CN105190845A - Substrate precession mechanism for CMP polishing head - Google Patents
Substrate precession mechanism for CMP polishing head Download PDFInfo
- Publication number
- CN105190845A CN105190845A CN201480014938.7A CN201480014938A CN105190845A CN 105190845 A CN105190845 A CN 105190845A CN 201480014938 A CN201480014938 A CN 201480014938A CN 105190845 A CN105190845 A CN 105190845A
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- China
- Prior art keywords
- retaining ring
- ring assembly
- substrate
- coupled
- gear
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move independently of one another to promote substrate precession during a CMP process.
Description
background of the present invention
Background technology
Usually by sequential deposition of conductive, semi-conductive layer or insulating barrier form integrated circuit on substrate on a silicon substrate.A manufacturing step relates to and being deposited on nonplanar surface by packing layer, and this packing layer of complanation is until expose nonplanar surface.For example, the packing layer of conduction can be deposited on patterned insulation layer to fill groove in insulating barrier or hole.Polishing packing layer is until expose the raised design of insulating barrier subsequently.After planarization, the part of the conductive layer between the raised design remaining in insulating barrier forms through hole, connector and line, and this through hole, connector and line provide the conductive path between the thin film circuit on substrate.In addition, complanation is needed to come planarizing substrates surface for photoetching.
Chemico-mechanical polishing (CMP) is a kind of received method of planarizing.On the carrier head that this method of planarizing requires substrate to be arranged on CMP device usually or rubbing head.The exposed surface of substrate is put against the polishing plate mat rotated or band pad.Polishing pad can be standard pad or fixed abrasive material pad.Standard pad can have durable roughened surface, and fixed abrasive material pad can have the abrasive grain remaining on and hold in medium.Carrier head provides controllable load to promote substrate against polishing pad on substrate.Carrier head can have retaining ring substrate being remained on appropriate location during polishing.The polishing liquid (such as, slurry) comprising at least one chemical reactor and abrasive grain can be supplied to the surface of polishing pad during polishing.
What maintain substrate evenly removes the importance that profile is CMP.The relatively uniform profile maintained in both extreme direction and radial direction on the surface of substrate may be wished.Thus, the method for the local inhomogeneities reducing complanation profile is adopted to can be important.
Technical field
Embodiment as herein described relates generally to a kind of chemico-mechanical polishing carrier head.More specifically, embodiment as herein described relates to a kind of substrate precession mechanism for carrying rubbing head.
Summary of the invention
Embodiment as herein described relates generally to a kind of substrate precession mechanism for CMP carrier head.A kind of substrate precession device for CMP carrier head is provided.This device is energized substrate precession, this substrate precession be during the polishing of substrate substrate relative to the rotary motion of carrier head.Carrier head and retaining ring assembly can decoupling zeros (de-couple), thus allow carrier head and retaining ring assembly independent of movement each other to promote substrate precession during CMP.
In one embodiment, a kind of device for polishing substrate is provided.This device comprises head group part, and retaining ring assembly.This retaining ring assembly comprises internal gear and is arranged on the bearing between head group part and retaining ring assembly.This bearing is adapted to and makes retaining ring assembly and the decoupling zero of head group part.The driven unit being adapted to and retaining ring assembly is rotated relative to head group part is also provided.
In another embodiment, a kind of retaining ring assembly for rubbing head is provided.This retaining ring assembly comprise have upper annular portion divide and lower annular section retaining ring and be coupled to the load-carrying ring that this upper annular portion divides.This retaining ring assembly comprises the bearing holder being coupled to this load-carrying ring and the internal gear being coupled to this bearing holder further, and this bearing holder is adapted to reception bearing.
In another embodiment, a kind of method operating burnishing device is provided.The method comprises provides rubbing head assembly and retaining ring assembly.This retaining ring assembly and this rubbing head assembly decoupling zero.The method also provides and rotates retaining ring assembly with First Speed rotating polishing head and with the second speed being greater than this First Speed.
Accompanying drawing explanation
In order to understand the mode of above-mentioned feature of the present invention in detail, by being further described in more detail the present invention summarized in upper with reference to embodiment, some embodiments in these embodiments are illustrated in accompanying drawing.But it should be noted, these accompanying drawings only illustrate exemplary embodiments of the present invention and are not therefore regarded as limiting category of the present invention, because the present invention can allow other Equivalent embodiments.
Fig. 1 is the phantom of the carrier head of the retaining ring assembly with decoupling zero.
Fig. 2 is the fragmentary, perspective view of the carrier head of Fig. 1.
Fig. 3 is the schematic, bottom view of retaining ring assembly and substrate.
For the ease of understanding, use identical Reference numeral to the similar elements indicating all figure common in possible place.It is conceivable that, the element of an embodiment and feature advantageously can be incorporated to other embodiments and without the need to being described in further detail.
Embodiment
Embodiment as herein described relates generally to a kind of substrate precession mechanism for CMP carrier head.A kind of substrate precession device for carrier head is provided.This device is energized substrate precession, this substrate precession be during the polishing of substrate substrate relative to the rotary motion of carrier head.Carrier head and retaining ring assembly can decoupling zeros and independent of mobile to promote substrate precession during CMP each other.
Generally speaking, the pressure of change can be applied to each radial portion of film structural component to create backside pressure, this backside pressure can by substrate clamping to CMP head.Pressure can be made to remove profile across the change of each district to provide predetermined in each radial portion.But the pressure in adjustment radial portion adjusts the inhomogeneities in extreme direction by halves.Can to cause in substrate uneven removes profile for the inhomogeneities of film structural component.Thus, in glossing, provide " (polar) is asymmetric in pole " removable or reduce the impact removing local inhomogeneities in profile.
Embodiment as herein described is generally provide about polishing 300mm substrate.But embodiment as herein described can be adapted to the substrate (such as, 100mm or 450mm substrate) of other sizes of polishing.Can be adapted to the CMP head benefiting from embodiment as herein described is the TITANHEAD that can obtain from the Applied Materials (AppliedMaterials, Inc.) of Santa Clara, Calif
tMor TITANCONTOUR.But it is expected to, the carrier head that can obtain from other manufacturers can be adapted to and adopt embodiment as herein described.
Fig. 1 is the phantom of traditional carrier head 100.Carrier head 100 comprises shell 106, head group part 102 and retaining ring assembly 104.Shell 106 generally can be round-shaped and can be connected to driving shaft (not shown) and rotate to utilize this driving shaft during polishing.Can exist and extend through the passage (not shown) of shell 106 for the pneumatic control of carrier head 100.Carrier head 100 also comprises retaining ring assembly 104, and this retaining ring assembly 104 comprises retaining ring 120, load-carrying ring 140, bearing holder 110 and internal gear 112.Bearing 130 can make head group part 102 and retaining ring assembly 104 decoupling zero.
Fig. 2 is the fragmentary, perspective view with head group part 102 and the carrier head 100 through the retaining ring assembly 104 of decoupling zero of Fig. 1.Head group part 102 can comprise shell 106, and this shell 106 generally can be round-shaped and can be connected to driving shaft (not shown) and rotate to utilize this driving shaft during polishing.Can exist and extend through the passage (not shown) of shell 106 for the pneumatic control of carrier head 100.Carrying main body 208 can be coupled to shell 106 flexibly and be turned with shell 106 corotation.Carrying main body 208 also can be coupled to flexible membrane 250, and this flexible membrane 250 can be adapted to and clamp substrate 201 during CMP.Flexible membrane 250 can be defined for clamping the several of substrate 201 can pressurised chamber.
As discussed previously, retaining ring assembly 104 can comprise retaining ring assembly 120, load-carrying ring 140, bearing holder 110 and internal gear 112.Load-carrying ring 140 can be circulus substantially.Load-carrying ring 140 can have annular upper portion 244 and annular lower portion 242.Annular upper portion 244 can be configured to be adjacent to bearing holder 110 and below bearing holder 110.Annular lower portion 242 can be configured to be adjacent to retaining ring 120 and above retaining ring 120.Load-carrying ring 140 can have through this load-carrying ring 140 arrange groove or hole to hold fastener (such as, screw or bolt (not shown)) to couple bearing holder 110, load-carrying ring 140 and retaining ring 120.
Retaining ring 120 can be formed by two rings (lower annulus 224 and upper annulus 222).Together with lower annulus 224 can be coupled in upper annulus 222.When engaging lower annulus 224 with upper annulus 222, internal diameter in its abutment surface of two rings and outer radius have substantially the same size, form flush surfaces to make lower annulus 224 with upper annulus 222 at its joint.
In the embodiment being configured for 300mm substrate, substrate 201 can have the external diameter of about 11.811 inches.In one embodiment, the internal diameter of lower annulus 224 can between about 11.830 inches and about 11.870 inches, such as 11.852 inches.In this embodiment, the gear ratio between substrate 201 external diameter and lower annulus 224 internal diameter can be about 0.99654.In another embodiment, the internal diameter of lower annulus 224 can between about 11.890 inches and about 11.950 inches, all 11.912 inches according to appointment.In this embodiment, the gear ratio between substrate 201 external diameter and lower annulus 224 internal diameter can be about 0.99152.
In certain embodiments, lower annulus 224 is attached at its abutment surface place by grafting material (not shown) with upper annulus 222.Grout material can be prevented connecting between lower annulus 224 with upper annulus 222 to be trapped in retaining ring 120.Grafting material can be jointing material, such as slowly solidifies or fast-curing epoxy resin.High temp. epoxy resins can resist grafting material deterioration due to high heat during CMP.In certain embodiments, epoxy resin comprises polyamide and fatty amine.
Upper annulus 222 can have inner surface 228, and this inner surface 228 can be adapted to and to couple with flexible membrane 250 and to provide support to flexible membrane 250.Upper annulus 222 can by compared with lower annulus 224 can more rigidity material (such as, the such as metal of stainless steel, molybdenum, aluminium, ceramic material, or other exemplary materials) formed.
Lower annulus 224 can be configured to be adjacent to annulus 222 and on this below annulus 222.Lower annulus 224 can have substrate and keep surface 226, and this substrate keeps surface 226 to be adapted to and keep substrate 201 during CMP.Lower annulus 224 can such as, by being that chemically inert material (such as, plastic cement, polyphenylene sulfide (PPS)) is formed in a cmp process.Lower annulus 224 also can be adapted to and provide durability and low wear rate.Lower annulus 224 can be and can enough compress, and does not cause substrate 201 cracked or break to make substrate 201 edge against the contact of lower annulus 224.But lower annulus 224 downward pressure in so flexible so that retaining ring 120 should not cause extrude lower annulus 224 during CMP.
Bearing holder 110 can be ring-type substantially.Bearing holder 110 can be configured to be adjacent to load-carrying ring 140 annular upper portion 244 and above this annular upper portion 244.Bearing holder 110 is coupled to load-carrying ring 140 by securing member 213 (such as, screw or bolt).Bearing holder 110 can be formed by the material of such as metal (such as, stainless steel, molybdenum, aluminium), ceramic material or other exemplary materials and so on.The top 216 of bearing holder 110 can be internal gear 112 and provides support.Bearing holder 110 can comprise several hole (not shown), and several holes (not shown) of this several Kong Keyu internal gear 112 are aimed at.Bearing receiving area 218 can be adapted to and receive bearing 130.
Bearing 130 can be coupled between bearing holder 110 and carrying main body 208.Bearing 130 can comprise the first annular surface 232, and this first annular surface 232 can be coupled to the bearing receiving area 218 of bearing holder 110 and be configured to be adjacent to this bearing receiving area 218.Second annular surface 234 can be coupled to carrying main body 208 and be configured to be adjacent to this carrying main body 208.Several ball bearing 236 can be arranged between the first annular surface 232 and the second annular surface 234 and can be adapted to and make head group part 102 and retaining ring assembly 104 decoupling zero.Bearing 130 provides additional rotary freedom can to carrier head 100.This additional rotary freedom allows retaining ring assembly 104 to rotate independent of head group part 102.
Internal gear 112 can be ring-type substantially.Internal gear 112 can be formed by the material of such as metal (such as, stainless steel, molybdenum, aluminium), ceramic material or other exemplary materials and so on.Internal gear 112 can be configured to be adjacent to the top 216 of bearing holder 110 and couple with this top 216.Several hole (not shown) can be configured to by internal gear 112 and be adapted to receive securing member (not shown), and this securing member can be adapted to and internal gear 112 is fixed to bearing holder 110.Several teeth 214 can comprise the inner surface of internal gear 112.
In certain embodiments, driven unit 290 can be configured to the rotary motion providing the rotation independent of head group part 102 to retaining ring assembly 104.Driven unit 290 comprises bezel ring, 258, bracket 256, actuator 260, main shaft 261 and worm-drive 262.Driven unit 290 activated actuators 292, this transmission device 292 can make retaining ring assembly 104 rotate relative to head group part 102.
Bezel ring, 258 can be configured to be adjacent to the part of carrying main body 208 and side on the portion.Bezel ring, 258 can be coupled to carrying main body 208, moves with the rotation mode identical with head group part 102 with the element making bezel ring, 258 and be coupled to this bezel ring, 258.Be coupled to this top surface 259 above the top surface 259 that bracket 256 can be arranged on bezel ring, 258.Bracket 256 can be adapted to and is supported in fixed position by actuator 260.Actuator 260 (such as air motor) can be coupled to pressure source 274 via supply line 272.Pressure source 274 can be adapted to provides gas-pressurized or fluid via supply line 272 to actuator 260.Main shaft 261 to extend and worm-drive 262 can be coupled to main shaft 261 from actuator 260.Actuator 260 is general to be applied rotary motion to main shaft 261 and worm-drive 262 is rotated.
Can by worm-drive 262 activated actuators 292.Transmission device 292 comprises worm gear 264, spur gear 268, driving shaft 266 and shaft encoder 270.Worm gear 264 can be configured to the first end 265 around driving shaft 266.Worm gear 264 can be coupled to worm-drive 262 and be adapted to and the rotary motion of worm-drive 262 is moved to driving shaft 266.Spur gear 268 can be substantially parallel with the tooth 214 of internal gear 112 below worm gear 264 region 269 place, be configured to around driving shaft 266.The rotary motion of driving shaft 266 can be moved to internal gear 112 by spur gear 268.Therefore, retaining ring assembly 104 can be rotated independent of the rotation of head group part 102.
Shaft encoder 270 can be arranged on below the spur gear 268 on driving shaft 266.Shaft encoder 270 (such as electromechanical equipment) can convert the rotary motion of driving shaft 266 to analog encoding or digital coding.Shaft encoder 270 can be coupled to controller (not shown), and this controller can be coupled to actuator 260.This controller can be adapted to the rotary speed controlling retaining ring 104 and rotate relative to head group part 102.
Casing assembly 280 can be arranged on carrying main body 208 a part in and can be adapted to receive driving shaft 266.Casing assembly 280 can have bottom 286 and several sidewall 282.Second end 267 of driving shaft 266 can be arranged in casing assembly 280.Several bearing 284 also can be arranged in casing assembly 280.This several bearing 284 can be arranged between the sidewall 282 of casing assembly 280 and driving shaft 266.Driving shaft 266 can be coupled to casing assembly 280 and allow driving shaft 266 relative to the rotary motion of casing assembly 280 by this several bearing 284.
In certain embodiments, can drive retaining ring assembly 104 by a speed, this speed is greater than the rotary speed of rotatable head assembly 102.For example, during 60 seconds CMP glossings, can by the speed swivel head assembly 102 reaching about 60rpm to about 120rpm.In this example, the rotary speed of retaining ring assembly 104 can be greater than the rotary speed of rubbing head, and this can promote substrate precession.Can rotate on the identical rightabout of the direction of rotation relative to head group part 102 it is conceivable that retaining ring assembly 104.In addition, substrate precession can by polishing substrate 201 against the direction of rotation of polishing pad affect.
Fig. 3 is the schematic, bottom view of retaining ring assembly 104 and substrate 201.The internal diameter of retaining ring assembly 104 can be greater than the external diameter of substrate 201.The direction of rotation 306 of retaining ring assembly 104 promotes that substrate 201 rotates 308 relative to head group part (not shown) (such as head group part 102 (see Fig. 2)) in one direction.Substrate 201 can be defined as previously discussed substrate precession relative to the rotation 308 of head group part.
As discussed previously, substrate precession is the rotation relative to the film 250 on head group part 102 or mobility experienced by substrate 201.Believe and promote that substrate precession " on average can be fallen (averageout) " substrate and remove any potential local inhomogeneities in profile on given polishing time.Believe the extremely asymmetric averaging effect caused about the local inhomogeneities in film 250 or polishing pad created by substrate precession.Local inhomogeneities can cause nonplanar remove profile and therefore reduce local inhomogeneities impact can be favourable.
Also believe and can be carried out the precession of regulation substrate by the relation between substrate 201 external diameter and retaining ring assembly 104 internal diameter.According to gear ratio, relation between substrate 201 external diameter and retaining ring assembly 104 internal diameter can be described.Less gear ratio between retaining ring assembly 104 internal diameter and substrate 201 external diameter will cause the substrate precession increased.
The speed drive retaining ring assembly 104 believing the speed being greater than head group part 102 further can promote substrate precession further.In one embodiment, retaining ring assembly 104 internal diameter of the head group part 102 rotary speed combination about 11.852 inches of about 60rpm can provide the substrate precession of about 90 °.In another embodiment, retaining ring assembly 104 internal diameter of the head group part 102 rotary speed combination about 11.852 inches of about 90rpm can provide the substrate precession of about 135 °.In another embodiment, retaining ring assembly 104 internal diameter of the head group part 102 rotary speed combination about 11.852 inches of about 120rpm can provide the substrate precession of about 100 °.The gear ratio of above-described embodiment can be about 0.99654.In the above-described embodiments, the rotary speed corotation that retaining ring assembly 104 can be greater than the rotary speed of head group part 102 turns or despining.
In one embodiment, retaining ring assembly 104 internal diameter of the head group part 102 rotary speed combination about 11.912 inches of about 60rpm can provide the substrate precession of about 180 °.In another embodiment, retaining ring assembly 104 internal diameter of about 90rpm head group part 102 rotary speed combination about 11.912 inches can provide the substrate precession of about 270 °.In another embodiment, retaining ring assembly 104 internal diameter of the head group part 102 rotary speed combination about 11.912 inches of about 120rpm can provide the substrate precession of about 360 °.The gear ratio of above-described embodiment can be about 0.99152.In the above-described embodiments, the rotary speed corotation that retaining ring assembly 104 can be greater than the rotary speed of head group part 102 turns or despining.
Although above for embodiments of the invention, other embodiments of the present invention and further embodiment can be designed when not departing from basic categories of the present invention, and category of the present invention determined by above claim.
Claims (15)
1., for a device for polishing substrate, comprising:
Head group part;
Retaining ring assembly, described retaining ring assembly comprises:
Internal gear; And
Bearing, described bearing is arranged between described head group part and described retaining ring assembly, and wherein said bearing is adapted to and makes described retaining ring assembly and the decoupling zero of described head group part; And
Driven unit, described driven unit is adapted to and described retaining ring assembly is rotated relative to described head group part.
2. device as claimed in claim 1, wherein said head group part comprises further:
Shell;
Carrying main body; And
Flexible membrane.
3. device as claimed in claim 1, wherein said head group part comprises the cover plate being coupled to described driven unit further.
4. device as claimed in claim 1, described device comprises further:
Transmission device, described transmission device comprises:
First gear;
Second gear;
Shaft encoder; And
Driving shaft.
5. device as claimed in claim 4, wherein said first gear is rotatably coupled to described driven unit.
6. device as claimed in claim 4, wherein said second gear is rotatably coupled to described internal gear.
7. device as claimed in claim 4, wherein said first gear and described second gear are coupled to described driving shaft.
8. device as claimed in claim 1, wherein said driven unit comprises:
Actuator;
Main shaft, described main shaft is coupled to described actuator; And
Worm-drive, described worm-drive is coupled to described main shaft.
9. device as claimed in claim 8, wherein said actuator is air motor.
10. device as claimed in claim 1, wherein said internal gear comprises several tooth.
11. devices as claimed in claim 1, the internal diameter of wherein said retaining ring assembly is between about 11.830 inches and about 11.870 inches.
12. devices as claimed in claim 1, the internal diameter of wherein said retaining ring assembly is between about 11.890 inches and about 11.950 inches.
13. 1 kinds, for the retaining ring assembly of rubbing head, comprising:
Retaining ring, described retaining ring has upper annular portion and divides and lower annular section;
Load-carrying ring, described load-carrying ring is coupled to described upper annular portion and divides;
Bearing holder, described bearing holder is coupled to described load-carrying ring, and described bearing holder is adapted to reception bearing; And
Internal gear, described internal gear is coupled to described bearing holder.
14. devices as claimed in claim 13, wherein said bearing makes described retaining ring assembly and the decoupling zero of rubbing head assembly.
15. 1 kinds of methods operating burnishing device, comprising:
There is provided rubbing head assembly and retaining ring assembly, wherein said retaining ring assembly and the decoupling zero of described rubbing head assembly;
Described rubbing head is rotated with First Speed; And
Described retaining ring assembly is rotated with the second speed being greater than described First Speed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/827,629 US20140273756A1 (en) | 2013-03-14 | 2013-03-14 | Substrate precession mechanism for cmp polishing head |
| US13/827,629 | 2013-03-14 | ||
| PCT/US2014/018069 WO2014158548A1 (en) | 2013-03-14 | 2014-02-24 | Substrate precession mechanism for cmp polishing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105190845A true CN105190845A (en) | 2015-12-23 |
| CN105190845B CN105190845B (en) | 2019-02-22 |
Family
ID=51529186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480014938.7A Active CN105190845B (en) | 2013-03-14 | 2014-02-24 | Substrate precession mechanism for CMP planarization head |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20140273756A1 (en) |
| JP (1) | JP6581964B2 (en) |
| KR (1) | KR102243725B1 (en) |
| CN (1) | CN105190845B (en) |
| TW (1) | TWI617393B (en) |
| WO (1) | WO2014158548A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014163735A1 (en) * | 2013-03-13 | 2014-10-09 | Applied Materials, Inc. | Reinforcement ring for carrier head |
| US20140273756A1 (en) * | 2013-03-14 | 2014-09-18 | Chih Hung Chen | Substrate precession mechanism for cmp polishing head |
| JP7051332B2 (en) | 2017-08-23 | 2022-04-11 | キヤノン株式会社 | Organic compounds and photoelectric conversion elements |
| KR102459832B1 (en) * | 2017-11-22 | 2022-10-28 | 주식회사 케이씨텍 | Carrier |
| TWI639486B (en) * | 2018-05-31 | 2018-11-01 | 國立清華大學 | Omni-directional integrated conditioner device |
| US11986923B2 (en) | 2020-11-10 | 2024-05-21 | Applied Materials, Inc. | Polishing head with local wafer pressure |
| US20230381917A1 (en) * | 2022-05-27 | 2023-11-30 | Applied Materials, Inc. | Clamping retainer for chemical mechanical polishing |
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-
2013
- 2013-03-14 US US13/827,629 patent/US20140273756A1/en not_active Abandoned
-
2014
- 2014-02-24 KR KR1020157029484A patent/KR102243725B1/en active IP Right Grant
- 2014-02-24 JP JP2016500364A patent/JP6581964B2/en active Active
- 2014-02-24 WO PCT/US2014/018069 patent/WO2014158548A1/en active Application Filing
- 2014-02-24 CN CN201480014938.7A patent/CN105190845B/en active Active
- 2014-03-06 TW TW103107644A patent/TWI617393B/en active
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| US20010039172A1 (en) * | 2000-04-17 | 2001-11-08 | Norio Kimura | Polishing apparatus |
| CN101607381A (en) * | 2000-08-31 | 2009-12-23 | 多平面技术公司 | Chemically mechanical polishing head, equipment and method and planarized semiconductor wafer |
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| KR20100096647A (en) * | 2009-02-25 | 2010-09-02 | 그린스펙(주) | Carrier head structure for polishing apparatus of silicon bare wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201446417A (en) | 2014-12-16 |
| CN105190845B (en) | 2019-02-22 |
| KR20150132842A (en) | 2015-11-26 |
| TWI617393B (en) | 2018-03-11 |
| WO2014158548A1 (en) | 2014-10-02 |
| JP2016515303A (en) | 2016-05-26 |
| JP6581964B2 (en) | 2019-09-25 |
| US20140273756A1 (en) | 2014-09-18 |
| KR102243725B1 (en) | 2021-04-23 |
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