display or the display device such as touch-screen, display of organic electroluminescence.
Here the announcement of full content as instructions of the present invention of the instructions of No. 2013-105562, the Japanese patent application that on May 17th, 2013 files an application, claims, accompanying drawing and summary is quoted.
The explanation of symbol
1 ... fender (transparent facestock of band bonding coat) with bonding coat, 2 ... resin bed forming apparatus, 10 ... fender (transparent facestock); 10a ... the upper surface (simultaneously) of fender; 11 ... shading Printing Department, 12 ... bonding coat, 13 ... diaphragm; 20 ... mould coating device; 21 ... solidification equipment, 30 ... hardening resin composition (resin combination), 31 ... the hardening resin composition of semi-solid preparation; 32,40,60 ... resin bed, 33 ... mobile device.
Claims (9)
1. be with the manufacture method of the transparent facestock of bonding coat, it comprises:
The one side of transparent facestock utilizes mould coating device be coated with the resin combination with curability, make the semi-solid preparation at least partially in be coated with described resin combination, form the operation of the resin bed of semi-solid preparation;
Described resin bed is made to solidify the operation making bonding coat;
In the operation forming described resin bed, start to carry out described semi-solid preparation in the process of the described resin combination of coating.
2. the manufacture method of the transparent facestock of band bonding coat as claimed in claim 1, is characterized in that, in the operation forming described resin bed, make be coated with described resin combination whole semi-solid preparation.
3. the manufacture method of the transparent facestock of band bonding coat as claimed in claim 1, is characterized in that, in the operation forming described resin bed, make a part of semi-solid preparation of the circumference of be coated with described resin combination.
4. the manufacture method of the transparent facestock of band bonding coat as claimed in claim 3, is characterized in that, in the operation forming described resin bed, make the circumference of be coated with described resin combination with frame-shaped semi-solid preparation.
5. the manufacture method of the transparent facestock of band bonding coat as claimed in claim 4, is characterized in that, comprise the operation making described resin bed planarization before the operation making described bonding coat.
6. the manufacture method of the transparent facestock of band bonding coat as claimed in claim 5, is characterized in that, in the operation making described resin bed planarization, heat described resin bed.
7. the manufacture method of the transparent facestock of band bonding coat as claimed in claim 1, it is characterized in that, the operation making described bonding coat comprises the operation making part semi-solid preparation uncured in be coated with described resin combination.
8. the manufacture method of the transparent facestock of the band bonding coat according to any one of claim 1 ~ 7, is characterized in that, the operation making described bonding coat comprises:
The operation of bonding protective film on described resin bed;
Make the operation that the described resin bed being pasted with described diaphragm formally solidifies.
9. the manufacture method of the transparent facestock of the band bonding coat according to any one of claim 1 ~ 8, is characterized in that, in the operation forming described resin bed, makes described resin combination semi-solid preparation by irradiating light.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013105562 | 2013-05-17 | ||
| JP2013-105562 | 2013-05-17 | ||
| PCT/JP2014/063115 WO2014185533A1 (en) | 2013-05-17 | 2014-05-16 | Method for producing transparent surface material having adhesive layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105210136A true CN105210136A (en) | 2015-12-30 |
Family
ID=51898507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480028226.0A Pending CN105210136A (en) | 2013-05-17 | 2014-05-16 | Method for producing transparent surface material having adhesive layer |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2014185533A1 (en) |
| KR (1) | KR20160012977A (en) |
| CN (1) | CN105210136A (en) |
| TW (1) | TW201501945A (en) |
| WO (1) | WO2014185533A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04266086A (en) * | 1991-02-21 | 1992-09-22 | Matsushita Electric Ind Co Ltd | Adhesive coating device |
| JPH06188550A (en) * | 1992-12-22 | 1994-07-08 | Matsushita Electric Ind Co Ltd | Adhesive coating method |
| JP4100203B2 (en) * | 2003-03-14 | 2008-06-11 | ソニー株式会社 | Element transfer method |
| JP2011145534A (en) * | 2010-01-15 | 2011-07-28 | Hitachi Displays Ltd | Display device with front window and method for manufacturing the same |
| WO2012077726A1 (en) * | 2010-12-08 | 2012-06-14 | 旭硝子株式会社 | Adhesive-layer-equipped transparent surface material, display device, and methods for producing same |
| CN102574736A (en) * | 2009-10-23 | 2012-07-11 | 日东电工株式会社 | Transparent substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05138820A (en) | 1991-11-22 | 1993-06-08 | Denki Kagaku Kogyo Kk | Laminate and formed body thereof |
| DE10111704B4 (en) * | 2001-03-12 | 2008-06-12 | Ivoclar Vivadent Ag | Process for producing a plastic part |
-
2014
- 2014-05-16 TW TW103117300A patent/TW201501945A/en unknown
- 2014-05-16 WO PCT/JP2014/063115 patent/WO2014185533A1/en active Application Filing
- 2014-05-16 KR KR1020157024454A patent/KR20160012977A/en not_active Application Discontinuation
- 2014-05-16 CN CN201480028226.0A patent/CN105210136A/en active Pending
- 2014-05-16 JP JP2015517149A patent/JPWO2014185533A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04266086A (en) * | 1991-02-21 | 1992-09-22 | Matsushita Electric Ind Co Ltd | Adhesive coating device |
| JPH06188550A (en) * | 1992-12-22 | 1994-07-08 | Matsushita Electric Ind Co Ltd | Adhesive coating method |
| JP4100203B2 (en) * | 2003-03-14 | 2008-06-11 | ソニー株式会社 | Element transfer method |
| CN102574736A (en) * | 2009-10-23 | 2012-07-11 | 日东电工株式会社 | Transparent substrate |
| JP2011145534A (en) * | 2010-01-15 | 2011-07-28 | Hitachi Displays Ltd | Display device with front window and method for manufacturing the same |
| WO2012077726A1 (en) * | 2010-12-08 | 2012-06-14 | 旭硝子株式会社 | Adhesive-layer-equipped transparent surface material, display device, and methods for producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014185533A1 (en) | 2014-11-20 |
| JPWO2014185533A1 (en) | 2017-02-23 |
| TW201501945A (en) | 2015-01-16 |
| KR20160012977A (en) | 2016-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI679457B (en) | Optical film with double-sided adhesive, manufacturing method of image display device using the same, and curl suppression method of optical film with double-sided adhesive | |
| JP5448024B2 (en) | Photocurable adhesive, polarizing plate using the photocurable adhesive, method for producing the same, optical member, and liquid crystal display device | |
| TWI513791B (en) | (2) A method for producing a transparent surface material, a display device and the like, | |
| CN103249552B (en) | Adhesive-layer-quipped transparent surface material, display device, and methods for producing same | |
| CN102869736B (en) | Adhesive composite | |
| CN104062701B (en) | The manufacturing method of polarizer | |
| JP2017102459A (en) | Resin composition and display device | |
| CN101104326B (en) | Thin film lamination body and manufacturing method thereof | |
| KR20210145102A (en) | Adhesive sheet and method of producing the same | |
| CN105764686B (en) | Transparent facestock and display device with adhesive linkage | |
| TW201617654A (en) | Optical film with pressure sensitive adhesive and production method thereof, and method for producing image display device | |
| TW201602295A (en) | Double sided adhesive film, adhesive layer-equipped transparent plate and laminate | |
| CN104914598A (en) | Bi-side adhesive film, transparent surface material with adhesive layer | |
| TW201431700A (en) | Transparent face plate with adhesive layer, laminate, display device, and production methods thereof | |
| KR101296316B1 (en) | Uv-curable adhesive composition and method for manufacturing polarizing len using the same | |
| KR20100103502A (en) | Method for bonding a transparent substrate to a liquid crystal display and associated device | |
| KR20130034629A (en) | Acrylic resin film and method for producing the same, and polarizing plate made with the same | |
| TW201318868A (en) | Method for manufacturing layered body | |
| TWI690738B (en) | Composite polarizing plate and liquid crystal panel using the same | |
| JP2015114624A (en) | Transparent face material with adhesive layer | |
| TW201501932A (en) | Manufacturing method of transparent surface material with adhesive layer, and transparent surface material with adhesive layer | |
| TW201532833A (en) | Manufacture method of laminate, laminate, and transparent surface materiel with adhesive layer | |
| KR101435139B1 (en) | Resin Composition Curable by Active Energy Ray for Pattern of Light Guiding Plate | |
| TWI597303B (en) | Curable resin composition, adhesive layer-equipped transparent surface material, and laminate | |
| JP5057809B2 (en) | Continuous production method of resin substrates |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151230 |