CN105164872A - 基台组件集成 - Google Patents

基台组件集成 Download PDF

Info

Publication number
CN105164872A
CN105164872A CN201480022733.3A CN201480022733A CN105164872A CN 105164872 A CN105164872 A CN 105164872A CN 201480022733 A CN201480022733 A CN 201480022733A CN 105164872 A CN105164872 A CN 105164872A
Authority
CN
China
Prior art keywords
laser
submount
abutment
slider
slide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480022733.3A
Other languages
English (en)
Chinese (zh)
Inventor
L·钟
E·C·盖奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seagate Technology LLC
Original Assignee
Seagate Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seagate Technology LLC filed Critical Seagate Technology LLC
Publication of CN105164872A publication Critical patent/CN105164872A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/10—Structure or manufacture of housings or shields for heads
    • G11B5/105—Mounting of head within housing or assembling of head and housing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B2005/0002—Special dispositions or recording techniques
    • G11B2005/0005—Arrangements, methods or circuits
    • G11B2005/0021—Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Semiconductor Lasers (AREA)
  • Magnetic Heads (AREA)
  • Recording Or Reproducing By Magnetic Means (AREA)
CN201480022733.3A 2013-03-06 2014-02-28 基台组件集成 Pending CN105164872A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/787,405 US9018737B2 (en) 2013-03-06 2013-03-06 Submount assembly integration
US13/787,405 2013-03-06
PCT/US2014/019320 WO2014137788A1 (en) 2013-03-06 2014-02-28 Submount assembly integration

Publications (1)

Publication Number Publication Date
CN105164872A true CN105164872A (zh) 2015-12-16

Family

ID=51486835

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480022733.3A Pending CN105164872A (zh) 2013-03-06 2014-02-28 基台组件集成

Country Status (5)

Country Link
US (1) US9018737B2 (enExample)
JP (1) JP2016516295A (enExample)
KR (1) KR101805644B1 (enExample)
CN (1) CN105164872A (enExample)
WO (1) WO2014137788A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9013967B1 (en) * 2014-07-02 2015-04-21 HGST Netherlands B.V. Heat-dissipating stepped slider for a heat-assisted magnetic recording head
JP7100641B2 (ja) * 2017-08-04 2022-07-13 ヌヴォトンテクノロジージャパン株式会社 サブマウント、半導体レーザ装置及び熱アシストハードディスク装置
WO2025026529A1 (de) * 2023-07-28 2025-02-06 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur justierung von elektrooptischen elementen auf einem substrat

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101373598A (zh) * 2007-08-23 2009-02-25 Tdk株式会社 具备光波导路的热辅助磁头
US20090225636A1 (en) * 2008-03-10 2009-09-10 Toshiki Hirano Components and assembly procedure for thermal assisted recording
US20110090770A1 (en) * 2009-10-15 2011-04-21 Hitachi, Ltd. Thermal-assisted-magnetic-recording head and magnetic recording system using the thermal-assisted-magnetic-recoring head
US20110242697A1 (en) * 2010-03-31 2011-10-06 Tdk Corporation Method for manufacturing thermally-assisted magnetic recording head with light source unit
US20120008470A1 (en) * 2010-07-08 2012-01-12 Tdk Corporation Magnetic recording head capable of monitoring light for thermal assist
CN102760451A (zh) * 2011-04-29 2012-10-31 希捷科技有限公司 用于在滑块上对准激光二极管的方法和装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69617928T2 (de) 1995-03-20 2002-07-18 Unitive International Ltd., Curacao Löthöcker-herstellungsverfahren und strukturen mit einer titan-sperrschicht
US7929248B2 (en) 2006-05-23 2011-04-19 Seagate Technology Llc Top bond pad for transducing head interconnect
US9065236B2 (en) 2010-04-30 2015-06-23 Seagate Technology Method and apparatus for aligning a laser diode on a slider
US8240025B2 (en) * 2010-09-23 2012-08-14 Tdk Corporation Method for manufacturing head including light source unit for thermal assist
US8456961B1 (en) * 2011-03-22 2013-06-04 Western Digital (Fremont), Llc Systems and methods for mounting and aligning a laser in an electrically assisted magnetic recording assembly
US8681594B1 (en) * 2012-09-28 2014-03-25 Western Digital (Fremont), Llc Method and system for improving laser alignment and optical transmission efficiency of an energy assisted magnetic recording head

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101373598A (zh) * 2007-08-23 2009-02-25 Tdk株式会社 具备光波导路的热辅助磁头
US20090225636A1 (en) * 2008-03-10 2009-09-10 Toshiki Hirano Components and assembly procedure for thermal assisted recording
US20110090770A1 (en) * 2009-10-15 2011-04-21 Hitachi, Ltd. Thermal-assisted-magnetic-recording head and magnetic recording system using the thermal-assisted-magnetic-recoring head
US20110242697A1 (en) * 2010-03-31 2011-10-06 Tdk Corporation Method for manufacturing thermally-assisted magnetic recording head with light source unit
US20120008470A1 (en) * 2010-07-08 2012-01-12 Tdk Corporation Magnetic recording head capable of monitoring light for thermal assist
CN102760451A (zh) * 2011-04-29 2012-10-31 希捷科技有限公司 用于在滑块上对准激光二极管的方法和装置

Also Published As

Publication number Publication date
US9018737B2 (en) 2015-04-28
US20140252560A1 (en) 2014-09-11
KR20150128819A (ko) 2015-11-18
WO2014137788A1 (en) 2014-09-12
KR101805644B1 (ko) 2017-12-07
JP2016516295A (ja) 2016-06-02

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20151216

RJ01 Rejection of invention patent application after publication