CN105176431A - Adhesive material - Google Patents
Adhesive material Download PDFInfo
- Publication number
- CN105176431A CN105176431A CN201510569826.4A CN201510569826A CN105176431A CN 105176431 A CN105176431 A CN 105176431A CN 201510569826 A CN201510569826 A CN 201510569826A CN 105176431 A CN105176431 A CN 105176431A
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- China
- Prior art keywords
- adhesion
- layer
- adhesive
- substrate
- present
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Abstract
The invention discloses an adhesive material, which comprises an upper layer material and a lower layer material; the upper layer material and the lower layer material are superposed together; the upper layer material is an adhesive layer; the lower layer material is a substrate; the substrate is sheet plastic; the adhesive layer is a thin film which is 0.01 to 0.2mm thick the adhesive layer is made of hexenoic acid adhesive in material. The adhesive material disclosed by the invention has good attachment performance and certain breathability, and when using the adhesive material, a human body feels relatively comfortable.
Description
Technical field
The present invention relates to a kind of adhesion material that can stick on the more smooth object in surface.
Background technology
Can adhesion material be used in a lot of occasion, spin off can be adhered on the surface of object, or directly stick on the surface of object or person body, animal body.Require that attaching is functional, and there is certain ventilation property.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of adhesion material, and this adhesion material attaches functional, and has certain ventilation property, feels comparatively comfortable when human body uses.
For solving the problems of the technologies described above, the technical solution used in the present invention is: provide a kind of adhesion material, it comprises upper and lower materials at two layers, described upper and lower materials at two layers is superimposed, described upper layer of material is adhesion layer, and described subsurface material is substrate, and described substrate is sheet plastic, the film of described adhesion layer to be thickness be 0.01-0.2mm, the material of described adhesion layer is ethene acids binder layer.
In a preferred embodiment of the present invention, the tensile strength of described adhesion layer is 0.5-3kPa.
In a preferred embodiment of the present invention, the bounding force of described adhesion layer is 0.5-4N/10mm.
In a preferred embodiment of the present invention, described substrate is provided with the through hole that multiple diameter is 0.05-0.2mm.
In a preferred embodiment of the present invention, the thickness of described substrate is 0.2-0.5mm.
The invention has the beneficial effects as follows: adhesion material of the present invention attaches functional, and has certain ventilation property, when human body uses, feel comparatively comfortable.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of adhesion material of the present invention.
In accompanying drawing, the mark of each parts is as follows: 1, adhesion layer, and 2, substrate.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention comprises: a kind of adhesion material, it comprises upper and lower materials at two layers, described upper and lower materials at two layers is superimposed, described upper layer of material is adhesion layer 1, and described subsurface material is substrate 2, and described substrate 2 is sheet plastic, described adhesion layer 1 for thickness be the film of 0.01-0.2mm, the material of described adhesion layer 1 is ethene acids binder layer.
Preferably, the tensile strength of described adhesion layer 1 is 0.5-3kPa.
Preferably, the bounding force of described adhesion layer 1 is 0.5-4N/10mm.
Preferably, described substrate 2 is provided with the through hole that multiple diameter is 0.05-0.2mm.
Preferably, the thickness of described substrate 2 is 0.2-0.5mm.
The adhesion material of this structure attaches functional, and has certain ventilation property, feels comparatively comfortable when human body uses.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. an adhesion material, it is characterized in that, comprise upper and lower materials at two layers, described upper and lower materials at two layers is superimposed, described upper layer of material is adhesion layer, and described subsurface material is substrate, and described substrate is sheet plastic, the film of described adhesion layer to be thickness be 0.01-0.2mm, the material of described adhesion layer is ethene acids binder layer.
2. adhesion material according to claim 1, is characterized in that, the tensile strength of described adhesion layer is 0.5-3kPa.
3. adhesion material according to claim 1, is characterized in that, the bounding force of described adhesion layer is 0.5-4N/10mm.
4. adhesion material according to claim 1, is characterized in that, described substrate is provided with the through hole that multiple diameter is 0.05-0.2mm.
5. adhesion material according to claim 1, is characterized in that, the thickness of described substrate is 0.2-0.5mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510569826.4A CN105176431A (en) | 2015-09-08 | 2015-09-08 | Adhesive material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510569826.4A CN105176431A (en) | 2015-09-08 | 2015-09-08 | Adhesive material |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105176431A true CN105176431A (en) | 2015-12-23 |
Family
ID=54898885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510569826.4A Pending CN105176431A (en) | 2015-09-08 | 2015-09-08 | Adhesive material |
Country Status (1)
Country | Link |
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CN (1) | CN105176431A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10066132B2 (en) | 2015-04-30 | 2018-09-04 | Avery Dennison Corporation | Opaque adhesives in wet condition for label application |
CN113547210A (en) * | 2021-07-15 | 2021-10-26 | Tcl华星光电技术有限公司 | Particulate matter adhesion device and laser treatment process |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1350043A (en) * | 2001-11-27 | 2002-05-22 | 陈锦凤 | Making process and use of porous permeable pressure-sensitive adhesive tape |
CN2549006Y (en) * | 2002-06-13 | 2003-05-07 | 联诚兴企业股份有限公司 | Reusable easily peeling-off adhesive tape |
CN1675057A (en) * | 2002-08-21 | 2005-09-28 | 艾利丹尼森公司 | Label and method of labeling |
CN102604565A (en) * | 2012-03-16 | 2012-07-25 | 琨诘电子(昆山)有限公司 | Low-adhesiveness polythene acid glue film adhesive for low-temperature low-adhesiveness curing protective film and production technology of low-adhesiveness polythene acid glue film adhesive |
CN102653663A (en) * | 2011-03-04 | 2012-09-05 | 日东电工株式会社 | Tackiness adhesive sheet for thin-film substrate fixing |
CN103059755A (en) * | 2011-10-20 | 2013-04-24 | 日东电工株式会社 | Adhesive tape |
TW201446924A (en) * | 2013-03-14 | 2014-12-16 | Nitto Denko Corp | Adhesive sheet |
-
2015
- 2015-09-08 CN CN201510569826.4A patent/CN105176431A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1350043A (en) * | 2001-11-27 | 2002-05-22 | 陈锦凤 | Making process and use of porous permeable pressure-sensitive adhesive tape |
CN2549006Y (en) * | 2002-06-13 | 2003-05-07 | 联诚兴企业股份有限公司 | Reusable easily peeling-off adhesive tape |
CN1675057A (en) * | 2002-08-21 | 2005-09-28 | 艾利丹尼森公司 | Label and method of labeling |
CN102653663A (en) * | 2011-03-04 | 2012-09-05 | 日东电工株式会社 | Tackiness adhesive sheet for thin-film substrate fixing |
CN103059755A (en) * | 2011-10-20 | 2013-04-24 | 日东电工株式会社 | Adhesive tape |
CN102604565A (en) * | 2012-03-16 | 2012-07-25 | 琨诘电子(昆山)有限公司 | Low-adhesiveness polythene acid glue film adhesive for low-temperature low-adhesiveness curing protective film and production technology of low-adhesiveness polythene acid glue film adhesive |
TW201446924A (en) * | 2013-03-14 | 2014-12-16 | Nitto Denko Corp | Adhesive sheet |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10066132B2 (en) | 2015-04-30 | 2018-09-04 | Avery Dennison Corporation | Opaque adhesives in wet condition for label application |
US10953627B2 (en) | 2015-04-30 | 2021-03-23 | Avery Dennison Corporation | Opaque adhesives in wet condition for label application |
CN113547210A (en) * | 2021-07-15 | 2021-10-26 | Tcl华星光电技术有限公司 | Particulate matter adhesion device and laser treatment process |
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C06 | Publication | ||
PB01 | Publication | ||
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WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151223 |
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WD01 | Invention patent application deemed withdrawn after publication |