CN105176463B - A kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property - Google Patents
A kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property Download PDFInfo
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- CN105176463B CN105176463B CN201510491398.8A CN201510491398A CN105176463B CN 105176463 B CN105176463 B CN 105176463B CN 201510491398 A CN201510491398 A CN 201510491398A CN 105176463 B CN105176463 B CN 105176463B
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- 229920000647 polyepoxide Polymers 0.000 claims abstract description 44
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 39
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 30
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 29
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 238000009413 insulation Methods 0.000 claims abstract description 25
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 239000004593 Epoxy Substances 0.000 claims abstract description 19
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 19
- 239000011230 binding agent Substances 0.000 claims abstract description 14
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000007822 coupling agent Substances 0.000 claims abstract description 13
- 229920001971 elastomer Polymers 0.000 claims abstract description 13
- 229920001021 polysulfide Polymers 0.000 claims abstract description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 11
- -1 hydroxy group imine Chemical group 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 10
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000839 emulsion Substances 0.000 claims abstract description 8
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 57
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 30
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 28
- 238000010792 warming Methods 0.000 claims description 27
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 26
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 15
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 15
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 14
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 14
- 230000018044 dehydration Effects 0.000 claims description 14
- 238000006297 dehydration reaction Methods 0.000 claims description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 13
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 244000226021 Anacardium occidentale Species 0.000 claims description 8
- 235000020226 cashew nut Nutrition 0.000 claims description 8
- 239000003921 oil Substances 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- NIXKBAZVOQAHGC-UHFFFAOYSA-N phenylmethanesulfonic acid Chemical compound OS(=O)(=O)CC1=CC=CC=C1 NIXKBAZVOQAHGC-UHFFFAOYSA-N 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 claims description 4
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 150000002926 oxygen Chemical class 0.000 claims 1
- VDGJOQCBCPGFFD-UHFFFAOYSA-N oxygen(2-) silicon(4+) titanium(4+) Chemical compound [Si+4].[O-2].[O-2].[Ti+4] VDGJOQCBCPGFFD-UHFFFAOYSA-N 0.000 claims 1
- FWVCSXWHVOOTFJ-UHFFFAOYSA-N 1-(2-chloroethylsulfanyl)-2-[2-(2-chloroethylsulfanyl)ethoxy]ethane Chemical compound ClCCSCCOCCSCCCl FWVCSXWHVOOTFJ-UHFFFAOYSA-N 0.000 abstract 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 9
- 239000003292 glue Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910003978 SiClx Inorganic materials 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000002783 friction material Substances 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
Abstract
The invention discloses a kind of wallboard of the heat-resistant bonded good excellent in mechanical performance of property, including basic unit, tack coat, heat-insulation layer, decorative mortar layer, fireprotection layer, waterproof layer, emulsion layer, decorative coveringn and the wearing layer set gradually from the inside to the outside；Wherein tack coat is epoxies binding agent；The raw material of epoxies binding agent includes 20 30 parts of first components, 13 parts of second components by weight；First component includes by weight：711 30 40 parts of epoxy resin, 5 10 parts of glycidol formaldehyde epoxy resin, 20 30 parts of terminal hydroxy group imine intermediate, 124 10 20 parts of liquid polysulphide rubber JLY, 5 10 parts of phenol-formaldehyde resin modified, 45 50 parts of basalt powder, 15 parts of nano silicon, 28 parts of nano titanium oxide, 5 10 parts of toluene；Second component includes by weight：550 12 parts of 31 10 15 parts of curing agent T, coupling agent KH, 30 0.5 1 parts of altax P.
Description
Technical field
The present invention relates to wallboard technical field, more particularly to a kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property.
Background technology
In recent years, wallboard industry is developed rapidly.Increasing field all refers to wallboard, such as in building, electricity
The application popularization of the industrial departments such as sub- electrical equipment, timber processing, wallboard turn into the indispensable important materials of modern industrial society,
Improved constantly now with requirement of the wallboard to binding material performance, the good wallboard of attractive and durable and adhesive property, which is increasingly becoming, to be ground
The main body studied carefully, tack coat made of pure epoxies binding agent, product caking property, heat resistance and mechanical property do not reach special feelings
The requirement of condition.
The content of the invention
Based on technical problem existing for background technology, the present invention proposes a kind of good excellent in mechanical performance of heat-resistant bonded property
Wallboard, caking property and heat-resist, excellent in mechanical performance.
A kind of wallboard of heat-resistant bonded good excellent in mechanical performance of property proposed by the present invention, including set gradually from the inside to the outside
Basic unit, tack coat, heat-insulation layer, decorative mortar layer, fireprotection layer, waterproof layer, emulsion layer, decorative coveringn and wearing layer；Wherein bond
Layer is epoxies binding agent；
The raw material of the epoxies binding agent includes 20-30 part first components, 1-3 part second components by weight；
The first component includes by weight：711 epoxy resin 30-40 parts, glycidol formaldehyde epoxy resin 5-10 parts, end
Hydroxyl imide intermediate 20-30 parts, toughener liquid polysulphide rubber JLY-124 10-20 parts, phenol-formaldehyde resin modified 5-10 parts are profound
Military rock dust end 45-50 parts, nano silicon 1-5 parts, nano titanium oxide 2-8 parts, toluene 5-10 parts；
The second component includes by weight：Curing agent T-31 10-15 parts, coupling agent KH-550 1-2 parts, accelerator
DMP-30 0.5-1 parts.
Preferably, the particle diameter of the nano silicon is 5-30nm, and wherein 5-12nm nano silicon accounts for 20-
40wt%, 12-25nm nano silicon account for 30-40wt%, and remaining is 25-30nm nano silicon.
Preferably, first component and the weight ratio of second component are 24-26：2-2.4.
Preferably, 711 epoxy resin, glycidol formaldehyde epoxy resin, terminal hydroxy group imine intermediate, liquid polysulphide rubber
The weight of JLY-124 and phenol-formaldehyde resin modified ratio is 6-8：6-8：24-26：14-16：32-36.
Preferably, the weight ratio of basalt powder, nano silicon and nano titanium oxide is 46-48：2-4：4-6.
Preferably, curing agent T-31, coupling agent KH-550 and altax P-30 weight ratio are 12-14：1.4-1.6：
0.6-0.8。
Preferably, the raw material of the epoxies binding agent includes 24-26 part first components, 2-2.4 part second components by weight；
The first component includes by weight：711 epoxy resin 32-36 parts, glycidol formaldehyde epoxy resin 6-8 parts, end
Hydroxyl imide intermediate 24-26 parts, liquid polysulphide rubber JLY-124 14-16 parts, phenol-formaldehyde resin modified 6-8 parts, basalt powder
Last 46-48 parts, nano silicon 2-4 parts, nano titanium oxide 4-6 parts, toluene 6-8 parts；
The second component includes by weight：Curing agent T-31 12-14 parts, coupling agent KH-550 1.4-1.6 parts, promote
Agent DMP-30 0.6-0.8 parts.
Preferably, the phenol-formaldehyde resin modified is prepared using following technique：
S1, by weight by 50-80 parts cashew nut shell oil, 40-50 parts phenol, 4-6 parts molybdic acid, 1-2 parts sodium hydroxide and 10-
15 parts of water are added in agitator and stirred, and wherein mixing speed is 300-800r/min, and whipping temp is 65-70 DEG C, during stirring
Between be 30-60min；
S2, to S1 obtain adding 0.1-0.5 parts in material to benzene methanesulfonic acid, material is continued with 1-2 DEG C/min speed
80-86 DEG C is warming up to, is incubated 40-50min, 1-5 part imidazole type polyoxyalkylene nonionic liquid insulating 5-15min is added, continuously adds
0.2-0.5 part triethanolamines, material is warming up to 90-95 DEG C with 0.5-1 DEG C/min speed, 10-20min is incubated, with 1-3
DEG C/min speed is cooled to room temperature；
5-10 parts formaldehyde, 0.2-0.5 parts triethylamine and 1-3 part ammoniacal liquor are added in S3, the material obtained to S2, by material with
1-2 DEG C/min speed is warming up to 70-75 DEG C of insulation 20-30min；
It is molten that 20-28 parts formaldehyde, 0.2-0.4 parts sulfuric acid solution and 0.5-0.8 part phosphoric acid are added in S4, the material obtained to S3
The mass concentration of liquid, wherein sulfuric acid solution is 80-86%, and the mass concentration of phosphoric acid solution is 70-76%, will under stirring
Material is cooled to 80-86 DEG C from room temperature to 70-80 DEG C, back flow reaction 40-50min, adds 0.5-0.8 part sodium hydroxides
It is stirred with 2-2.4 part barium sulfate, mixing time 40-60min, temperature is warming up to 96- with 1-3 DEG C/min speed
100 DEG C of insulation 10-20min；
S5, the material for obtaining S4 are cooled to 80-85 DEG C of vacuum dehydration 30-40min, vacuum 0.5-0.8MPa, after
It is continuous to be warming up to 100-110 DEG C, vacuum dehydration 40-60min, vacuum 0.2-0.4MPa, 120-125 DEG C is warming up to, is incubated 5-
10min, it is 500-520mPas to add ethanol regulation material viscosity, is cooled to 45-50 DEG C, adds 1-2 part LNBRs
And 5-10 parts methanol insulation 10-20min, obtain phenol-formaldehyde resin modified.
Preferably, added in S4, in the material obtained to S3 24-26 parts formaldehyde, 0.3-0.35 parts sulfuric acid solution and
0.6-0.7 part phosphoric acid solutions, the wherein mass concentration of sulfuric acid solution are 82-84%, and the mass concentration of phosphoric acid solution is 72-
74%, material back flow reaction 42-46min, is cooled to 82-84 DEG C, added from room temperature to 74-76 DEG C under stirring
Enter 0.6-0.74 parts sodium hydroxide to be stirred with 2.1-2.2 part barium sulfate, mixing time 50-56min, by temperature with 2-
2.5 DEG C/min speed is warming up to 97-98 DEG C of insulation 14-16min.
Preferably, in S5, the material that S4 is obtained is cooled to 82-84 DEG C of vacuum dehydration 32-34min, and vacuum is
0.6-0.7MPa, 105-108 DEG C is continuously heating to, vacuum dehydration 50-54min, vacuum 0.3-0.36MPa, is warming up to
122-124 DEG C, 6-8min is incubated, it is 505-510mPas to add ethanol regulation material viscosity, is cooled to 46-48 DEG C, adds
1.2-1.4 parts LNBR and 6-8 parts methanol insulation 14-16min, obtain phenol-formaldehyde resin modified.
In the present invention, 711 epoxy resin, glycidol formaldehyde epoxy resin, phenol-formaldehyde resin modified synergy, and use end
Hydroxyl imide intermediate and liquid polysulphide rubber JLY-124 coordination plasticizings, curing agent T-31 is as curing agent, altax P-30
As accelerator, coupling agent KH-550 carries out storeroom coupling, is interacted by each active group of storeroom, product is not only resistance to
Hot good, adhesive property is excellent, and mechanical property is good, and in phenol-formaldehyde resin modified, cashew nut shell oil primary structure is band one in meta
The monoene of individual 15 carbon or the phenol of diolefin long-chain, the feature of its existing phenolic compound, there is the flexibility of aliphatic compound again,
Internal plasticization can be played, improves the toughness of phenolic resin, when exposed to external forces, surface, which forms charing film, has toughness, is not easy to make
Tack coat comes off, but the aliphatic side chainses of cashew nut shell oil have certain influence on heat resistance, by the way that cashew nut shell oil and molybdic acid are matched somebody with somebody into cooperation
With product heat resistance can be significantly increased, and heat resistance is extremely excellent, by adding molybdic acid, can improve the heat resistance of material, especially
It is instantaneous resistance to elevated temperatures, and heat decomposition temperature is better than ammonia phenolic aldehyde, barium phenolic aldehyde up to 550 DEG C, and its charring rate is also high, with tree
The increase of molybdenum content in fat, resin heat decomposition temperature improve, and can be used as high-temperature ablative material, friction material and adhesive etc., miaow
Azoles type polyoxyalkylene nonionic liquid not only has coupled action between unclassified stores, and itself has solidification, and comprehensive function can
Significantly improve the mechanical property and hot property of phenol-formaldehyde resin modified because its ionic liquid carries active end group, can with major ingredient it
Between form stable conjugated structure, significantly increase product adhesion strength.
The present invention has good cohesive force, and heat-resist, bonding strength reaches 7.5MPa, than unmodified Wear Characteristics of Epoxy Adhesive
Agent improves more than 620%.
Brief description of the drawings
Fig. 1 is the preparation technology flow chart of phenol-formaldehyde resin modified proposed by the present invention.
Embodiment
As shown in figure 1, Fig. 1 is the preparation technology flow chart of phenol-formaldehyde resin modified proposed by the present invention.
Below, technical scheme is described in detail by specific embodiment.
Embodiment 1
A kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property, including set gradually from the inside to the outside basic unit, tack coat,
Heat-insulation layer, decorative mortar layer, fireprotection layer, waterproof layer, emulsion layer, decorative coveringn and wearing layer；Wherein tack coat glues for epoxies
Tie agent；
The raw material of the epoxies binding agent includes 20 parts of first components, 3 parts of second components by weight；
The first component includes by weight：711 30 parts of epoxy resin, 10 parts of glycidol formaldehyde epoxy resin, terminal hydroxy group
20 parts of imine intermediate, 20 parts of liquid polysulphide rubber JLY-124,5 parts of phenol-formaldehyde resin modified, 50 parts of basalt powder, nanometer two
1 part of silica, 8 parts of nano titanium oxide, 5 parts of toluene；
The second component includes by weight：1 part of 15 parts of curing agent T-31, coupling agent KH-550, altax P-301
Part.
Embodiment 2
A kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property, including set gradually from the inside to the outside basic unit, tack coat,
Heat-insulation layer, decorative mortar layer, fireprotection layer, waterproof layer, emulsion layer, decorative coveringn and wearing layer；Wherein tack coat glues for epoxies
Tie agent；
The raw material of the epoxies binding agent includes 30 parts of first components, 1 part of second component by weight；
The first component includes by weight：711 40 parts of epoxy resin, 5 parts of glycidol formaldehyde epoxy resin, terminal hydroxy group are sub-
30 parts of amine intermediate, 10 parts of liquid polysulphide rubber JLY-124,10 parts of phenol-formaldehyde resin modified, 45 parts of basalt powder, nanometer two
5 parts of silica, 2 parts of nano titanium oxide, 10 parts of toluene；
The second component includes by weight：2 parts of 10 parts of curing agent T-31, coupling agent KH-550, altax P-
300.5 part.
Embodiment 3
A kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property, including set gradually from the inside to the outside basic unit, tack coat,
Heat-insulation layer, decorative mortar layer, fireprotection layer, waterproof layer, emulsion layer, decorative coveringn and wearing layer；Wherein tack coat glues for epoxies
Tie agent；
The raw material of the epoxies binding agent includes 26 parts of first components, 2 parts of second components by weight；
The first component includes by weight：711 36 parts of epoxy resin, 6 parts of glycidol formaldehyde epoxy resin, terminal hydroxy group are sub-
26 parts of amine intermediate, 14 parts of liquid polysulphide rubber JLY-124,8 parts of phenol-formaldehyde resin modified, 46 parts of basalt powder, nano-silica
4 parts of SiClx, 4 parts of nano titanium oxide, 8 parts of toluene；
The second component includes by weight：1.6 parts of 12 parts of curing agent T-31, coupling agent KH-550, altax P-
300.6 part.
The particle diameter of the nano silicon is 5-30nm, and wherein 5-12nm nano silicon accounts for 40wt%, 12-
25nm nano silicon accounts for 30wt%, and remaining is 25-30nm nano silicon.
Reference picture 1, phenol-formaldehyde resin modified proposed by the present invention are prepared using following technique：
S1,80 parts of cashew nut shell oils, 40 parts of phenol, 6 parts of molybdic acids, 1 part of sodium hydroxide and 15 parts of water are added to by weight
Stirred in agitator, wherein mixing speed is 300r/min, and whipping temp is 70 DEG C, mixing time 30min；
S2, to S1 obtain in material add 0.5 part to benzene methanesulfonic acid, material is continuously heating to 1 DEG C/min speed
86 DEG C, 40min is incubated, 5 parts of imidazole type polyoxyalkylene nonionic liquid insulating 5min is added, 0.5 part of triethanolamine is continuously added, by material
95 DEG C are warming up to 0.5 DEG C/min speed, 10min is incubated, room temperature is cooled to 3 DEG C/min speed；
5 parts of formaldehyde, 0.5 part of triethylamine and 1 part of ammoniacal liquor are added in S3, the material obtained to S2, by material with 2 DEG C/min's
Speed is warming up to 70 DEG C of insulation 30min；
20 parts of formaldehyde, 0.4 part of sulfuric acid solution and 0.5 part of phosphoric acid solution, wherein sulfuric acid are added in S4, the material obtained to S3
The mass concentration of solution is 86%, and the mass concentration of phosphoric acid solution is 70%, under stirring by material from room temperature to
80 DEG C, back flow reaction 40min, 86 DEG C are cooled to, 0.5 part of sodium hydroxide is added and is stirred with 2.4 parts of barium sulfate, mixing time
For 40min, temperature is warming up to 96 DEG C of insulation 20min with 3 DEG C/min speed；
S5, the material for obtaining S4 are cooled to 80 DEG C of vacuum dehydration 40min, vacuum 0.5MPa, are continuously heating to 110
DEG C, vacuum dehydration 40min, vacuum 0.4MPa, 120 DEG C are warming up to, are incubated 10min, adding ethanol regulation material viscosity is
500mPas, 50 DEG C are cooled to, add 1 part of LNBR and 10 parts of methanol insulation 10min, obtain phenol-formaldehyde resin modified.
Embodiment 4
A kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property, including set gradually from the inside to the outside basic unit, tack coat,
Heat-insulation layer, decorative mortar layer, fireprotection layer, waterproof layer, emulsion layer, decorative coveringn and wearing layer；Wherein tack coat glues for epoxies
Tie agent；
The raw material of the epoxies binding agent includes 24 parts of first components, 2.4 parts of second components by weight；
The first component includes by weight：711 32 parts of epoxy resin, 8 parts of glycidol formaldehyde epoxy resin, terminal hydroxy group are sub-
24 parts of amine intermediate, 16 parts of liquid polysulphide rubber JLY-124,6 parts of phenol-formaldehyde resin modified, 48 parts of basalt powder, nano-silica
2 parts of SiClx, 6 parts of nano titanium oxide, 6 parts of toluene；
The second component includes by weight：1.4 parts of 14 parts of curing agent T-31, coupling agent KH-550, altax P-
300.8 part.
The particle diameter of the nano silicon is 5-30nm, and wherein 5-12nm nano silicon accounts for 20wt%, 12-
25nm nano silicon accounts for 40wt%, and remaining is 25-30nm nano silicon.
The phenol-formaldehyde resin modified is prepared using following technique：
S1,50 parts of cashew nut shell oils, 50 parts of phenol, 4 parts of molybdic acids, 2 parts of sodium hydroxides and 10 parts of water are added to by weight
Stirred in agitator, wherein mixing speed is 800r/min, and whipping temp is 65 DEG C, mixing time 60min；
S2, to S1 obtain in material add 0.1 part to benzene methanesulfonic acid, material is continuously heating to 2 DEG C/min speed
80 DEG C, 50min is incubated, 1 part of imidazole type polyoxyalkylene nonionic liquid insulating 15min is added, 0.2 part of triethanolamine is continuously added, by thing
Material is warming up to 90 DEG C with 1 DEG C/min speed, is incubated 20min, room temperature is cooled to 1 DEG C/min speed；
10 parts of formaldehyde, 0.2 part of triethylamine and 3 parts of ammoniacal liquor are added in S3, the material obtained to S2, by material with 1 DEG C/min
Speed be warming up to 75 DEG C insulation 20min；
28 parts of formaldehyde, 0.2 part of sulfuric acid solution and 0.8 part of phosphoric acid solution, wherein sulfuric acid are added in S4, the material obtained to S3
The mass concentration of solution is 80%, and the mass concentration of phosphoric acid solution is 76%, under stirring by material from room temperature to
70 DEG C, back flow reaction 50min, 80 DEG C are cooled to, 0.8 part of sodium hydroxide is added and is stirred with 2 parts of barium sulfate, mixing time is
60min, temperature is warming up to 100 DEG C of insulation 10min with 1 DEG C/min speed；
S5, the material for obtaining S4 are cooled to 85 DEG C of vacuum dehydration 30min, vacuum 0.8MPa, are continuously heating to 100
DEG C, vacuum dehydration 60min, vacuum 0.2MPa, 125 DEG C are warming up to, are incubated 5min, adding ethanol regulation material viscosity is
520mPas, 45 DEG C are cooled to, add 2 parts of LNBRs and 5 parts of methanol insulation 20min, obtain phenol-formaldehyde resin modified.
Embodiment 5
A kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property, including set gradually from the inside to the outside basic unit, tack coat,
Heat-insulation layer, decorative mortar layer, fireprotection layer, waterproof layer, emulsion layer, decorative coveringn and wearing layer；Wherein tack coat glues for epoxies
Tie agent；
The raw material of the epoxies binding agent includes 25 parts of first components, 2.2 parts of second components by weight；
The first component includes by weight：711 34 parts of epoxy resin, 7 parts of glycidol formaldehyde epoxy resin, terminal hydroxy group are sub-
25 parts of amine intermediate, 15 parts of liquid polysulphide rubber JLY-124,7 parts of phenol-formaldehyde resin modified, 47 parts of basalt powder, nano-silica
3 parts of SiClx, 5 parts of nano titanium oxide, 7 parts of toluene；
The second component includes by weight：1.5 parts of 13 parts of curing agent T-31, coupling agent KH-550, altax P-
300.7 part.
The particle diameter of the nano silicon is 5-30nm, and wherein 5-12nm nano silicon accounts for 30wt%, 12-
25nm nano silicon accounts for 35wt%, and remaining is 25-30nm nano silicon.
The phenol-formaldehyde resin modified is prepared using following technique：
S1,65 parts of cashew nut shell oils, 45 parts of phenol, 5 parts of molybdic acids, 1.3 parts of sodium hydroxides and 12 parts of water are added by weight
Stirred into agitator, wherein mixing speed is 500r/min, and whipping temp is 68 DEG C, mixing time 45min；
S2, to S1 obtain in material add 0.3 part to benzene methanesulfonic acid, material is continued to heat up with 1.2 DEG C/min speed
To 83 DEG C, 45min is incubated, 3 parts of imidazole type polyoxyalkylene nonionic liquid insulating 10min is added, continuously adds 0.3 part of triethanolamine, will
Material is warming up to 92 DEG C with 0.8 DEG C/min speed, is incubated 15min, room temperature is cooled to 2 DEG C/min speed；
8 parts of formaldehyde, 0.3 part of triethylamine and 2 parts of ammoniacal liquor are added in S3, the material obtained to S2, by material with 1.2 DEG C/min
Speed be warming up to 73 DEG C insulation 25min；
25 parts of formaldehyde, 0.33 part of sulfuric acid solution and 0.66 part of phosphoric acid solution, wherein sulphur are added in S4, the material obtained to S3
The mass concentration of acid solution is 83%, and the mass concentration of phosphoric acid solution is 73%, by material from room temperature under stirring
To 75 DEG C, back flow reaction 44min, 83 DEG C are cooled to, 0.7 part of sodium hydroxide is added and is stirred with 2.15 parts of barium sulfate, stirred
Time is 53min, and temperature is warming up into 97.8 DEG C of insulation 15min with 2.2 DEG C/min speed；
S5, the material for obtaining S4 are cooled to 83 DEG C of vacuum dehydration 33min, vacuum 0.66MPa, are continuously heating to
106 DEG C, vacuum dehydration 52min, vacuum 0.35MPa, 123 DEG C are warming up to, is incubated 7min, adds ethanol regulation material viscosity
For 508mPas, 47 DEG C are cooled to, 1.3 parts of LNBRs and 7 parts of methanol insulation 15min is added, obtains modified phenolic resin
Fat.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (9)
1. a kind of wallboard of the good excellent in mechanical performance of heat-resistant bonded property, it is characterised in that including the base set gradually from the inside to the outside
Layer, tack coat, heat-insulation layer, decorative mortar layer, fireprotection layer, waterproof layer, emulsion layer, decorative coveringn and wearing layer；Wherein tack coat
For epoxies binding agent；
The raw material of the epoxies binding agent includes by weight:20-30 part first components, 1-3 part second components；
The first component includes by weight：711 epoxy resin 30-40 parts, glycidol formaldehyde epoxy resin 5-10 parts, terminal hydroxy group
Imine intermediate 20-30 parts, liquid polysulphide rubber JLY-124 10-20 parts, phenol-formaldehyde resin modified 5-10 parts, basalt powder
45-50 parts, nano silicon 1-5 parts, nano titanium oxide 2-8 parts, toluene 5-10 parts；
The second component includes by weight：Curing agent T-31 10-15 parts, coupling agent KH-550 1-2 parts, altax P-30
0.5-1 parts；
The phenol-formaldehyde resin modified is prepared using following technique：
S1, by weight by 50-80 parts cashew nut shell oil, 40-50 parts phenol, 4-6 parts molybdic acid, 1-2 parts sodium hydroxide and 10-15 parts
Water is added in agitator and stirred, and wherein mixing speed is 300-800r/min, and whipping temp is 65-70 DEG C, and mixing time is
30-60min；
S2, to S1 obtain in material add 0.1-0.5 parts to benzene methanesulfonic acid, material is continued to heat up with 1-2 DEG C/min speed
To 80-86 DEG C, 40-50min is incubated, 1-5 part imidazole type polyoxyalkylene nonionic liquid insulating 5-15min is added, continuously adds 0.2-0.5
Part triethanolamine, material is warming up to 90-95 DEG C with 0.5-1 DEG C/min speed, 10-20min is incubated, with 1-3 DEG C/min's
Speed is cooled to room temperature；
5-10 parts formaldehyde, 0.2-0.5 parts triethylamine and 1-3 part ammoniacal liquor are added in S3, the material obtained to S2, by material with 1-2
DEG C/min speed is warming up to 70-75 DEG C of insulation 20-30min；
20-28 parts formaldehyde, 0.2-0.4 parts sulfuric acid solution and 0.5-0.8 part phosphoric acid solutions are added in S4, the material obtained to S3,
Wherein the mass concentration of sulfuric acid solution is 80-86%, and the mass concentration of phosphoric acid solution is 70-76%, by thing under stirring
Material is cooled to 80-86 DEG C from room temperature to 70-80 DEG C, back flow reaction 40-50min, add 0.5-0.8 parts sodium hydroxide with
2-2.4 part barium sulfate is stirred, mixing time 40-60min, and temperature is warming up into 96-100 with 1-3 DEG C/min speed
DEG C insulation 10-20min；
S5, the material for obtaining S4 are cooled to 80-85 DEG C of vacuum dehydration 30-40min, vacuum 0.5-0.8MPa, continue to rise
Temperature is warming up to 120-125 DEG C to 100-110 DEG C, vacuum dehydration 40-60min, vacuum 0.2-0.4MPa, is incubated 5-
10min, it is 500-520mPas to add ethanol regulation material viscosity, is cooled to 45-50 DEG C, adds 1-2 part LNBRs
And 5-10 parts methanol insulation 10-20min, obtain phenol-formaldehyde resin modified.
2. the wallboard of the good excellent in mechanical performance of heat-resistant bonded property according to claim 1, it is characterised in that the nanometer two
The particle diameter of silica is 5-30nm, and wherein 5-12nm nano silicon accounts for 20-40wt%, 12-25nm nanometer titanium dioxide
Silicon accounts for 30-40wt%, and remaining is 25-30nm nano silicon.
3. the wallboard of the good excellent in mechanical performance of heat-resistant bonded property according to claim 1 or 2, it is characterised in that first component
Weight ratio with second component is 24-26：2-2.4.
4. the wallboard of the good excellent in mechanical performance of heat-resistant bonded property according to claim 1 or 2, it is characterised in that 711 epoxies
Resin, glycidol formaldehyde epoxy resin, terminal hydroxy group imine intermediate, liquid polysulphide rubber JLY-124 and phenol-formaldehyde resin modified
Weight ratio is 6-8：6-8：24-26：14-16：32-36.
5. the wallboard of the good excellent in mechanical performance of heat-resistant bonded property according to claim 1 or 2, it is characterised in that basalt
The weight ratio of powder, nano silicon and nano titanium oxide is 46-48：2-4：4-6.
6. the wallboard of the good excellent in mechanical performance of heat-resistant bonded property according to claim 1 or 2, it is characterised in that curing agent
T-31, coupling agent KH-550 and altax P-30 weight ratio are 12-14：1.4-1.6：0.6-0.8.
7. the wallboard of the good excellent in mechanical performance of heat-resistant bonded property according to claim 1 or 2, it is characterised in that the ring
The raw material of oxygen class binding agent includes 24-26 part first components, 2-2.4 part second components by weight；
The first component includes by weight：711 epoxy resin 32-36 parts, glycidol formaldehyde epoxy resin 6-8 parts, terminal hydroxy group
Imine intermediate 24-26 parts, liquid polysulphide rubber JLY-124 14-16 parts, phenol-formaldehyde resin modified 6-8 parts, basalt powder 46-
48 parts, nano silicon 2-4 parts, nano titanium oxide 4-6 parts, toluene 6-8 parts；
The second component includes by weight：Curing agent T-31 12-14 parts, coupling agent KH-550 1.4-1.6 parts, accelerator
DMP-30 0.6-0.8 parts.
8. the wallboard of the good excellent in mechanical performance of heat-resistant bonded property according to claim 1, it is characterised in that in S4, to
24-26 parts formaldehyde, 0.3-0.35 parts sulfuric acid solution and 0.6-0.7 part phosphoric acid solutions, wherein sulfuric acid are added in the material that S3 is obtained
The mass concentration of solution is 82-84%, and the mass concentration of phosphoric acid solution is 72-74%, by material from room temperature under stirring
74-76 DEG C, back flow reaction 42-46min is warming up to, is cooled to 82-84 DEG C, adds 0.6-0.74 parts sodium hydroxide and 2.1-2.2
Part barium sulfate is stirred, and mixing time 50-56min, temperature is warming up into 97-98 DEG C of guarantor with 2-2.5 DEG C/min speed
Warm 14-16min.
9. the wallboard of the good excellent in mechanical performance of heat-resistant bonded property according to claim 1 or 8, it is characterised in that in S5,
The material that S4 is obtained is cooled to 82-84 DEG C of vacuum dehydration 32-34min, vacuum 0.6-0.7MPa, is continuously heating to 105-
108 DEG C, vacuum dehydration 50-54min, vacuum 0.3-0.36MPa, 122-124 DEG C is warming up to, is incubated 6-8min, adds second
Alcohol regulation material viscosity is 505-510mPas, is cooled to 46-48 DEG C, adds 1.2-1.4 parts LNBR and 6-8 parts
Methanol is incubated 14-16min, obtains phenol-formaldehyde resin modified.
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| CN107722898A (en) * | 2017-10-26 | 2018-02-23 | 鹤山市怡信化工厂有限公司 | A kind of composite nano materials modified imide epoxy adhesive |
| CN109575859B (en) * | 2018-11-13 | 2021-02-02 | 武汉市科达云石护理材料有限公司 | Graded curing temperature-resistant epoxy adhesive and preparation method thereof |
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|---|---|---|---|---|
| CN103265926A (en) * | 2013-06-04 | 2013-08-28 | 伍淑华 | Composite nano powder modified imine epoxy adhesive |
| CN203308029U (en) * | 2013-05-08 | 2013-11-27 | 浙江新瑞铭装饰材料有限公司 | Real stone paint thermal-insulation decoration board |
| CN103555236A (en) * | 2013-10-25 | 2014-02-05 | 沈阳工业大学 | High-adhesiveness phenol aldehyde composite adhesive and preparation method thereof |
| CN103980851A (en) * | 2013-10-16 | 2014-08-13 | 上海华信摩擦材料有限公司 | Brake shoe adhesive resin used for rail transit vehicles, and preparation method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203308029U (en) * | 2013-05-08 | 2013-11-27 | 浙江新瑞铭装饰材料有限公司 | Real stone paint thermal-insulation decoration board |
| CN103265926A (en) * | 2013-06-04 | 2013-08-28 | 伍淑华 | Composite nano powder modified imine epoxy adhesive |
| CN103980851A (en) * | 2013-10-16 | 2014-08-13 | 上海华信摩擦材料有限公司 | Brake shoe adhesive resin used for rail transit vehicles, and preparation method thereof |
| CN103555236A (en) * | 2013-10-25 | 2014-02-05 | 沈阳工业大学 | High-adhesiveness phenol aldehyde composite adhesive and preparation method thereof |
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