CN105177585A - High-smoothness metal surface preparation method based on chemical plating and polishing technology - Google Patents
High-smoothness metal surface preparation method based on chemical plating and polishing technology Download PDFInfo
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- CN105177585A CN105177585A CN201510679369.4A CN201510679369A CN105177585A CN 105177585 A CN105177585 A CN 105177585A CN 201510679369 A CN201510679369 A CN 201510679369A CN 105177585 A CN105177585 A CN 105177585A
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Abstract
The invention relates to a high-smoothness metal surface preparation method based on a chemical plating and polishing combined technology, and belongs to the technical field of metal surface treatment. The high-smoothness metal surface preparation method comprises the step of polishing by adding chemical plating and polishing complex liquid on a metal surface which is mechanically polished. The high-smoothness metal surface preparation method disclosed by the invention has the beneficial effect that a high-smoothness metal surface can be quickly obtained.
Description
Technical field
The present invention relates to a kind of high metallic surface finish preparation method based on electroless plating polishing recombining process, belong to field of metal surface treatment technology.
Background technology
Existing metal surface polishing technology comprises mechanical polishing, fluid polishing, magnetic grinding and polishing, ultrasonic polishing, chemical rightenning and electropolishing etc.Wherein, mechanical polishing, fluid polishing, magnetic grinding and polishing and ultrasonic polishing are removed metallic surface micro-bulge by friction shear action and are reduced Metal Surface Roughness; In above-mentioned polishing mode, in mechanical polishing, to grind the polishing precision of polishing technology the highest for superfinishing, and Metal Surface Roughness Ra is 0.008 μm, but its shortcoming is that material removing rate is low, polishing efficiency is low.Corrosion reaction is there is in chemical rightenning and electropolishing by chemical brightening solution and metallic surface; the viscous substance generated is attached to metallic surface, hinder chemical reaction, but convex place thickness is thin; recess thickness is thick; therefore, first corrode convex place, recess is protected; improve polishing efficiency; but the roughness that chemical rightenning metallic surface is general reached is 10 μm, the roughness that electrochemical polishing of metal surface reaches is 1 μm, and roughness grade number is low.Require in high engineer applied field at some to metallic surface, such as, when utilizing optical interferometry to measure oil film thickness between test button and glass disc, oil film thickness is tens nanometer to tens nanometers, test button surfaceness, smooth finish, Surface flat, reflectivity etc. all have impact to measuring result, and existing glossing cannot fill up nick place, need to utilize machinery, chemical process removes nick place adjacent material, reach the super mirror status of defect-free surface, not only pay the plenty of time, also to prevent excessive polishing and exposing metal lattice defect, therefore existing glossing cannot complete high-accuracy, the efficient preparation of high metallic surface finish.
Summary of the invention
The present invention is by utilizing the synergy of electroless plating and mechanical polishing, and metal refining simple substance fills up nick place, and the metal simple-substance of the unnecessary deposition in dimpling place is removed in mechanical polishing on one side, solves the problems referred to above.
The invention provides a kind of high metallic surface finish preparation method based on electroless plating polishing recombining process, electroless plating and polishing complex liquid are added on the metallic surface after mechanical polishing to carry out polishing by described preparation method.
Electroless plating of the present invention and polishing complex liquid are preferably the mixed solution of chemical plating solution and nano-polishing particle.
Nano-polishing particle of the present invention is preferably diamond or the aluminium sesquioxide of granularity≤10nm.
The weight ratio of chemical plating solution of the present invention and nano-polishing particle is preferably 1:0.02 ~ 0.05.
Chemical plating solution of the present invention is preferably main salt silver nitrate solution and reductive agent glucose solution, main salt stannous chloride solution and reductive agent Titanium Trichloride Solution or main salt nickel sulfate solution and reductive agent ortho phosphorous acid sodium solution.
The present invention utilizes electroless plating principle, conjunction with mechanical polishing, fills up modification to nick place, the metallic surface defect after mechanical polishing.Electroless plating is an electrochemical process without extra electric field, the electronics reduced in this process required for main salt metallic cation is provided by reductive agent, electroless plating and polishing complex liquid do not react with polished metal surface, because electroless plating and polishing complex liquid are added on the metallic surface after mechanical polishing, electroless plating and polishing complex liquid are stirred in metallic rotary motion, prevent the precipitation of nano-polishing particle, metallic rotary motion simultaneously also impels electroless plating and polishing complex liquid to be wrapped in polished metal surface, because of the katalysis of polished metal surface active atomic, electroless plating and polishing complex liquid generation redox reaction, generate elemental metals, metal and polishing cloth rub simultaneously, and electroless plating and polishing complex liquid there will be transfer transport as even electric layer, and promote that chemical reaction carries out, the metal simple-substance accelerating to separate out constantly deposits to metallic surface, under the mechanical polishing effect of nano-polishing particle, the because of metal friction shear action of dimpling place deposition is thrown away, nick place because of mechanical polishing effect little, and be constantly deposited metal and fill up.
The contact pressure in polishing cloth of the present invention and medal polish face is preferably 40 ~ 200g/cm
2.
Polishing cloth velocity of rotation of the present invention is preferably 30 ~ 90r/min.
Polishing metal of the present invention rotating speed is preferably 600 ~ 1500r/min.
Polish temperature of the present invention is preferably 20 ~ 80 DEG C.
Preparation method of the present invention preferably comprises the steps:
Rough polishing: adopt emery wheel by metal surface polishing;
Finishing polish: polishing fluid is added on the metallic surface after rough polishing and carries out polishing;
Electroless plating composite polishing: electroless plating and polishing complex liquid are added on the metallic surface after finishing polish and carry out polishing.
Rough polishing step of the present invention more preferably adopts the diamond plastic cement emery wheel of granularity≤300nm by 20 ~ 50 DEG C, metallic surface polishing 3 ~ 5min, continue to drip distilled water, the contact pressure 100 ~ 300g/cm in described diamond plastic cement emery wheel and medal polish face to contact surface during polishing
2, metal rotating speed is 600 ~ 1500r/min.
The colloid diamond polishing liquid of pH value 8 ~ 14, concentration 10 ~ 50wt%, granularity 10 ~ 300nm is more preferably added on the metallic surface after rough polishing and adopts polishing cloth to carry out by volume particle size colloid diamond polishing liquid to small grain size colloid diamond polishing liquid segmentation polishing by finishing polish step of the present invention, each section of 20 ~ 50 DEG C of polishing 5 ~ 15min, the contact pressure 50 ~ 200g/cm in described polishing cloth and medal polish face
2, described polishing cloth velocity of rotation is 30 ~ 90r/min, cleaning.
Polishing cloth of the present invention is preferably real silk suede polishing cloth, synthetic leather polishing cloth or polyurethane polishing cloth.
Beneficial effect of the present invention is to obtain high bright and clean metallic surface fast.
Embodiment
Following non-limiting example can make the present invention of those of ordinary skill in the art's comprehend, but does not limit the present invention in any way.
Embodiment 1
Based on a high metallic surface finish preparation method for electroless plating polishing recombining process, described preparation method comprises the steps:
Rough polishing: adopt granularity be the diamond plastic cement emery wheel of 300nm by 30 DEG C, metallic surface polishing 4min, during polishing to contact surface continue drip distilled water, the contact pressure 300g/cm in described diamond plastic cement emery wheel and medal polish face
2, metal rotating speed is 1500r/min;
Finishing polish: first the colloid diamond polishing liquid of pH value 8, concentration 30wt%, granularity 250nm is added on the metallic surface after rough polishing, adopt real silk suede polishing cloth to carry out 30 DEG C of polishing 10min, the contact pressure in described real silk suede polishing cloth and medal polish face is 200g/cm
2, described real silk suede polishing cloth velocity of rotation is 1500r/min; Being added in by the colloid diamond polishing liquid of pH value 8, concentration 30wt%, granularity 100nm on the metallic surface after rough polishing adopts real silk suede polishing cloth to carry out 30 DEG C of polishing 10min again, and the contact pressure in described real silk suede polishing cloth and medal polish face is 150g/cm
2, described real silk suede polishing cloth velocity of rotation is 1000r/min; Then being added in by the colloid diamond polishing liquid of pH value 8, concentration 30wt%, granularity 50nm on the metallic surface after rough polishing adopts real silk suede polishing cloth to carry out 30 DEG C of polishing 10min, and the contact pressure in described real silk suede polishing cloth and medal polish face is 100g/cm
2, described real silk suede polishing cloth velocity of rotation is 800r/min; Finally 3wt% sodium hydroxide solution, dehydrated alcohol, distilled water is adopted to clean respectively on the metal after polishing;
Electroless plating composite polishing: be drip chemical plating solution and granularity on the metallic surface after finishing polish after 10nm diamond nano polishing particles mixes, utilize real silk suede polishing cloth 25 DEG C of polishing 10min, its chemical equation is:
nAg
++C
6H
12O
6+3/2nOH
-→nAg+1/2RCOO
-+nH
2O
The contact pressure of described real silk suede polishing cloth and polished metal surface is 40g/cm
2, described real silk suede polishing cloth velocity of rotation is 60r/min, and described polishing metal rotating speed is 600r/min;
Described chemical plating solution comprises the main salt silver nitrate solution of electroless plating, electroless plating reductive agent glucose solution;
The preparation method of described electroless plating main salt silver nitrate solution is: by main for 3.5g salt AgNO
3be dissolved in 60mL deionized water, stir and add ammoniacal liquor, dissolve to the black precipitate generated, solution is clarified, and adds 1.6gNaOH solid, adds ammoniacal liquor again after mixing, clarify to solution;
The preparation method of described electroless plating reductive agent glucose solution is: be dissolved in 50mL deionized water by 2.25g reductive agent glucose, after adding 5mL anhydrous alcohol solution, then adds 0.2g concentrated nitric acid, boils and boil 15min;
The preparation method of described chemical plating solution is: by main for electroless plating salt silver nitrate solution and electroless plating reductive agent glucose solution by volume 1:1 mix;
Described chemical plating solution and granularity are the weight ratio of 10nm diamond nano polishing particles is 1:0.04.
Before polishing, adopting TR200 type roughmeter to record polished Metal Surface Roughness Ra is 0.14 μm, after polishing, and Metal Surface Roughness Ra is≤0.008 μm, and at metallography microscope Microscopic observation, nick place is filled up, the bright and clean zero defect in metallic surface; During for interference of light oil film thickness survey meter, interference of light image uniform, without cutting off, zero defect, meets specification of quality.
Embodiment 2
Based on a high metallic surface finish preparation method for electroless plating polishing recombining process, and being distinguished as of embodiment 1:
Electroless plating composite polishing: be drip on the metallic surface after finishing polish after 10nm diamond nano polishing particles mixes to utilize real silk suede polishing cloth to carry out 80 DEG C of polishing 10min by chemical plating solution and granularity, its chemical equation is:
Sn
2++Ti
3+→Sn+Ti
4+
The contact pressure of described real silk suede polishing cloth and polished metal surface is 40g/cm
2, described real silk suede polishing cloth velocity of rotation is 60r/min, and described polishing metal rotating speed is 600r/min;
The preparation method of described chemical plating solution is: main for 1.5g salt tin protochloride is dissolved in 20mL deionized water, 10.2g Trisodium Citrate is dissolved in 20mL deionized water, 3gEDTA2Na is dissolved in 10mL deionized water, 4g nitrilotriacetic acid is dissolved in 10mL deionized water, 0.6g reductive agent titanous chloride is dissolved in 10mL deionized water, sodium citrate solution, EDTA2Na solution, nitrilotriacetic acid solution are joined in stannous chloride solution and adds stannous chloride solution again after mixing, mixing, be diluted to 100mL, dripping ammoniacal liquor to pH value is 9;
Described chemical plating solution and granularity are the weight ratio of 10nm diamond nano polishing particles is 1:0.04.
Embodiment 3
Based on a high metallic surface finish preparation method for electroless plating polishing recombining process, and being distinguished as of embodiment 1:
Electroless plating composite polishing: be drip on the metallic surface after finishing polish after 10nm diamond nano polishing particles mixes to utilize real silk suede polishing cloth to carry out 40 DEG C of polishing 10min by chemical plating solution and granularity, the contact pressure of described real silk suede polishing cloth and polished metal surface is 40g/cm
2, described real silk suede polishing cloth velocity of rotation is 60r/min, and described polishing metal rotating speed is 600r/min;
The preparation method of described chemical plating solution is: the main salt single nickel salt of 2g is dissolved in 20mL deionized water, 2g reductive agent inferior sodium phosphate is dissolved in 20mL deionized water, 2g coordination agent Trisodium Citrate is dissolved in 10mL deionized water, nickel sulfate solution is joined in sodium citrate solution and add ortho phosphorous acid sodium solution again after mixing, mixing, be diluted to 100mL, dripping ammoniacal liquor to pH value is 9;
Described chemical plating solution and granularity are the weight ratio of 10nm diamond nano polishing particles is 1:0.04.
The above; be only the present invention's preferably embodiment; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to according to technical scheme of the present invention and inventive concept thereof and replace or change, all should be encompassed within protection scope of the present invention.
Claims (10)
1. based on a high metallic surface finish preparation method for electroless plating polishing recombining process, it is characterized in that: electroless plating and polishing complex liquid are added on the metallic surface after mechanical polishing to carry out polishing by described preparation method.
2. preparation method according to claim 1, is characterized in that: described electroless plating and polishing complex liquid are the mixed solution of chemical plating solution and nano-polishing particle.
3. preparation method according to claim 2, is characterized in that: described nano-polishing particle is diamond or the aluminium sesquioxide of granularity≤10nm.
4. preparation method according to claim 2, is characterized in that: the weight ratio of described chemical plating solution and nano-polishing particle is 1:0.02 ~ 0.05.
5. preparation method according to claim 2, is characterized in that: described chemical plating solution is main salt silver nitrate solution and reductive agent glucose solution, main salt stannous chloride solution and reductive agent Titanium Trichloride Solution or main salt nickel sulfate solution and reductive agent ortho phosphorous acid sodium solution.
6. preparation method according to claim 1, is characterized in that: the contact pressure in polishing cloth and medal polish face is 40 ~ 200g/cm
2.
7. preparation method according to claim 1, is characterized in that: polishing cloth velocity of rotation is 30 ~ 90r/min.
8. preparation method according to claim 1, is characterized in that: described polishing metal rotating speed is 600 ~ 1500r/min.
9. preparation method according to claim 1, is characterized in that: polish temperature is 20 ~ 80 DEG C.
10. preparation method according to claim 1, is characterized in that: described preparation method comprises the steps:
Rough polishing: adopt emery wheel by metal surface polishing;
Finishing polish: polishing fluid is added on the metallic surface after rough polishing and carries out polishing;
Electroless plating composite polishing: electroless plating and polishing complex liquid are added on the metallic surface after finishing polish and carry out polishing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510679369.4A CN105177585A (en) | 2015-10-19 | 2015-10-19 | High-smoothness metal surface preparation method based on chemical plating and polishing technology |
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|---|---|---|---|
| CN201510679369.4A CN105177585A (en) | 2015-10-19 | 2015-10-19 | High-smoothness metal surface preparation method based on chemical plating and polishing technology |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108161581A (en) * | 2017-12-25 | 2018-06-15 | 大连三生科技发展有限公司 | A kind of method of dental implant surface polishing |
| CN108247471A (en) * | 2018-02-02 | 2018-07-06 | 成都精密光学工程研究中心 | A kind of optical element surface mist spot restorative procedure |
| CN109415598A (en) * | 2016-06-27 | 2019-03-01 | 三星Sdi株式会社 | Slurry composition for CMP and polishing method for metal film |
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|---|---|---|---|---|
| US4270932A (en) * | 1978-04-24 | 1981-06-02 | H.L.P. Imports Ltd. | Polishing of silver-plated articles |
| GB8703664D0 (en) * | 1987-02-17 | 1987-03-25 | Green A | Electroless silver plating composition |
| CN1718859A (en) * | 2005-07-07 | 2006-01-11 | 浙江大学 | Acidic chemical nickel plating composite brightening agent and its use method |
| CN103192322A (en) * | 2012-01-06 | 2013-07-10 | 信越化学工业株式会社 | Dressing and manufacture of outer blade cutting wheel |
| CN103243360A (en) * | 2012-02-13 | 2013-08-14 | 南车戚墅堰机车车辆工艺研究所有限公司 | Zn-Ni alloy brush plating solution and brush plating method |
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2015
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Patent Citations (5)
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|---|---|---|---|---|
| US4270932A (en) * | 1978-04-24 | 1981-06-02 | H.L.P. Imports Ltd. | Polishing of silver-plated articles |
| GB8703664D0 (en) * | 1987-02-17 | 1987-03-25 | Green A | Electroless silver plating composition |
| CN1718859A (en) * | 2005-07-07 | 2006-01-11 | 浙江大学 | Acidic chemical nickel plating composite brightening agent and its use method |
| CN103192322A (en) * | 2012-01-06 | 2013-07-10 | 信越化学工业株式会社 | Dressing and manufacture of outer blade cutting wheel |
| CN103243360A (en) * | 2012-02-13 | 2013-08-14 | 南车戚墅堰机车车辆工艺研究所有限公司 | Zn-Ni alloy brush plating solution and brush plating method |
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|---|
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109415598A (en) * | 2016-06-27 | 2019-03-01 | 三星Sdi株式会社 | Slurry composition for CMP and polishing method for metal film |
| CN109415598B (en) * | 2016-06-27 | 2021-10-22 | 三星Sdi株式会社 | CMP slurry composition for metal film and polishing method |
| CN108161581A (en) * | 2017-12-25 | 2018-06-15 | 大连三生科技发展有限公司 | A kind of method of dental implant surface polishing |
| CN108247471A (en) * | 2018-02-02 | 2018-07-06 | 成都精密光学工程研究中心 | A kind of optical element surface mist spot restorative procedure |
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Application publication date: 20151223 |