CN105203236A - Organic polymer semiconductor tactile sensor and preparation method thereof - Google Patents

Organic polymer semiconductor tactile sensor and preparation method thereof Download PDF

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Publication number
CN105203236A
CN105203236A CN201510647951.2A CN201510647951A CN105203236A CN 105203236 A CN105203236 A CN 105203236A CN 201510647951 A CN201510647951 A CN 201510647951A CN 105203236 A CN105203236 A CN 105203236A
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organic polymer
electrode
polymer semiconductor
touch sensor
poly
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钟高余
闫伟青
侯伟
侯雨轩
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Fudan University
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Fudan University
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Abstract

The invention belongs to the technical field of sensors, and particularly relates to an organic polymer semiconductor tactile sensor and a preparation method thereof. Organic conjugated polymer semiconductor materials, namely, poly[2-methoxy-5-(3',7'-dimethyloctyloxy)-1,4-phenylacetylene] and poly[2,5-bis(3',7'-dimethyloctyloxy)-1,4-phenylenevinylene] are adopted as working substances of the tactile sensor, a sandwich structure is adopted as a basic structure of the tactile sensor, a flexible substrate, a second electrode, an organic polymer layer, namely, the working substances, and a first electrode are sequentially arranged from bottom to top, and a packaged plastic film is arranged on the uppermost layer. The tactile sensor is high in sensitivity, small in size, light and low in cost, and can be bent freely. The tactile senor is suitable for touch sensing of household or medical robot fingers, and is wide in application prospect.

Description

A kind of organic polymer semiconductor touch sensor and preparation method thereof
Technical field
The invention belongs to sensor technical field, be specifically related to a kind of organic polymer pressure transducer and preparation method thereof.
Background technology
At present, in sense of touch or pressure sensing, mainly contain piezoelectric type, condenser type and piezoresistive transducer.Relatively more conventional piezoresistive transducer mainly contains metal strain plate pressure transducer, inorganic semiconductor pressure transducer, and mix the dielectric resilience body sensor of conductor or semiconductor, conductive rubber pressure transducer as black in carbon dope, or the piezoresistive transducer of carbon nanotubes, nanosphere, and the pressure transducer of micromechanics.The most volume ratio of these elements is comparatively large, and weight is also larger, not easily forms the flexible large area of microcomponent composition and many device arrays, is not easily formed and resembles " sense of touch " measuring condition pointing.
Organic conjugate polymer material is a kind of organic semiconductor.In a conjugated polymer main chain, usually have the electronics of socialization, charge carrier can closely free movement on main chain.Therefore, the main chain electric conductivity of organic conjugate polymer is very good.And high molecular side chain normally saturated bond combine, be insulation, and side chain is changeable, the amount doesn't matter, these side chains can be separated the main chain of conduction, make the conductive capability of material very low.If material is subject to ambient pressure, side chain can be compacted, and the spacing of main chain reduces, and the conductive capability of material is promoted rapidly, and after removing ambient pressure, side chain returns to the original form, and the conductive capability of material also returns to original lower level.Utilize this characteristic of organic conjugate polymer material can the superior piezoresistive tactile sensor of processability.These characteristics combine with the bendability characteristics of rubber or plastic substrate, just can prepare flexiblely to have high sensitivity, lightweight, the large area sensor that cost is low, and sensor array.
Summary of the invention
The object of the present invention is to provide a kind of highly sensitive, volume is little, lightweight, cost is low, easy to use flexible organic polymer semiconductor touch sensor and preparation method thereof.
Organic polymer semiconductor touch sensor provided by the invention, use a kind of tactile sensing material as operation material, this sensitive material comprises two kinds of organic conjugate polymer semiconductor materials, i.e. two kinds of polyphenylacetylene analog derivatives:
1, poly-[2-methoxyl-5-(3 ', 7 '-dimethyl octyloxy)-1,4-phenylacetylene] (Poly [2-methoxy-5-(3 ', 7 '-dimethyloctyloxy)-1,4-phenylenevinylene], MDMO-PPV), structure is shown in shown in (a) formula;
2, poly-[2,5-two (3 ', 7 '-dimethyl octyloxy)-1,4-phenylenevinylenes] (Poly [2,5-bis (3 ', 7 '-dimethyloctyloxy)-Isosorbide-5-Nitrae-phenylenevinylene], BDMO-PPV), its structure is shown in shown in (b) formula:
(a) MDMO-PPV molecular structure
(b) BDMO-PPV molecular structure.
In this bi-material, high molecular molecular weight is different according to molecular chain length, and be not 1 ~ 1,000 ten thousand not etc., preferred molecular weight is 10000-1000000.
Namely the present invention is using above-mentioned organic conjugate polymer semiconductor material as operation material, by measuring the change of its electrology characteristic after compressing this material, get final product perception institute's applied pressure on this material, thus make device presser sensor to external world, form tactile sensing.
Organic polymer semiconductor touch sensor provided by the invention is sandwich structure.As depicted in figs. 1 and 2, its bottom is flexible substrate 1, flexible substrate 1 is above the second electrode 2, second electrode 2 be organic polymer layer 3, and organic polymer layer 3 is the first electrode 4 above, is topmost the plastic foil 5 of encapsulation.
In said structure, flexible substrate 1 can adopt polyimide (PET) or PS material.First electrode material is generally aluminium, or silver-colored individual layer, or is active metal calcium, as negative electrode.Organic polymer layer 3 i.e. operation material, adopts MDMO-PPV or BDMO-PPV.Second electrode material is generally ito film, as anode.
In the present invention, the thickness of electrode is generally 0.1 ~ 0.5 micron, and the live width of electrode is generally 0.1 ~ 2 millimeter.Between electrode, the thickness of organic polymer layer is generally 0.05 ~ 5 micron.The thickness of flexible substrate and encapsulated plastic film is generally at 0.2 ~ 1 millimeter.
In the present invention, devices function district size is generally the square or circular area of 0.5 ~ 10 millimeter.Therefore, the radius of touch sensor of the present invention is 0.25 ~ 5 millimeter.
Touch sensor of the present invention, its principle is mainly: by impressed pressure, and make encapsulated plastic film transmit impressed pressure on organic polymer layer, organic polymer layer is compressed the change of rear generation resistance, by measuring the change of this resistance value, get final product the size of perception impressed pressure.
The preparation method of organic polymer semiconductor touch sensor provided by the invention, is divided into two kinds:
One is the method for solution spin coating.Namely on substrate, the second electrode is made, then spin coating one deck organic polymer film on the second electrode, dry; Prepare the first electrode by the method for vacuum evaporation, be namely placed in vacuum cavity, by mask evaporation metal negative electrode i.e. the first electrode.Keep the vacuum tightness of vacuum cavity higher than 10 in evaporate process -4handkerchief, evaporation rate is within the scope of 0.05 ~ 1nm/Sec.The substrate of good for evaporation metallic cathode is carried out plastic foil encapsulation in inert atmosphere (if water, oxygen content are lower than the nitrogen of 1ppm or argon gas).Namely seal with plastic foil and be bonded on substrate, environmental seal is good, exposes electrode for connecting external circuit.
Two is methods of inkjet printing.Namely on substrate, the second electrode is made, then the method for inkjet printing makes organic polymer book film on the second electrode, wherein, the organic polymer solution concentration of inkjet printing is in the scope of 1 ~ 10mg/ml, and existing inkjet technology be used for reference or be used to the inkjet technology used can.Use the method will avoid the introducing of various pollution.The preparation of the first electrode is the same (namely also adopting the method for vacuum evaporation), and the method for encapsulation is also the same.
The using method of organic polymer semiconductor touch sensor provided by the invention, concrete steps are:
Voltage is added, the size of measuring current between two electrodes.Alive mode has following two kinds: one to be square-wave voltage; Two is constant voltages.These two kinds of alive modes respectively have function.The function of square wave electric pulse is mainly the size of quantitative test pressure signal.The high level of square wave (is generally (1 ~ 50) × 10 depending on average electric field size 6v/m) needs, are roughly positioned at the scope of 0.1 ~ 5V.Low level is generally near 0V.Can process the size of identical voltage, current, roughly analyze the size obtaining impressed pressure.Constant voltage may be used for test impressed pressure over time.
Touch sensor of the present invention is highly sensitive, volume is little, lightweight, cost is low, and can bend arbitrarily, is applicable to the tactile sensing of family expenses or hospital machines finger, has a extensive future.
Accompanying drawing explanation
Fig. 1 is the structural diagrams (vertical profile) of organic polymer semiconductor touch sensor of the present invention.
Fig. 2 is the structure top view of organic polymer semiconductor touch sensor of the present invention.
Embodiment
Prepare the MDMO-PPV solution of 8mg/ml, get and deposit and etched the polyimide base film of ITO pattern, spin coating a layer thickness is over the substrate the MDMO-PPV film of 100nm, each MDMO-PPV point is the circle of diameter 12 millimeters, cover the ITO electrode that diameter is 10 millimeters completely, then on MDMO-PPV evaporation diameter be 10 millimeters calcium aluminium electrode, formed negative electrode, and with stay the square ITO conducting of an on-chip block length, form the pin that contacts with external circuit.Then using PET or PS film as encapsulating film, paste around device, and cover and seal up devices function district, so just prepare a novel organic polymer semiconductor touch sensor.Encapsulation process is carried out under high-purity inert environments of anhydrous and oxygen-free.After packaged, tactile sensor array is connected special external analysis circuit, namely can carry out the test of sense of touch.

Claims (8)

1. an organic polymer semiconductor touch sensor, it is characterized in that using a kind of tactile sensing material as operation material, this sensitive material is the one of following two kinds of organic conjugate polymer semiconductor materials:
(1) poly-[2-methoxyl-5-(3 ', 7 '-dimethyl octyloxy)-Isosorbide-5-Nitrae-phenylacetylene], its structure is for shown in (a) formula:
(a);
(2) poly-[two (3 ', the 7 '-dimethyl octyloxy)-Isosorbide-5-Nitrae-phenylenevinylenes of 2,5-], its structure is for shown in (b) formula:
(b)。
2. organic polymer semiconductor touch sensor according to claim 1, it is characterized in that for sandwich structure, its bottom is flexible substrate, it flexible substrate is the second electrode, be organic polymer layer and operation material above second electrode, being the first electrode above organic polymer layer, is topmost the plastic foil of encapsulation.
3. organic polymer semiconductor touch sensor according to claim 2, is characterized in that described flexible substrate adopts PET or PS material; First electrode material is aluminium, or silver-colored individual layer, or is active metal calcium; Organic polymer layer and operation material adopt MDMO-PPV or BDMO-PPV; Second electrode material is ito film.
4. organic polymer semiconductor touch sensor according to claim 2, is characterized in that the thickness of two kinds of electrodes is 0.1 ~ 0.5 micron, and the live width of electrode is 0.1 ~ 2 millimeter; Between electrode, the thickness of organic polymer layer is 0.05 ~ 5 micron; The thickness of flexible substrate and encapsulated plastic film is 0.2 ~ 1 millimeter.
5. organic polymer semiconductor touch sensor according to claim 2, is characterized in that working sensor district is the square or circular area of 0.5 ~ 10 millimeter.
6. a preparation method for the organic polymer semiconductor touch sensor as described in one of claim 1-5, is characterized in that being divided into two kinds:
Method one, solution spin-coating method: make the second electrode on substrate, then spin coating one deck organic polymer film on the second electrode, dry; The first electrode is prepared by the method for vacuum evaporation; The substrate of evaporation first electrode is carried out plastic foil encapsulation in an inert atmosphere;
Method two, ink-jet printing process: make the second electrode on substrate, then the method for inkjet printing makes organic polymer book film on the second electrode, and wherein, the organic polymer solution concentration of inkjet printing is in the scope of 1 ~ 10mg/ml; The preparation of the first electrode and the method for encapsulation are with method one.
7. a using method for the organic polymer semiconductor touch sensor as described in one of claim 1-5, is characterized in that: between two electrodes, add voltage, then the size of measuring current; Institute's making alive has following two kinds: one to be square-wave voltage; Two is constant voltages; Wherein, square wave electric pulse is mainly the size of quantitative test pressure signal; The high level of square wave is positioned at the scope of 0.1 ~ 5V, and low level is near 0V; Constant voltage is for testing impressed pressure over time.
8. be used as an operation material for organic polymer semiconductor touch sensor, it is characterized in that the one for following two kinds of organic conjugate polymer semiconductor materials:
(1) poly-[2-methoxyl-5-(3 ', 7 '-dimethyl octyloxy)-Isosorbide-5-Nitrae-phenylacetylene], its structure is for shown in (a) formula:
(a);
(2) poly-[two (3 ', the 7 '-dimethyl octyloxy)-Isosorbide-5-Nitrae-phenylenevinylenes of 2,5-], its structure is for shown in (b) formula:
(b)。
CN201510647951.2A 2015-10-09 2015-10-09 Organic polymer semiconductor tactile sensor and preparation method thereof Pending CN105203236A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107898463A (en) * 2017-11-13 2018-04-13 深圳大学 A kind of flexible electronic pressure sensor and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101071085A (en) * 2007-06-21 2007-11-14 复旦大学 Organic pressure sensor and its use method
CN101261167A (en) * 2008-04-24 2008-09-10 复旦大学 Bendable organic small molecule touch sensor array and method for making same
CN101368858A (en) * 2008-10-10 2009-02-18 复旦大学 Organic conjugate polymer material pressure transducer
CN101609870A (en) * 2008-06-18 2009-12-23 韩国科学技术院 Organic solar batteries and its manufacture method
JP4916549B2 (en) * 2006-08-31 2012-04-11 コーリア リサーチ インスティトゥート オブ スタンダーズ アンド サイエンス Curved adhesion type tactile sensor and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916549B2 (en) * 2006-08-31 2012-04-11 コーリア リサーチ インスティトゥート オブ スタンダーズ アンド サイエンス Curved adhesion type tactile sensor and manufacturing method thereof
CN101071085A (en) * 2007-06-21 2007-11-14 复旦大学 Organic pressure sensor and its use method
CN101261167A (en) * 2008-04-24 2008-09-10 复旦大学 Bendable organic small molecule touch sensor array and method for making same
CN101609870A (en) * 2008-06-18 2009-12-23 韩国科学技术院 Organic solar batteries and its manufacture method
CN101368858A (en) * 2008-10-10 2009-02-18 复旦大学 Organic conjugate polymer material pressure transducer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107898463A (en) * 2017-11-13 2018-04-13 深圳大学 A kind of flexible electronic pressure sensor and preparation method thereof

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Application publication date: 20151230